CN202307890U - Novel integrated high-power LED (light-emitting diode) packaging structure - Google Patents
Novel integrated high-power LED (light-emitting diode) packaging structure Download PDFInfo
- Publication number
- CN202307890U CN202307890U CN2011204492350U CN201120449235U CN202307890U CN 202307890 U CN202307890 U CN 202307890U CN 2011204492350 U CN2011204492350 U CN 2011204492350U CN 201120449235 U CN201120449235 U CN 201120449235U CN 202307890 U CN202307890 U CN 202307890U
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- China
- Prior art keywords
- wall
- annular body
- led chip
- integrated high
- fluorescent powder
- Prior art date
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The utility model discloses a novel integrated high-power LED (light-emitting diode) packaging structure which comprises a substrate, an LED chip fixed on the substrate, and an annular wall body arranged around the LED chip, wherein a transparent sheet, a fluorescent powder film and a transparent protective plate are sequentially superposed on the top of the annular wall body; a fixed cover is sheathed on the annular wall body; the outer side wall of the annular wall body is provided with a first annular rib; the inner side wall of the fixed cover is provided with a second rib matched with the first rib; the second rib is clamped at the lower part of the first rib to fix the fixed cover to the annular wall body; and the fixed cover tightly clamps the transparent sheet, the fluorescent powder film and the transparent protective plate. The utility model adopts the fluorescent powder film instead of the traditional adhesive dispensing mode, so that the fluorescent powder is far from the LED chip, thereby reducing the optical attenuation; and since the thickness of the fluorescent powder film adopted by the utility model is uniform, and can be accurately controlled, the utility model has the advantages of favorable consistency and high excited efficiency, and can obviously improve the light spot.
Description
[technical field]
The utility model relates to a kind of LED structure, refers in particular to a kind of novel integrated high power LED encapsulating structure.
[background technology]
White light emitting diode (Lighting Emitting Diode) has the efficient height, and the life-span is long, and reliability is high, environmental protection and energy saving, and plurality of advantages such as applying flexible are the lighting source in the 4th generation by generally approving, have vast potential for future development.The acquisition of white light LEDs at present mainly contains three kinds of approach, and a kind of is on blue chip, to cover yttrium-aluminium-garnet (YAG:Ce3+) fluorescent material, and the blue light that utilizes blue chip to send is not absorbed part and receives the green-yellow light of blue-light excited ejaculation to mix the formation white light with fluorescent material; A kind of is to excite RGB three primary colors fluorescent powder colour mixture to form white light with the ultraviolet LED chip; Also having a kind of is that led chip with RGB sends RGB three primary colors light respectively, again through spacing color mixed formation white light.Comparatively ripe at present, business-like method is above-mentioned first kind of approach, and promptly blue-ray LED+(YAG:Ce3+) fluorescent material obtains white light.
In the preparation technology of large power white light LED, the coating of fluorescent material at present is still some powder mode mainly, after fluorescent material and used silica gel are mixed by a certain percentage, utilizes air pressure control mode point to be coated in around the led chip top reaches.Because there are difference of specific gravity in fluorescent material and used silica gel, this some powder mode can cause fluorescent material above led chip, to reach skewness all around, and led chip top fluorescent material sedimentary facies is to more; And less relatively all around, add that the difference of air pressure control also can cause the inconsistent of whole glue amount, will cause in the batch process like this; The colour temperature of white light LEDs is inconsistent; Discreteness is big, even occurs as hot spot defectives such as yellow circle or blue circle, influences the performance and the illuminating effect of white light LEDs.
As shown in Figure 7; Existing structural manufacturing process is a fixed L ED chip 101 on the microscope carrier 104 in pedestal 105, then fluorescent material 102 is directly evenly covered on the led chip 101, and in the outermost of led chip 101 lens 103 is set; When led chip 101 work; Will produce heat, the fluorescent material 102 that covers on the led chip 101 then can be because of the charing of turning black of being heated, and 102 in the fluorescent material after the charing directly remains on the led chip; Thereby reduced the luminous efficiency of led chip, caused the lifetime of whole element function.
[utility model content]
To LED encapsulating structure in the prior art exist bright dipping inhomogeneous, yellow circle is arranged, technological deficiency such as luminous efficiency is low, light decay is big, useful life is short, the purpose of the utility model be to provide a kind of go out light effect evenly, the LED encapsulating structure of little, the long service life of Wu Huangquan, light extraction efficiency height, light decay.
In order to reach above-mentioned technical purpose; The technical scheme that the utility model is taked is a kind of novel integrated high power LED encapsulating structure; The led chip and the ring that comprise substrate, be fixed on the substrate are located at led chip annular body of wall on every side, and the top of said annular body of wall is equipped with light transmission piece, is coated with fluorescent powder film on the said light transmission piece; Cover the printing opacity baffle on the said fluorescent powder film; One fixed cap is nested with on annular body of wall, and the lateral wall of said annular body of wall is provided with first convex tendon of annular, and the madial wall of said fixed cap is provided with second convex tendon that is complementary with said first convex tendon; Said second convex tendon is clamped on the first convex tendon bottom fixed cap is fixed on the annular body of wall, and said fixed cap clamps light transmission piece, fluorescent powder film and printing opacity baffle; The top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
The utility model adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; Simultaneously with respect to traditional some plastic structure; The thickness of the utility model employing fluorescent powder film is even and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
Preferably, said annular body of wall is embedded on the substrate.
Preferably, the bottom of said annular body of wall is provided with a plurality of location-plates, and corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
Preferably, be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
Preferably, the angle of the madial wall of said annular body of wall and substrate is greater than 90 degree.
Preferably, the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
Preferably, said reflector layer is reflective sheeting or reflecting coating.
Preferably, said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
Preferably, the surface of said printing opacity baffle is a rough surface.
Preferably, said led chip is a blue-light LED chip, and said fluorescent powder film is the yellow fluorescent powder film.
[description of drawings]
Shown in Figure 1 is the structural representation of the utility model substrate;
Shown in Figure 2 is the structural representation of the utility model annular body of wall;
Shown in Figure 3 is the utility model STRUCTURE DECOMPOSITION sketch map;
Shown in Figure 4 is the internal structure sketch map of the utility model;
Fig. 5 is the partial structurtes enlarged diagram of A part shown in Figure 4;
Shown in Figure 6 is the structural representation of the preferred embodiment of the utility model;
Fig. 7 is the prior art constructions sketch map.
[embodiment]
Technical scheme for further detailed elaboration the utility model is elaborated below in conjunction with accompanying drawing.
Like Fig. 1, Fig. 2, Fig. 3, Fig. 4, shown in Figure 5; The utility model discloses a kind of novel integrated high power LED encapsulating structure; The led chip 11 and the ring that comprise substrate 1, be fixed on the substrate 1 are located at led chip 11 annular body of wall 2 on every side, and the top of said annular body of wall 2 is equipped with light transmission piece 30, is coated with fluorescent powder film 3 on the said light transmission piece 30; Cover a printing opacity baffle 4 on the said fluorescent powder film 3; One fixed cap 5 is nested with on annular body of wall 2, and the lateral wall of said annular body of wall 2 is provided with first convex tendon 20 of annular, and the madial wall of said fixed cap 5 is provided with second convex tendon 50 that is complementary with said first convex tendon 20; Said second convex tendon 50 is clamped on first convex tendon, 20 bottoms fixed cap 5 is fixed on the annular body of wall 2; Said fixed cap 5 just light transmission piece 30, fluorescent powder film 3 and printing opacity baffle 4 clamps, and the top of said fixed cap 5 is provided with light-emitting window 51, and said printing opacity baffle 4 corresponding annular bodies of wall 2 inner printing opacity baffle zones expose to said light-emitting window 51.
The utility model adopts fluorescent powder film to replace traditional phosphor dot glue mode, makes fluorescent material away from led chip, has avoided fluorescent material directly to contact led chip, has reduced light decay, has prolonged the useful life of LED lamp; While is with respect to the structure of the heap shape fluorescent coating of conventional point glue formation; The thickness of the utility model employing fluorescent powder film is even and can accurately control its gauge; The efficient that is stimulated is high, and photochromic uniformity high conformity can avoid occurring the perhaps phenomenon of blue circle of yellow circle fully; Make the whole hot spot uniformity obtain remarkable improvement, and improved light extraction efficiency.
In practical application, if find photochromic inconsistent phenomenon, also can fixed cap 5 be unloaded, change fluorescent powder film 3 again; As the phenomenon of dead lamp or stroboscopic appears, can fixed cap 5 be unloaded inspection line fault or change led chip 11 equally.
Certainly in order further to make it more firm, the later stage can be provided with a circle sealed colloid at the end face and the edge of fixed cap 5 bottoms, to reach good sealing effectiveness.
As shown in Figure 6, in order to reduce total reflection, improve light extraction efficiency, the madial wall of the said annular body of wall 2 of the utility model and the angle theta of substrate 1 to form the structure of prefocus cup, change the light ray propagation path greater than 90 degree, increase the light extraction yield.
The annular body of wall 2 of the utility model is embedded on the substrate 1; The mode of inlaying can adopt following structure; 4 location- plates 21,22,23,24 can be set in the bottom of annular body of wall 2; Corresponding 4 location-plates are provided with holddown groove 12a, 12b, 12c, the 12d that a plurality of and said location- plate 21,22,23,24 is complementary on the said substrate 1, and said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d annular body of wall 2 is fixed on the substrate.In order to make annular body of wall 2 more firm; Can preset part sealing and fixing colloid (not shown) in said holddown groove 12a, 12b, 12c, the 12d, said location- plate 21,22,23,24 is embedded in holddown groove 12a, 12b, 12c, the 12d fastening through the sealing of sealing and fixing colloid.
In order to make light farthest obtain utilizing, the substrate surface of the utility model in annular body of wall 2 is provided with reflector layer 6, is provided with reflector layer 7 at the inner surface of annular body of wall 2.This reflector layer 6 and reflector layer 7 are reflective sheeting or reflecting coating.
The said led chip 11 of the utility model is many group led chip groups; As shown in Figure 1; The utility model led chip 11 is four groups of led chip group 11a, 11b, 11c, 11d; The adjacent mutual dislocation of respectively organizing between the led chip group is arranged, and the mode that described dislocation is arranged is meant between the led chip of adjacent led chip group that the gap of corresponding its vertical distribution is provided with separately, and such mode can let the distance maximization between the led chip; The heat of led chip let the thermal source of led chip in limited space, scatter as much as possible, so that can make full use of substrate 1 quick heat radiating.The substrate 1 of the utility model is provided with anodal wire welding area 13a and negative pole wire welding area 13b, and is provided with fixing hole 14a, 14b in the position at diagonal angle.
In order to reduce total reflection, the surface of the printing opacity baffle 4 of the utility model is set to rough surface (not shown), to improve the light extraction efficiency.
The led chip 11 of the utility model can be a blue-light LED chip, and said fluorescent powder film 3 is the yellow fluorescent powder film, and this moment, blue chip excited the yellow fluorescent powder film can send white light.
The above only with convenient explanation the utility model, in not breaking away from the creation spirit category of the utility model, knows this technological any simple modification and distortion that personnel did, still belongs to the protection range of the utility model.
Claims (10)
1. novel integrated high power LED encapsulating structure; It is characterized in that: the led chip and the ring that comprise substrate, are fixed on the substrate are located at led chip annular body of wall on every side; The top of said annular body of wall is equipped with light transmission piece; Be coated with fluorescent powder film on the said light transmission piece, cover the printing opacity baffle on the said fluorescent powder film, a fixed cap is nested with on annular body of wall; The lateral wall of said annular body of wall is provided with first convex tendon of annular; The madial wall of said fixed cap is provided with second convex tendon that is complementary with said first convex tendon, and said second convex tendon is clamped on the first convex tendon bottom fixed cap is fixed on the annular body of wall, and said fixed cap clamps light transmission piece, fluorescent powder film and printing opacity baffle; The top of said fixed cap is provided with light-emitting window, and the inner printing opacity baffle zone of the corresponding annular body of wall of said printing opacity baffle exposes to said light-emitting window.
2. a kind of novel integrated high power LED encapsulating structure according to claim 1, it is characterized in that: said annular body of wall is embedded on the substrate.
3. a kind of novel integrated high power LED encapsulating structure according to claim 2; It is characterized in that: the bottom of said annular body of wall is provided with a plurality of location-plates; Corresponding a plurality of location-plates are provided with the holddown groove that a plurality of and said location-plate is complementary on the said substrate, and said location-plate is embedded in the holddown groove annular body of wall is fixed on the substrate.
4. a kind of novel integrated high power LED encapsulating structure according to claim 3 is characterized in that: be provided with the sealing and fixing colloid in the said holddown groove, said location-plate is embedded in the holddown groove fastening through the sealing of sealing and fixing colloid.
5. a kind of novel integrated high power LED encapsulating structure according to claim 4 is characterized in that: the madial wall of said annular body of wall and the angle of substrate are greater than 90 degree.
6. according to each described a kind of novel integrated high power LED encapsulating structure of claim 1 to 5, it is characterized in that: the substrate surface in the said annular body of wall and the inner surface of annular body of wall are provided with reflector layer.
7. a kind of novel integrated high power LED encapsulating structure according to claim 6, it is characterized in that: said reflector layer is reflective sheeting or reflecting coating.
8. a kind of novel integrated high power LED encapsulating structure according to claim 7 is characterized in that: said led chip is many group led chip groups, and the adjacent mutual dislocation of respectively organizing between the led chip group is arranged.
9. a kind of novel integrated high power LED encapsulating structure according to claim 8, it is characterized in that: the surface of said printing opacity baffle is a rough surface.
10. a kind of novel integrated high power LED encapsulating structure according to claim 9, it is characterized in that: said led chip is a blue-light LED chip, said fluorescent powder film is the yellow fluorescent powder film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204492350U CN202307890U (en) | 2011-11-09 | 2011-11-09 | Novel integrated high-power LED (light-emitting diode) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204492350U CN202307890U (en) | 2011-11-09 | 2011-11-09 | Novel integrated high-power LED (light-emitting diode) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202307890U true CN202307890U (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204492350U Expired - Fee Related CN202307890U (en) | 2011-11-09 | 2011-11-09 | Novel integrated high-power LED (light-emitting diode) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202307890U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103062653A (en) * | 2012-12-24 | 2013-04-24 | 余姚市泰联照明电器有限公司 | Light emitting diode (LED) illuminating device |
| CN103175001A (en) * | 2012-12-24 | 2013-06-26 | 余姚市泰联照明电器有限公司 | Light-emitting diode (LED) lighting component |
-
2011
- 2011-11-09 CN CN2011204492350U patent/CN202307890U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103062653A (en) * | 2012-12-24 | 2013-04-24 | 余姚市泰联照明电器有限公司 | Light emitting diode (LED) illuminating device |
| CN103175001A (en) * | 2012-12-24 | 2013-06-26 | 余姚市泰联照明电器有限公司 | Light-emitting diode (LED) lighting component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20191109 |