200952556 六、發明說明： 【發明所屬之技術領域】 ，，月係涉及一種發光二極體模組，特別 在一杈組封裝製程下所製 & Ά一種 組及應用之光源裝置與其製&、光二極體模 【先前技術】 法。 近幾年來，由於發光二極 用設計也逐漸體㈣速成長，其相關應 漸減開來，此外基於發光 =、、錢、輯容料優點。因此，在產有體積 也就=:整合了發光二極體來作為指示或照明的 們都知道，發光二極體只能進行單向導電，也 時了透過直流電來驅動點亮。因此，在應用於各種 ^時’勢必在電路板上再另外設計有交流轉直流的整产 或者額外透過外接的整流器來達到整流的效果。‘ 小產2&僅會增加產品成本，整體來講更無法有效縮 疋，目前的習知技術就有提出交流電發光二極體 、叹°十，其疋在晶圓製程階段來完成之後才進行封裝。並 在aa圓製程的過程，其必須結合整流電路的設計，而把 ^顆的發光二鋪晶粒叢集在―起，最後才依亮度需求 "、切晶圓，以再進行封裝而製作出交流電發光二極體。 但是，由於發光二極體的順向壓降會影響良品率， ，而右為了完成晶圓的製程，而將所有發光二極體晶粒進 了叢集整合的話，只要其中一個發光二極體晶粒發生問 題，疣會導致整個叢集產生不良。因此對於原本可以大量 200952556 將會提高生產製造的風險，而使得 生產的晶圓製程而言 產品的良率降低。 【發明内容】 有鑑於此，本發明所要解決的技術問題在 個製程實現在發光二極體模組的额縣階段，使^ 二極體皆可在完成篩選之後才進而打線焊接，並^ 本發明的0單架構之設計，！I以大幅 曰 及有效地提升產品的良品率。 衣作-耘’以200952556 VI. Description of the Invention: [Technical Fields of the Invention] The monthly system relates to a light-emitting diode module, which is specially made in a group package process, and a group of light source devices and their applications are manufactured & , light diode model [previous technology] method. In recent years, as the design of the light-emitting diode has gradually grown (four), its correlation should be gradually reduced, and it is based on the advantages of illuminating =, money, and material. Therefore, in the production of volume = = integrated light-emitting diodes for indication or illumination, we know that the light-emitting diode can only be unidirectionally conductive, and it is also driven by direct current to illuminate. Therefore, when applied to various times, it is necessary to additionally design an AC-to-DC product on the circuit board or additionally through an external rectifier to achieve the rectification effect. 'Small production 2 & only increase the cost of the product, and overall it is not effective to shrink. The current conventional technology has proposed the AC light-emitting diode, sighing ten, and then proceeding after the wafer processing stage is completed. Package. And in the aa round process, it must be combined with the design of the rectifier circuit, and the illuminating two-layer dies are clustered together, and finally, according to the brightness requirement, the wafer is cut and then packaged. Alternating current LEDs. However, since the forward voltage drop of the light-emitting diode affects the yield rate, and right, in order to complete the wafer process, all the light-emitting diode grains are integrated into the cluster, as long as one of the light-emitting diode crystals If there is a problem with the grain, it will cause the whole cluster to be bad. Therefore, the original 200952556 will increase the risk of manufacturing, and the yield of the product will be reduced. SUMMARY OF THE INVENTION In view of the above, the technical problem to be solved by the present invention is realized in the process of the county of the light-emitting diode module in a process, so that the two diodes can be wire-bonded after the screening is completed, and Invented 0 single architecture design,! I is able to increase the product's yield rate significantly. Clothing-耘’
為了達到上述目的，根據本發明所提出之一方案 提供-種交流電發光二極體模組，其包括：= Ζί二Γ^。其中’該基板的—上表面係“複數個圓 $凹槽，並排列成形為—矩陣排列，而該基板更且有 線架構，並且該導線架構的複數個電‘ =刀別對應該矩陣排列而設置該些圓形凹㈣。而該些 ϋ極體係分別焊接於該導線架構的電氣接點，以使該 f式m路完錢接。藉此，該橋式整流電路係接收交 錢賴些發光二㈣來達到交流轉直流之轉換 以及發光之作用。 為了達到上述目的，根據本發明所提出之另一方 批提供Γ種光源裝置m路板、—電源接頭及 3 ϋ上述方案所提供的交流電發光二極體模組。其中， 頭是連接電路板’並且絲接收—交流電，而交流 、·! 極體模組是設置於電路板，並且連接電源接頭， 以接收父流電來進行發光。 宏，if 了達到^上述目的’根據本發明所提出之再一方 ^ β供一種交流電發光二極體模組法，係 拉組封裝製程’該製造方法之步驟包括：首先，透過一基 5 200952556 一方式來整合一橋式整流電路之導線架構，以成形為 廿二❹其巾該基板的—上表面係具有複數侧形凹槽， 二·成為—矩陣排列，而該橋式整流電路之導線架構的 稷數個電氣接點係分別對應設置於該此 内 著：別進行黏著複數個發光二極體於該1开表=的二 曰内γ並分別打線焊接該些發光二極體於該些圓形凹槽 =電氣接點’以使該橋式整流電路完成連接。最後，進 行、'、佈#體在該基板的上表面，以填滿該些圓形凹槽。 处、以上之概述與接下來的詳細說明及附圖，皆是為了 月b*進丄步5兒明本發明為達成預定目的所採取之方式、手段 及功效。而錢本發明的其他目的及優點，將在後續的說 明及圖式中加以闡述。 【實施方式】 本發明之交流電發光二極體模組主要是透過簡單的 模組架構之設計，以在模組封裝製程時來完成整合發光二 極體及整流電路’而並非利用晶圓製程來製作，也就是並 非實現於㈣電路或半導程之_。#崎低生產風 險而提升生產之良率。 明同時參考第-@，為本發明交流電發光二極體模 組之實施例立體圖。如圖所示’本實施例提供—種交流電 發光二極體模組1，其是直接接收—交流電而來作為驅動 之電源。而交流電發光二極體模組】包括♦·—基板n及 複數個發光二極體12。其中，基板u的_上表面⑴是 具有複數個圓形凹槽111G，並且所有的圓形凹槽⑴〇是 排列成為-矩陣㈣。此外，在基板u製作形成時，便 整合有「橋式整流電路之導線架構(圖未示），並且該導線 架構的複數個電氣接點（圖未示)是顯露設置於基板η的 200952556 ^表面 刻對應該矩陣排列而設置於，此门/ 槽1110内，以作為打線焊 =亥些圓形凹 應可以了解，該導線架槿 : 二、、、々該項技術者 1110是提供有兩個電氣、接點ϋ又於每〜個圓形凹槽 (FR-4)或BT基板。 长氧樹脂基板 而發光二極體12即是分別焊接於導 點，以使橋式整流電路在發光 &構的電氣接 ❹ 後，便可以完成橋式整产雷& _ τ線焊接完成之 是，發光二極體^^路庫的用連上接^用。補充說明的In order to achieve the above object, according to one aspect of the present invention, there is provided an AC electroluminescent diode module comprising: = Ζ Γ Γ 。. Wherein the upper surface of the substrate is "a plurality of circles" and arranged in a matrix arrangement, and the substrate is more wired, and the plurality of wires of the wire structure are aligned with each other. The circular recesses (four) are disposed, and the bungee systems are respectively soldered to the electrical contacts of the wire structure, so that the f-type m roads are connected. Thus, the bridge rectifier circuit receives the money. Illuminating two (four) to achieve the conversion of AC to DC and the role of illumination. In order to achieve the above object, the other party according to the present invention provides a m-type board, a power connector, and an alternating current provided by the above scheme. The light-emitting diode module, wherein the head is connected to the circuit board 'and the wire receives-alternating current, and the AC, ·! polar body module is disposed on the circuit board, and is connected to the power connector to receive the parent current to emit light. Macro, if to achieve the above purpose 'the further one proposed according to the present invention ^ β for an alternating current light emitting diode module method, the pull group packaging process 'the manufacturing method steps include: first Integrating the wire structure of a bridge rectifier circuit by means of a base 5 200952556 to form a substrate, the upper surface of the substrate has a plurality of side grooves, and the matrix is arranged in a matrix. The plurality of electrical contacts of the wire structure of the rectifier circuit are respectively disposed in the same: respectively, the plurality of light-emitting diodes are adhered to the two turns of the first open table and the wires are respectively soldered. The poles are in the circular grooves=electrical contacts' to make the bridge rectifier circuit complete the connection. Finally, the ', the cloth body is on the upper surface of the substrate to fill the circular grooves. The above summary, the following detailed description and the accompanying drawings are all for the purpose, means and functions of the present invention for achieving the intended purpose. Advantages will be explained in the following description and drawings. [Embodiment] The AC LED module of the present invention is mainly designed through a simple module architecture to complete integrated illumination during the module packaging process. Two pole And the rectifier circuit 'is not made by the wafer process, that is, it is not realized in (4) circuit or semi-lead _. #崎低 production risk and improve the production yield. Ming also refers to the -@, the invention is AC A perspective view of an embodiment of a light-emitting diode module. As shown in the figure, the present embodiment provides an AC light-emitting diode module 1 that directly receives AC power as a driving power source, and an AC light-emitting diode. The module includes a substrate n and a plurality of light emitting diodes 12. The upper surface (1) of the substrate u has a plurality of circular grooves 111G, and all the circular grooves (1) are arranged to be - Matrix (4). In addition, when the substrate u is formed, a conductor structure (not shown) of the bridge rectifier circuit is integrated, and a plurality of electrical contacts (not shown) of the wire structure are exposed on the substrate η. 200952556 ^ surface engraved corresponding to the matrix arrangement and set in this door / slot 1110, as a wire welding = Hai circular recess should be able to understand, the lead frame 槿: Second, the 々 the technician 1110 is Available in two Electrical, and contacts every ~ ϋ circular recess (FR-4) or the BT substrate. The long-oxygen resin substrate and the light-emitting diodes 12 are respectively soldered to the lead points, so that the bridge-type rectifier circuit can complete the bridge-type full-scale thunder & _ τ line welding after the electrical connection of the light-emitting & The use of the light-emitting diode ^^ library is connected. Supplementary explanation
Wire)來焊接於導線架構的電氣接點^ ， 利用覆晶組裝技術(FHp_Chi R ’亦了疋 的電氣接點，在Μ Λ g)來痒接於導線架構 :來達到同時進行交流轉直流之轉換；= 際設«’本實施贿叙橋式錢電路在實 Cii，如為全波整流電路之設計，並且橋 ΐΓ:= 道:;收的交流電大小來計算設計，以決 設ϊ配置及連接。其中，在發光二極mi 目如貝驗出較佳的數據是在每平方公分的基板 設計有3〇〜1⑼個發光二極體12 ^換句話說，圓形凹 槽1 =形成在基板η上的密度是3G〜⑽個/每平方公分。 请再參考第二圖’為本發明的橋式整流電路之第一 貝施例電路示意圖。如圖所示’橋式整流電路μ在設計 7 200952556 電路日夺，其包括有一四臂電路仙及-負載 體12 H °並且橋輕流電路112完全是透過發光二極 之雷Λ到整流並發細侧。其中，在四臂電路1121 f 點疋分別焊接有一第—發光二極體組LEIM 一 —^ ^二極體組LED2、—第三㈣二極體組LED3及 光二極體組LED4。而在負载電路ιΐ22之電氣 接疋焊接有—第五發光二極體組LED5。 雷=假設本實施例是用以接收11〇伏特，刪z的交流 因此焊接在四臂電路1121上的第—發光二極體組 至第四發光二極體組哪4是經由計算後而分別設 ，為4個發光二極體12，而焊接在負载電路⑽上的 光二極體組LED5是設計為16個發光二極體12， 〜共為72個發光二極體12。 於是，當橋式整流電路H2運作於正半週時，第一 :光二極體組LEIM、第五發光二極體組LED5及第三發 一:極體組LED3會被驅動而點亮，因而會有44個發光 $體12會運作產生光源；相反的，當橋式整流電路ιΐ2 於負半週時，則是第二發光二極體組LED2、第五發 =極體組LED5及第四發光二極脉咖4會被驅動而 點焭，而同樣是會有44個發光二極體12運作產生光源。 ^因此，搭配本實施例所提供的橋式整流電路112之 =流電發光二極體模組i，其運作時的發光二極體12之 刊用率（Payload Ratio)為 44/72=61%。 再參考第二圖，為本發明的橋式整流電路之第二 施例電路示意圖。如圖所示’本實施例在設計上大致與 一實施例相同。而主要的差異點在於，橋式整流電^ 200952556 T :的負栽電路1122是進—步採用並聯的 設 =’也就是說在負載電路1122之電氣接點是烊接I第 le^2發光二極體組㈣5]及—第五之二發光二極體組 ❹ ❹ 而若同樣是假設接收110伏特，60Hz的交 貝j焊^在四臂電路上的第—發光二極體組L咖至 弟四發光二極體組LED4是經由計算後而分別設 個發光二極n 12，而焊接在負载電路ιΐ22上的第五之一 =二極體組LE职及第五之二發光二極體組咖5_2 疋分別設計為14個發光二極體12，總共 極體12。 丨口知尤一 於是，當橋式整流電路112運作於正半週時，第一 ，光二極肢LED1、第五之二發光二極體組咖5_2及 第二發光二極體組LED3會被驅動而點亮，因而會有5〇 個發光二極體12會運作產生光源；相反的，當橋式整流 電路112運作於負半週時，則是第二發光二極 LED2、第五之一發光二極體組LED5-1及第四發光二極 體組LED4會被驅動而點壳，而同樣是會有％個發光: 極體12運作產生光源。 一 因此，搭配本貫施例所提供的橋式整流電路112之 父電發光一極體模組1，其運作時的發光二極體12之 利用率為50/80=67.5%。 請再參考第四A圖，為本發明的橋式整流電路之第 三實施例電路示意圖。如圖所示，本實施例是用以表示交 流電發光二極體模組1可進一步包含有四個整流二極體 D1〜D4，並且搭配發光二極體12來達成整流及發光的作 9 200952556 用。其中，四個整流二極體D1〜D4是分別焊接於橋式整 流電路112之四臂電路1121的電氣接點，而由發光二極 體12所組成的第一發光二極體組LED1則是順向串列焊 接於負載電路1122之電氣接點。 由於本實施例是主要的整流工作是由整流二極體 D1〜D4來進行，而第一發光二極體組LED1是焊接於負 載電路1122 °因此’不管橋式魏電路112是運作於正 半週或負半週’則第一發光二極體組1^1)1皆會處於恆亮 的狀態。因此搭配本實施例所提供的橋式整流電路Η] 之交流電發光二極體模組卜其運作時的發光二極體12 之利用率為100%。 、此外，請複參考第四B圖，為對應第三實施例之橋 式整流電路的轉制示意圖。本實施例是魏說明橋式 正/;IL電路112在依據基板11之圓形凹槽1110所成形的矩 陣排列之下’所設計出的其巾之—電路連接示意圖。如圖 所示，其對應第四A圖中的整流二極體D1〜D4，是分別 連接於橋式整流電路112的四臂電路1121。而所有的發 光一極體12皆是串列連接於橋式整流電路112的負載電 路1122，也就是順向串接於電極(+)至電極㈠之間，以形 成矩陣形狀之排列。 而上述所提及的實施例部分，由於實際上的發光二 3 12之順向壓降會有所差異，因此其中所設計的橋式 路112之導線架構及其中所使用的發光二極體12 之數量時’可能會因實際設計時所接收的交流電大小而有 所差異。上述之舉例說明並非用以限制本發明之態樣。 為了說明本發明交流電發光二極體模組丨的架構組 200952556 成，進一步透過其製造方法來加以描述。請參考第五圖， 為本發明交流電發光二極體模組的製造方法之實施例流 程圖。如圖所示，本實施例提供一種交流電發光二極體模 組1的製造方法，其步·驟包括：首先，依據應用上所需接 收的交流電大小及發光二極體12之特性來設計一橋式整 流電路112(S501)，進而透過基板製程方式來整合橋式整 流電路112之導線架構，以成形為基板n(S5〇3)。其中， 在基板11在成形後，基板11的上表面lu是對應整合橋 式整流電路112之導線架構而形成多個圓形凹槽111〇， 並且排列成為—矩陣排列，而橋式整流電路M2之導線架 構的電氣接點是分別對應設置於該些圓形凹槽1110内。 。接著，分別進行黏著發光二極體12於上表面上 的圓形凹# 111G内，並再分別打線焊接發光二極體 於圓形凹槽U1G _電氣接點(S5G5)，讀該橋式整流 電路112完成連接。此外，若欲使整體發光二極體12的 利用率較佳，且橋式整流電路112的整流效果較好的話， 則可以進一步搭配發光二極體12來進行黏著整流二極體 於橋式整流電路112之四臂電路1121所對應的圓形凹槽 内’並進行打線連接於圓形凹槽111()内的電氣接點 (S507)。最後，進行塗佈一膠體在基板u的上表面 111(S509)，以填滿所有的圓形凹槽ηι〇，而完成交流電 發光二極體模組1之製作。其中，上述之膠體在設計上可 例如為透明膠體或者調和有螢光粉的膠體（用於白光發光 二極體）’並且膠體在材質上是可採用聚合膠水(Cumble P〇lymer)、環氧樹脂(Epoxy)及有矽膠(SiliC0ne)等其中之 一種材料。 11 200952556 為了進-步說明本發明錢電發光二極體模組】的 實際應用態樣’請進-步參考第六圖，為本發明光源裝置 的實施例不意圖。如圖所示，本實施例所提供的一種光源 裝置2是屬於燈泡的態樣，也就是本實施例所設計的光源 裝置2是以發光二極體12為發光來源的燈泡。 光源裝置2是包含一電路板201、-電源接頭202及 多個交流電發光二極體模乡且！。其中，電路板2〇1可進一 步疋與散減置（H未示）連接，以㈣散熱裝置進行散Wire) to solder the electrical contacts of the wire structure ^, using flip chip assembly technology (FHp_Chi R 'also has a good electrical contact, in Μ Λ g) to itch the wire structure: to achieve simultaneous AC to DC Conversion; = Interaction «' This implementation of bribe-bridge money circuit in the real Cii, such as the design of the full-wave rectifier circuit, and bridge: = Road:; the size of the AC power to calculate the design to determine the configuration and connection. Among them, in the light-emitting diodes, the best data is that the substrate is designed to have 3 〇 1 (1) light-emitting diodes per square centimeter of the substrate. ^ In other words, the circular groove 1 = is formed on the substrate η. The density on the top is 3G ~ (10) / per square centimeter. Please refer to the second figure again as a schematic diagram of the first embodiment of the bridge rectifier circuit of the present invention. As shown in the figure, 'bridge rectifier circuit μ is designed in the circuit of 200952556 circuit, which includes a four-arm circuit and a load body 12 H ° and the bridge light flow circuit 112 is completely through the lightning diode to the rectification Concurrent side. Wherein, the four-arm circuit 1121 f is respectively soldered with a first-light-emitting diode group LEIM-^^ diode group LED2, a third (four) diode group LED3 and an optical diode group LED4. The fifth light-emitting diode group LED5 is soldered to the electrical connection of the load circuit ι 22 . Ray = Assume that this embodiment is for receiving 11 volts, and the exchange of z is thus soldered to the fourth to fourth light-emitting diode groups on the four-arm circuit 1121, which is calculated by It is assumed that there are four light-emitting diodes 12, and the light-diode group LEDs 5 soldered on the load circuit (10) are designed as 16 light-emitting diodes 12, and a total of 72 light-emitting diodes 12 are provided. Therefore, when the bridge rectifier circuit H2 operates in the positive half cycle, the first: the light diode group LEIM, the fifth light emitting diode group LED 5, and the third one: the polar body group LED 3 are driven to be lit, thereby There will be 44 illuminating $body 12 will operate to generate the light source; conversely, when the bridge rectifier circuit ιΐ2 is in the negative half cycle, it is the second illuminating diode group LED2, the fifth illuminating group, the polar body group LED5 and the fourth The light-emitting diodes 4 will be driven and clicked, and there will be 44 light-emitting diodes 12 operating to produce a light source. Therefore, with the galvanic diode module i of the bridge rectifier circuit 112 provided in this embodiment, the payload ratio of the LED 12 during operation is 44/72=61. %. Referring again to the second figure, a circuit diagram of a second embodiment of the bridge rectifier circuit of the present invention is shown. As shown in the figure, the present embodiment is substantially the same in design as an embodiment. The main difference is that the bridge rectifier motor ^200952556 T: the load circuit 1122 is step-by-step with the setting = 'that is, the electrical contact at the load circuit 1122 is spliced. Diode group (4) 5] and - 5th illuminator diode group ❹ ❹ And if it is assumed to receive 110 volts, 60Hz ray j soldering ^ on the four-arm circuit - the light-emitting diode group L The fourth light-emitting diode group LED4 is calculated by setting a light-emitting diode n 12, and the fifth one is connected to the load circuit ι 22 and the second and second light-emitting diodes The body group 5_2 疋 is designed as 14 light-emitting diodes 12, respectively, for a total of 12 poles. In other words, when the bridge rectifier circuit 112 operates in the positive half cycle, the first, the light dipole limb LED1, the fifth two-light LED group coffee 5_2 and the second LED group LED3 will be Driving and lighting, so that 5 LEDs 12 will operate to generate a light source; conversely, when the bridge rectifier circuit 112 operates in the negative half cycle, it is one of the second LEDs 2, 5 The LED group 5-1 and the fourth LED group 4 are driven to be point-shelled, and there is also a % of illumination: the polar body 12 operates to generate a light source. Therefore, with the parent electroluminescent one-pole module 1 of the bridge rectifier circuit 112 provided by the present embodiment, the utilization ratio of the LED 12 during operation is 50/80 = 67.5%. Referring to FIG. 4A again, it is a circuit diagram of a third embodiment of the bridge rectifier circuit of the present invention. As shown in the figure, this embodiment is used to indicate that the AC LED module 1 can further include four rectifying diodes D1 DD4, and is combined with the LED 12 to achieve rectification and illumination. 9 200952556 use. The four rectifier diodes D1 to D4 are respectively soldered to the electrical contacts of the four-arm circuit 1121 of the bridge rectifier circuit 112, and the first LED group LED1 composed of the LEDs 12 is The forward series is soldered to the electrical contacts of the load circuit 1122. Since the main rectification operation is performed by the rectifying diodes D1 to D4 in this embodiment, the first LED group LED1 is soldered to the load circuit 1122. Therefore, the bridge type Wei circuit 112 operates in the positive half. In the week or negative half cycle, the first light-emitting diode group 1^1)1 will be in a constant light state. Therefore, the utilization ratio of the light-emitting diode 12 in the operation of the AC-emitting diode module of the bridge rectifier circuit provided in the present embodiment is 100%. In addition, please refer to FIG. 4B for a schematic diagram of the conversion of the bridge rectifier circuit corresponding to the third embodiment. This embodiment is a schematic diagram of the circuit-to-wire connection of the bridge type positive/; IL circuit 112 under the arrangement of the matrix formed by the circular recess 1110 of the substrate 11. As shown in the figure, the rectifying diodes D1 to D4 in the fourth A diagram are connected to the four-arm circuit 1121 of the bridge rectifier circuit 112, respectively. All of the light-emitting diodes 12 are connected in series to the load circuit 1122 of the bridge rectifier circuit 112, that is, in series between the electrodes (+) and the electrodes (1) to form a matrix shape. In the embodiment mentioned above, since the actual voltage drop of the light-emitting diodes 12 12 is different, the conductor structure of the bridge circuit 112 designed therein and the light-emitting diode 12 used therein The quantity may vary depending on the amount of AC power received during actual design. The above description is not intended to limit the invention. In order to explain the architecture group of the present invention, the embodiment of the invention is further described by its manufacturing method. Please refer to the fifth figure, which is a flow chart of an embodiment of a method for manufacturing an alternating current light emitting diode module of the present invention. As shown in the figure, the embodiment provides a method for manufacturing an AC LED module 1. The steps include: first, designing a bridge according to the size of the AC power required to be received and the characteristics of the LED 12 The rectifier circuit 112 (S501) further integrates the conductor structure of the bridge rectifier circuit 112 through the substrate processing method to form the substrate n (S5〇3). After the substrate 11 is formed, the upper surface lu of the substrate 11 is formed by a plurality of circular grooves 111 对应 corresponding to the wire structure of the integrated bridge rectifier circuit 112, and arranged in a matrix arrangement, and the bridge rectifier circuit M2 The electrical contacts of the wire structure are respectively disposed in the circular grooves 1110. . Then, the LEDs 12 are respectively adhered to the circular recesses #111G on the upper surface, and the LEDs are respectively soldered to the circular recess U1G_Electrical contacts (S5G5), and the bridge rectification is read. Circuit 112 completes the connection. In addition, if the utilization ratio of the overall light-emitting diode 12 is to be better, and the rectification effect of the bridge rectifier circuit 112 is better, the LED diode 12 can be further combined to perform the adhesion rectification diode on the bridge rectifier. The circular groove corresponding to the four-arm circuit 1121 of the circuit 112 is 'wired and connected to the electrical contact in the circular groove 111 () (S507). Finally, a colloid is applied to the upper surface 111 of the substrate u (S509) to fill all the circular grooves ηι〇 to complete the fabrication of the AC LED module 1. Wherein, the above-mentioned colloid can be designed, for example, as a transparent colloid or a colloid (for white light emitting diode) which is blended with phosphor powder, and the colloid can be made of a polymer glue (Cumble P〇lymer) or epoxy. Epoxy and silicone (SiliC0ne) and other materials. 11 200952556 In order to further explain the practical application of the present invention, the sixth embodiment is not intended to be an embodiment of the light source device of the present invention. As shown in the figure, a light source device 2 provided in this embodiment belongs to a light bulb, that is, the light source device 2 designed in the embodiment is a light bulb with the light emitting diode 12 as a light source. The light source device 2 includes a circuit board 201, a power connector 202, and a plurality of AC light-emitting diodes. . Among them, the circuit board 2〇1 can be further connected to the decrementing (H not shown), and (4) the heat dissipating device
熱。電源接頭202是連接電路板2(n，並且用來插接於一 燈泡座體(¾未示）’叫收—找電。錢錢光二極體 模組1則是烊接設置於電路板2(n，並且絲接收交流 電’以直接㈣執行交流轉錢之賴運作，並進行發光。 此外’光源裝置2的實際態樣並不侷限於燈泡，更 可因應使用上需求而設計為不同長度的燈管等態樣，在此 並無加以限制。heat. The power connector 202 is connected to the circuit board 2 (n, and is used for plugging in a light bulb body (3⁄4 not shown) to call and find electricity. The Qian Qianguang diode module 1 is connected to the circuit board 2 (n, and the wire receives the alternating current' to directly (four) perform the exchange and transfer money, and to illuminate. In addition, the actual aspect of the light source device 2 is not limited to the bulb, but can be designed to different lengths according to the demand. Lamps and other aspects are not limited here.
綜上所述’本發明是可以將整個交流電發光二極體 模組的製㈣現在馳縣階段，使得其巾所使用的發光 -極體e可在&成篩選之後才進而打線焊 本發明的簡單_之設計，以能大幅地減少製作流^ 及有效地提升產品的良品率。 惟’以上所述，僅為本發㈣具體實_之詳Μ 非，限制本發明，本發明之所有範圍 述之申印專利範圍為準’任何熟悉該項技藝者在本 發明之領域内’可㈣思及之變化或修 ^ 本案所界冑之專難目。 ^在以下 【圖式簡單說明】 第-圖係本發較流光二極體漁之實施例立體圖； 12 200952556 第二圖係本發明的橋式整流電路之第一實施例電路示意 圖， 第三圖係本發明的橋式整流電路之第二實施例電路示意 圖； 第四A圖係本發明的橋式整流電路之第三實施例電路示 意圖； 第四B圖係本發明第三實施例之橋式整流電路的矩陣排 列示意圖； 第五圖係本發明交流電發光二極體模組的製造方法之實 ® 施例流程圖；及 第六圖係本發明光源裝置的實施例示意圖。 【主要元件符號說明】 交流電發光二極體模組1 基板11 上表面111 圓形凹槽1110 橋式整流電路112 ⑩ 四臂電路1121 負載電路1122 發光二極體12 光源裝置2 電路板201 電源接頭202 整流二極體Dl，D2，D3，D4 第一發光二極體組LED1 第二發光二極體組LED2 第三發光二極體組LED3 13 200952556 第四發光二極體組LED4 第五發光二極體組LED5 第五之一發光二極體組LED5-1 第五之二發光二極體組LED5-2 14In summary, the present invention can be used to make the entire AC electroluminescent diode module (4) in the current Chixian stage, so that the illuminating-electrode e used in the towel can be wire-bonded after the screening. The simple design is designed to greatly reduce the production flow and effectively increase the yield of the product. However, the above description is only for the purpose of the present invention, and is not intended to limit the scope of the invention, and all the scope of the invention is subject to the scope of the patent application. (4) Thinking about changes or repairs. ^In the following [Simplified description of the drawings] The first figure is a perspective view of the embodiment of the present invention, which is a flow-light diode fishing; 12 200952556 The second figure is a circuit diagram of the first embodiment of the bridge rectifier circuit of the present invention, the third figure A circuit diagram of a second embodiment of the bridge rectifier circuit of the present invention; a fourth circuit diagram of a third embodiment of the bridge rectifier circuit of the present invention; and a fourth circuit diagram of a third embodiment of the present invention A schematic diagram of a matrix arrangement of a rectifier circuit; a fifth diagram is a flow chart of a method for manufacturing an AC LED module of the present invention; and a sixth diagram is a schematic diagram of an embodiment of a light source device of the present invention. [Main component symbol description] AC LED module 1 Substrate 11 Upper surface 111 Circular groove 1110 Bridge rectifier circuit 112 10 Four-arm circuit 1121 Load circuit 1122 Light-emitting diode 12 Light source device 2 Circuit board 201 Power connector 202 rectifier diodes Dl, D2, D3, D4 first light-emitting diode group LED1 second light-emitting diode group LED2 third light-emitting diode group LED3 13 200952556 fourth light-emitting diode group LED4 fifth light-emitting two Polar body group LED5 fifth one light-emitting diode group LED5-1 fifth fifth light-emitting diode group LED5-2 14