CN101963303A - Manufacturing method of surface adhered light-emitting element lamp group - Google Patents
Manufacturing method of surface adhered light-emitting element lamp group Download PDFInfo
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- CN101963303A CN101963303A CN2009101511198A CN200910151119A CN101963303A CN 101963303 A CN101963303 A CN 101963303A CN 2009101511198 A CN2009101511198 A CN 2009101511198A CN 200910151119 A CN200910151119 A CN 200910151119A CN 101963303 A CN101963303 A CN 101963303A
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- emitting element
- type light
- surface adhesion
- adhesion type
- rod
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000004804 winding Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 4
- 238000005498 polishing Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000012945 sealing adhesive Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 10
- 238000003466 welding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 241000191291 Abies alba Species 0.000 description 1
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The invention discloses a manufacturing method of a surface adhered light-emitting element lamp group, which comprises the following steps of: firstly, manufacturing a rod with a predetermined length and a winding frame with a corresponding rotary drive shaft; driving the rod to rotate by using a winding device after integrating the rod with the rotary drive shaft so as to wind conducting wires around the surface of the rod adjacently in a predetermined winding distance, wherein the winding distance is corresponding to the pin distance of a selected surface adhered light-emitting element; polishing an insulating layer of each conducting wire along the axial direction of the rod until the conducting part of each conducting wire is exposed, forming contact pad regions, coating a conducting adhesive to each contact pad region, bridging the surface adhered light-emitting element so that all pins of the surface adhered light-emitting element are respectively corresponding to the contact pad regions of the adjacent conducting wires; and electrically connecting the pins with the conducting parts of the conducting wires through the conducting adhesive, and coating with a sealing adhesive.
Description
Technical field
The present invention relates to a kind of process design of semiconductor light-emitting elements lamp group, particularly about a kind of manufacture method of surface adhesion type light-emitting element lamp group.
Background technology
In recent years, semiconductor light-emitting elements replaces general conventional illumination device gradually.With light emitting diode (Light Emitting Diode, LED) be example, but it has that volume is little, reaction is fast, the life-span long, be difficult for decay, firm in appearance, vibration resistance full-color light-emitting (containing black light), point to design easily, low-voltage, low current, advantages such as conversion loss is low, heat radiation is little, volume production is easy, environmental protection.
The known configurations of LED is to coat a led chip by a bulb shape packaging plastic to form, and extending from led chip has a pair of pin, and it passes the usefulness of packaging plastic as electric connection.In use, then need a pair of pin with LED be welded in lead respectively and have on the lead of negative supply, make led chip accept electric power and shinny with positive supply.Because the volume of bulb type LED is bigger, afterwards in order to adapt to more compact package and factory automation, the less surface adhesion type LED of volume also occurred.
Though LED has various advantages, because the characteristic of itself low-voltage, low current, so the shortcoming of luminosity deficiency is also arranged.Therefore, general in order to improve the brightness of LED, then a plurality of LED combinations or serial connection can be used for lamp group or lamp string.
In view of the above, known semiconductor light-emitting elements is to see through welding manner the pin of semiconductor light-emitting elements is linked to each other with lead respectively.Yet welding quality is difficult to control, and the soundness that is connected between semiconductor light-emitting elements and lead is subjected to the influence of welding quality, makes semiconductor light-emitting elements be subject to external force and damages, comes off ... produce etc. problem, reliability is relatively poor.
Moreover, during with a plurality of semiconductor light-emitting elements combinations or serial connection, need to be welded in a pair of pin of a plurality of semiconductor light-emitting elements on the lead one by one, the complicated difficulty of work progress, when the semiconductor light-emitting elements that will make up the more, whole production efficiency more is a problem, and semiconductor light-emitting elements is difficult to accurate positioning on lead, have the problem that differs at interval, cause end product quality not good.
Summary of the invention
Main purpose of the present invention provides a kind of manufacture method of surface adhesion type light-emitting element lamp group, and is very easy in assembling construction, to make surface adhesion type light-emitting element lamp group fast and positively, solves the problem of known technology on manufacturing.
For achieving the above object, technical solution of the present invention is:
Manufacture method of the present invention, preparation one earlier have the body of rod of predetermined length and have the coiling system frame of corresponding rotation driving shaft, the body of rod are incorporated into the rotating driveshaft of coiling system frame again, and rotating driveshaft is driven rotation by a spooling equipment.Then, at least two leads with outer insulating layer coating are scheduled to the winding spacing with one, when the body of rod is subjected to winding the line the driving rotation of rotating driveshaft of system frame, adjacent winding is on the surface of the body of rod, the winding spacing is the pin spacing corresponding to a surface adhesion type light-emitting element of selecting, polish the insulating barrier of each lead to the conductive part that exposes each lead along the axial direction of the body of rod again, to form the contact mat district of opposite position on each lead.Afterwards, at each contact mat district coating conducting resinl, and the surface adhesion type light-emitting element that bridges in the contact mat interval of adjacent wires, each pin of surface adhesion type light-emitting element are the contact mat districts of the corresponding adjacent wires of difference, and are electrically connected at the conductive part of adjacent wires via conducting resinl.
Lead is more with the surface of a predetermined winding pitch winding at the body of rod.And behind the surface adhesion type light-emitting element that bridges, more comprise surface adhesion type light-emitting component and lead are conducted test, dry conducting resinl again after testing successfully, make surface adhesion type light-emitting element secure bond in lead.Moreover the contact mat district of adjacent wires and surface adhesion type light-emitting element are more with sealant covers, and baking and curing.Selecting for use of element, being shaped as of the body of rod is cylindrical, and its surface more is formed with at least two helical grooves, for the lead winding.Lead is selected enamel-covered wire for use, and conducting resinl is selected elargol for use, and the surface adhesion type light-emitting element is then selected surface adhesion type LED for use.
The advantage that the present invention contrasts prior art is:
Via the technology used in the present invention means, after lead being set around the system frame, polish in the lump, except saving man-hour, increasing the efficient, more can be by adjusting the winding pitch, make that processing the position that exposes conductive part on lead is controlled, allow the interval unanimity of each surface adhesion type light-emitting element on the lead of end product, reach accurate location.
Moreover, owing to do not need the pin of surface adhesion type light-emitting component is welded one by one, but directly it is cross-placed on corresponding contact mat district, be electrically connected at the conductive part of lead by conducting resinl, assembling process is simple, convenient, effectively promotes production efficiency.
In addition, because of the contact mat district provides the effect of locating surface binding type light-emitting component, make the contact area between surface adhesion type light-emitting element and lead bigger, the surface more is coated with sealing, and overall structure is firm, is not subject to external force and damages, comes off, and reliability is preferable.
Description of drawings
Fig. 1 is the flow chart of steps that shows preferred embodiment of the present invention;
Fig. 2 is the schematic side view that shows the body of rod, coiling system frame and spooling equipment;
Fig. 3 is the stereogram that shows the body of rod and have the coiling system frame of corresponding rotation driving shaft;
Fig. 4 shows that the body of rod is incorporated into the stereogram of the rotating driveshaft of coiling system frame;
Fig. 5 shows the stereogram of lead winding on the surface of the body of rod;
Fig. 6 is the stereogram that shows after lead is polished;
Fig. 7 is the partial enlarged view that shows C zone among Fig. 6;
Fig. 8 is the partial enlarged view that the pin correspondence of display surface binding type light-emitting component is coated with the contact mat district of conducting resinl;
Fig. 9 is the partial enlarged view that display surface binding type light-emitting component is cross-placed on lead;
Figure 10 is display surface binding type light-emitting component and the contact mat district partial enlarged view with sealant covers;
Figure 11 is display surface binding type light-emitting component and the contact mat district cutaway view with sealant covers;
Figure 12 is the stereogram of display surface binding type light emitting element lamp group.
[main element symbol description]
1 lead
11 insulating barriers
12 conductive parts
13 contact mat districts
2 leads
21 insulating barriers
22 conductive parts
23 contact mat districts
3 conducting resinls
4 surface adhesion type light-emitting elements
41,42 pins
5 sealings
6 surface adhesion type light-emitting element lamp groups
D winding spacing
The E spooling equipment
P winding pitch
The R direction of rotation
The S body of rod
The S0 axial direction
The S1 surface
S21, S21 helical groove
T coiling system frame
T1, T2 rotating driveshaft
W pin spacing
The specific embodiment
Specific embodiment of the present invention will be further described by following embodiment and accompanying drawing.
Consult shown in Figure 1ly, it is the flow chart of steps that shows preferred embodiment of the present invention, and cooperates Fig. 2 to Figure 12 that preferred embodiment of the present invention is done one simultaneously to be described as follows.
Consult Fig. 2, Fig. 3 and Fig. 4, at first prepare the coiling system frame T (step 101) that a body of rod S and with predetermined length L has corresponding rotation driving shaft T1, T2.Body of rod S is incorporated into rotating driveshaft T1, the T2 of coiling system frame T, rotating driveshaft T1, T2 are driven rotation (step 102) by a spooling equipment E again.
Consult Fig. 5, at least two leads 1,2 with outer insulating layer coating 11,21 are scheduled to the winding space D with one, be subjected to winding the line rotating driveshaft T1, the T2 of system frame T when a direction of rotation R drives rotation in body of rod S, adjacent winding is at the surperficial S1 of body of rod S, and the winding space D is the pin spacing (step 103) corresponding to a surface adhesion type light-emitting element of selecting.
In the present embodiment, being shaped as of body of rod S is cylindrical, can also be other shape (as: ellipse), has an axial direction S0, and more be formed with at least two helical groove S21, S22 at the surperficial S1 of body of rod S, for lead 1,2 windings, so that when making lead 1,2 be set around the surperficial S1 of body of rod S, keep its winding space D unanimity.
Consult Fig. 6 and Fig. 7, after lead 1,2 is set around body of rod S, polish the insulating barrier 11,21 of each lead 1,2 to the conductive part 12,22 that exposes each lead 1,2, to form the contact mat district 13,23 (step 104) of opposite position on each lead 1,2 along the axial direction S0 of body of rod S.
Consult Fig. 8 and Fig. 9, after polishing contact mat district 13,23 on the lead 1,2, at each contact mat district 13,23 coating conducting resinl 3 (step 105).A surface adhesion type light-emitting element 4 then bridges in 13,23 in the contact mat district of adjacent wires 1,2, each pin the 41, the 42nd of surface adhesion type light-emitting element 4 is distinguished the contact mat district 13,23 of corresponding adjacent wires 1,2, and is electrically connected at the conductive part 12,22 (step 106) of adjacent wires 1,2 via conducting resinl 3.Afterwards surface adhesion type light-emitting component 4 and lead 1,2 are conducted test (step 107), whether electrically connect really with lead 1,2 to detect surface adhesion type light-emitting element 4.
In the present embodiment, surface adhesion type light-emitting element 4 is a surface adhesion type LED, includes a pair of pin 41,42, and 41,42 of pins have a predetermined pin spacing W, and pin spacing W equates with the winding space D of lead 1,2.When conducting test, then lead 1,2 is connected to positive and negative power supply, whether shinny judging whether electrically connects according to surface adhesion type light-emitting element 4.Certainly, the specification of surface adhesion type light-emitting element is of a great variety, the design of three pins or many pins is also arranged, on the implementation, the number needs of lead cooperates the then corresponding pin spacing adjustment of winding spacing of pin count adjustment, lead, so that the surface adhesion type light-emitting element is when being cross-placed on the lead, its pin is corresponding contact mat district respectively, becomes the electric connection state with lead.
Conducting resinl 3 adopts elargol in the present embodiment, need via baking box hyperthermia drying conducting resinl 3, make surface adhesion type light-emitting element 4 secure bond in lead 1,2 (step 108), allow the conductive part 12,22 of surface adhesion type light-emitting element 4 and lead 1,2, conductive characteristic by conducting resinl 3, finish contacting and conducting, stoving time needs 150 ℃/1.5Hrs approximately.Conducting resinl 3 is except that the contact mat district 13,23 in order to help more to promote the bond strength of 1,2 in surface adhesion type light-emitting element 4 and lead the conduction, surface adhesion type light-emitting element 4 can stably be bridged to be fixed on lead 1,2.And,, do not cause the difficulty in the production so the overall package process is simple, convenient owing to do not need to do the welding of pin.
Consult Figure 10 and Figure 11, after surface adhesion type light-emitting element 4 bridges, the contact mat district 13,23 of adjacent wires 1,2 and surface adhesion type light-emitting element 4 are coated (step 109) with sealing 5.AB glue is adopted in sealing 5, and the lead 1,2 after coating with sealing 5 need be put into 150 ℃/2Hrs of baking box baking, with baking and curing sealing 5 (step 110).Sealing 5 is avoided promoting integrally-built reliability because of being subjected to external force to damage, come off in order to protection surface adhesion type light-emitting element 4 and lead 1,2.And by its to the insulation characterisitic of electricity to prevent conduction and to intercept extraneous dust fall, keep lead 1,2 insulation characterisitic originally, avoid dust, particulate to fly into and cause fault because of the external world.On the other hand, can also regulate the dispersion angle of surface adhesion type light-emitting component 4 emitted lights, the user is provided required effect by sealing 5.
Consult Figure 12, last, take off lead 1,2 from body of rod S, promptly obtain surface adhesion type light-emitting element lamp group 6.When practical application because lead the 1, the 2nd, arbitrarily bending, around, can be so as to wrapping on various article, as Christmas tree, door, window ... Deng, as the usefulness of decoration.
By above embodiment as can be known; value on the true tool industry of manufacture method of surface adhesion type light-emitting element lamp group provided by the present invention; but above narration only is preferred embodiment explanation of the present invention; allly be skillful in this skill person when can doing other all improvement according to above-mentioned explanation, these changes still belong in the protection domain of invention spirit of the present invention and claims.
Claims (11)
1. the manufacture method of a surface adhesion type light-emitting element lamp group is characterized in that, comprises the following steps:
Step a: preparation one has the body of rod of predetermined length and has the coiling system frame of corresponding rotation driving shaft;
Step b: this body of rod is incorporated into the rotating driveshaft of this coiling system frame, and this rotating driveshaft is driven rotation by a spooling equipment;
Step c: at least two leads with outer insulating layer coating are scheduled to the winding spacing with one, when this body of rod is subjected to winding the line the driving rotation of rotating driveshaft of system frame, adjacent winding is on the surface of this body of rod, and this winding spacing is the pin spacing corresponding to a surface adhesion type light-emitting element of selecting;
Steps d: polish the insulating barrier of this each lead to the conductive part that exposes this each lead along the axial direction of this body of rod, on this each lead, to form the contact mat district of opposite position;
Step e: at this each contact mat district coating conducting resinl;
Step f: this surface adhesion type light-emitting element that bridges in the contact mat interval of this adjacent wires, each pin of this surface adhesion type light-emitting element are respectively to contact mat district that should adjacent wires, and are electrically connected at the conductive part of this adjacent wires via this conducting resinl.
2. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that, among the described step c, this lead is also with the surface of a predetermined winding pitch winding at this body of rod.
3. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that, after the described step f, also comprises the step that this surface adhesion type light-emitting element and lead is conducted test.
4. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that, after the described step f, also comprises this conducting resinl of oven dry, makes this surface adhesion type light-emitting element secure bond in the step of this lead.
5. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that, after the described step f, also comprises the contact mat district of this adjacent wires and this surface adhesion type light-emitting element step with sealant covers.
6. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 5 is characterized in that, after contact mat district and the step of this surface adhesion type light-emitting element with sealant covers with this adjacent wires, also comprises the step of this sealing of baking and curing.
7. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that being shaped as of the described body of rod is cylindrical.
8. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that the surface of the described body of rod also is formed with at least two helical grooves, for this each lead winding.
9. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that described lead is an enamel-covered wire.
10. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that described conducting resinl is an elargol.
11. the manufacture method of surface adhesion type light-emitting element lamp group as claimed in claim 1 is characterized in that, described surface adhesion type light-emitting element is a surface adhesion type LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101511198A CN101963303B (en) | 2009-07-21 | 2009-07-21 | Manufacturing method of surface adhered light-emitting element lamp group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101511198A CN101963303B (en) | 2009-07-21 | 2009-07-21 | Manufacturing method of surface adhered light-emitting element lamp group |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101963303A true CN101963303A (en) | 2011-02-02 |
| CN101963303B CN101963303B (en) | 2013-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101511198A Expired - Fee Related CN101963303B (en) | 2009-07-21 | 2009-07-21 | Manufacturing method of surface adhered light-emitting element lamp group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101963303B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016074364A1 (en) * | 2014-11-13 | 2016-05-19 | 许国大 | Manufacturing process for novel led copper wire lamp |
| CN109578842A (en) * | 2019-02-14 | 2019-04-05 | 永林电子有限公司 | A kind of coiling mold core and copper wire lamp for copper wire lamp production |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101280890A (en) * | 2007-04-02 | 2008-10-08 | 蔡乃成 | Method for manufacturing LED light bulb |
| US20100157598A1 (en) * | 2008-12-18 | 2010-06-24 | Kenneth Tsai | Light set with surface mounted light emitting components |
-
2009
- 2009-07-21 CN CN2009101511198A patent/CN101963303B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101280890A (en) * | 2007-04-02 | 2008-10-08 | 蔡乃成 | Method for manufacturing LED light bulb |
| US20100157598A1 (en) * | 2008-12-18 | 2010-06-24 | Kenneth Tsai | Light set with surface mounted light emitting components |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016074364A1 (en) * | 2014-11-13 | 2016-05-19 | 许国大 | Manufacturing process for novel led copper wire lamp |
| CN109578842A (en) * | 2019-02-14 | 2019-04-05 | 永林电子有限公司 | A kind of coiling mold core and copper wire lamp for copper wire lamp production |
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| Publication number | Publication date |
|---|---|
| CN101963303B (en) | 2013-10-16 |
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