JP2007290013A - Cutting method for shielded conductor layer, and laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting method for shielded conductor layer capable of preventing a shield line not to be cut from being remained on a side surface of a shield conductor layer, and sufficiently ensuring the insulation between an internal conductor and the shield conductor layer, and a laser beam machining apparatus. <P>SOLUTION: In the cutting method for shield conductor layer, a shield cable 1 comprised of a center conductor, an internal insulator arranged to cover the center conductor, and a shield conductor layer arranged to cover the internal insulator is prepared. The shield conductor layer is cut by irradiating laser beams on the shield conductor layer from at least three directions which are substantially orthogonal to the longitudinal direction of the shield cable 1. The angle formed by adjacent two optical axes of the laser beams irradiated on the shield conductor layer is below 180°. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a shield conductor layer cutting method and a laser processing apparatus that do not leave uncut shield wires on the side surfaces of a shield conductor layer and that can sufficiently ensure insulation between an internal conductor and a shield conductor layer.

  In recent years, with the spread of notebook computers, mobile phones, small video cameras, and the like, in addition to the reduction in size and weight of these information communication devices, high speed and high image quality are required. In order to cope with this, an extremely thin electric wire (sometimes referred to as a cable) in which an inner insulator, an outer conductor, and a jacket are sequentially formed on the outer periphery of the inner conductor in a coaxial manner is used. In addition, in order to prevent unnecessary noise from being mixed in other control devices such as a medical ultrasonic probe, a similar electric wire is used as a shielded electric wire. Hereinafter, the coaxial cable or the shielded cable including the shielded cable is referred to as a shielded cable.

  Usually, a plurality of shielded cables are used by bundling them, and the ends thereof are flattened and connected to an electrical connector. When connecting to the electrical connector, it is necessary to form a terminal for electrically connecting the inner conductor and the outer conductor to the shielded cable. However, when the outer diameter of the cable is as fine as 1 mm or less and the thickness of the internal insulator is about several tens of μm, it is not easy to form a connection terminal without impairing the cable arrangement pitch and electrical performance. . For this reason, various proposals have heretofore been made for the terminal formation of this type of shielded cable.

FIG. 10 is a cross-sectional view showing a structural example of a conventional shielded cable.
The inner conductor (center conductor) 2 is formed, for example, by twisting seven tin-plated copper alloy wires having an outer diameter of about 0.025 mm, and the outer surface is made of an insulating material made of fluororesin and has a thickness of 0.04 mm to The inner insulator (inner dielectric) 3 is formed to cover about 0.055 mm. The outer conductor (shield conductor layer) 4 disposed on the outer peripheral surface of the inner insulator 3 is formed by winding a plurality of shield wires 4a such as a plurality of copper alloy wires having an outer diameter of about 0.03 mm in a horizontal winding. A two-layer polyester tape having a thickness of about 0.004 mm is wound on the outer surface and fused together to form a jacket (jacket) 5 so that a shielded cable 1 having an outer diameter of about 0.3 mm or less can be obtained. Formed. Note that a copper vapor-deposited tape (not shown) may be wound around the outer surface of the shield conductor layer 4 with the copper vapor-deposited surface inside, and the shield conductor layer 4 has two layers with the winding direction of the shield wire opposite. It may be a structure wound around, or may be a braided structure (see, for example, Patent Document 1).

Next, a method for cutting the shield conductor layer in the conventional shielded cable will be described.
FIG. 11 is a diagram for explaining a method of cutting the shield layer 4 of the shielded cable shown in FIG. 10 with a laser beam and problems caused by the method. In FIG. 11, the shield conductor layer 4 and the inner conductor 2 are schematically shown. However, in FIG. 11, the actual structure is the same as that of the shield conductor layer 4 and the inner conductor 2 shown in FIG.

  First, the shielded cable 1 in a state where the jacket 5 shown in FIG. 10 is peeled off is fixed and held by a holding mechanism (not shown), and the shield conductor layer 4 is irradiated from above the shielded cable while scanning as indicated by an arrow. To do. Next, laser light is irradiated from below the shielded cable 1 to the shield conductor layer 4 while scanning as indicated by an arrow. In this way, the shield conductor layer 4 is cut by irradiating the entire shield conductor layer 4 with laser light.

Japanese Patent Laying-Open No. 2005-251522 (paragraphs 0002, 0016, FIG. 1)

  In the above-described method of cutting the shield conductor layer with the laser beam, the laser beam is irradiated onto the shield conductor layer 4 from the upper and lower directions. The light is also blocked by the adjacent shield line 4a, and the laser beam irradiation becomes insufficient. As a result, the shield wire 4a that is not cut off on the shield conductor layer side surface 6 may remain.

  On the other hand, when the laser beam is irradiated on the shield conductor side surface 6 under a high output condition such that the shield wire 4a is completely cut, the laser beam penetrates the shield conductor layer 4 located in front of the laser beam irradiation direction. The laser light reaches the internal insulator 3, and as a result, as shown in FIG. 11, a portion 7 in which the internal insulator is damaged is generated. In this portion 7, since the electrical insulation of the internal insulator 3 is lowered, it may be impossible to ensure sufficient insulation between the internal conductor 2 and the shield conductor layer 4.

  In the conventional cutting method, when the number of scans is increased, the shield conductor layer is easily melted and cut regardless of the scan speed, and when the number of scans is small, there is a tendency that uncut portions of the shield wire are increased. In addition, the damage to the internal dielectric when the number of scans is increased tends to be reduced as the scan speed increases.

  As described above, the shield wire 4a that is not cut off on the side surface 6 of the shield conductor layer or the portion 7 in which the internal insulator is scratched is caused by irradiating the laser light from the upper and lower directions. It is believed that there is.

  The present invention has been made in consideration of the above-described circumstances, and the object thereof is to prevent unshielded shield wires from remaining on the side surfaces of the shield conductor layer, and to provide sufficient insulation between the inner conductor and the shield conductor layer. It is another object of the present invention to provide a method of cutting a shield conductor layer and a laser processing apparatus that can be ensured.

In order to solve the above-described problems, a shielding conductor layer cutting method according to the present invention includes a central conductor, an internal insulator disposed to cover the central conductor, and an internal insulator. Prepare a shielded cable with a shielded conductor layer
Cutting the shield conductor layer by irradiating the shield conductor layer with laser light from at least three directions which are substantially perpendicular to the longitudinal direction of the shield cable;
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

  According to the method for cutting the shield conductor layer, the shield conductor layer is irradiated with the laser light from at least three directions, so that the shield conductor layer is irradiated from the upper and lower two directions as in the prior art. In comparison with this, it is possible to prevent the shield conductor layer that is not cut even from the side of the shield conductor layer from remaining, and the entire shield conductor layer can be cut completely and stably. At the same time, by irradiating the laser beam from at least three directions, even if the laser beam is irradiated under the condition that all the shield conductor layers are completely cut, a part of the internal insulator is damaged. Can be suppressed. Therefore, it is possible to prevent the electrical insulation of the internal insulator from being deteriorated, and to sufficiently secure the insulation between the internal conductor and the shield conductor layer.

  In the shield conductor layer cutting method according to the present invention, it is preferable that an angle formed by the two optical axes is 150 ° or less.

  Further, in the method for cutting a shield conductor layer according to the present invention, the shield conductor layer is irradiated with laser light from four directions, and the optical axes of the laser beams that are not adjacent to each other are arranged so as to form a substantially straight line. It is preferable.

  Further, in the method for cutting a shield conductor layer according to the present invention, when preparing the shield cable, when preparing a plurality of shield cables, and irradiating the shield conductor layer with laser light, the laser light or the shield It is preferable to scan and irradiate the laser beam by sliding a cable.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A laser irradiation mechanism for irradiating laser light;
A first reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in a first direction or a second direction;
A second reflecting mirror that reflects the laser beam reflected in the first direction by the first reflecting mirror in a third direction;
A third reflection mirror that reflects the laser light reflected in the third direction by the second reflection mirror in a fourth direction and irradiates the shield conductor layer;
A mirror slide mechanism that slides so as to remove the third reflection mirror from the optical axis of the laser beam reflected in the third direction;
The laser beam reflected in the third direction by the second reflecting mirror in a state where the third reflecting mirror is removed from the optical axis of the laser beam reflected in the third direction. A fourth reflecting mirror that reflects in the direction of 5 and irradiates the shield conductor layer;
A fifth reflecting mirror that reflects the laser light reflected in the second direction by the first reflecting mirror in a sixth direction;
A sixth reflecting mirror that reflects the laser light reflected in the sixth direction by the fifth reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A laser irradiation mechanism for irradiating laser light;
A first reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in a first direction or a second direction;
A second reflecting mirror that reflects the laser beam reflected in the first direction by the first reflecting mirror in a third direction;
A third reflection mirror that irradiates the shield conductor layer with the laser light reflected in the third direction by the second reflection mirror in a fourth direction or a fifth direction; 1 mirror slide unit,
A first slide mechanism for sliding the third reflection mirror provided in the first mirror slide unit;
A first rotating mechanism for rotating the third reflecting mirror provided in the first mirror slide unit;
A fourth reflecting mirror that reflects the laser light reflected in the second direction by the first reflecting mirror in a sixth direction;
A fifth reflecting mirror that reflects the laser light reflected in the sixth direction by the fourth reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

  Further, in the laser processing apparatus according to the present invention, the optical axis of the laser beam irradiated from each of the fourth direction, the fifth direction, and the seventh direction is respectively rotated by a rotation mechanism. It is also possible to further comprise a rotating lens.

Further, in the laser processing apparatus according to the present invention, a second mirror slide unit is arranged instead of the fifth reflecting mirror,
The second mirror slide unit irradiates the shield conductor layer by reflecting the laser beam reflected in the sixth direction by the fourth reflecting mirror in a seventh direction or an eighth direction. A fifth reflecting mirror,
The second mirror slide unit may include a second slide mechanism that slides the fifth reflection mirror and a second rotation mechanism that rotates the fifth reflection mirror. .

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A laser irradiation mechanism for irradiating laser light;
A first half mirror that reflects part of the laser light emitted by the laser irradiation mechanism in a first direction and transmits part of the laser light;
A first reflecting mirror that reflects the laser light reflected in the first direction by the first half mirror in a second direction;
A part of the laser beam reflected in the second direction by the first reflecting mirror is reflected in a third direction to irradiate the shield conductor layer and to transmit a part of the laser beam. Half mirror and
A second reflection mirror that reflects the laser light transmitted by the second half mirror in a fourth direction and irradiates the shield conductor layer;
A third reflecting mirror that reflects the laser light transmitted by the first half mirror in a fifth direction and irradiates the shield conductor layer;
Comprising
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

  In the laser processing apparatus according to the present invention, a part of the laser beam disposed between the first half mirror and the third reflection mirror and transmitted by the first half mirror It is also possible to further include a third half mirror that reflects in the direction and irradiates the shield conductor layer and transmits a part of the laser beam.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A laser irradiation mechanism for irradiating laser light;
A rotary reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in first to third directions;
A first reflection mirror that reflects the laser light reflected in the first direction by the rotary reflection mirror in a fourth direction and irradiates the shield conductor layer;
A second reflecting mirror that reflects the laser light reflected in the second direction by the rotary reflecting mirror in a fifth direction and irradiates the shield conductor layer;
A third reflection mirror that reflects the laser light reflected in the third direction by the rotary reflection mirror in a sixth direction and irradiates the shield conductor layer;
Comprising
The rotation reflection mirror has a rotation mechanism for rotating the rotation reflection mirror, and adjusts the direction of the rotation reflection mirror by the rotation mechanism,
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A first laser irradiation mechanism for irradiating the shield conductor layer with a first laser beam;
A second laser irradiation mechanism for irradiating the shield conductor layer with a second laser beam;
A third laser irradiation mechanism for irradiating the shield conductor layer with a third laser beam;
Comprising
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A first laser irradiation mechanism for irradiating a first laser beam in a first direction;
A first reflecting mirror that reflects the first laser beam irradiated by the first laser irradiation mechanism in a second direction;
A slide mechanism for sliding the first reflecting mirror along the first direction;
A first paraboloid that reflects the first laser beam reflected in the second direction by the first reflecting mirror in a third direction or a fourth direction to irradiate the shield conductor layer. With a mirror,
A second laser irradiation mechanism for irradiating a second laser beam in a fifth direction that is parallel to the first direction and rotated by approximately 180 °;
A second reflecting mirror that reflects the second laser light irradiated by the second laser irradiation mechanism in a sixth direction;
A third reflecting mirror that reflects the second laser light reflected in the sixth direction by the second reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The first parabolic mirror reflects the first laser light in the third direction or the fourth direction by sliding the first reflecting mirror by the sliding mechanism. ,
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.
In the laser processing apparatus according to the present invention, a second parabolic mirror is provided instead of the third reflecting mirror, and the second reflecting mirror is slid along the fifth direction. And the second parabolic mirror reflects the second laser light in the seventh direction or the eighth direction by sliding the second reflecting mirror by the sliding mechanism. It is also possible to make it.

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shielded conductor layer disposed so as to cover the internal insulator. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable,
A laser irradiation mechanism for irradiating the shield conductor layer with laser light;
A rotating mechanism for rotating the shielded cable;
Comprising
The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

  As described above, according to the present invention, the shield conductor layer cutting method and the laser can ensure sufficient insulation between the inner conductor and the shield conductor layer without leaving uncut shield wires on the side surfaces of the shield conductor layer. A processing apparatus can be provided.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 1 of the present invention.
This laser processing apparatus is an apparatus for cutting the shield conductor layer 4 by irradiating the shield conductor layer 4 in the shielded cable 1 shown in FIGS. 10 and 11 with laser light from four directions. The shielded cable 1 is an ultra-fine coaxial wire such as AWG (American Wire Gauge) 30 or more, and the shield conductor layer 4 is composed of a plurality of shield wires 4a as shown in FIG. In the case of the AWG 42 wire, for example, it is a tin-plated copper alloy wire having an outer diameter of about 0.03 mm. The shield wire that can be processed by the laser processing apparatus according to the present embodiment is a silver-plated copper alloy wire, an aluminum foil, etc. in addition to the tin-plated copper alloy wire.

  1 includes a laser irradiation mechanism 11 that irradiates a laser beam 12, first to seventh reflection mirrors 13 to 19, first to fourth lenses 20 to 23, and a mirror slide mechanism (see FIG. 1). Not shown). The laser beam emitted from the laser irradiation mechanism 11 is, for example, a YAG fundamental wave pulse laser (wavelength λ = 1064 nm). The shielded cable 1 is held by a holding mechanism (not shown) in the laser processing apparatus. The shield cable 1 is provided with a cable slide mechanism (not shown) that slides when the laser beam is irradiated.

  The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected by the first reflecting mirror 13 in the first direction 31 and bent by about 90 ° with respect to the first direction 31 by the second reflecting mirror 14. Reflected in the second direction 32, reflected by the third reflecting mirror 15 in the third direction 33, and the reflected laser light 12 passes through the first lens 20 to the shield conductor layer 4 of the shielded cable 1. Irradiated. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

  The third reflection mirror 15 can be slid by a mirror slide mechanism (not shown) to a position deviated from the optical axis of the laser beam reflected by the second reflection mirror 14. The laser beam 12 emitted from the laser irradiation mechanism 11 in a state where the third reflection mirror 15 is slid by the mirror slide mechanism and removed from the optical axis is moved in the first direction 31 by the first reflection mirror 13. Reflected, reflected by the second reflecting mirror 14 in the second direction 32 bent by about 90 ° with respect to the first direction 31, and reflected by the fourth reflecting mirror 16 in the fourth direction 34. The reflected laser beam 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the second lens 21. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

  The first reflection mirror 13 reflects the laser beam 12 irradiated by the laser irradiation mechanism 11 in a fifth direction 35 rotated by 180 ° with respect to the first direction 31. A drive mechanism (not shown) that can change the direction of the mirror 13 is attached. The sixth reflection mirror 18 can be slid by a mirror slide mechanism (not shown) to a position deviated from the optical axis of the laser beam reflected by the seventh reflection mirror 19. The laser beam 12 emitted from the laser irradiation mechanism 11 in a state where the direction of the first reflection mirror 13 is changed by the drive mechanism and the sixth reflection mirror 18 is slid by the mirror slide mechanism and removed from the optical axis. Is reflected in the fifth direction 35 by the first reflecting mirror 13, reflected in the sixth direction 36 bent by about 90 ° with respect to the fifth direction 35 by the seventh reflecting mirror 19, The reflection mirror 17 reflects the laser beam 12 in the eighth direction 38 and irradiates the shield conductor layer 4 of the shield cable 1 through the third lens 22. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the sixth direction 36.

  The laser beam 12 emitted from the laser irradiation mechanism 11 in a state where the sixth reflection mirror 18 is slid by the mirror slide mechanism and returned to the optical axis, is in a fifth direction 35 by the first reflection mirror 13. And reflected in the sixth direction 36 bent by about 90 ° with respect to the fifth direction 35 by the seventh reflection mirror 19, reflected in the seventh direction 37 by the sixth reflection mirror 18, The reflected laser beam 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the fourth lens 23. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the sixth direction 36.

  Further, the laser processing apparatus includes a control unit (not shown), and this control unit slides the driving mechanism for changing the direction of the first reflection mirror 13, the third reflection mirror 15, and the sixth reflection mirror 18, respectively. The operation of each of the mirror slide mechanism and the laser irradiation mechanism 11 to be controlled is controlled.

Next, a method for cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 1 will be described.
First, the jacket 5 of the shielded cable 1 shown in FIG. 10 is peeled off for a predetermined length to expose the shield conductor layer. The shielded cable 1 in this state is fixed and held by the holding mechanism of the laser processing apparatus shown in FIG.

  Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first to third reflecting mirrors 13 to 15, and the reflected laser beam 12 passes through the first lens 20. Then, the shield conductor layer 4 of the shield cable 1 is irradiated from the third direction 33. At this time, the shield conductor layer is slid by the cable slide mechanism to scan the shield conductor layer.

  Next, the third reflecting mirror 15 is slid by the mirror sliding mechanism to a position deviated from the optical axis of the laser beam reflected by the second reflecting mirror 14. Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first, second and fourth reflecting mirrors 13, 14, and 16, and the reflected laser beam 12 is second. The shield conductor layer is irradiated from the fourth direction 34 through the lens 21. At this time, the shield conductor layer is slid by the cable slide mechanism to scan the shield conductor layer.

  Next, the direction of the first reflection mirror 13 is changed by the drive mechanism, and the laser beam 12 is emitted from the laser irradiation mechanism 11, and the laser beam 12 is emitted from the first, seventh, and fifth reflection mirrors 13, 19, and 17, respectively. The reflected laser beam 12 passes through the third lens 22 and irradiates the shield conductor layer 4 from the seventh direction 37. At this time, the shield conductor layer is slid by the cable slide mechanism to scan the shield conductor layer.

  Next, the sixth reflection mirror 18 is slid by the mirror slide mechanism on the optical axis of the laser beam reflected by the seventh reflection mirror 19. Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first, seventh, and sixth reflecting mirrors 13, and the reflected laser beam 12 passes through the fourth lens 23. The shield conductor layer is irradiated from the eighth direction 38 through. At this time, the shield conductor layer is slid by the cable slide mechanism to scan the shield conductor layer.

  In this way, the shield cable 1 after the entire shield conductor layer is completely melted and cut, and the shield conductor layer is peeled off, has the internal insulator exposed as shown in FIG. As shown in FIG. 2, the central conductor 2 is exposed at the distal end side of the shielded cable 1 after cutting, and the internal insulator 3 that covers the central conductor 2 is also exposed, and the shield conductor layer that covers the internal insulator 3 is exposed. Is cut at the laser irradiation position. A shield conductor layer exists between the jacket 5 and the inner insulator 3.

  According to the first embodiment, since the shield conductor layer is irradiated with the laser light from four directions, the laser conductor is irradiated to the shield conductor layer 4 from the upper and lower two directions as in the prior art. It is possible to prevent the laser light from being blocked by the adjacent shield wire and insufficiently irradiating the laser light. As a result, it is possible to prevent the unshielded shield wire from remaining on the side surface of the shield conductor layer, and to completely and stably melt and cut the entire shield conductor layer. At the same time, by irradiating the laser beam from four directions, even if the laser beam is irradiated under the condition that all the shield lines are completely cut, the irradiation condition of the high-power laser beam is maintained as in the prior art. There is no need to do. For this reason, a laser beam does not penetrate through the shield conductor layer and reach the internal insulator 3, and it is possible to suppress the occurrence of a portion where the internal insulator is damaged. Therefore, it is possible to prevent the electrical insulation of the internal insulator 3 from being deteriorated, and to sufficiently ensure insulation between the internal conductor 2 and the shield conductor layer 4.

  In the present embodiment, the irradiation direction in which the shield conductor layer is irradiated with the laser light is such that the optical axes of the laser beams that are not adjacent to each other form a straight line as shown in FIG. By adopting such a direction, the entire shield conductor layer can be surely melted and cut by a laser beam having a lower output.

  In this embodiment, the shield conductor layer is irradiated with laser light from four directions. However, the present invention is not limited to this, and the shield conductor layer may be irradiated with laser light from three directions. The shield conductor layer may be irradiated with laser light from five or more directions. In this case, the angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer may be less than 180 °, but is preferably less than 150 °, and a more remarkable effect is obtained. .

In this embodiment, an irradiation method (scan irradiation) for scanning the shield conductor layer with laser light is used. However, the present invention is not limited to this, and the following modifications are made. Is also possible. For example, when the shield conductor layer can be cut even when the diameter of the laser beam is larger than the width of the shield conductor layer and the scan conductor layer can be cut, the laser beam can be irradiated to the shield conductor layer without scanning. In addition, it is possible to perform laser irradiation from one direction a plurality of times by using a laser output that can be cut by a plurality of times of laser irradiation of a shield wire made of a thin metal wire constituting the shield conductor layer in the case of no scan irradiation. . Also, in the case of scan irradiation, a shield wire made of a thin metal wire constituting the shield conductor layer cannot be cut by one scan irradiation, but a laser output that can be cut by a plurality of scan irradiations, and laser from one direction Irradiation can also be performed by multiple scan irradiations.
As described above, when the laser output can be cut by a plurality of times of laser irradiation or multiple times of scan irradiation, the shield wire is compared with the case of using a laser output that can be cut by one time of laser irradiation or one time of scan irradiation. It becomes easier to select a laser output that can reduce damage to the internal insulator. In other words, adjusting the laser output that can be cut by multiple times of laser irradiation or multiple times of scan irradiation is easier than adjusting the laser output that can be cut by one time of laser irradiation or single scan irradiation. is there. As a result, damage to the internal insulator can be reduced.

  In this embodiment, the shield conductor layer is scanned and irradiated with the laser light by sliding the shield cable by the cable slide mechanism. However, the shield conductor layer is obtained by sliding the laser light while the shield cable is fixed. It is also possible to scan with laser light.

  In the present embodiment, as shown in FIG. 1, the shield conductor layer is irradiated with laser light from four directions. However, the shield conductor layer can be irradiated with laser light from five or more directions. . In this case, in the laser processing apparatus of FIG. 1, a reflection mirror with a mirror slide mechanism similar to the third reflection mirror 15 is arranged between the third reflection mirror 15 and the fourth reflection mirror 16, and this reflection is performed. By disposing a lens between the mirror and the shield cable 1, the laser light reflected by the reflection mirror can be irradiated to the shield conductor layer of the shield cable through the lens, or such a reflection mirror and lens. This can be realized by arranging more than one. Further, in the laser processing apparatus of FIG. 1, a reflection mirror with a mirror slide mechanism similar to the sixth reflection mirror 18 is disposed between the sixth reflection mirror 18 and the fifth reflection mirror 17. By arranging a lens between the shielded cable 1 and the laser beam reflected by the reflecting mirror, it is possible to irradiate the shield conductor layer of the shielded cable through the lens. This can be realized by arranging a plurality.

  In the present embodiment, the case where the shield conductor layer of one shielded cable is cut as shown in FIG. 1 is described. However, the present invention is not limited to this, and each of the plurality of shielded cables is not limited thereto. It is also possible to cut the shield conductor layer at the same time. A method in this case will be described below.

FIG. 3 is a diagram for explaining a method of simultaneously cutting the shield conductor layers of a plurality of shielded cables arranged as a modification of the first embodiment.
Since the laser processing apparatus is the same as Embodiment 1 except that a plurality of shielded cables 1 are arranged in a horizontal row and held by a holding mechanism, description thereof is omitted.

  Further, in order to scan and irradiate the shielded cable 1 with laser light, the shielded cable may be slid in the direction of arrow 24 by a cable slide mechanism, and the optical system is moved in the direction of arrow 25 with the shielded cable fixed. The optical system or shielded cable may be slid back and forth multiple times.

  Also in the modified example, the same effect as in the first embodiment can be obtained.

(Embodiment 2)
FIG. 4 is a schematic diagram showing the configuration of the laser processing apparatus according to Embodiment 2 of the present invention, and the same parts as those in FIG.
Since the laser irradiation mechanism 11, the first reflection mirror 13, the second reflection mirror 14, the seventh reflection mirror 19, the shield cable holding mechanism, and the cable slide mechanism are the same as those in the first embodiment, description thereof is omitted. .

  The laser beam 12 reflected in the second direction 32 by the second reflecting mirror 14 is reflected in the third direction 33 by the reflecting mirror 26a in the mirror slide unit 26, and the reflected laser beam 12 is reflected in the first direction. The shield conductor layer 4 of the shielded cable 1 is irradiated through the rotating lens 27a. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

  The mirror slide unit 26 includes a reflection mirror 26a, a slide mechanism (not shown) for sliding the reflection mirror 26a, and a rotation mechanism (not shown) for adjusting the direction of the reflection mirror 26a. The first rotating lens 27a is attached with a rotating mechanism (not shown) that rotates the periphery of the shielded cable 1 as indicated by an arrow.

The laser beam 12 reflected in the sixth direction 36 by the seventh reflecting mirror 19 is reflected in the seventh direction 37 by the reflecting mirror 28a in the mirror slide unit 28, and the reflected laser beam 12 is reflected in the second direction. The shield conductor layer 4 of the shielded cable 1 is irradiated through the rotating lens 27b. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the sixth direction 36.
The mirror slide unit 28 includes a reflection mirror 28a, a slide mechanism (not shown) for sliding the reflection mirror 28a, and a rotation mechanism (not shown) for adjusting the direction of the reflection mirror 28a. The second rotating lens 27b is attached with a rotating mechanism (not shown) that rotates around the shielded cable 1 as indicated by an arrow.

Next, a method for cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 4 will be described.
First, the shield cable 1 with the jacket 5 peeled off for a predetermined length to expose the shield conductor layer is fixed and held by the holding mechanism of the laser processing apparatus shown in FIG.

  Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, and the laser beam 12 is reflected by the first and second reflecting mirrors 13 and 14 and the reflecting mirror 26a in the mirror slide unit, and the reflected laser beam. 12 is irradiated to the shield conductor layer 4 of the shielded cable 1 from the third direction 33 through the first rotating lens 27a. At this time, the reflecting mirror 26a and the first rotating lens 27a are aligned so that the laser light is reflected in the third direction 33 and irradiated to the shield conductor layer.

  Next, the reflecting mirror 26a is slid in the mirror slide unit 26, and the first rotating lens 27a is rotated. As a result, the reflecting mirror 26a and the first rotating lens 27a are aligned so that the laser light is reflected in the fourth direction 34 and applied to the shield conductor layer. Then, the laser beam 12 is emitted from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first and second reflecting mirrors 13 and 14, and the reflecting mirror 26a, and the reflected laser beam 12 is reflected by the first laser beam 12. The shield conductor layer is irradiated from the fourth direction 34 through the rotating lens 27a.

  Next, the direction of the first reflection mirror 13 is changed by the drive mechanism, and the laser beam 12 is emitted from the laser irradiation mechanism 11, and the laser beam 12 is reflected in the first and seventh reflection mirrors 13 and 19 and the mirror slide unit 28. Are reflected by the respective reflecting mirrors 28a, and the reflected laser light 12 is irradiated onto the shield conductor layer 4 of the shielded cable 1 from the seventh direction 37 through the second rotating lens 27b. At this time, the reflecting mirror 28a and the second rotating lens 27b are aligned so that the laser light is reflected in the seventh direction 37 and irradiated to the shield conductor layer.

  Next, the reflecting mirror 28a is slid in the mirror slide unit 28, and the second rotating lens 27b is rotated. As a result, the reflecting mirror 28a and the second rotating lens 27b are aligned so that the laser light is reflected in the eighth direction 38 and applied to the shield conductor layer. Then, the laser beam 12 is emitted from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first and seventh reflecting mirrors 13 and 19 and the reflecting mirror 28a, and the reflected laser beam 12 is reflected by the second laser beam 12. The shield conductor layer is irradiated from the eighth direction 38 through the rotating lens 27b.

In the second embodiment, the same effect as in the first embodiment can be obtained.
Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

(Embodiment 3)
FIG. 5 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 3 of the present invention, and the same reference numerals are given to the same portions as those in FIG.
The laser irradiation mechanism 11, the second reflection mirror 14, the fourth reflection mirror 16, the fifth reflection mirror 17, the first to fourth lenses 20 to 23, the shield cable holding mechanism, and the cable slide mechanism are implemented. Since it is the same as that of form 1, description is abbreviate | omitted.

  The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the first direction 31 by the first half mirror 43, reflected in the second direction 32 by the second reflecting mirror 14, and the second half mirror. 45 is reflected in the third direction 33, and the reflected laser light 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the first lens 20.

  Further, a part of the laser beam 12 is transmitted through the second half mirror 45. As a result, the transmitted laser light 12 is reflected by the fourth reflecting mirror 16 in the fourth direction 34, and the reflected laser light 12 passes through the second lens 21 and the shield conductor layer 4 of the shield cable 1. Is irradiated.

  Further, a part of the laser beam 12 is transmitted through the first half mirror 43. As a result, the transmitted laser beam 12 is reflected by the third half mirror 48 in the seventh direction 37, and the reflected laser beam 12 passes through the fourth lens 23 and the shield conductor layer 4 of the shield cable 1. Is irradiated.

  Further, a part of the laser beam 12 is transmitted through the third half mirror 48. Thus, the transmitted laser light 12 is reflected in the eighth direction 38 by the fifth reflecting mirror 17, and the reflected laser light 12 passes through the third lens 22 and the shield conductor layer 4 of the shield cable 1. Is irradiated.

In the third embodiment, the same effect as in the first embodiment can be obtained.
Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

(Embodiment 4)
FIG. 6 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 4 of the present invention, and the same reference numerals are given to the same portions as those in FIG.
Since the laser irradiation mechanism 11, the first to fourth lenses 20 to 23, the shield cable holding mechanism, and the cable slide mechanism are the same as those in the first embodiment, description thereof is omitted.

  The laser processing apparatus of FIG. 6 has a rotary reflection mirror 51 provided with a rotary drive mechanism (not shown). The rotary reflection mirror 51 can change the reflection mirror in the first to fourth directions by a rotation driving mechanism. The rotary reflection mirror 51 is adjusted by adjusting the rotation reflection mirror 51 in the first to fourth directions. The laser beam can be reflected in the first to fourth directions 61 to 64.

  The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the first direction 61 by the rotary reflection mirror 51 adjusted in the first direction, reflected in the fifth direction 65 by the first reflection mirror 52, The reflected laser light 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the first lens 20.

  The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the second direction 62 by the rotary reflection mirror 51 adjusted in the second direction, reflected in the sixth direction 66 by the second reflection mirror 53, The reflected laser light 12 is applied to the shield conductor layer 4 of the shield cable 1 through the second lens 21.

  The laser beam 12 emitted from the laser irradiation mechanism 11 is reflected in the third direction 63 by the rotary reflection mirror 51 adjusted in the third direction, reflected in the seventh direction 67 by the third reflection mirror 54, and The reflected laser light 12 is applied to the shield conductor layer 4 of the shield cable 1 through the third lens 22.

  The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the fourth direction 64 by the rotary reflection mirror 51 adjusted in the fourth direction, and is reflected in the eighth direction 68 by the fourth reflection mirror 55. The reflected laser beam 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the fourth lens 23.

In the fourth embodiment, the same effect as in the first embodiment can be obtained.
Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

(Embodiment 5)
FIG. 7 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 5 of the present invention, and the same parts as those in FIG.
Since the first to fourth lenses 20 to 23, the shield cable holding mechanism, and the cable slide mechanism are the same as those in the first embodiment, description thereof is omitted.
This laser processing apparatus has first to fourth laser irradiation mechanisms 71 to 74.

  The laser light emitted from each of the first to fourth laser irradiation mechanisms 71 is irradiated to the shield conductor layer 4 of the shield cable 1 through each of the first to fourth lenses 20 to 23.

In the fifth embodiment, the same effect as in the first embodiment can be obtained.
Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

(Embodiment 6)
FIG. 8 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 6 of the present invention, and the same parts as those in FIG.
Since the shielded cable holding mechanism and the cable sliding mechanism are the same as those in the first embodiment, the description thereof is omitted.

  This laser processing apparatus includes first and second laser irradiation mechanisms 81 and 82, a first reflecting mirror 83, a second reflecting mirror 84, a first parabolic mirror 85, and a second emitting mirror. And an object mirror 86. Each of the first reflection mirror 83 and the second reflection mirror 84 can be freely slid on the optical axis of the laser beam by a slide mechanism. Each of the first parabolic mirror 85 and the second parabolic mirror 86 can be used for the shielded cable 1 even if the first reflecting mirror 83 and the second reflecting mirror 84 are slid by the slide mechanism and the positions thereof are changed. The shield conductor layer 4 is configured to be irradiated with laser light.

  Next, a method for cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 8 will be described.

  Laser light is emitted from the first laser irradiation mechanism 81, the laser light is reflected by the first reflecting mirror 83 and the first parabolic mirror 85, and the reflected laser light is the shield conductor of the shield cable 1. Layer 4 is irradiated.

  Next, after the first reflection mirror 83 is slid by the slide mechanism, laser light is emitted from the first laser irradiation mechanism 81, and the laser light is emitted from the first reflection mirror 83 and the first parabolic mirror 85. The reflected laser light is irradiated onto the shield conductor layer 4 of the shielded cable 1.

  Next, laser light is emitted from the second laser irradiation mechanism 82, the laser light is reflected by the second reflecting mirror 84 and the second parabolic mirror 86, and the reflected laser light is reflected on the shield cable 1. The shield conductor layer 4 is irradiated.

  Next, after the second reflection mirror 84 is slid by the slide mechanism, the second laser irradiation mechanism 82 irradiates laser light, and the laser light is emitted from the second reflection mirror 84 and the second parabolic mirror 86. The reflected laser light is irradiated onto the shield conductor layer 4 of the shielded cable 1.

In the sixth embodiment, the same effect as in the first embodiment can be obtained.
Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

  In the sixth embodiment, the second parabolic mirror 86 is used, but a third reflecting mirror may be used instead of the second parabolic mirror 86. In this case, it becomes possible to irradiate the shield conductor layer with laser light from three directions that are substantially perpendicular to the longitudinal direction of the shield cable.

(Embodiment 7)
FIG. 9 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 7 of the present invention, and the same parts as those in FIG.
Since the laser irradiation mechanism 11 is the same as that of the first embodiment, the description thereof is omitted.
The laser processing apparatus includes a lens 91, a motor 93 that rotates the shield cable 1, and a belt 92 that transmits the rotational driving force of the motor 93 to the shield cable 1.

  The laser beam irradiated from the laser irradiation mechanism 11 is irradiated to the shield conductor layer 4 of the shield cable 1 through the lens 91. At this time, by rotating the shield cable 1 by the motor 93 and the belt 92, the laser light is irradiated to the shield conductor layer from at least three directions.

  Also in the seventh embodiment, the same effect as in the first embodiment can be obtained.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 1 of this invention. It is a figure which shows the shielded cable after the whole shield conductor layer was melt-cut completely and the shield conductor layer was peeled off. It is a modification of Embodiment 1, and is a figure explaining the method to cut | disconnect simultaneously the shield conductor layer of each shield cable arranged in multiple numbers. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 2 of this invention. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 3 of this invention. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 4 of this invention. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 5 of this invention. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 6 of this invention. It is a schematic diagram which shows the structure of the laser processing apparatus by Embodiment 7 of this invention. It is sectional drawing which shows the structural example of the conventional shield cable. It is a figure explaining the method by which the shield layer 4 of the shielded cable shown in FIG. 10 is cut | disconnected with a laser beam, and the problem by the method.

Explanation of symbols

1 Shielded cable 2 Inner conductor (center conductor)
3 Internal insulator (internal dielectric)
4 Outer conductor (shield conductor layer)
4a Shielded wire 5 Jacket (jacket)
6 Side surface of shield conductor layer 7 Part where internal insulator is damaged 11 Laser irradiation mechanism 12 Laser beam 13-19 First to seventh reflection mirrors 20-23 First to fourth lenses 24, 25 Arrows 26, 28 Mirror Slide unit 26a, 28a Reflective mirror 27a First rotating lens 27b Second rotating lens 31-38 First to eighth directions 43, 45, 48 First to third half mirrors 51 Rotating reflecting mirrors 52-55 First 1st-4th reflection mirror 61-68 1st-8th direction 71-74 1st-4th laser irradiation mechanism 81 1st laser irradiation mechanism 82 2nd laser irradiation mechanism 83 1st reflection mirror 84 Second reflecting mirror 85 First parabolic mirror 86 Second parabolic mirror 91 Lens 92 Belt 93 Motor

Claims (14)

Preparing a shielded cable comprising a central conductor, an internal insulator arranged to cover the central conductor, and a shield conductor layer arranged to cover the internal insulator;
Cutting the shield conductor layer by irradiating the shield conductor layer with laser light from at least three directions which are substantially perpendicular to the longitudinal direction of the shield cable;
A method of cutting a shield conductor layer, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °.   2. The method for cutting a shield conductor layer according to claim 1, wherein an angle formed by the two optical axes is 150 [deg.] Or less.   3. The shield according to claim 1, wherein the shield conductor layer is irradiated with laser light from four directions, and the optical axes of laser beams that are not adjacent to each other are arranged in a substantially straight line. Cutting method of conductor layer.   4. When preparing the shielded cable according to claim 1, preparing a plurality of shielded cables, and irradiating the shield conductor layer with laser light, the laser light or the shielded cable A method of cutting a shield conductor layer, wherein the laser beam is scanned and irradiated by sliding. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A laser irradiation mechanism for irradiating laser light;
A first reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in a first direction or a second direction;
A second reflecting mirror that reflects the laser beam reflected in the first direction by the first reflecting mirror in a third direction;
A third reflection mirror that reflects the laser light reflected in the third direction by the second reflection mirror in a fourth direction and irradiates the shield conductor layer;
A mirror slide mechanism that slides so as to remove the third reflection mirror from the optical axis of the laser beam reflected in the third direction;
The laser beam reflected in the third direction by the second reflecting mirror in a state where the third reflecting mirror is removed from the optical axis of the laser beam reflected in the third direction. A fourth reflecting mirror that reflects in the direction of 5 and irradiates the shield conductor layer;
A fifth reflecting mirror that reflects the laser light reflected in the second direction by the first reflecting mirror in a sixth direction;
A sixth reflecting mirror that reflects the laser light reflected in the sixth direction by the fifth reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A laser irradiation mechanism for irradiating laser light;
A first reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in a first direction or a second direction;
A second reflecting mirror that reflects the laser beam reflected in the first direction by the first reflecting mirror in a third direction;
A third reflection mirror that irradiates the shield conductor layer with the laser light reflected in the third direction by the second reflection mirror in a fourth direction or a fifth direction; 1 mirror slide unit,
A first slide mechanism for sliding the third reflection mirror provided in the first mirror slide unit;
A first rotating mechanism for rotating the third reflecting mirror provided in the first mirror slide unit;
A fourth reflecting mirror that reflects the laser light reflected in the second direction by the first reflecting mirror in a sixth direction;
A fifth reflecting mirror that reflects the laser light reflected in the sixth direction by the fourth reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °.   7. The rotating lens according to claim 6, further comprising: a rotating lens that is disposed on an optical axis of the laser light emitted from each of the fourth direction, the fifth direction, and the seventh direction, and is rotated by a rotating mechanism. A laser processing apparatus comprising: In claim 6, a second mirror slide unit is arranged in place of the fifth reflection mirror,
The second mirror slide unit irradiates the shield conductor layer by reflecting the laser beam reflected in the sixth direction by the fourth reflecting mirror in a seventh direction or an eighth direction. A fifth reflecting mirror,
The second mirror slide unit includes a second slide mechanism that slides the fifth reflection mirror, and a second rotation mechanism that rotates the fifth reflection mirror. Laser processing equipment. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A laser irradiation mechanism for irradiating laser light;
A first half mirror that reflects part of the laser light emitted by the laser irradiation mechanism in a first direction and transmits part of the laser light;
A first reflecting mirror that reflects the laser light reflected in the first direction by the first half mirror in a second direction;
A part of the laser beam reflected in the second direction by the first reflecting mirror is reflected in a third direction to irradiate the shield conductor layer and to transmit a part of the laser beam. Half mirror and
A second reflection mirror that reflects the laser light transmitted by the second half mirror in a fourth direction and irradiates the shield conductor layer;
A third reflecting mirror that reflects the laser light transmitted by the first half mirror in a fifth direction and irradiates the shield conductor layer;
Comprising
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A laser irradiation mechanism for irradiating laser light;
A rotary reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in first to third directions;
A first reflection mirror that reflects the laser light reflected in the first direction by the rotary reflection mirror in a fourth direction and irradiates the shield conductor layer;
A second reflecting mirror that reflects the laser light reflected in the second direction by the rotary reflecting mirror in a fifth direction and irradiates the shield conductor layer;
A third reflection mirror that reflects the laser light reflected in the third direction by the rotary reflection mirror in a sixth direction and irradiates the shield conductor layer;
Comprising
The rotation reflection mirror has a rotation mechanism for rotating the rotation reflection mirror, and adjusts the direction of the rotation reflection mirror by the rotation mechanism,
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A first laser irradiation mechanism for irradiating the shield conductor layer with a first laser beam;
A second laser irradiation mechanism for irradiating the shield conductor layer with a second laser beam;
A third laser irradiation mechanism for irradiating the shield conductor layer with a third laser beam;
Comprising
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A first laser irradiation mechanism for irradiating a first laser beam in a first direction;
A first reflecting mirror that reflects the first laser beam irradiated by the first laser irradiation mechanism in a second direction;
A slide mechanism for sliding the first reflecting mirror along the first direction;
A first paraboloid that reflects the first laser beam reflected in the second direction by the first reflecting mirror in a third direction or a fourth direction to irradiate the shield conductor layer. With a mirror,
A second laser irradiation mechanism for irradiating a second laser beam in a fifth direction that is parallel to the first direction and rotated by approximately 180 °;
A second reflecting mirror that reflects the second laser light irradiated by the second laser irradiation mechanism in a sixth direction;
A third reflecting mirror that reflects the second laser light reflected in the sixth direction by the second reflecting mirror in a seventh direction and irradiates the shield conductor layer;
Comprising
The first parabolic mirror reflects the first laser light in the third direction or the fourth direction by sliding the first reflecting mirror by the sliding mechanism. ,
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °.   13. The slide mechanism according to claim 12, further comprising a second parabolic mirror instead of the third reflection mirror, the slide mechanism configured to slide the second reflection mirror along the fifth direction, The second parabolic mirror reflects the second laser light in the seventh direction or the eighth direction by sliding the second reflecting mirror by the sliding mechanism. A featured laser processing apparatus. A shield cable comprising a center conductor, an internal insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the internal insulator is held, and the length of the shield cable A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with a laser beam from a direction substantially perpendicular to a direction;
A laser irradiation mechanism for irradiating the shield conductor layer with laser light;
A rotating mechanism for rotating the shielded cable;
Comprising
The laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °.

Images