WO2007125677A1

WO2007125677A1 - Shield conductor layer cutting method and laser treatment device

Info

Publication number: WO2007125677A1
Application number: PCT/JP2007/053482
Authority: WO
Inventors: Atsushi Miyakoshi; Tadashi Kurata
Original assignee: Phoeton Corp.
Priority date: 2006-04-26
Filing date: 2007-02-26
Publication date: 2007-11-08
Also published as: KR20080091168A; CN101378876A; KR101026428B1; TW200802415A; JP2007290013A

Abstract

Provided are a shield conductor cutting method and a laser treatment device capable of sufficiently assuring insulation between an internal conductor and a shield conductor layer without leaving a shield line not cut on the shield conductor layer side. The shield conductor layer cutting method includes: a step of preparing a shield cable (1) having a center conductor, an internal insulator arranged to cover the center core, and a shield conductor arranged to cover the internal insulator; and a step of applying a laser beam (12) to the shield conductor layer from at least three directions substantially vertical to the longitudinal direction of the shield cable (1). The angle defined by the two adjacent optical axes of the laser beam applied to the shield conductor layer is less than 180 degrees.

Description

Specification

Shield conductor layer cutting method and laser processing apparatus

Technical field

TECHNICAL FIELD [0001] The present invention relates to a shield conductor layer cutting method and a laser heating device that do not leave uncut shield wires on the side surfaces of a shield conductor layer and that can sufficiently ensure insulation between an inner conductor and a shield conductor layer. .

Background art

[0002] In recent years, with the spread of notebook computers, mobile phones, small video cameras, etc., these information and communication devices have become smaller, lighter, and faster.

RU To cope with this, very thin electric wires (sometimes called cables) are used in which an inner insulator, an outer conductor, and a jacket are sequentially formed on the outer circumference of the inner conductor in a coaxial manner. In addition, similar wires are used as shield wires to prevent unwanted noise from entering other control devices such as medical ultrasonic probes. Hereinafter, the coaxial cable or shielded cable including the shielded cable will be referred to as a shielded cable.

[0003] Normally, a plurality of shielded cables are used by bundling them, and the ends thereof are made flat and connected to an electrical connector. When connecting to the electrical connector, it is necessary to form a terminal for electrically connecting the inner conductor and the outer conductor to the shielded cable. However, if the outer diameter of the cable is as fine as lmm or less and the thickness of the internal insulator is about several tens / zm, it is easy to form a connection terminal without impairing the cable arrangement pitch and electrical performance. is not. For this reason, various proposals have been made so far on the formation of this type of shielded cable end.

FIG. 10 is a cross-sectional view showing a structural example of a conventional shielded cable.

The inner conductor (center conductor) 2 is formed by twisting a copper alloy wire with tinned outer diameter of about 0.025 mm, for example, and its outer surface is made of an insulating material made of fluorine resin with a thickness of 0.04mn! ~ 0.055mm is covered to make an internal insulator (internal dielectric) 3. The outer conductor (shield conductor layer) 4 arranged on the outer peripheral surface of the inner insulator 3 is formed by, for example, winding shield wires 4a such as a plurality of copper alloy wires having an outer diameter of about 0.03 mm on the side, About 0.004 thick on its outer surface Two pieces of polyester tape having a thickness of about mm are overlapped and fused together to form a jacket (jacket) 5 so that a shielded cable 1 having an outer diameter of about 0.3 mm or less can be obtained. A copper vapor-deposited tape (not shown) may be wrapped around the outer surface of the shield conductor layer 4 with the copper vapor-deposited surface inside, and the shield conductor layer 4 has two layers with the shield wire in the opposite direction. In addition to this, it may be a braided structure (for example, see Patent Document 1).

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[0005] Next, a method for cutting the shield conductor layer in the conventional shielded cable will be described.

FIG. 11 is a diagram for explaining a method of cutting the shield layer 4 of the shielded cable shown in FIG. 10 with a laser beam and problems caused by the method. In FIG. 11, the shield conductor layer 4 and the inner conductor 2 are schematically shown. However, in FIG. 11, the actual structure is the same as the shield conductor layer 4 and the inner conductor 2 shown in FIG. .

[0006] First, the shielded cable 1 with the jacket 5 peeled off as shown in FIG. 10 is fixed and held by a holding mechanism (not shown), and laser light is directed to the shield conductor layer 4 from above the shielded cable as indicated by an arrow. Irradiate while scanning. Next, the downward force of the shield cable 1 is also applied to the shield conductor layer 4 while scanning the laser beam as indicated by the arrow. In this way, the shield conductor layer 4 is cut by irradiating the entire shield conductor layer 4 with laser light.

Patent Document 1: Japanese Patent Application Laid-Open No. 2005-251522 (0002, paragraph 0016, 01)

Disclosure of the invention

Problems to be solved by the invention

[0008] In the above-described method of cutting the shield conductor layer with the laser beam, the laser beam is applied to the shield conductor layer 4 from the upper and lower directions. Both the light and the laser beam from below are blocked by the adjacent shield line 4a, and the laser beam irradiation becomes insufficient. As a result, the shield wire 4a may remain without being cut at the side surface 6 of the shield conductor layer.

On the other hand, when the laser beam is irradiated on the side surface 6 of the shield conductor layer under a high output condition such that the shield wire 4a is completely cut, the shield positioned in front of the laser beam irradiation direction is used. The laser light penetrates the conductor layer 4 and the laser light reaches the internal insulator 3, and as a result, a portion 7 in which the internal insulator is damaged as shown in FIG. 11 is generated. In this portion 7, since the electrical insulation of the internal insulator 3 is lowered, it may be impossible to sufficiently secure the insulation between the internal conductor 2 and the shield conductor layer 4.

[0010] Further, in the above-described conventional cutting method, when the number of scans is increased, the shield conductor layer is melted and cut regardless of the scan speed, or the number of scans is decreased immediately. . In addition, damage to the internal dielectric when the number of scans is increased tends to be reduced as the scan speed increases.

[0011] As described above, the shield conductor layer side surface 6 is not cut and the shield wire 4a remains or the internal insulator is damaged. It is thought that there is a cause in irradiation from two directions.

[0012] The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to prevent the shield wire from being left on the side surface of the shield conductor layer and the inner conductor and the shield conductor layer. It is an object of the present invention to provide a method for cutting a shield conductor layer and a laser processing apparatus capable of sufficiently ensuring the insulation.

Means for solving the problem

[0013] In order to solve the above problems, a method of cutting a shield conductor layer according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and the internal insulator. Prepare a shielded cable with a shield conductor layer arranged so that

The shield conductor layer is cut by irradiating the shield conductor layer with laser light from at least three directions which are substantially perpendicular to the longitudinal direction of the shield cable.

The angle formed by two adjacent optical axes of the laser light applied to the shield conductor layer is less than 180 °.

[0014] According to the method for cutting the shield conductor layer, since the laser beam is irradiated to the shield conductor layer from at least three directions, the laser beam is applied to the shield conductor layer from the upper and lower two directions as in the prior art. Compared to irradiation, the shield conductor layer can be prevented from remaining on the side of the shield conductor layer. ヽ The shield conductor layer can be prevented from remaining, and the entire shield conductor layer can be completely and stably maintained. Can be cut. At the same time, by irradiating the laser light from at least three directions, even if the laser light is irradiated under the condition that all the shield conductor layers are completely cut, a part of the internal insulator is damaged. This can be suppressed. Therefore, it is possible to prevent the electrical insulation of the internal insulator from being deteriorated, and to sufficiently ensure the insulation between the internal conductor and the shield conductor layer.

[0015] Further, in the method for cutting the shield conductor layer according to the present invention, it is preferable that the angle formed by the two optical axes is 150 ° or less.

[0016] Further, according to the method for cutting the shield conductor layer according to the present invention, the shield conductor layer is irradiated with laser light from four directions, and the optical axes of the laser beams that are not adjacent to each other are substantially straight. It is preferable to be arranged to form.

[0017] Further, according to the method for cutting a shield conductor layer according to the present invention, when preparing the shield cable, a plurality of shield cables arranged in series are prepared, and the shield conductor layer is irradiated with laser light. At this time, it is preferable that the laser light or the shielded cable be slid to scan the laser light.

[0018] A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A laser irradiation mechanism for irradiating laser light;

A first reflecting mirror that reflects the laser beam irradiated by the laser irradiation mechanism in a first direction or a second direction;

A second reflecting mirror for reflecting the laser beam reflected in the first direction by the first reflecting mirror in a third direction;

A third reflection mirror that reflects the laser light reflected in the third direction by the second reflection mirror in a fourth direction and irradiates the shield conductor layer;

A mirror slide mechanism that slides so as to remove the third reflecting mirror from the optical axis of the laser beam reflected in the third direction; The laser light reflected in the third direction by the second reflecting mirror in a state where the third reflecting mirror is removed from the optical axis of the laser light reflected in the third direction. A fourth reflecting mirror that reflects in the direction of 5 and irradiates the shield conductor layer; and a laser beam that reflects in the second direction by the first reflecting mirror reflects in the sixth direction. With 5 reflection mirrors,

A sixth reflecting mirror that reflects the laser light reflected in the sixth direction by the fifth reflecting mirror in a seventh direction and irradiates the shield conductor layer; and

A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device that holds a cable and cuts the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A laser irradiation mechanism for irradiating laser light;

A third reflecting mirror for reflecting the laser light reflected in the third direction by the second reflecting mirror in the fourth direction or the fifth direction and irradiating the shield conductor layer; A first mirror slide unit;

A first slide mechanism for sliding the third reflecting mirror provided in the first mirror slide unit;

A first rotating mechanism for rotating the third reflecting mirror provided in the first mirror slide unit;

The laser beam reflected in the second direction by the first reflecting mirror is A fourth reflecting mirror that reflects in the direction of

A fifth reflecting mirror that reflects the laser light reflected in the sixth direction by the fourth reflecting mirror in a seventh direction and irradiates the shield conductor layer; and

[0020] Further, in the laser processing apparatus according to the present invention, each of the fourth direction, the fifth direction, and the seventh direction may be respectively rotated on an optical axis of the laser beam irradiated with force. It is also possible to further include a rotating lens arranged to rotate.

[0021] Further, in the laser processing apparatus according to the present invention, a second mirror slide unit is arranged instead of the fifth reflecting mirror,

The second mirror slide unit irradiates the shield conductor layer by reflecting the laser beam reflected in the sixth direction by the fourth reflecting mirror in a seventh direction or an eighth direction. A fifth reflecting mirror that

The second mirror slide unit may include a second slide mechanism that slides the fifth reflection mirror and a second rotation mechanism that rotates the fifth reflection mirror. is there.

[0022] A laser processing apparatus according to the present invention comprises a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A laser irradiation mechanism for irradiating laser light;

A first half mirror that reflects a part of the laser light irradiated by the laser irradiation mechanism in a first direction and transmits a part of the laser light;

A first reflecting mirror that reflects the laser light reflected in the first direction by the first half mirror in a second direction;

A part of the laser beam reflected in the second direction by the first reflecting mirror; A second half mirror that reflects in a third direction and irradiates the shield conductor layer and transmits a part of the laser beam;

A second reflecting mirror that reflects the laser light transmitted by the second half mirror in a fourth direction and irradiates the shield conductor layer;

A third reflecting mirror that reflects the laser light transmitted by the first half mirror in a fifth direction and irradiates the shield conductor layer;

Comprising

[0023] Further, in the laser processing apparatus according to the present invention, a part of the laser light that is disposed between the first half mirror and the third reflection mirror and transmitted by the first half mirror. It is also possible to further include a third half mirror that reflects the light in the sixth direction to irradiate the shield conductor layer and transmits a part of the laser light.

[0024] A laser processing apparatus according to the present invention comprises a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A laser irradiation mechanism for irradiating laser light;

A rotary reflection mirror that reflects the laser light emitted by the laser irradiation mechanism in first to third directions;

A first reflection mirror that reflects the laser light reflected in the first direction by the rotary reflection mirror in a fourth direction and irradiates the shield conductor layer;

A second reflecting mirror that reflects the laser light reflected in the second direction by the rotary reflecting mirror in a fifth direction and irradiates the shield conductor layer;

A third reflection mirror that reflects the laser light reflected in the third direction by the rotary reflection mirror in a sixth direction and irradiates the shield conductor layer;

Comprising The rotating reflection mirror has a rotating mechanism for rotating the rotating reflecting mirror, and adjusts the direction of the rotating reflecting mirror by the rotating mechanism;

[0025] A laser processing apparatus according to the present invention includes a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A first laser irradiation mechanism that irradiates the shield conductor layer with a first laser beam; a second laser irradiation mechanism that irradiates the shield conductor layer with a second laser beam; and a shield that applies a third laser beam to the shield conductor layer. A third laser irradiation mechanism for irradiating the conductor layer, and

The angle formed by two adjacent optical axes of the laser light irradiated to the shield conductor layer is 180.

It is less than °.

[0026] A laser processing apparatus according to the present invention comprises a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A first laser irradiation mechanism for irradiating the first laser beam in the first direction;

A first reflecting mirror that reflects the first laser beam irradiated by the first laser irradiation mechanism in a second direction;

A slide mechanism that slides the first reflection mirror along the first direction; and the first laser light reflected by the first reflection mirror in the second direction.

A first parabolic mirror that reflects in a third direction or a fourth direction and irradiates the shield conductor layer;

The second laser beam is parallel to the first direction and rotated in the fifth direction by approximately 180 °. A second laser irradiation mechanism for irradiating;

A second reflecting mirror for reflecting the second laser light irradiated by the second laser irradiation mechanism in a sixth direction;

A third reflection mirror that reflects the second laser light reflected in the sixth direction by the second reflection mirror in a seventh direction and irradiates the shield conductor layer; and

The first parabolic mirror reflects the first laser beam in the third direction or the fourth direction by sliding the first reflecting mirror by the sliding mechanism. ,

In the laser processing apparatus according to the present invention, a second parabolic mirror is provided instead of the third reflecting mirror, and the second reflecting mirror is slid along the fifth direction. The second parabolic mirror has a sliding mechanism, and the second laser beam is moved in the seventh direction or the eighth direction by sliding the second reflecting mirror by the sliding mechanism. It can also be reflected.

[0027] A laser processing apparatus according to the present invention comprises a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator. A laser carriage device for holding the shielded cable and cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to the longitudinal direction of the shield cable;

A laser irradiation mechanism for irradiating the shield conductor layer with laser light;

A rotating mechanism for rotating the shielded cable;

Comprising

The invention's effect

[0028] As described above, according to the present invention, the shield without being cut on the side surface of the shield conductor layer. It is possible to provide a shield conductor layer cutting method and a laser processing apparatus in which no wire remains and sufficient insulation between the inner conductor and the shield conductor layer can be secured.

Brief Description of Drawings

FIG. 1 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a diagram showing the shielded cable after the entire shield conductor layer has been completely melted and cut and the shield conductor layer is peeled off.

FIG. 3 is a diagram for explaining a method of simultaneously cutting a shield conductor layer of each of a plurality of shielded cables arranged as a modification of the first embodiment.

FIG. 4 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 2 of the present invention.

FIG. 5 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 3 of the present invention.

FIG. 6 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 4 of the present invention.

FIG. 7 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 5 of the present invention.

FIG. 8 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 6 of the present invention.

FIG. 9 is a schematic diagram showing a configuration of a laser processing apparatus according to a seventh embodiment of the present invention.

FIG. 11 is a diagram for explaining a method of cutting the shield layer 4 of the shielded cable shown in FIG. 10 with a laser beam and problems caused by the method.

Explanation of symbols

[0030] 1 Sino Red Cape Nore

2 Inner conductor (center conductor)

3 Internal insulator (internal dielectric)

4 External conductor (shield conductor layer)

4a Sino Red Line

5 Jacket (jacket)

6 Side of shield conductor layer

7 Parts where internal insulation is damaged

11 Laser irradiation mechanism 13-19 First to seventh reflection mirrors

20-23 First to fourth lenses

24, 25 arrows

26, 28 Mirror slide unit

26a, 28a Reflective mirror

27a First rotating lens

27b Second rotating lens

31 '-38 1st to 8th directions

43, 45, 48 1st to 3rd noise mirror

51 Rotating reflection mirror

52 '-55 1st to 4th reflection mirror

61 '-68 1st to 8th directions

71 '-74 1st to 4th laser irradiation mechanism

81 First laser irradiation mechanism

82 Second laser irradiation mechanism

83 First reflection mirror

84 Second reflection mirror

85 First parabolic mirror

86 Second parabolic mirror

91 lenses

92 Benoleto

93 Motor

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)

FIG. 1 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 1 of the present invention. This laser cable apparatus cuts the shield conductor layer 4 by irradiating the shield conductor layer 4 in the shield cable 1 shown in FIGS. It is a device to do. The shielded cable 1 is an ultra-fine coaxial wire such as AWG (American Wire Gauge) 30 or more, and the shield conductor layer 4 is composed of a plurality of shield wires 4a as shown in FIG. The material is AWG42, for example, a tin-plated copper alloy wire with an outer diameter of about 0.03mm. The shield wire that can be covered by the laser calorie apparatus according to the present embodiment is a silver-plated copper alloy wire, aluminum foil, etc. in addition to a tin-plated copper alloy wire.

The laser processing apparatus of FIG. 1 includes a laser irradiation mechanism 11 that irradiates a laser beam 12, first to seventh reflecting mirrors 13 to 19, first to fourth lenses 20 to 23, and a mirror slide. And a mechanism (not shown). The laser light emitted from the laser irradiation mechanism 11 is, for example, a YAG fundamental wave pulse laser (wavelength = 1064 nm). The shielded cable 1 is held by a holding mechanism (not shown) in the laser processing apparatus. The shield cable 1 is provided with a cable slide mechanism (not shown) that slides when the laser beam is irradiated.

The laser beam 12 emitted from the laser irradiation mechanism 11 is reflected in the first direction 31 by the first reflecting mirror 13 and about 90 ° with respect to the first direction 31 by the second reflecting mirror 14. Is reflected in the second direction 32 bent by the second angle, and reflected in the third direction 33 by the third reflecting mirror 15, and the reflected laser light 12 passes through the first lens 20 and the shield lens 1 The shield conductor layer 4 is irradiated. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

[0034] The third reflection mirror 15 can be slid by a mirror slide mechanism (not shown) to a position off the optical axis of the laser light reflected by the second reflection mirror 14! /, The In a state where the third reflecting mirror 15 is slid by the mirror sliding mechanism and the optical axis force is also removed, the laser light 12 irradiated from the laser irradiation mechanism 11 is moved in the first direction 31 by the first reflecting mirror 13. Reflected and reflected by the second reflecting mirror 14 in the second direction 32 bent by about 90 ° with respect to the first direction 31 and reflected by the fourth reflecting mirror 16 in the fourth direction 34. The reflected laser beam 12 is irradiated to the shield conductor layer 4 of the shielded cable 1 through the second lens 21. At this time, scan the shield conductor layer. In order to shoot, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

The first reflecting mirror 13 reflects the laser beam 12 irradiated by the laser irradiation mechanism 11 in a fifth direction 35 rotated by 180 ° with respect to the first direction 31. A drive mechanism (not shown) that can change the direction of the reflecting mirror 13 is attached. The sixth reflecting mirror 18 can be slid by a mirror slide mechanism (not shown) to a position where the optical axis force of the laser beam reflected by the seventh reflecting mirror 19 is also removed. The laser irradiated from the laser irradiation mechanism 11 while changing the direction of the first reflection mirror 13 by the drive mechanism and sliding the sixth reflection mirror 18 by the mirror slide mechanism to remove the optical axis force. The light 12 is reflected by the first reflecting mirror 13 in the fifth direction 35, and reflected by the seventh reflecting mirror 19 in the sixth direction 36 bent by about 90 ° with respect to the fifth direction 35. Then, the light is reflected in the eighth direction 38 by the fifth reflecting mirror 17, and the reflected laser light 12 is irradiated to the shield conductor layer 4 of the shielded cable 1 through the third lens 22. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the sixth direction 36.

The laser beam 12 emitted from the laser irradiation mechanism 11 in a state where the sixth reflection mirror 18 is slid by the mirror slide mechanism and returned to the optical axis, is transmitted by the first reflection mirror 13. 5 reflected in the direction 35, reflected by the seventh reflecting mirror 19 in the sixth direction 36 bent by about 90 ° with respect to the fifth direction 35, and reflected by the sixth reflecting mirror 18 in the seventh direction. The reflected laser beam 12 is reflected by 37, and the shielded conductor layer 4 of the shielded cable 1 is irradiated through the fourth lens 23. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid in the direction parallel to the sixth direction 36 by the cable slide mechanism.

[0037] The laser processing apparatus also includes a control unit (not shown). The control unit changes the direction of the first reflection mirror 13, the third reflection mirror 15, and the sixth reflection mirror 18. The mirror slide mechanism that slides each of them and the laser irradiation mechanism 11 are controlled. Next, a method for cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 1 will be described.

First, the jacket 5 of the shielded cable 1 shown in FIG. 10 is peeled off for a predetermined length to expose the shield conductor layer. The shielded cable 1 in this state is fixed and held by the holding mechanism of the laser carriage device shown in FIG.

[0039] Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first to third reflecting mirrors 13 to 15, and the reflected laser beam 12 is reflected to the first lens. The light passes through 20 and is irradiated from the third direction 33 to the shield conductor layer 4 of the shielded cable 1. At this time, the shield conductor layer 1 is slid by the cable slide mechanism to scan the shield conductor layer.

Next, the third reflection mirror 15 is slid by the mirror slide mechanism to a position deviated from the optical axis force of the laser light reflected by the second reflection mirror 14. Next, the laser irradiation mechanism 11 also irradiates the laser beam 12, and this laser beam 12 is reflected by the first, second and fourth reflecting mirrors 13, 14 and 16, and the reflected laser beam 12 is reflected by the second laser beam 12. The shield conductor layer is irradiated from the fourth direction 34 through the lens 21. At this time, the shield conductor layer 1 is slid by the cable slide mechanism to irradiate the shield conductor layer.

Next, the direction of the first reflecting mirror 13 is changed by the drive mechanism, and the laser irradiation mechanism 11 also irradiates the laser beam 12, which is reflected by the first, seventh and fifth reflecting mirrors 13, 19. , 17, and the reflected laser light 12 is irradiated to the shield conductor layer 4 from the seventh direction 37 through the third lens 22. At this time, the shield conductor layer is slid by the cable slide mechanism to scan the shield conductor layer.

Next, the sixth reflection mirror 18 is slid by the mirror slide mechanism on the optical axis of the laser beam reflected by the seventh reflection mirror 19. Next, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first, seventh, and sixth reflecting mirrors 13, respectively, and the reflected laser beam 12 is reflected by the fourth laser beam 12. The shield conductor layer is irradiated through the lens 23 from the eighth direction 38. At this time, connect the shielded cable 1 to the cable The shield conductor layer is scanned and irradiated by sliding with an id mechanism.

[0043] In this way, the shielded cable 1 after the entire shield conductor layer is completely melted and cut and the shield conductor layer is peeled off has the internal insulator exposed as shown in FIG. As shown in Fig. 2, the center conductor 2 is exposed at the distal end of the shielded cable 1 after cutting, and the inner insulator 3 covering the center conductor 2 is also exposed, and the shield covering the inner insulator 3 is exposed. The conductor layer is cut at the laser irradiation position. There is a shield conductor layer between the jacket 5 and the inner insulator 3.

[0044] According to the first embodiment, the shield conductor layer 4 is irradiated with the laser light from the four directions. Therefore, the shield conductor layer 4 is irradiated with the laser light from the upper and lower directions as in the prior art. In comparison with this, it is possible to suppress the laser beam from being shielded by the adjacent shield line and insufficiently irradiating the laser beam. As a result, it is possible to prevent the shield wire from remaining without being cut even on the side surface of the shield conductor layer, and to completely and stably melt and cut the shield conductor layer. At the same time, by irradiating the laser beam from four directions, even if the laser beam is irradiated under the condition that all the shield wires are completely cut, the irradiation condition of the high-power laser beam is the same as the conventional technology. There is no need to For this reason, it is possible to suppress the occurrence of a scratched portion in the internal insulator where the laser light does not penetrate through the shield conductor layer and reach the internal insulator 3. Therefore, it is possible to prevent the electrical insulation property of the inner insulator 3 from being lowered, and to sufficiently secure insulation between the inner conductor 2 and the shield conductor layer 4.

In the present embodiment, the irradiation direction in which the shield conductor layer is irradiated with the laser light is such that the optical axes of the laser beams that are not adjacent to each other form a straight line as shown in FIG. . By adopting such a direction, the entire shield conductor layer can be reliably melted and cut with a laser beam having a lower output.

In this embodiment, the shield conductor layer is irradiated with laser light from four directions. However, the present invention is not limited to this, and the shield conductor layer may be irradiated with laser light from three directions. The shield conductor layer may be irradiated with laser light from five or more directions. In this case, the angle formed by two adjacent optical axes of the laser light irradiated to the shield conductor layer may be less than 180 °, but it is more preferable that the angle is less than 150 °. Is obtained. [0047] In the present embodiment, the force using an irradiation method (scan irradiation) for scanning the shield conductor layer with laser light is not limited to this, and the following modifications are made. It is also possible to do. For example, when the shield conductor layer can be cut even if the diameter of the laser beam is larger than the width of the shield conductor layer and the scan conductor is not irradiated, it is possible to irradiate the shield conductor layer without scanning. In addition, even when scan irradiation is not performed, it is possible to perform laser irradiation from one direction multiple times by using a laser output that can be cut by multiple times of laser irradiation of the shield wire, which is a metal thin wire force that constitutes the shield conductor layer. The Also, in the case of scanning irradiation, a shield wire made of a thin metal wire that constitutes the shield conductor layer cannot be cut by a single scanning irradiation, but a laser output that can be cut by a plurality of scanning irradiations, and from one direction. It is also possible to perform multiple laser irradiations.

The laser output that can be cut by multiple times of laser irradiation or multiple times of scan irradiation as described above, compared with the case of laser output that can be cut by one time of laser irradiation or single scan irradiation. This makes it easier to select a laser output that can reduce damage to the internal insulator. In other words, adjusting the laser output that can be cut by multiple laser irradiations or multiple scan irradiations is more effective than adjusting the laser output that can be cut by 1 laser irradiation or 1 scan irradiation. Easy. As a result, damage to the internal insulator can be reduced.

[0048] In this embodiment, the shield conductor layer is scanned and irradiated with laser light by sliding the shield cable with the cable slide mechanism. However, the laser light is slid with the shield cable fixed. It is also possible to scan and irradiate the shield conductor layer with laser light.

[0049] In the present embodiment, as shown in Fig. 1, the force that irradiates the shield conductor layer with the laser beam as well as the four-direction force can also irradiate the shield conductor layer with the laser beam. It is. In this case, a reflection mirror with a mirror slide mechanism similar to the third reflection mirror 15 is arranged between the third reflection mirror 15 and the fourth reflection mirror 16 in the laser carriage device of FIG. By arranging a lens between the reflecting mirror and the shielded cable 1, the laser beam reflected by the reflecting mirror passes through the lens and is shielded. It can be realized by irradiating one shield conductor layer or by arranging a plurality of such reflecting mirrors and lenses. In the laser carriage apparatus of FIG. 1, a reflection mirror with a mirror slide mechanism similar to that of the sixth reflection mirror 18 is arranged between the sixth reflection mirror 18 and the fifth reflection mirror 17, and this By arranging a lens between the reflection mirror and the shield cable 1, the laser light reflected by the reflection mirror can be irradiated to the shield conductor layer of the shield cable through the lens, or such a reflection mirror can be used. Further, this can be realized by arranging a plurality of lenses.

[0050] Further, in the present embodiment, as illustrated in FIG. 1, a force is described for cutting a shield conductor layer of one shielded cable. A plurality of shielded cables is not limited to this. It is also possible to cut each shield conductor layer at the same time. A method in this case will be described below.

[0051] FIG. 3 is a diagram for explaining a method for simultaneously cutting a plurality of shield conductor layers of a plurality of shielded cables, which is a modification of the first embodiment.

Since the laser processing apparatus is the same as Embodiment 1 except that a plurality of shielded cables 1 are arranged in a horizontal row and held by a holding mechanism, description thereof is omitted.

[0052] Further, in order to scan and irradiate the laser beam to the scene red cape 1, the shield cable may be slid in the direction of the arrow 24 by the cable slide mechanism, or the optical system is fixed with the shield cable fixed. May be slid in the direction of arrow 25, or the optical system or shielded cable may be slid back and forth multiple times.

[0053] Effects similar to those of the first embodiment can also be obtained in the above modification.

(Embodiment 2)

FIG. 4 is a schematic diagram showing the configuration of the laser processing apparatus according to Embodiment 2 of the present invention, and the same reference numerals are given to the same parts as those in FIG.

Laser irradiation mechanism 11, first reflecting mirror 13, second reflecting mirror 14, seventh reflecting mirror 1

9. The shielded cable holding mechanism and the cable slide mechanism are the same as those in the first embodiment, and thus the description thereof is omitted.

[0055] The laser beam 12 reflected in the second direction 32 by the second reflecting mirror 14 is reflected in the third direction 33 by the reflecting mirror 26a in the mirror slide unit 26, and is reflected. The laser beam 12 is irradiated to the shield conductor layer 4 of the shield cable 1 through the first rotating lens 27a. At this time, in order to scan the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the second direction 32.

[0056] The mirror slide unit 26 includes a reflection mirror 26a, a slide mechanism (not shown) for sliding the reflection mirror 26a, and a rotation mechanism (not shown) for adjusting the direction of the reflection mirror 26a. ing. The first rotating lens 27a is attached with a rotating mechanism (not shown) that rotates around the shielded cable 1 as indicated by an arrow.

The laser beam 12 reflected in the sixth direction 36 by the seventh reflecting mirror 19 is reflected in the seventh direction 37 by the reflecting mirror 28a in the mirror slide unit 28, and this reflected laser beam 12 Is irradiated to the shield conductor layer 4 of the shield cable 1 through the second rotating lens 27b. At this time, in order to scan and irradiate the shield conductor layer, the shield cable 1 is slid by the cable slide mechanism in a direction parallel to the sixth direction 36.

The mirror slide unit 28 includes a reflection mirror 28a, a slide mechanism (not shown) for sliding the reflection mirror 28a, and a rotation mechanism (not shown) for adjusting the direction of the reflection mirror 28a. The second rotating lens 27b is attached with a rotating mechanism (not shown) that rotates around the shielded cable 1 as indicated by an arrow.

Next, a method for cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 4 will be described.

First, the shield cable 1 with the jacket 5 peeled off for a predetermined length to expose the shield conductor layer is fixed and held by the holding mechanism of the laser processing apparatus shown in FIG.

Next, laser light 12 is emitted from the laser irradiation mechanism 11, and this laser light 12 is reflected by the first and second reflection mirrors 13 and 14 and the reflection mirror 26a in the mirror slide unit, and is reflected. The laser beam 12 passes through the first rotating lens 27a and is applied to the shield conductor layer 4 of the shield cable 1 from the third direction 33. At this time, the reflecting mirror 26a and the first rotating lens 27a are aligned so that the laser light is reflected in the third direction 33 and irradiated to the shield conductor layer. Next, the reflecting mirror 26a is slid in the mirror slide unit 26, and the first rotating lens 27a is rotated. As a result, the reflecting mirror 26a and the first rotating lens 27a are aligned so that the laser light is reflected in the fourth direction 34 and applied to the shield conductor layer. Then, the laser beam 12 is irradiated from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first and second reflecting mirrors 13, 14, and the reflecting mirror 26a, respectively, and the reflected laser beam 12 is reflected by the first laser beam 12. The shield conductor layer is irradiated from the fourth direction 34 through the rotating lens 27a.

Next, the direction of the first reflection mirror 13 is changed by the driving mechanism, and the laser irradiation mechanism 11 also irradiates the laser beam 12, and the laser beam 12 is applied to the first and seventh reflection mirrors 13 and 19 and the mirror 1. The reflected laser beam 12 is reflected by each of the reflecting mirrors 28a in the slide unit 28, and the reflected laser light 12 is irradiated to the shield conductor layer 4 of the shield cable 1 from the seventh direction 37 through the second rotating lens 27b. At this time, the reflecting mirror 28a and the second rotating lens 27b are positioned so that the laser light is reflected in the seventh direction 37 and irradiated to the shield conductor layer.

Next, the reflecting mirror 28a is slid in the mirror slide unit 28, and the second rotating lens 27b is rotated. As a result, the reflecting mirror 28a and the second rotating lens 27b are aligned so that the laser light is reflected in the eighth direction 38 and irradiated to the shield conductor layer. Then, the laser beam 12 is emitted from the laser irradiation mechanism 11, the laser beam 12 is reflected by the first and seventh reflecting mirrors 13, 19, and the reflecting mirror 28a, and the reflected laser beam 12 is reflected by the second laser beam 12. The shield conductor layer is irradiated from the eighth direction 38 through the rotating lens 27b.

[0063] In the second embodiment, the same effect as in the first embodiment can be obtained.

Also in the present embodiment, it is possible to implement a modification similar to that in the first embodiment.

[Embodiment 3]

FIG. 5 is a schematic diagram showing the configuration of the laser machining apparatus according to Embodiment 3 of the present invention, and the same reference numerals are given to the same parts as those in FIG.

Laser irradiation mechanism 11, second reflecting mirror 14, fourth reflecting mirror 16, fifth reflecting mirror 1 Since the first to fourth lenses 20 to 23, the shield cable holding mechanism, and the cable slide mechanism are the same as those in the first embodiment, the description thereof is omitted.

The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the first direction 31 by the first half mirror 43, reflected in the second direction 32 by the second reflection mirror 14, and the second The half mirror 45 reflects the laser beam 12 in the third direction 33, and the reflected laser light 12 passes through the first lens 20 and is applied to the shield conductor layer 4 of the shield cable 1.

Further, a part of the laser beam 12 is transmitted through the second half mirror 45. As a result, the transmitted laser beam 12 is reflected by the fourth reflecting mirror 16 in the fourth direction 34, and the reflected laser beam 12 passes through the second lens 21 and the shield conductor layer 4 of the shielded cable 1. Is irradiated.

Further, a part of the laser beam 12 is transmitted through the first half mirror 43. As a result, the transmitted laser beam 12 is reflected in the seventh direction 37 by the third half mirror 48, and the reflected laser beam 12 passes through the fourth lens 23 to be a shield conductor layer of the shield cable 1. 4 is irradiated.

In addition, a part of the laser light 12 is transmitted through the third half mirror 48. As a result, the transmitted laser beam 12 is reflected in the eighth direction 38 by the fifth reflecting mirror 17, and the reflected laser beam 12 passes through the third lens 22 and the shield conductor layer 4 of the shielded cable 1. Is irradiated.

[0069] In the third embodiment, the same effect as in the first embodiment can be obtained.

[Embodiment 4]

FIG. 6 is a schematic diagram showing a configuration of a laser processing apparatus according to Embodiment 4 of the present invention, and the same parts as those in FIG.

Since the laser irradiation mechanism 11, the first to fourth lenses 20 to 23, the shield cable holding mechanism, and the cable slide mechanism are the same as those in the first embodiment, the description thereof is omitted.

The laser processing apparatus of FIG. 6 has a rotary reflection mirror 51 provided with a rotary drive mechanism (not shown). The rotary reflection mirror 51 is a first to a first reflection mirror that is rotated by a rotary drive mechanism. 4 can be changed, and by adjusting the rotary reflection mirror 51 in the first to fourth directions, the laser beam can be reflected in the first to fourth directions 61 to 64. It has become so.

The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the first direction 61 by the rotary reflection mirror 51 adjusted in the first direction, and in the fifth direction 65 by the first reflection mirror 52. The reflected laser light 12 is reflected and irradiated to the shield conductor layer 4 of the shield cable 1 through the first lens 20.

The laser beam 12 irradiated from the laser irradiation mechanism 11 is reflected in the second direction 62 by the rotary reflection mirror 51 adjusted in the second direction, and in the sixth direction 66 by the second reflection mirror 53. The reflected laser light 12 is reflected and irradiated to the shield conductor layer 4 of the shield cable 1 through the second lens 21.

The laser beam 12 emitted from the laser irradiation mechanism 11 is reflected in the third direction 63 by the rotary reflection mirror 51 adjusted in the third direction, and in the seventh direction 67 by the third reflection mirror 54. The reflected laser light 12 is reflected and irradiated to the shield conductor layer 4 of the shield cable 1 through the third lens 22.

The laser beam 12 emitted from the laser irradiation mechanism 11 is reflected in the fourth direction 64 by the rotary reflection mirror 51 adjusted in the fourth direction, and in the eighth direction 68 by the fourth reflection mirror 55. The reflected laser light 12 is reflected and irradiated to the shield conductor layer 4 of the shield cable 1 through the fourth lens 23.

[0076] In the fourth embodiment, the same effect as in the first embodiment can be obtained.

[0077] (Embodiment 5)

FIG. 7 is a schematic diagram showing the configuration of the laser processing apparatus according to the fifth embodiment of the present invention. The same parts as those in FIG.

Since the first to fourth lenses 20 to 23, the shielded cable holding mechanism, and the cable sliding mechanism are the same as those in the first embodiment, description thereof is omitted.

This laser carriage apparatus has first to fourth laser irradiation mechanisms 71 to 74. The first to fourth laser irradiation mechanisms 71 irradiate the respective laser beams through the first to fourth lenses 20 to 23 irradiate the shield conductor layer 4 of the shield cable 1.

[0079] In the fifth embodiment, the same effect as in the first embodiment can be obtained.

[0080] (Embodiment 6)

FIG. 8 is a schematic diagram showing the configuration of the laser processing apparatus according to Embodiment 6 of the present invention, and the same reference numerals are given to the same portions as those in FIG.

Since the shielded cable holding mechanism and the cable sliding mechanism are the same as those in the first embodiment, description thereof is omitted.

This laser processing apparatus includes first and second laser irradiation mechanisms 81 and 82, a first reflection mirror 83, a second reflection mirror 84, a first parabolic mirror 85, And a second parabolic mirror 86. Each of the first reflection mirror 83 and the second reflection mirror 84 can be freely slid on the optical axis of the laser beam by a slide mechanism. The first parabolic mirror 85 and the second parabolic mirror 86 are respectively shielded cables even if the first reflecting mirror 83 and the second reflecting mirror 84 are slid by the slide mechanism and changed in position. The shield conductor layer 1 is configured to be irradiated with laser light.

Next, a method of cutting the shield conductor layer in the shielded cable 1 using the laser processing apparatus of FIG. 8 will be described.

[0083] Laser light is emitted from the first laser irradiation mechanism 81, the laser light is reflected by the first reflecting mirror 83 and the first parabolic mirror 85, and the reflected laser light is shielded cable. 1 shielded conductor layer 4 is irradiated.

Next, after the first reflection mirror 83 is slid by the slide mechanism, the first laser irradiation mechanism 81 irradiates laser light, and this laser light is emitted from the first reflection mirror 83 and the first paraboloid. Reflected by the surface mirror 85, the reflected laser light is applied to the shield conductor layer 4 of the shielded cable 1.

Next, laser light is emitted from the second laser irradiation mechanism 82, and this laser light is Reflected by the reflecting mirror 84 and the second parabolic mirror 86, the reflected laser light is applied to the shield conductor layer 4 of the shielded cable 1.

[0086] Next, after the second reflection mirror 84 is slid by the slide mechanism, the second laser irradiation mechanism 82 irradiates laser light, and this laser light is emitted from the second reflection mirror 84 and the second paraboloid. Reflected by the surface mirror 86, the reflected laser light is applied to the shield conductor layer 4 of the shielded cable 1.

[0087] In the sixth embodiment, the same effect as in the first embodiment can be obtained.

In the sixth embodiment, the second parabolic mirror 86 is used. However, a third reflecting mirror may be used instead of the second parabolic mirror 86. . In this case, it becomes possible to irradiate the shield conductor layer with laser light from three directions that are substantially perpendicular to the longitudinal direction of the shield cable.

[0089] (Embodiment 7)

FIG. 9 is a schematic diagram showing the configuration of the laser processing apparatus according to the seventh embodiment of the present invention, and the same parts as those in FIG.

Since the laser irradiation mechanism 11 is the same as that of the first embodiment, description thereof is omitted. This laser processing apparatus includes a lens 91, a motor 93 that rotates the shield cable 1, and a belt 92 that transmits the rotational driving force of the motor 93 to the shield cable 1.

The laser light emitted from the laser irradiation mechanism 11 is applied to the shield conductor layer 4 of the shield cable 1 through the lens 91. At this time, by rotating the shield cable 1 by the motor 93 and the belt 92, the laser beam is applied to the shield conductor layer in at least three directions.

[0091] In the seventh embodiment, the same effect as in the first embodiment can be obtained.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

Claims

The scope of the claims

[1] A shield cable comprising a central conductor, an internal insulator disposed so as to cover the central conductor, and a shield conductor layer disposed so as to cover the internal insulator is prepared, and the shield cable The shield conductor layer is cut by irradiating the shield conductor layer with laser light from at least three directions that are substantially perpendicular to the longitudinal direction of

A method of cutting a shield conductor layer, characterized in that an angle formed by two adjacent optical axes of laser light irradiated to the shield conductor layer is less than 180 °.

[2] The method of cutting a shield conductor layer according to claim 1, wherein an angle formed by the two optical axes is 150 ° or less.

[3] In Claim 1 or 2, wherein the shield conductor layer is irradiated with laser light from four directions, and the optical axes of laser light that are not adjacent to each other are arranged so as to be substantially in a straight line. A method for cutting the shield conductor layer.

[4] When preparing the shielded cable according to any one of claims 1 to 3, when preparing a plurality of shielded cables and irradiating the shield conductor layer with laser light, A method for cutting a shield conductor layer, wherein the laser beam or the shielded cable is slid to scan and irradiate the laser beam.

[5] A shield cable including a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is retained, and the shield A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a longitudinal direction of a cable,

A laser irradiation mechanism for irradiating laser light;

A second reflecting mirror for reflecting the laser beam reflected in the first direction by the first reflecting mirror in a third direction; A third reflection mirror that reflects the laser light reflected in the third direction by the second reflection mirror in a fourth direction and irradiates the shield conductor layer;

A mirror slide mechanism that slides so as to remove the third reflecting mirror from the optical axis of the laser beam reflected in the third direction;

The laser light reflected in the third direction by the second reflecting mirror in a state where the third reflecting mirror is removed from the optical axis of the laser light reflected in the third direction. A fourth reflecting mirror that reflects in the direction of 5 and irradiates the shield conductor layer; and a laser beam that reflects in the second direction by the first reflecting mirror reflects in the sixth direction. With 5 reflection mirrors,

A laser processing apparatus, wherein an angle formed by two adjacent optical axes of laser light irradiated on the shield conductor layer is less than 180 °.

A shield cable comprising a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is held, and the length of the shield cable is maintained. A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a direction;

A laser irradiation mechanism for irradiating laser light;

Slide the third reflecting mirror provided on the first mirror slide unit A first slide mechanism;

A fourth reflecting mirror for reflecting the laser beam reflected in the second direction by the first reflecting mirror in a sixth direction;

Laser processing equipment characterized by being less than °.

[7] In Claim 6, on the optical axis of the laser beam irradiated from each of the fourth direction, the fifth direction, and the seventh direction, they are respectively rotated by a rotation mechanism. The laser processing apparatus further comprising a rotating lens.

[8] In Claim 6, a second mirror slide unit is arranged instead of the fifth reflecting mirror,

The second mirror slide unit includes a second slide mechanism that slides the fifth reflection mirror, and a second rotation mechanism that rotates the fifth reflection mirror. Laser carriage device.

[9] A shield cable comprising a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is retained, and the shield A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a longitudinal direction of a cable,

A laser irradiation mechanism for irradiating laser light;

A part of the laser light irradiated by the laser irradiation mechanism is reflected in the first direction. And a first half mirror that transmits a part of the laser beam,

A part of the laser beam reflected in the second direction by the first reflecting mirror is reflected in a third direction to irradiate the shield conductor layer, and a second part that transmits a part of the laser beam. Half mirror and

Comprising

A laser irradiation mechanism for irradiating laser light;

[11] A shield cable comprising a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is retained, and the shield A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a longitudinal direction of a cable,

[12] A shield cable comprising a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is retained, and the shield A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a longitudinal direction of a cable,

[13] In Claim 12, a second parabolic mirror is provided instead of the third reflecting mirror, and a slide mechanism is provided that slides the second reflecting mirror along the fifth direction. The second parabolic mirror reflects the second laser beam in the seventh direction or the eighth direction by sliding the second reflecting mirror by the sliding mechanism. The laser processing apparatus characterized by being.

[14] A shield cable comprising a center conductor, an inner insulator disposed so as to cover the center conductor, and a shield conductor layer disposed so as to cover the inner insulator is retained, and the shield A laser processing apparatus for cutting the shield conductor layer by irradiating the shield conductor layer with laser light from a direction substantially perpendicular to a longitudinal direction of a cable,

A rotating mechanism for rotating the shielded cable;

Comprising