JP2013005525A - Terminal processing method and terminal treatment structure of ultrafine coaxial wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal processing method and a terminal treatment structure of an ultrafine coaxial wire capable reducing the damage to an internal insulator when cutting a shield conductor.SOLUTION: The terminal processing method of an ultrafine coaxial wire including, from the center to the outside in order, a central conductor 2, an internal insulator 3, plural shield conductors 4 and a jacket 5 in which the shield conductor 4 is formed with served shield or braided shield of a conductor includes: step S1 to expose the shield conductors 4 by cutting the jacket 5 in the end portion of an ultrafine coaxial wire 1; step S2 to cut the exposed shield conductors 4 along a longitudinal direction of the ultrafine coaxial wire 1; and step S3 to strip and expose the central conductor 2 by removing the cut shield conductors 4 toward the end of the ultrafine coaxial wire 1. The shield conductors 4 has n (n: integer greater than 1) cutting points 9 along a peripheral direction of the ultrafine coaxial wire 1. Each of the shield conductors 4 is cut by at least a length of (1/n)P with respect to winding pitch P at the cutting point 9.

Description

  The present invention relates to a terminal processing method and a terminal processing structure for an ultrafine coaxial line that reduces damage to an internal insulator when a shield conductor is cut.

  High-flexibility cables that transmit high-frequency signals and high-speed signals, such as wiring that connects the main body of a notebook computer and a liquid crystal display, and wiring that connects the main body of a medical ultrasonic diagnostic apparatus and a probe. There is a coaxial line.

  The ultra-fine coaxial line is formed by laminating a center conductor, an internal insulator, a shield conductor, and a jacket in order from the center to the outside. When the micro coaxial line is directly connected to the device or attached to the connector, a terminal process is performed to expose the center conductor and the shield conductor of the terminal portion.

  The procedure of terminal processing of a plurality of micro coaxial lines by the conventional terminal processing method will be described with reference to FIG.

  As shown in FIG. 16A, a plurality of micro coaxial wires 1 are aligned at a desired alignment pitch, and the alignment state is fixed with an adhesive tape 6 for cable lamination.

  As shown in FIG. 16 (b), the adhesive tape 6 and the adhesive tape 6 are irradiated by irradiating the adhesive tape 6 and the jacket 5 of the micro coaxial cable 1 from the upper and lower surfaces at a terminal processing position at a desired distance from the terminal. The jacket 5 of the micro coaxial cable 1 is cut, and the adhesive tape 6 and the jacket 5 on the terminal side are simultaneously pulled out in the terminal direction from this terminal processing portion. As a result, the shield conductor 4 from the terminal processing portion to the terminal is exposed. In addition, cutting means making a cut.

  As shown in FIG. 16 (c), the shield conductor 4 is cut by irradiating the shield conductor 4 with laser light from the upper and lower surfaces at a terminal processing location closer to the terminal than the terminal processing location in FIG. 16 (b). Then, the shield conductor 4 on the terminal side is pulled out from the terminal processing portion in the terminal direction. Thereby, the internal insulator 3 from this terminal processing location to the terminal is exposed.

  As shown in FIG. 16D, the inner insulator 3 is irradiated with laser light from the upper and lower surfaces at a terminal processing location closer to the terminal than the terminal processing location in FIG. It cut | disconnects and the internal insulator 3 in the terminal side is pulled out to a terminal direction from this terminal processing location. Thereby, the center conductor 2 from this terminal processing location to a terminal is exposed.

  By performing the above steps in order, the shield conductor 4, the internal insulator 3, and the center conductor 2 are each exposed to a desired length.

  In Patent Document 1, a plurality of laser beams are irradiated at different optical axis angles so that the entire shield conductor 4 wound around the internal insulator 3 is uniformly given laser power.

  In Patent Document 2, the step of exposing the shield conductor 4 by cutting the jacket 5 by scanning the jacket 5 with laser light from the front and back surfaces at a terminal processing location consisting of a plurality of locations, and the exposed shield conductor 4 By scanning the laser beam from the front and back surfaces, the shield conductor 4 located in the gap between the adjacent micro coaxial lines 1 and 1 among the shield conductors 4 is cut without cutting the shield conductor 4 located on the laser irradiation surface. A terminal processing method including the steps of: According to this method, damage to the internal insulator 3 when the shield conductor 4 is cut can be reduced.

JP 2007-290013 A JP 2010-263698 A

  However, in the terminal processing method of Patent Document 1, when laser light is irradiated while sliding a plurality of arranged fine coaxial wires 1 in the left-right direction by a slide mechanism, the focal depth is the center of the shield conductor 4 as shown in FIG. The first side portion 11 (perpendicular to the longitudinal direction of the micro coaxial line 1) from the apex position of the portion 13 (the region including the internal insulator 3 and the shield conductor 4 on the optical axis orthogonal to the longitudinal direction of the micro coaxial line 1) Of the region including only the shield conductor 4 on the optical axis, or the second side portion 12 (only the shield conductor 4 is included on the optical axis perpendicular to the longitudinal direction of the micro coaxial line 1). If the depth distance to the other region of the region is not reached, a location that does not match the location where the laser beam is focused is formed, and the intensity of the laser beam varies. In addition, the number of parts constituting the mechanism for irradiating laser light is large, and it is difficult to adjust the irradiation direction and irradiation intensity of the laser light.

  For this reason, in the portion where the intensity of the laser light is less than the intensity necessary for cutting the shield conductor 4, the cutting of the shield conductor 4 is caused, and in the portion where the intensity of the laser light is too high, the internal insulator 3 is damaged.

  Further, when a plurality of micro coaxial lines 1 are arranged at a narrow pitch, in the shield conductor 4 located in the gap between the adjacent micro coaxial lines 1 and 1, as shown in an example of FIG. May not reach all of the shield conductors 4, resulting in a cutting failure.

  Further, in the terminal processing method of Patent Document 2, even when the number of shield conductors 4 processed at one time is reduced so that the first side portion 11 and the second side portion 12 are not irradiated with the laser light 8, the ultra-coaxial cable As long as the laser beam 8 is irradiated on the circumference of 1, the intensity of the laser beam 8 varies, and the cutting of the shield conductor 4 and the damage to the internal insulator 3 may occur.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a terminal processing method and terminal processing structure for an ultrafine coaxial line that solves the above-described problems and reduces damage to an internal insulator when a shield conductor is cut.

  The present invention devised to achieve this object has a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, and the shield conductor is either a horizontal winding or a braided winding made of a conductive wire. In the terminal processing method of the formed micro coaxial line, the step of cutting the jacket of the terminal portion of the micro coaxial line to expose the shield conductor, and the exposed shield conductor in the longitudinal direction of the micro coaxial line And stripping the cut shield conductor to the end of the micro coaxial line to expose the center conductor, wherein the shield conductor has a periphery of the micro coaxial line. There are n (n is an integer of 1 or more) cutting points along the direction, and the cutting pitch is less than the winding pitch P of the shield conductor at the cutting points. Is also (1 / n) P long terminal processing method very thin coaxial cable to cut the.

  The cutting location may be a region including only the shield conductor on a cutting axis perpendicular to the longitudinal direction of the micro coaxial line.

  The cutting location may be a region including at least the internal insulator and the shield conductor on a cutting axis perpendicular to the longitudinal direction of the micro coaxial line.

  The present invention also includes a terminal of an ultrafine coaxial line having a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, wherein the shield conductor is formed by either a horizontal winding or a braided winding made of a conductive wire. In the processing structure, the central conductor and the shield conductor of the terminal portion of the fine coaxial line are exposed, and the shield conductor is at least with respect to the winding pitch P of the shield conductor along the longitudinal direction of the fine coaxial line. This is a terminal processing structure of a fine coaxial line that is continuously cut by a length of (1 / n) P.

  ADVANTAGE OF THE INVENTION According to this invention, the terminal processing method and terminal processing structure of a micro coaxial line which reduce the damage to an internal insulator when cut | disconnecting a shield conductor can be provided.

(A)-(e) is a top view which shows the procedure of the terminal process of the several micro coaxial line by the terminal processing method of the micro coaxial line of this invention. It is the perspective view which showed the detail of the location which a laser beam scans at the time of the shield conductor cutting | disconnection in the 1st Embodiment of this invention. (A), (b) is sectional drawing which showed the detail of the shield conductor cut surface in the A-A 'surface of FIG. FIG. 3 is a perspective view showing a state after stripping the cut shield conductor after cutting the shield conductor in FIG. 2. It is the perspective view which showed the detail of the location which a laser beam scans at the time of the shield cutting | disconnection in the modification of the 1st Embodiment of this invention. (A), (b) is sectional drawing which showed the detail of the shield conductor cut surface in the B-B 'surface of FIG. FIG. 6 is a perspective view showing a state after stripping the cut shield conductor after cutting the shield conductor in FIG. 5. It is the perspective view which showed the detail of the location which a laser beam scans at the time of the shield cutting | disconnection in the 2nd Embodiment of this invention. (A), (b) is sectional drawing which showed the detail of the shield conductor cut surface in the C-C 'surface of FIG. FIG. 9 is a perspective view showing a state after stripping the cut shield conductor after cutting the shield conductor in FIG. 8. It is the perspective view which showed the detail of the location which a laser beam scans at the time of the shield cutting | disconnection in the modification of the 2nd Embodiment of this invention. (A), (b) is sectional drawing which showed the detail of the shield conductor cut surface in the D-D 'surface of FIG. FIG. 12 is a perspective view showing a state after the shield conductor cut in FIG. 11 is stripped after cutting the shield conductor. It is the perspective view which showed the detail of the location which a laser beam scans at the time of the shield cutting | disconnection in the 3rd Embodiment of this invention. It is a top view which shows the state which apply | coated the solder material to the cut part of a shield conductor after the terminal process of a microfine coaxial line. (A)-(d) is a top view which shows the procedure of the terminal process of the several fine coaxial wire by the conventional terminal processing method of a micro coaxial line. It is sectional drawing which shows the cross section of a very fine coaxial line. It is sectional drawing which showed the subject by the terminal processing method of the conventional extra fine coaxial line.

  Hereinafter, a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIGS. 1A to 1E, the terminal processing method of the micro coaxial line according to the first embodiment includes a center conductor 2, an inner insulator 3, a shield conductor 4, in order from the center to the outside. This is a method of processing the end of the micro coaxial cable 1 having a jacket 5 and the shield conductor 4 formed by either horizontal winding or braided winding made of a conducting wire (for example, copper wire).

  Specifically, the jacket 5 at the end portion of the micro coaxial wire 1 is cut to expose the shield conductor 4, and the shield conductor 4 exposed in step S 1 extends along the longitudinal direction of the micro coaxial wire 1. Step S2 for cutting the shield conductor 4 by scanning with laser light, Step S3 for stripping the shield conductor 4 cut in Step S2 to the terminal side of the micro coaxial line 1 and exposing the center conductor 2; including.

  As shown in FIG. 2, the irradiation spot 7 (line for scanning the laser beam 8) of the laser beam 8, which is the cutting spot of the shield conductor 4 in FIG. 1C, is the first side portion of each micro coaxial line 1. 11 and the shield conductor 4 located on the second side portion 12, the scanning direction of the laser light 8 is the longitudinal direction of each micro coaxial line 1, and the scanning length of the laser light 8 is the winding of the shield conductor 4. The length is (1/2) P with respect to the pitch P. In addition, the 1st side part 11 and the 2nd side part 12 are area | regions where only a shield conductor is contained on the cutting axis orthogonal to the longitudinal direction of each micro coaxial line 1. FIG.

  As shown in FIG. 3A, the irradiated portions 7 of the laser light 8 on the AA ′ plane in FIG. 2 are located on the first side portion 11 and the second side portion 12 of each micro coaxial line 1. In the shield conductor 4, as shown in FIG. 3B, the cut portions 9 of the shield conductor 4 by the irradiation of the laser light 8 are the first side portion 11 and the second side portion of each micro coaxial line 1. 12, the first side portion 11 and the second side of the micro coaxial cable 1 continuously along the longitudinal direction of the micro coaxial cable 1 over the length of (1/2) P. The shield conductor 4 located at the portion 12 is cut.

  By the way, the shield conductor 4 of the micro coaxial cable 1 is wound around the surface of the inner insulator 3 by 180 ° with respect to the winding pitch P by a length corresponding to (½) P.

  That is, between the lengths of (1/2) P, all of the shield conductors 4 are routed through the positions located on the first side portion 11 and the second side portion 12 of the micro coaxial cable 1, The shield conductors 4 positioned on the first side portion 11 and the second side portion 12 are continuously cut over a length of at least (1/2) P, so that all the shield conductors 4 are removed from the first side portion 11. And at either location on the second side 12 can be cut as shown in FIG.

  As shown in FIG. 5, when the irradiation spot 7 of the laser beam 8 is on the shield conductor 4 located on the first side portion 11 of each micro coaxial line 1, the scanning direction of the laser beam 8 is each micro coaxial line. 1 and the scanning length of the laser beam 8 is 1 P with respect to the winding pitch P of the shield conductor 4.

  As shown in FIG. 6A, the irradiation spot 7 of the laser beam 8 on the BB ′ plane in FIG. 5 is in the shield conductor 4 located on the first side portion 11 of each micro coaxial line 1, As shown in FIG. 6B, the cut portion 9 of the shield conductor 4 by the laser beam 8 is only the shield conductor 4 positioned on the first side portion 11 of each micro coaxial line 1, and the length of the micro coaxial line 1 is long. The shield conductor 4 located on the first side portion 11 of the micro coaxial cable 1 is continuously cut along the direction for at least a length of 1P.

  By the way, the shield conductor 4 of the micro coaxial cable 1 is wound around the surface of the inner insulator 3 by 360 ° with respect to the winding pitch P for a length of 1P.

  That is, between the lengths of 1P, all of the shield conductors 4 are routed through the locations located on either the first side portion 11 or the second side portion 12 of the micro coaxial line 1, and the first By cutting the shield conductor 4 located on either the side portion 11 or the second side portion 12 continuously over the length of 1P along the longitudinal direction, all the shield conductors 4 are 7 can be cut.

  In addition, the irradiation location 7 and the cutting location 9 may be the 2nd side part 12 of the shield conductor 4, and can be implemented by the same method.

  That is, the shield conductor 4 has n (n is an integer greater than or equal to 1) cut points 9 along the circumferential direction of the micro coaxial line 1, and the shield conductor 4 has a winding pitch P with respect to the shield conductor 4. Cut at least the length of (1 / n) P.

  According to the first embodiment, the internal insulator 3 and the central conductor 2 are not present on the cutting axis of the powerful laser beam 8 that cuts the shield conductor 4, that is, on the optical axis. After cutting, the inner insulator 3 and the central conductor 2 are not reached.

  In the first embodiment, the laser beam 8 is used for cutting the jacket 5 and the shield conductor 4, but the cutting method is not limited to the method using the laser beam 8, and for example, a processing method using a cutting blade is used. Also good.

  Here, the terminal processing procedure will be described in detail along a time series.

  As shown in FIG. 1A, first, a plurality of micro coaxial wires 1 are aligned at a desired alignment pitch to form a flat cable. Lamination with the adhesive tape 6 for cable laminating is performed on the plurality of flat coaxial cables 1. Thereby, the plurality of micro coaxial lines 1 are fixed in an aligned state. The ultra-fine coaxial line 1 is, for example, an AWG 46 cable having an outer diameter of 0.2 mm, and the shield conductor 4 is configured by horizontally winding 20 conductors each having a diameter of 0.02 mm.

Thereafter, as shown in FIG. 1B, the jacket 5 made of a polymer material is irradiated with a laser beam 8 using a CO ₂ laser having a wavelength of 10.6 μm. When the laser beam 8 is irradiated, the adhesive tape 6 and the jacket 5 absorb the energy of the laser beam 8 and become high temperature, burn and evaporate, and a hole is formed in the adhesive tape 6 and the jacket 5. Since the CO ₂ laser is reflected on the surface of the conducting wire (metal wire) constituting the shield conductor 4, the shield conductor 4 and the internal insulator 3 are not damaged.

The CO ₂ laser cuts the jacket 5 for the entire circumference of the fine coaxial line 1 by irradiating from the upper and lower surfaces of the fine coaxial line 1.

  In this way, by irradiating the jacket 5 with the laser beam 8, the jacket 5 is cut to expose the shield conductor 4, and the shield conductor exposed portion is formed. The process of FIG. 1B is step S1.

  The shield conductor 4 may be exposed by cutting the jacket 5 by another processing method such as a dicing saw.

Thereafter, as shown in FIG. 1 (c), the shield conductors 4 located on the first side portion 11 and the second side portion 12 of the micro coaxial line 1 are arranged along the longitudinal direction of the micro coaxial wire 1. By scanning the laser beam 8 with a length of at least (1/2) P with respect to the winding pitch P of the shield conductor 4, the shield conductor 4 at the location irradiated with the laser beam 8 is cut. At this time, a YVO ₄ laser having a wavelength of 1.06 μm was used as the laser.

  At this time, since there is no internal insulator 3 or center conductor 2 on the optical axis of the laser beam 8 that becomes the cutting axis of the shield conductor 4, a condition with a strong laser intensity is selected so that the shield conductor 4 can be sufficiently cut. be able to. The process of FIG. 1C is step S2.

  In the conventional end processing method for the fine coaxial line, all of the shield conductors 4 positioned in the upper half and all of the shield conductors 4 positioned in the lower half are cut by irradiating the laser beam 8 from the upper and lower surfaces. .

  Therefore, it is necessary to use strong laser conditions that can cut the shield conductors 4 located on the first side portion 11 and the second side portion 12, and the shield conductor 4 in the center portion 13 is cut using the conditions. For this reason, the laser beam 8 reaches the internal insulator 3 and the central conductor 2 at the central portion 13 to damage the internal insulator 3 and the central conductor 2.

  On the other hand, in the first embodiment, the internal insulator 3 and the central conductor 2 are not on the optical axis of the laser beam 8 even when a strong laser condition is used, and the laser beam 8 is transmitted to the internal insulator 3. And the central conductor 2 is not damaged.

  Furthermore, in the first embodiment, it is not necessary to irradiate the laser beam 8 for cutting the shield conductor 4 from the upper and lower surfaces. For example, all the shield conductors 4 can be cut only by irradiation from the upper surface. is there.

  Thereafter, as shown in FIG. 1D, the cut shield conductor 4 is stripped to expose the internal insulator 3. This process is step S3.

Finally, as shown in FIG. 1E, the internal insulator 3 is irradiated with laser light 8 using a CO ₂ laser having a wavelength of 1.06 μm, so that the internal insulator 3 is cut to the terminal side. Drawing out and forming the central conductor exposed part.

  As described above, according to the first embodiment, the center conductor 2, the inner insulator 3, the shield conductor 4, and the jacket 5 are provided in this order from the center to the outside, and the shield conductor 4 is a horizontal winding or braided winding made of a conductive wire. In the terminal processing method of the micro coaxial line formed by any of the above, step S1 in which the jacket 5 of the terminal portion of the micro coaxial line 1 is cut to expose the shield conductor 4, and the exposed shield conductor 4 is micro coaxial. A step S2 for cutting along the longitudinal direction of the line 1, and a step S3 for stripping the cut shield conductor 4 to the end side of the micro coaxial line 1 to expose the center conductor 2; And n (n is an integer of 1 or more) cutting points 9 along the circumferential direction of the micro coaxial line 1, and at the cutting points 9, at least (1 / ) For cutting a length of P, it is possible to reduce the damage to the inner insulator 3 when cutting the shield conductor 4.

  In step S2, the winding pitch of the shield conductor 4 in the longitudinal direction of the micro coaxial line 1 is set on the shield conductor 4 positioned on either the first side portion 11 or the second side portion 12 of the micro coaxial wire 1. By scanning the laser beam 8 with a length of at least 1P with respect to P, the same effect can be obtained even when the shield conductor 4 at the location irradiated with the laser beam 8 is cut.

  In other words, the region including only the shield conductor 4 on the cutting axis perpendicular to the longitudinal direction of the micro coaxial line 1, that is, the case where at least one of the first side portion 11 and the second side portion 12 is the cutting portion 9. However, the same effect can be obtained.

  Next, a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As in the first embodiment, in step S2, the shield conductor 4 located at the center portion 13 of the micro coaxial line 1 is shielded from the upper and lower surfaces of the micro coaxial line 1 in the longitudinal direction of the micro coaxial line 1. By scanning the laser beam 8 with a length of at least (1/2) P with respect to the winding pitch P of 4, damage to the internal insulator 3 and the central conductor 2 can be eliminated.

  As shown in FIG. 8, the irradiated portions 7 of the laser light 8 that are the cut portions of the shield conductor 4 in FIG. 1C are formed on the upper and lower surfaces of the shield conductor 4 located in the central portion 13 of each micro coaxial line 1. The scanning direction of the laser light 8 is the longitudinal direction of each micro coaxial line 1, and the scanning length of the laser light 8 is (1/2) P with respect to the winding pitch P of the shield conductor 4. The central portion 13 is a region including at least an internal insulator and a shield conductor on a cutting axis orthogonal to the longitudinal direction of each micro coaxial line 1.

  As shown in FIG. 9A, the irradiated portions 7 of the laser light 8 on the CC ′ plane in FIG. 8 are on the upper and lower surfaces of the shield conductor 4 located in the central portion 13 of each micro coaxial line 1. As shown in FIG. 9B, the cut portion 9 of the shield conductor 4 by the laser beam 8 is only the upper and lower surfaces of the shield conductor 4 located at the central portion 13 of each micro coaxial line 1. The shield conductor 4 located on the upper surface and the lower surface of the central portion 13 of the micro coaxial line 1 is continuously cut by a length of (1/2) P along the longitudinal direction.

  By the way, the shield conductor 4 of the micro coaxial cable 1 is wound around the surface of the inner insulator 3 by 180 ° with respect to the winding pitch P by a length corresponding to (½) P.

  That is, the shield conductors 4 are all routed through the upper surface and the lower surface of the central portion 13 of the micro coaxial cable 1 within the length of (1/2) P. , And the shield conductor 4 located on the lower surface is continuously cut over a length of at least (1/2) P, so that all the shield conductors 4 are located on either the upper surface or the lower surface of the central portion 13. Can be cut as shown in FIG.

  According to the second embodiment, as the laser light 8 for cutting the shield conductor 4, unlike the first embodiment, the shield conductors located on the first side portion 11 and the second side portion 12. It is not necessary to use laser conditions that are strong enough to cut all four. In addition, unlike the conventional method for processing an ultrafine coaxial line, since the laser beam 8 is not irradiated in the circumferential direction, the distance from the laser is constant and the focus is not shifted.

  Therefore, it is not necessary to increase the intensity of the laser beam 8 in consideration of defocusing, and it can be irradiated with the laser beam 8 that is weaker and has a certain intensity compared to the conventional ultrafine coaxial line terminal processing method. 3 and the central conductor 2 are not damaged.

  Similarly to the first embodiment, in step S 2, the shield conductor 4 positioned at the central portion 13 of the fine coaxial line 1 is extended from one side of the fine coaxial line 1 along the longitudinal direction of the fine coaxial line 1. By scanning the laser beam 8 with a length of at least 1P with respect to the winding pitch P of the shield conductor 4, damage to the internal insulator 3 and the center conductor 2 can be eliminated.

  As shown in FIG. 11, the irradiation spot 7 of the laser beam 8 in FIG. 1C is on the upper surface of the shield conductor 4 located in the central portion 13 of each micro coaxial line 1, and in FIG. As shown, the cut portion 9 of the shield conductor 4 by the laser beam 8 is only the upper surface of the shield conductor 4 located at the central portion 13 of each micro coaxial line 1, and 1P along the longitudinal direction of the micro coaxial line 1. The shield conductor 4 located on the upper surface of the central portion 13 of the micro coaxial cable 1 is continuously cut.

  By the way, the shield conductor 4 of the micro coaxial cable 1 is wound around the surface of the inner insulator 3 by 360 ° with respect to the winding pitch P for a length of 1P.

  That is, between the lengths of 1P, all of the shield conductors 4 are routed through a location located on either the upper surface or the lower surface of the central portion 13 of the micro coaxial cable 1, and the upper surface of the central portion 13; Alternatively, by continuously cutting the shield conductor 4 located on either one of the lower surfaces along the longitudinal direction over the length of 1P, all the shield conductors 4 are placed on the upper surface or the lower surface of the central portion 13. Can be cut as shown in FIG.

  In addition, the irradiation location 7 and the cutting location 9 may be the lower surface of the center part 13 of the shield conductor 4, and can be implemented by the same method.

  Also in this embodiment, as the laser beam 8 for cutting the shield conductor 4, unlike the first embodiment, all of the shield conductors 4 located on the first side portion 11 and the second side portion 12 are cut. There is no need to use such powerful laser conditions. In addition, unlike the conventional method for processing an ultrafine coaxial line, since the laser beam 8 is not irradiated in the circumferential direction, the distance from the laser is constant and the focus is not shifted.

  Therefore, it is not necessary to increase the intensity of the laser beam 8 in consideration of defocusing, and it can be irradiated with the laser beam 8 that is weaker and has a certain intensity compared to the conventional ultrafine coaxial line terminal processing method. 3 and the central conductor 2 are not damaged.

  Next, a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIG. 14, the irradiation spot 7 of the laser beam 8 in FIG. 1C is set such that the upper surface center of the shield conductor 4 located at the central portion 13 of each micro coaxial line 1 and the upper surface center are 0 °. There are three positions of 120 ° and 240 ° around the outer periphery of the fine coaxial line 1, the scanning direction of the laser light 8 is the longitudinal direction of each fine coaxial line 1, and the scanning length of the laser light 8 is the shield conductor 4. Is a length of (1/3) P with respect to the winding pitch P.

  The shield conductor 4 of the ultrafine coaxial line 1 is wound around the surface of the internal insulator 3 by 120 ° with respect to the winding pitch P by a length corresponding to (1/3) P.

  That is, between the lengths of (1/3) P, the shield conductors 4 are all 120 ° around the outer periphery of the micro coaxial line 1 when the center of the top surface of the micro coaxial wire 1 and the center of the top surface are 0 °. Via the locations located at three locations of 240 °, and assuming that the center of the top surface and the center of the top surface are 0 °, the shield conductors 4 located at three locations of 120 ° and 240 ° around the outer periphery of the micro coaxial cable 1 All the shield conductors 4 can be cut by continuously cutting at least (1/3) P along the longitudinal direction.

  According to the third embodiment, as the laser light 8 for cutting the shield conductor 4, unlike the first embodiment, the shield conductors located on the first side portion 11 and the second side portion 12. It is not necessary to use laser conditions that are strong enough to cut all four. Specifically, the same laser conditions as those used in the second embodiment can be used, and the internal insulator 3 and the central conductor 2 are not damaged. In addition, unlike the conventional method for processing an ultrafine coaxial line, since the laser beam 8 is not irradiated in the circumferential direction, the distance from the laser is constant and the focus is not shifted.

  Therefore, it is not necessary to increase the intensity of the laser beam 8 in consideration of defocusing, and it is weaker than the terminal processing method of Patent Document 2 and can be irradiated with the laser beam 8 having a constant intensity. The center conductor 2 is not damaged.

  Further, the terminally treated ultrafine coaxial wire 1 is grounded by applying a solder material 10 to the exposed shield conductor 4 and connecting a ground bar. Since the solder material 10 has a high temperature of about 220 ° C. when applied to the shield conductor 4, if the solder material 10 is applied to the shield conductor 4 of the ultrafine coaxial wire 1 subjected to the terminal treatment by the conventional terminal treatment method, The material 10 may touch the internal insulator 3 and damage the internal insulator 3.

  On the other hand, as shown in FIG. 15, the micro coaxial cable 1 subjected to terminal processing according to the first to third embodiments returns the winding of the shield conductor 4 at the cut portion 9, and the adjacent micro coaxial cable 1. After the shield conductor 4 is arranged between them, the solder material 10 is applied to the shield conductor 4 so that the solder material 10 does not fall on the internal insulator 3. Therefore, damage to the internal insulator 3 due to the solder material 10 can be prevented.

  In short, according to the present invention, the optical axis of the laser beam 8 for cutting the shield conductor 4 is removed from the internal insulator 3 and the central conductor 2 that may be damaged, or even on the optical axis of the laser beam 8. Even if the internal insulator 3 and the center conductor 2 exist, the laser beam 8 can be reduced to a strength that does not damage the internal insulator 3 and the center conductor 2.

  This makes it possible to reduce the damage caused by the processing steps on the internal insulator 3 and the central conductor 2 when processing the terminals of a plurality of arrayed micro coaxial cables 1 all at once. Reliability is improved.

The type of laser used for cutting the shield conductor 4 is not particularly limited, for example, not limited to the YVO ₄ laser with a wavelength of 1.06 .mu.m, it may also be used YAG laser. Further, by passing these lasers through a nonlinear crystal such as an LBO crystal, a laser having a wavelength of 532 nm, which is the second harmonic, may be generated and used. Since the optical absorptance of the copper surface when processing copper is as low as 2% at a wavelength of 1.06 μm and as high as 33% at a wavelength of 532 nm, a laser with a wavelength of 532 nm can be processed more efficiently.

DESCRIPTION OF SYMBOLS 1 Very fine coaxial line 2 Center conductor 3 Inner insulator 4 Shield conductor 5 Jacket 6 Adhesive tape 7 Irradiation place 8 Laser beam 9 Cutting place 10 Solder material 11 1st side part 12 2nd side part 13 Center part

Claims (4)

In the terminal processing method of the fine coaxial wire, which has a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, and the shield conductor is formed by either a horizontal winding or a braided winding made of a conductive wire.
Cutting the jacket of the end portion of the micro coaxial cable to expose the shield conductor;
Cutting the exposed shield conductor along the longitudinal direction of the micro coaxial line;
Stripping the cut shield conductor to the end of the micro coaxial line to expose the center conductor;
Including
The shield conductor has n (n is an integer of 1 or more) cut portions along the circumferential direction of the micro coaxial line, and at least (1) with respect to the winding pitch P of the shield conductor at the cut portion. / N) A terminal processing method for an ultrafine coaxial line, characterized by cutting the length of P.   2. The terminal processing method for a micro coaxial line according to claim 1, wherein the cut portion is a region including only the shield conductor on a cutting axis orthogonal to a longitudinal direction of the micro coaxial line.   2. The terminal processing method for a micro coaxial line according to claim 1, wherein the cutting location is a region including at least the internal insulator and the shield conductor on a cutting axis orthogonal to a longitudinal direction of the micro coaxial cable. In the terminal processing structure of the fine coaxial wire, which has a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, and the shield conductor is formed by either a horizontal winding or a braided winding made of a conductive wire,
The central conductor and the shield conductor of the end portion of the micro coaxial line are exposed,
The shield conductor is continuously cut along the longitudinal direction of the micro coaxial line by a length of at least (1 / n) P with respect to the winding pitch P of the shield conductor. Coaxial line terminal processing structure.