JP2010129295A - Method for treating terminal of ultrafine coaxial wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for treating a terminal of an ultrafine coaxial wire, capable of reducing the damage on an internal insulator when cutting a shield conductor. <P>SOLUTION: The method includes: step S1 of cutting a jacket 5 at a first processing point P1 located in a first distance from a terminal T to expose a shield conductor 4; step S2 of exposing the exposed shield conductor 4 in step S1 with laser beam prior to removal of the jacket 5 closer to the terminal T from the exposed shield conductor 4, thereby cutting the shield conductor 4 to expose an internal conductor 3; and step S3 of cutting the jacket 5 at a second processing point P2 located in a second distance longer than the first distance from the terminal T to expose the shield conductor 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a terminal processing method for an ultrafine coaxial line that reduces damage to an internal insulator when a shield conductor is cut.

  As a flexible cable that transmits high-frequency signals and high-speed signals, such as wiring that connects the main body of a notebook computer and a liquid crystal display, or wiring that connects the main body of a medical ultrasonic diagnostic apparatus and a probe, it is extremely thin. There is a coaxial line.

  The ultra-fine coaxial line is formed by laminating a center conductor, an internal insulator, a shield conductor, and a jacket in order from the center to the outside. When the micro coaxial cable is directly connected to the device or attached to the connector, a terminal process is performed to expose the center conductor and the shield conductor of the terminal portion.

  A procedure of terminal processing of a plurality of micro coaxial lines by a conventional terminal processing method will be described with reference to FIG.

  As shown in FIG. 3 (a), a plurality of micro coaxial wires 1 are aligned at a desired alignment pitch and fixed in the aligned state with an adhesive tape 6.

  As shown in FIG. 3B, the adhesive tape 6 and the micro coaxial cable 1 are irradiated with laser light on the adhesive tape 6 and the jacket 5 of the micro coaxial cable 1 at a processing point at a desired distance from the terminal. The jacket 5 is cut, and the adhesive tape 6 and the jacket 5 on the terminal side are simultaneously pulled out from the processing portion in the terminal direction. Thereby, the shield conductor 4 is exposed from this processing location to the terminal. In addition, cutting means making a cut.

  As shown in FIG. 3C, the shield conductor 4 is irradiated with laser light at a processing location closer to the terminal than the processing location in FIG. The shield conductor 4 on the terminal side is pulled out from the location in the terminal direction. Thereby, the internal insulator 3 is exposed from this processing location to the terminal.

  As shown in FIG. 3D, the internal insulator 3 is cut by irradiating the internal insulator 3 with a laser beam at a processing location closer to the terminal than the processing location of FIG. The internal insulator 3 on the terminal side is pulled out from the processing portion in the terminal direction. As a result, the central conductor 2 is exposed from the processing location to the terminal.

  By performing the above steps in order, the shield conductor 4, the internal insulator 3, and the center conductor 2 are exposed to the desired lengths.

2007-290013 No. 2000-2445026

  However, in the conventional terminal processing method, when the shield conductor 4 is irradiated with the laser beam and the shield conductor 4 is cut, the jacket 5 covering the shield conductor 4 has already been removed, so that the shield conductor 4 is configured. Lead wire is easy to move. When the conducting wire moves and the interval between the conducting wires becomes wide, the laser beam for cutting the shield conductor 4 reaches the internal insulator 3 through the gap between the conducting wires. For this reason, a hole is opened in the internal insulator 3, causing a problem that the center conductor 2 and the shield conductor 4 are short-circuited.

  In Patent Document 1, damage to the internal insulator due to laser light is reduced by devising the irradiation direction of the laser light. However, when a plurality of ultra-fine coaxial lines are aligned and subjected to terminal processing at the same time, an optical system centered on one ultra-fine coaxial line cannot be assembled, and thus Patent Document 1 cannot be applied.

  In Patent Document 2, a plurality of micro coaxial lines are aligned, the jacket is irradiated with laser light, the jacket is cut, the jacket is shifted to expose the shield conductor to a predetermined width, and solder is applied to the shield conductor. The solder portion is irradiated with a laser beam to form a processed groove, and a plurality of fine coaxial lines are bent with the processed groove as a fulcrum, thereby separating the shield conductor at the processed groove.

  Thereby, the space | interval of conducting wire can be filled up with solder. However, the amount of laser light energy required to cut the jacket is required as much as the solder is applied. In addition, defects that depend on variations in the amount of solder applied occur. Further, in the solder application process, adjacent fine coaxial lines come close to each other and come into contact with each other due to the surface tension of the molten solder.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and provide a terminal processing method for an ultra-fine coaxial line that reduces damage to an internal insulator when a shield conductor is cut.

  In order to achieve the above object, the present invention provides a terminal processing method for a micro coaxial cable having a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, wherein the shield conductor is formed of a conductive wire. Cutting the jacket to expose the shield conductor at the first processing location at a first distance from the front, and removing the jacket on the terminal side from the shield conductor exposed in the above step to the exposed shield conductor Cutting the shield conductor by irradiating the laser beam to expose the internal insulator, and cutting the jacket at the second processing position at a second distance longer than the first distance from the terminal to shield the shield conductor; Exposing the step.

  The width for exposing the shield conductor formed by spiral winding (longitudinal direction of the fine coaxial line) may be equal to or less than 1/8 of the spiral winding pitch of the conductive wire.

  A carbon dioxide laser may be used for cutting the jacket.

  A YAG laser may be used for cutting the shield conductor.

  The present invention exhibits the following excellent effects.

  (1) When the shield conductor is cut, damage to the internal insulator can be reduced.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIGS. 1 (a) to 1 (g), the terminal processing method of the micro coaxial wire 1 according to the present invention is the center conductor 2, the inner insulator 3, the shield conductor 4, the jacket in order from the center to the outside. In the terminal processing method for the ultra-fine coaxial wire 1 having a shield conductor 4 formed of any one of a spiral winding, a longitudinal winding, and a braid made of a conductive wire, a first processing point P1 that is at a first distance from the terminal T In step S1 in which the jacket 5 is cut by irradiating the jacket 5 with laser light to expose the shield conductor 4, and before the jacket 5 on the terminal T side is removed from the shield conductor 4 exposed in step S1. Step S2 in which the shield conductor 4 is cut by irradiating the exposed shield conductor 4 with laser light to expose the internal insulator 3, and the terminal T is at a second distance longer than the first distance. At 2 processing point P2, it is intended to include a step S3 to expose the shield conductor 4 by cutting the jacket 5 by irradiating the jacket 5 with a laser beam.

  This will be described in detail according to the terminal processing procedure.

  As shown in FIG. 1A, first, a plurality of micro coaxial cables 1 are aligned at a desired alignment pitch to form a flat cable. Lamination with an adhesive tape 6 is performed on the flat cable-shaped ultrafine coaxial wires 1. As a result, the plurality of fine coaxial wires 1 are fixed in an aligned state. The ultrafine coaxial line 1 is, for example, an AWG # 46 cable having an outer diameter of 0.2 mm.

Next, as shown in FIG. 1B, a laser is applied to the jacket 5 made of a polymer material using a CO ₂ laser having a wavelength of 10.6 μm at the first processing point P1 at the first distance from the terminal T. Irradiate light. When the laser beam is irradiated, the adhesive tape 6 and the jacket 5 absorb the energy of the laser beam, become high temperature, burn and evaporate, and a hole is formed in the adhesive tape 6 and the jacket 5. The size of the hole can be adjusted by adjusting the energy received from the laser beam. Since the laser light of the CO ₂ laser is reflected on the surface of the metal wire constituting the shield conductor 4, the shield conductor 4 and the internal insulator 3 are not damaged.

  In this way, by irradiating the jacket 5 with laser light, the jacket 5 is cut to expose the shield conductor 4, thereby forming the shield conductor exposed portion 7. The process of FIG. 1B is step S1. Note that the shield conductor 4 may be exposed by cutting the jacket 5 by other processing methods such as dicing saw processing.

It is preferable to adjust the intensity of the CO ₂ laser, the scanning speed, the number of scans, etc., so that the width of the shield conductor exposed portion 7 (longitudinal direction of the ultrafine coaxial line 1) is 0.4 mm or less. This is because if it is larger than 0.4 mm, it is necessary to increase the number of scans of the CO ₂ laser, which increases the cost. In consideration of the spot diameter of the CO ₂ laser, the width of the shield conductor exposed portion 7 is preferably 0.1 mm or more.

Next, as shown in FIG. 1C, the shield conductor 4 is irradiated with laser light on the shield conductor 4 using a YAG laser (double harmonic) having a wavelength of 532 nm at the first processing point P1. Is cut to expose the internal insulator 3 to form the internal insulator exposed portion 8. The trajectory in which the laser beam of the YAG laser moves in the alignment direction of the micro coaxial line 1 is the same as the trajectory in which the laser beam of the CO ₂ laser moves in the alignment direction of the micro coaxial line 1 in the step of FIG. The shield conductor 4 exposed at the shield conductor exposed portion 7 is cut, and the internal insulator 3 is exposed.

  After the process of FIG. 1B, the jacket 5 can be pulled out in the direction of the terminal. However, after the process of FIG. 1B, the jacket 5 is not removed and the process shown in FIG. It is step S2 to continue the process of 1 (c).

  Next, as shown in FIG. 1D, the jacket 5 and the shield conductor 4 on the terminal T side are pulled out in the terminal direction from the first processing point P1. Thereby, the internal insulator 3 is exposed from the first processing point P1 to the terminal T.

Next, as shown in FIG. 1E, a jacket 5 is used by using a CO ₂ laser having a wavelength of 10.6 μm at the second processing point P2 at a second distance longer than the first distance from the terminal T. By irradiating with laser light, the jacket 5 is cut and the shield conductor 4 is exposed to form the second shield conductor exposed portion 9. Through the process of FIG. 1E, the jacket 5 on the terminal T side can be pulled out in the terminal direction from the second processing point P2. The process in FIG. 1E is step S3. Note that, similarly to step S1, the jacket 5 may be cut by dicing saw processing or the like.

  Next, as shown in FIG. 1 (f), the jacket 5 on the terminal T side is pulled out from the second processing point P2 toward the terminal. Thereby, the shield conductor 4 is exposed from the 2nd process location P2 to the 1st process location P1.

Next, as shown in FIG. 1G, internal insulation is performed using a CO ₂ laser having a wavelength of 10.6 μm at a third processing point P3 located at a third distance shorter than the first distance from the terminal T. By irradiating the body 3 with laser light, the inner insulator 3 is cut to expose the central conductor 2. Thereafter, the internal insulator 3 on the terminal T side is pulled out from the third processing place P3 in the terminal direction. As a result, the center conductor 2 is exposed from the third processing point P3 to the terminal T. This completes the terminal process.

  According to the present invention, when the shield conductor 4 is cut by irradiating the shield conductor 4 with laser light in the step of FIG. 1C, the terminal T side of the shield conductor exposed portion 7 remains covered with the jacket 5. It is a state. For this reason, unlike the conventional process of FIG. 3C, the conductive wire constituting the shield conductor 4 is difficult to move. Since the conducting wire does not move and the interval between the conducting wires does not increase, the laser light for cutting the shield conductor 4 does not reach the internal insulator 3 through the gap between the conducting wires. For this reason, it is prevented that a hole is formed in the internal insulator 3, and there is no problem that the center conductor 2 and the shield conductor 4 are short-circuited.

  Here, consider a case where the shield conductor 4 of the micro coaxial cable 1 is formed by spirally winding a plurality of conductive wires around the outer periphery of the internal insulator 3. The inventors of the present invention have examined that when the shield conductor 4 is exposed from the jacket 5, loosening of the conductive wire occurs. When the width of the shield conductor 4 exposed from the jacket 5 (longitudinal direction of the micro coaxial line 1) exceeds 1/8 period of the spiral (1/8 turn of the spiral winding of the conducting wire), loosening of the conducting wire occurs. There is a case. In the conventional terminal processing method, the jacket 5 is removed from the cut portion of the jacket 5 to the terminal in the step of FIG. Therefore, the lead wire which comprises the shield conductor 4 will move at the process of FIG.3 (c).

  On the other hand, in the present invention, in step S1, the width of the shield conductor exposed portion 7 is set to be equal to or less than 1/8 of the spiral winding pitch of the conductive wire (the length wound by 45 °), and step S2 is performed in that state. Therefore, when irradiating the shield conductor 4 of the shield conductor exposed part 7 with a laser beam, it can be made more certain that the conducting wire which comprises the shield conductor 4 does not move.

  According to the present invention, when the end of the micro coaxial cable 1 is processed, particularly when the terminals of a plurality of arrayed micro coaxial lines 1 are processed all at once, the processing operation becomes easy and productivity is improved.

  In the present invention, since solder is not applied to the shield conductor 4 as in the prior art, there is no movement of the conductor due to the surface tension of the molten solder.

  In the present invention, since the shield conductor 4 is cut before the jacket 5 on the terminal side is removed after the jacket 5 is cut, in the terminal processing of a plurality of arrayed micro coaxial cables 1, the micro coaxial cable It is possible not to move the interval between the ones. As a result, in the process of connecting a plurality of arrayed micro coaxial wires 1 to the other party, such as connection to a connector or connection to a printed circuit board after terminal processing, handling of the micro coaxial wire 1 is facilitated and productivity is increased. Will improve.

  Next, another embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  As shown in FIGS. 2A to 2E, the terminal processing method of the micro coaxial cable 1 according to the present invention includes steps S1, S2, and S3 in the same manner as the terminal processing method described in FIG. Including.

  As shown in FIG. 2A, first, a plurality of micro coaxial wires 1 are aligned at a desired alignment pitch to form a flat cable. Lamination with an adhesive tape 6 is performed on the flat cable-shaped ultrafine coaxial wires 1. As a result, the plurality of fine coaxial wires 1 are fixed in an aligned state. The ultrafine coaxial line 1 is, for example, an AWG # 46 cable having an outer diameter of 0.2 mm.

Next, as shown in FIG. 2B, the jacket 5 is irradiated with laser light using a CO ₂ laser having a wavelength of 10.6 μm at the first processing point P1 at the first distance from the terminal T. As a result, the jacket 5 is cut to expose the shield conductor 4 formed of any one of spiral winding, vertical winding, and braiding, and the shield conductor exposed portion 7 is formed. It is preferable to adjust the intensity of the CO ₂ laser, the scanning speed, the number of scans, etc., so that the width of the shield conductor exposed portion 7 (longitudinal direction of the ultrafine coaxial line 1) is 0.4 mm or less. In particular, when the shield conductor 4 is formed by spirally winding a conductive wire, the width of the shield conductor exposed portion 7 is less than 1/8 period of the spiral winding pitch of the conductive wire (for example, when the pitch is 3.2 mm). By setting the thickness to 0.4 mm or less, it is possible to prevent the shield conductor 4 from being loosened.

Subsequently (or at the same time), the jacket 5 is irradiated with laser light using a CO ₂ laser having a wavelength of 10.6 μm at the second processing point P2 at a second distance longer than the first distance from the terminal T. Thus, the jacket 5 is cut to expose the shield conductor 4, and the second shield conductor exposed portion 9 is formed.

Next, as shown in FIG. 2C, the shield conductor 4 is irradiated with laser light on the shield conductor 4 using a YAG laser (double harmonic) with a wavelength of 532 nm at the first processing point P1. Is cut to expose the internal insulator 3 to form the internal insulator exposed portion 8. The trajectory in which the laser light of the YAG laser moves in the alignment direction of the micro coaxial line 1 is the same as the trajectory in which the laser light of the CO ₂ laser moves in the alignment direction of the micro coaxial line 1 and is exposed to the shield conductor exposed portion 7. The shield conductor 4 that has been cut is cut to expose the internal insulator 3.

  Next, as shown in FIG. 2 (d), the jacket 5 on the terminal T side is pulled out from the second processing point P2 toward the terminal, and thereafter, or at the same time, the jacket on the terminal T side from the first processing point P1. 5 and the shield conductor 4 are pulled out in the terminal direction. Thereby, the internal insulator 3 is exposed from the first processing location P1 to the terminal T, and the shield conductor 4 is exposed from the second processing location P2 to the first processing location P1.

Next, as shown in FIG. 2 (e), internal insulation is performed using a CO ₂ laser having a wavelength of 10.6 μm at the third processing point P3 at a third distance shorter than the first distance from the terminal T. By irradiating the body 3 with laser light, the inner insulator 3 is cut to expose the central conductor 2. Thereafter, the internal insulator 3 on the terminal T side is pulled out from the third processing place P3 in the terminal direction. As a result, the center conductor 2 is exposed from the third processing point P3 to the terminal T. This completes the terminal process.

  In the terminal processing method of FIG. 2, steps S1 and S3 are performed simultaneously or successively, step S2 is subsequently performed, and then the jacket 5 and the shield conductor 4 are removed together. The terminal processing method of FIG. 2 is the same in that it includes step S2 of irradiating the shield conductor 4 with laser light before removing the jacket 5, although the irradiation order of the laser light is different from the terminal processing method of FIG. The same effect is obtained that the shield conductor 4 can be irradiated with laser light in a state in which the conducting wire constituting the shield conductor 4 does not move.

In the embodiments so far, a CO ₂ laser having a wavelength of 10.6 μm is used for cutting the jacket 5 and a YAG laser having a wavelength of 532 nm is used for cutting the shield conductor 4. However, the present invention is not limited to this, and a semiconductor laser, Various lasers such as an excimer laser can be used, and various wavelengths can be selected.

  Further, the present invention can be applied not only to laser processing but also to the case where the jacket 5 and the internal insulator 3 are cut by dicing saw processing.

  Further, in the embodiment, an AWG # 46 cable having an outer diameter of 0.2 mm is used as the fine coaxial wire 1 and the spiral winding pitch of the conductive wire in the shield conductor 4 is 3.2 mm. The pitch of the standard and the spiral winding is not limited to this, and the present invention can be applied to any micro coaxial wire 1 in which the shield conductor 4 is formed of a conductive wire.

(A)-(g) is a top view which shows the procedure of the terminal process of the several micro coaxial line by the terminal processing method of the micro coaxial line of this invention. (A)-(e) is a top view which shows the procedure of the terminal process of the several micro coaxial line by the terminal processing method of the micro coaxial line of this invention. (A)-(d) is a top view which shows the procedure of the terminal process of the several fine coaxial wire by the conventional terminal processing method of a micro coaxial line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Micro coaxial line 2 Center conductor 3 Inner insulator 4 Shield conductor 5 Jacket 6 Adhesive tape 7 Shield conductor exposed part 8 Internal insulator exposed part 9 2nd shield conductor exposed part

Claims (4)

In the terminal processing method of the fine coaxial line having a center conductor, an inner insulator, a shield conductor, and a jacket in order from the center to the outside, and the shield conductor is formed of a conductive wire,
Cutting the jacket to expose the shield conductor at a first processing location at a first distance from the terminal; and
Cutting the shield conductor by irradiating the exposed shield conductor with laser light before removing the terminal-side jacket from the shield conductor exposed in the above step, and exposing the internal insulator;
Cutting the jacket and exposing the shield conductor at a second processing location at a second distance longer than the first distance from the terminal.   The width of the shield conductor formed by spiral winding (longitudinal direction of the ultrafine coaxial line) is 1/8 or less of the spiral winding pitch of the conducting wire. Coaxial line terminal processing method.   3. The terminal processing method for an ultrafine coaxial line according to claim 1, wherein a carbon dioxide laser is used for cutting the jacket.   4. The terminal processing method for an ultrafine coaxial line according to claim 1, wherein a YAG laser is used for cutting the shield conductor.

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