CN105407654A - Surface mounting machine and surface mounting method thereof - Google Patents
Surface mounting machine and surface mounting method thereof Download PDFInfo
- Publication number
- CN105407654A CN105407654A CN201510762053.1A CN201510762053A CN105407654A CN 105407654 A CN105407654 A CN 105407654A CN 201510762053 A CN201510762053 A CN 201510762053A CN 105407654 A CN105407654 A CN 105407654A
- Authority
- CN
- China
- Prior art keywords
- light source
- tin cream
- blue
- surface mounting
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Abstract
The invention provides a surface mounting machine. The surface mounting machine comprises a mobile camera and a data processing module. The mobile camera is electrically connected with the data processing module. The mobile camera is used for identifying the reference points on circuit boards. The data processing module is used for analyzing reference point information to generate surface mounting coordinates. The mobile camera comprises a lens and a light source. The light source comprises a blue light source. The light source is used for irradiating the circuit boards. The lens is aligned with the circuit boards. The invention also provides a surface mounting method applying the surface mounting machine. According to the surface mounting method, the blue light source of the surface mounting machine is utilized to perform component surface mounting of circuit board splicing boards. Compared with machines in the prior art, the surface mounting machine has high identification capacity for solder paste, and the surface mounting method significantly enhances efficiency of surface mounting and significantly reduces the defects of surface mounting.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of chip mounter and pasting method thereof.
Background technology
Surface mounting technology SMT (SurfaceMountedTechnology) penetrates into every field as circuit assembly technology of new generation.SMT product has that compact conformation, volume are little, vibration resistance, shock resistance, high frequency characteristics are good, production efficiency advantages of higher.SMT occupies leading position in circuit board dress connection technique.
Along with assembly element size diminishes, packaging density is more and more higher.Because of paste solder printing offset the reflow soldering caused after dry joint, establish bad increasing.When component mounter using tin cream central point as component mounter central point, paste solder printing can be reduced and offset the failure welding caused, there is side-play amount in tin cream central point and pad center point, described side-play amount can cross the surface tension automatic straightening by tin cream in furnaceman's sequence.
In correlation technique, tin cream automatic visual inspection (AutomaticOpticInspection is increased between printing machine and chip mounter, AOI) equipment, tin cream is gathered relative to after the deviation of pad by AOI equipment, again by chip mounter identification pad central point and in conjunction with this deviation, paster coordinate is compensated, this process is comparatively complicated; Owing to adding AOI equipment, also need to develop corresponding software and the corresponding software interface opened between AOI equipment and chip mounter, technical difficulty is large and cost is high.
Therefore, be necessary to provide a kind of new chip mounter and pasting method thereof to solve the problem.
Summary of the invention
The technical issues that need to address of the present invention are to provide one can identify that tin cream is as datum mark, and the high chip mounter of paster efficiency and pasting method thereof.
For solving the problems of the technologies described above, the invention provides a kind of chip mounter, described chip mounter comprises mobile camera and data processing module, described mobile camera is electrically connected with described data processing module, the datum mark of described mobile camera on identification circuit plate, described data processing module generates paster coordinate for analyzing described benchmark information, described mobile camera comprises camera lens and light source, described light source comprises blue-light source, described light source is for irradiating described wiring board, and described lens alignment is in described wiring board.
Preferably, described blue-light source is low angle blue light.
Preferably, described light source also comprises white light source and diverter switch, and described diverter switch is electrically connected with described blue-light source and described white light source respectively, and described diverter switch controls the opening and closing of described blue-light source and described white light source.
Preferably, described white light source and described blue-light source are light-emitting diode.
Preferably, described white light source and described blue-light source are located on described camera lens.
The present invention also provides a kind of and is applied to the method that described chip mounter carries out paster, comprises the steps:
Optional m igration camera light source: select the blue-light source in described chip mounter as mobile camera light source;
Gather datum mark coordinate: provide by the assembled wiring board jigsaw of polylith wiring board, select the tin cream being positioned at described wiring board jigsaw two diagonal angle as benchmark tin cream, described wiring board jigsaw is irradiated with described blue-light source, described lens alignment is in the position at described benchmark tin cream place, described in described mobile camera identification, the central point of benchmark tin cream is as datum mark, and by the data information transfer of described datum mark to described data processing module, described data processing module generates tin cream coordinate automatically;
Generate paster coordinate: described data processing module calculates the deviate of patch location and the described tin cream coordinate prestored, and described deviate is compensated described patch location, generates the paster coordinate of each element;
Paster: the central point each element being mounted extremely described tin cream according to described paster coordinate.
Preferably, the element that described benchmark tin cream is corresponding finally mounts.
Preferably, described benchmark tin cream is circular or rectangle.
Preferably, the size of described benchmark tin cream is more than or equal to 0.8mm × 0.8mm.
Preferably, described mobile camera as reference pad, generates the paster coordinate of each element by the pad of wiring board jigsaw described in described white light source identification by described benchmark tin cream and described reference pad.
Compared with correlation technique, the mobile camera of described chip mounter provided by the invention comprises blue-light source, in paster technique, described wiring board is under blue light illumination, described mobile camera can identify that described benchmark tin cream is as datum mark smoothly, and described blue light source is preferably low angle blueness, the contrast between described tin cream and described pad can be improved; Meanwhile, described pasting method, to be positioned at the described benchmark tin cream of two diagonal positions of described wiring board jigsaw for datum mark, greatly reduces datum mark recognition time.Element is affixed on the central point of described tin cream by described pasting method, and the deviation of the central point of described tin cream and the central point of described pad can cross furnaceman's sequence automatic straightening by follow-up, and attachment principle is simple, and cost is low, and mount effective, ratio of defects significantly declines.
Accompanying drawing explanation
Fig. 1 is the structural representation that chip mounter of the present invention is applied to the wiring board jigsaw of element paster;
Fig. 2 is the structural representation of chip mounter of the present invention;
Fig. 3 is the schematic flow sheet of pasting method of the present invention;
Fig. 4 moves the identification figure of camera to tin cream when being and adopting blue light source in pasting method of the present invention;
Fig. 5 moves the integral curve figure of camera to tin cream when being and adopting blue light source in pasting method of the present invention;
Fig. 6 moves the teaching result figure of camera to tin cream when being and adopting blue light source in pasting method of the present invention;
Fig. 7 moves the identification figure of camera to tin cream when being and adopting white light source;
Fig. 8 moves the integral curve figure of camera to tin cream when being and adopting white light source;
Fig. 9 moves the teaching result figure of camera to tin cream when being and adopting white light source;
Figure 10 be after pasting method of the present invention carries out paster with the pasting method of prior art product defects rate contrast figure.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Incorporated by reference to consulting Fig. 1 and Fig. 2, wherein, Fig. 1 is the structural representation that chip mounter of the present invention is applied to the wiring board jigsaw of element paster, and Fig. 2 is the structural representation of chip mounter of the present invention.Described wiring board jigsaw 2 is assembled by polylith wiring board 21.Wiring board 21 described in polylith be assembled into integrally be convenient to print polylith wiring board 21 simultaneously, paster and cross furnaceman's sequence, save the production time.
In the present embodiment, described wiring board jigsaw 2 is spliced by 8 pieces of described wiring boards 21.
Can be understood as, described wiring board 21 quantity being assembled into described wiring board jigsaw 2 is not limit, and according to need of production, the described wiring board 21 of any amount is assembled into one and is all included within protection scope of the present invention.
Described wiring board jigsaw 2 is by a fixture support, and 8 pieces of described wiring boards 21 adopt white high tempreture tape to be fixed on described fixture respectively, and described white high temperature paster cost is low and can repeatedly use.
The fixed form of described wiring board 21 is not limited in takes described white high temperature paster to paste, and takes other fixed forms such as magnetic clamp to be all in like manner included within protection scope of the present invention.
Described wiring board 21 comprises pad 211 and tin cream 213, and described tin cream 213 is multiple and is located on described pad 211 according to the position of component mounter.
According to the position of described tin cream 213 at described wiring board jigsaw 2, described tin cream 213 be divided into the benchmark tin cream 213a of the diagonal position being positioned at described wiring board jigsaw 2 and be positioned at other tin creams 213b of other positions.
Described chip mounter 1 comprises mobile camera 11 for identifying datum mark and data processing module 12.Described mobile camera 11 is electrically connected with described data processing module 12, and Information Monitoring is transferred to described data processing module 12 by described mobile camera 11, and described data processing module 12 carries out analyzing and processing to the information received.
Described mobile camera 11 comprises camera lens 111 and light source 113.In paster technique, described camera lens 111 is to being positioned at described wiring board 21.Described light source 113 is for irradiating described wiring board 21, and it is peripheral that described light source 13 is located on described camera lens 111, and make described camera lens 111 ambient light even, the crawl identifying antijamming capability of described camera lens 111 is stronger.
In the present embodiment, described light source 113 comprises white light source 1131, blue-light source 1133 and diverter switch 1135.Described diverter switch 1135 is electrically connected with described white light source 1131 and described blue-light source 1133 respectively, and described diverter switch 1135 controls the opening and closing of described white light source 1131 and described blue-light source 1133.
Described white light source 1131 and described blue-light source 1133 are light-emitting diode, and user can freely switch described white light source 1131 and described blue-light source 1133 light source as described mobile camera 11 by described diverter switch 1135.Wherein, described blue-light source 1133 can significantly improve the contrast of described tin cream 213 and surrounding environment.
Described blue-light source 1133 is set to low-angle blue light, can further improve the contrast of described tin cream 213.
Certainly, described chip mounter 1 does not arrange described white light source 1131 and is in like manner included in protection scope of the present invention yet.
Referring to Fig. 3 again, is the schematic flow sheet of pasting method of the present invention.Described pasting method comprises the steps:
Step S1, optional m igration camera light source: select the described blue-light source 1133 in described chip mounter 1 as the light source of described mobile camera 11;
Concrete, select the described blue-light source 1133 in described chip mounter 1 as the light source of described mobile camera 11, wherein said blue-light source 1133 is low angle blue light, and therefore described tin cream 213 is large with the contrast of described pad 211.
Step S2, gather datum mark coordinate: provide described wiring board jigsaw 2, select the described tin cream 213 being positioned at described wiring board jigsaw 2 liang of diagonal angles as described benchmark tin cream 213a, described wiring board jigsaw 2 is irradiated with described blue-light source 1133, described camera lens 111 is to the position being positioned at described benchmark tin cream 213a place, described mobile camera 11 identifies that the central point of described benchmark tin cream 213a is as datum mark, and by the data information transfer of described datum mark to described data processing module 12, described data processing module 12 generates tin cream coordinate automatically;
Concrete, described camera lens 111 is under described blue-light source 1133 irradiates, to being positioned at described benchmark tin cream 213a position and automatically identifying that the central point being positioned at the described benchmark tin cream 213a at two diagonal angles of described wiring board jigsaw 2 is as datum mark, described chip mounter 1 generates the tin cream coordinate of described other tin creams 213b automatically, connecting line due to diagonal angle is the longest connecting line on described wiring board jigsaw 2, when therefore adopting two described benchmark tin cream 213a as datum mark, the crawl precision of described mobile camera 11 is the highest.
Described wiring board jigsaw 2 is formed by the printing of monoblock steel mesh, relative position described in each on wiring board 21 described in every block between tin cream 213 is determined, during with the central point of two described benchmark tin cream 213a for datum mark, described data processing module 12 can calculate the described described tin cream coordinate of other tin creams 213b and the relative position of datum mark smoothly, ensures that element fills the central point being labelled to each described tin cream 213 smoothly.
When selecting the central point of described benchmark tin cream 213a as datum mark, following item should be noted:
1, the position that surface mount elements is more sparse is selected.
Described wiring board jigsaw 2 has four angles, and each angle exists multiple described tin cream 213, and when described mobile camera 11 identifies datum mark, need the multiple described tin cream 213 around to datum mark contrast and judge, therefore recognition time certainly will increase; When datum mark is positioned at the more sparse position of described tin cream 213, the judgement number of objects of described mobile camera 11 reduces, therefore to the identification of datum mark shortening corresponding to the time that judges, also greatly can reduce the probability of miscarriage of justice of described mobile camera 11 pairs of datum marks simultaneously, reduce the risk of whole plate paster offset mass defect.
2, select suitable tin cream as datum mark.
The shape of described benchmark tin cream 213a should be regular, and preferable shape is circular or rectangle, is convenient to determine that the central point of described benchmark tin cream 213a is as datum mark; Meanwhile, preferred size is more than or equal to the central point of the described benchmark tin cream 213a of 0.8mm × 0.8mm as datum mark, is convenient to described mobile camera 11 and identifies, prevents erroneous judgement, is also more conducive to the central point calculating described benchmark tin cream 213a.
Step S3, generates paster coordinate: described data processing module 12 calculates the deviate of patch location and the described tin cream coordinate prestored, and described deviate is compensated described patch location, generates the paster coordinate of each element;
Concrete, with described tin cream coordinate for benchmark, calculate the deviate of each element paster coordinate and the described tin cream coordinate prestored, compensate described paster coordinate by described deviate, described paster coordinate is overlapped with described tin cream coordinate.
Step S4, paster: the central point each element being mounted extremely described tin cream according to described paster coordinate;
Concrete, by each component mounter to the central point of described tin cream 213, in order to ensure that other coordinates can carry out precise positioning by basis of reference point, the mount components that therefore described benchmark tin cream 213a is corresponding should finally mount.
When adopting the identification light source of described blue-light source 1133 as described mobile camera 11 in pasting method of the present invention, form striking contrast between described tin cream 213 and described pad 211, described mobile camera 11 can identify that described tin cream 213 is as datum mark smoothly.
Referring to Fig. 4, moving the identification figure of camera to tin cream for adopting in pasting method of the present invention during blue light source.The brightness of described tin cream 213 and the contrast of described pad 211 greatly, possess the condition as datum mark.
Referring to Fig. 5, moving the integral curve figure of camera to tin cream for adopting in pasting method of the present invention during blue light source.Integral curve parabolically shape in Fig. 5, wherein parabolical summit is the feature locations of integral curve, and feature locations is obvious.
Referring to Fig. 6, moving the teaching result figure of camera to tin cream for adopting in pasting method of the present invention during blue light source.In Fig. 6, the result of teaching is very good, and described mobile camera 11 can catch described tin cream 213 rapidly and accurately as datum mark, and therefore under blue light illumination, described mobile camera 11 has the described tin cream 213 of identification as the ability of datum mark.
There is deviation in the central point of described tin cream 213 and the central point of described pad 211, cause each component mounter position and design attitude to there is side-play amount, the self-rectification function that this side-play amount can be passed through furnaceman's sequence is corrected automatically.Carry out paster according to pasting method provided by the invention, side-play amount error-correcting effect is as shown in table 1:
The side-play amount statistical form at table 1 pad center and tin cream center
After crossing furnaceman's sequence, the side-play amount between the central point of described tin cream 213 and the central point of described pad 211 is no more than 0.08mm, lower than each element allowable offset, therefore changes the defect that datum mark RM can not cause Component Displacement amount excessive.
According to pasting method of the present invention, use instead after described benchmark tin cream 213a carries out component mounter as datum mark, acquisition elements sample carries out the statistics of side-play amount defective products, and statistics is as shown in table 2:
Table 2 tin cream side-play amount defects statistics table
| Numbering | Packing forms | Tin cream side-play amount | Sample size | Bad quantity |
| 1 | CHIP 1005 | >0.15mm | 100 | 0 |
| 2 | Row's appearance 1410 | >0.15mm | 100 | 0 |
| 3 | Row's appearance 2014 | >0.15mm | 100 | 0 |
| 4 | Exclusion 1010 | >0.15mm | 100 | 0 |
| 5 | LED | >0.15mm | 100 | 0 |
| 6 | Diode | >0.15mm | 100 | 0 |
| 7 | SOP 8 | >0.15mm | 100 | 0 |
| 8 | QFN 28 | >0.15mm | 100 | 0 |
| 9 | CN 24 | >0.15mm | 100 | 0 |
| 10 | CSP 18 | >0.15mm | 100 | 0 |
Described statistic analysis result shows, in sample range, changes the defective products that datum mark can not cause side-play amount excessive.
Compare with pasting method provided by the invention, white light source is adopted to carry out one group of tin cream recognition effect contrast test, test result as shown in Figure 7 to 9, wherein, Fig. 7 moves the identification figure of camera to tin cream when being and adopting white light source, Fig. 8 moves the integral curve figure of camera to tin cream when being and adopting white light source, moves the teaching result figure of camera to tin cream when Fig. 9 is and adopts white light source.
In Fig. 7, the brightness of described tin cream 213 and the dark background of surrounding close, therefore under white light, described in described mobile camera 11 None-identified, tin cream 213 is as datum mark.
In Fig. 8, integral curve is accidental fluctuation, and therefore without obvious characteristic position, after teaching, the center of datum mark is not in the centre of described tin cream 213.
In Fig. 9, described tin cream 213 and surrounding environment contrast are not strong, when described mobile camera 11 finds datum mark under white light, are subject to the interference of surrounding environment and cannot find correct datum mark, the side-play amount that therefore must make mistake, can cause element to fill when pasting and occur overall offset.
Obtain through above-mentioned test analysis, under white light source irradiates, described mobile camera 11 is difficult to effectively identify described tin cream 213.
Pasting method provided by the invention, has the advantages that product defects rate after paster is low.Refer to Figure 10, for pasting method of the present invention carry out paster with the pasting method of prior art after product defects rate contrast figure.Described ratio of defects refers to the skew of surface mount elements after furnaceman's sequence, erects fraction defective.Prior art adopts described pad 211 for element dress subsides datum mark, paster ratio of defects is 19%-46%, when adopting described tin cream 213 to paste datum mark for element dress, paster ratio of defects is 2%-19%, after adopting pasting method of the present invention, paster ratio of defects reduces 11%-41%, and product quality promotes Be very effective.
In pasting method of the present invention, except being identified that by described blue-light source 1133 described tin cream 213 is as except datum mark, described mobile camera can also identify reference pad with described white light source 1131, by the combination of described benchmark tin cream 213a and described reference pad, calculate tin cream coordinate and pad coordinate respectively, and tin cream coordinate described in comparative analysis and the deviate between described pad coordinate, to generate the accurate paster coordinate of each element.
In correlation technique, in wiring board 21 described in each block, all select two to be datum mark to angle point, therefore described mobile camera 11 need identify multiple datum mark, the identifying waste plenty of time.Usual described mobile camera 11 identifies that the speed of datum mark is about 0.6s/ couple, 8 pieces of described wiring boards 2 are comprised for wiring board jigsaw 2 described in block every in the present embodiment, identify that datum mark needs 4.8s in the conventional way, and adopt the method identification datum mark in the present invention only to need 0.6s, recognition time shortens 87.5%, after adopting the method, the CYCLETIME of described chip mounter 1 is reduced to 43s by original 48s, production capacity is increased to 664pcs/h by 584pcs/h, lifting amplitude, up to 13.7%, has significant progress in production capacity lifting.Pasting method provided by the invention, greatly reduces datum mark recognition time, thus improves the operating efficiency of paster technique.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a chip mounter, comprise mobile camera and data processing module, described mobile camera is electrically connected with described data processing module, the datum mark of described mobile camera on identification circuit plate, described data processing module generates paster coordinate for analyzing described benchmark information, it is characterized in that, described mobile camera comprises camera lens and light source, described light source comprises blue-light source, and described light source is for irradiating described wiring board, and described lens alignment is in described wiring board.
2. chip mounter according to claim 1, is characterized in that, described blue-light source is low angle blue light.
3. chip mounter according to claim 1, it is characterized in that, described light source also comprises white light source and diverter switch, and described diverter switch is electrically connected with described blue-light source and described white light source respectively, and described diverter switch controls the opening and closing of described blue-light source and described white light source.
4. according to the chip mounter in claim 3 described in any one, it is characterized in that, described white light source and described blue-light source are light-emitting diode.
5. chip mounter according to claim 4, is characterized in that, described white light source and described blue-light source are located on described camera lens.
6. application rights requires a pasting method for the chip mounter in 1 to 5 described in any one, it is characterized in that, comprises the steps:
Optional m igration camera light source: select the blue-light source in described chip mounter as mobile camera light source;
Gather datum mark coordinate: provide by the assembled wiring board jigsaw of polylith wiring board, select the tin cream being positioned at described wiring board jigsaw two diagonal angle as benchmark tin cream, described wiring board jigsaw is irradiated with described blue-light source, described lens alignment is in the position at described benchmark tin cream place, described in described mobile camera identification, the central point of benchmark tin cream is as datum mark, and by the data information transfer of described datum mark to described data processing module, described data processing module generates tin cream coordinate automatically;
Generate paster coordinate: described data processing module calculates the deviate of patch location and the described tin cream coordinate prestored, and described deviate is compensated described patch location, generates the paster coordinate of each element;
Paster: the central point each element being mounted extremely described tin cream according to described paster coordinate.
7. pasting method as claimed in claim 6, it is characterized in that, the element that described benchmark tin cream is corresponding finally mounts.
8. pasting method as claimed in claim 6, is characterized in that, described benchmark tin cream is circular or rectangle.
9. pasting method as claimed in claim 6, it is characterized in that, the size of described benchmark tin cream is more than or equal to 0.8mm × 0.8mm.
10. pasting method as claimed in claim 6, is characterized in that, described mobile camera as reference pad, generates the paster coordinate of each element by the pad of wiring board jigsaw described in described white light source identification by described benchmark tin cream and described reference pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510762053.1A CN105407654A (en) | 2015-11-09 | 2015-11-09 | Surface mounting machine and surface mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510762053.1A CN105407654A (en) | 2015-11-09 | 2015-11-09 | Surface mounting machine and surface mounting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105407654A true CN105407654A (en) | 2016-03-16 |
Family
ID=55472826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510762053.1A Pending CN105407654A (en) | 2015-11-09 | 2015-11-09 | Surface mounting machine and surface mounting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105407654A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106154437A (en) * | 2016-07-14 | 2016-11-23 | 江苏奥雷光电有限公司 | A kind of light splitting piece image recognition automatic chip mounting method |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN109561603A (en) * | 2018-11-30 | 2019-04-02 | 惠州市协昌电子有限公司 | A kind of pasting method and device |
| CN109585627A (en) * | 2017-09-29 | 2019-04-05 | 科斯莫灯饰公司 | The patch device and method of LED chip |
| CN111542218A (en) * | 2020-04-23 | 2020-08-14 | 国网浙江省电力有限公司电力科学研究院 | Electric energy meter credible production patch link acquisition verification method and system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077592A (en) * | 1999-08-31 | 2001-03-23 | Asuriito Fa Kk | Flip chip mounting device |
| CN101377282A (en) * | 2008-07-31 | 2009-03-04 | 苏州德天自动化科技有限公司 | Method and apparatus for arranging tricolor annular LED |
| CN102281749A (en) * | 2010-06-10 | 2011-12-14 | 世成电子(深圳)有限公司 | Mounting method, mounting system and mounting machine |
| CN104999791A (en) * | 2015-08-21 | 2015-10-28 | 苏州三体智能科技有限公司 | Vision-based circuit board printing and detection device and working method thereof |
-
2015
- 2015-11-09 CN CN201510762053.1A patent/CN105407654A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077592A (en) * | 1999-08-31 | 2001-03-23 | Asuriito Fa Kk | Flip chip mounting device |
| CN101377282A (en) * | 2008-07-31 | 2009-03-04 | 苏州德天自动化科技有限公司 | Method and apparatus for arranging tricolor annular LED |
| CN102281749A (en) * | 2010-06-10 | 2011-12-14 | 世成电子(深圳)有限公司 | Mounting method, mounting system and mounting machine |
| CN104999791A (en) * | 2015-08-21 | 2015-10-28 | 苏州三体智能科技有限公司 | Vision-based circuit board printing and detection device and working method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106154437A (en) * | 2016-07-14 | 2016-11-23 | 江苏奥雷光电有限公司 | A kind of light splitting piece image recognition automatic chip mounting method |
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN109585627A (en) * | 2017-09-29 | 2019-04-05 | 科斯莫灯饰公司 | The patch device and method of LED chip |
| CN109561603A (en) * | 2018-11-30 | 2019-04-02 | 惠州市协昌电子有限公司 | A kind of pasting method and device |
| CN109561603B (en) * | 2018-11-30 | 2020-06-02 | 惠州市协昌电子有限公司 | Paster attaching method and device |
| CN111542218A (en) * | 2020-04-23 | 2020-08-14 | 国网浙江省电力有限公司电力科学研究院 | Electric energy meter credible production patch link acquisition verification method and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105407654A (en) | Surface mounting machine and surface mounting method thereof | |
| TWM528570U (en) | Intelligent welding fully automatic production line | |
| US9681553B2 (en) | Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board | |
| CN111060515A (en) | PCBA quality detection method, system and computer equipment | |
| TW200630607A (en) | Inspecting method for wiring board, manufacturing method for wiring board and inspecting device for wiring board | |
| CN205573284U (en) | Solder paste printing machine's printing table and solder paste printing machine | |
| CN107396538A (en) | A kind of mainboard production line automation production management method | |
| TWI452284B (en) | The method of detecting the mark of the multi-board, the method of detecting the device and the multi-board | |
| CN201173397Y (en) | Automatic optical detection device light source for printed circuit board | |
| CN109561651A (en) | A kind of SMT surface mount elements position control method and its system | |
| CN109192683B (en) | MCM integrated circuit packaging production line integrating SMT procedures | |
| CN205561756U (en) | Tin cream, red check out test set of gluing | |
| US10069042B2 (en) | Light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting system | |
| CN202262230U (en) | Chip mounter | |
| KR101581894B1 (en) | Apparatus for SMT management | |
| CN105759196A (en) | Automatic positioning initial workpiece circuit board detection system with compensation calibration function | |
| CN104853540A (en) | SMT chip packaging process | |
| CN109119393B (en) | MCM integrated circuit packaging structure integrating SMT | |
| CN106793566A (en) | The preparation method and mobile terminal of a kind of printed circuit board plate | |
| CN208157376U (en) | A kind of independent automatic correcting mechanism and chip mounter | |
| JP2003218505A (en) | Printed board, printed board unit, method of checking and manufacturing the same, and communication equipment using the same | |
| JP4263519B2 (en) | Inspection method of automatic component mounting equipment | |
| CN107907552A (en) | A kind of circuit board tin face checks technique | |
| CN109548398A (en) | A kind of SMT surface mount elements stowage and its device | |
| CN100362640C (en) | Method for preventing semiconductor assembly pin welding from shorting circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160316 |