CN210485370U

CN210485370U - Electrodeless flat-pasted LED lamp string and production equipment thereof

Info

Publication number: CN210485370U
Application number: CN201921488075.3U
Authority: CN
Inventors: 单西万; 杨土秀; 艾云东; 张�杰; 李群林; 刘启明; 闫肃; 刘艳勇; 贺君超; 蔡加会; 陈悦
Original assignee: Zhuhai Bojay Electronics Co Ltd
Current assignee: Zhuhai Bojay Electronics Co Ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2020-05-08
Anticipated expiration: 2029-09-06

Abstract

The utility model discloses an electrodeless flat-paste LED lamp cluster and production facility thereof, electrodeless flat-paste LED lamp cluster, include: a first conductive line and a second conductive line; the LED units comprise two patch LEDs, light emitting surfaces of the two patch LEDs are opposite, and the light emitting surfaces of the two patch LEDs are parallel to the axial direction of the first lead and the second lead; and the packaging colloids are used for respectively coating the two surface mounted LEDs of the LED units inside the packaging colloids. The electrodeless flat-pasting LED lamp string has the advantages that two SMD LEDs are welded in each welding lamp area, so that the utilization rate of the lamp string lamp wire is improved, the utilization rate of raw materials and equipment is improved, and the product quality and the production efficiency are improved; moreover, the electrodeless effect is realized, and the use is convenient; further, the colors of the two patch LEDs may be set to be different, and the colors are changed by changing the direction of energization.

Description

Electrodeless flat-pasted LED lamp string and production equipment thereof

Technical Field

The utility model relates to the field of lamps and lanterns, especially relate to an electrodeless flat LED lamp cluster and production facility thereof.

Background

The LED lamp string is a decorative lamp decoration containing luminous lamp beads, wires and the like, and is widely applied to industries such as decoration, building, landscape and the like. The LED lamp string is pursued by people due to the characteristics of energy conservation, environmental protection, beautiful appearance, low price and the like. A conventional LED light string generally consists of two wires side by side and several chip LEDs packaged on the wires. The LED lamp string is welded with a patch LED at an assembly position, so that the utilization rate of a lead is low, and great waste of manpower, raw materials and equipment is caused; moreover, the patch LED is unipolar, and when the patch LED is used, the positive pole and the negative pole of the string of lights must correspond to the positive pole and the negative pole of the driving power supply, so that the patch LED is inconvenient to use.

Disclosure of Invention

To above-mentioned prior art current situation, the utility model provides a electrodeless flat LED lamp cluster that pastes of wire high-usage, convenient to use. The utility model also provides a production facility of above-mentioned electrodeless flat paste LED lamp cluster.

In order to solve the technical problem, the utility model provides an electrodeless flat LED lamp cluster that pastes, include:

the first lead and the second lead are arranged side by side or are twisted together, the first lead and the second lead both comprise lead cores and insulating layers coated on the surfaces of the lead cores, the insulating layers of the first lead are removed at intervals of a set length along the axial direction of the first lead to form a plurality of first welding points, the insulating layers of the second lead are removed at intervals of a set length along the axial direction of the second lead to form second welding points, and the positions of the second welding points correspond to the positions of the first welding points one by one to form a plurality of welding lamp areas;

the LED welding device comprises a plurality of LED units, wherein the LED units are respectively arranged at a plurality of welding lamp areas, each LED unit comprises a first patch LED and a second patch LED, the light emitting surfaces of the first patch LED and the second patch LED are opposite, the light emitting surface of the first patch LED faces the upper side of the welding lamp area, the light emitting surface of the second patch LED faces the lower side of the welding lamp area, the positions of the positive electrodes and the negative electrodes of the first patch LED and the second patch LED are opposite, and two welding feet of the first patch LED and the second patch LED of each LED unit are respectively welded on the first welding spot and the second welding spot of the corresponding welding lamp area; and

and the packaging colloid is respectively coated on the two surface-mounted LEDs of the LED units to form a plurality of lamp beads.

The electrodeless flat-pasting LED lamp string has the advantages that two SMD LEDs are welded in each welding lamp area, so that the utilization rate of the lamp string lamp wire is improved, the utilization rate of raw materials and equipment is improved, and the product quality and the production efficiency are improved; in addition, the positive electrodes and the negative electrodes of the two surface-mounted LEDs are opposite, so that one surface-mounted LED emits light and the other surface-mounted LED does not emit light when the two surface-mounted LEDs are electrified in the forward direction, and one surface-mounted LED does not emit light and the other surface-mounted LED emits light when the two surface-mounted LEDs are electrified in the reverse direction, so that the electrodeless effect is realized, and the use is convenient; in addition, the colors of the two patch LEDs can be set to be different, the colors can be changed by changing the electrifying direction, and the color mixing effect of any two light colors can be completed according to the patch LEDs and the coated fluorescent powder when alternating current is electrified.

In one embodiment, the two patch LEDs of the LED unit are different in color.

In one embodiment, the first and second wires are insulated wires or coated wires.

The utility model provides a production method of electrodeless flat LED lamp cluster, including following step:

a first conducting wire and a second conducting wire are threaded through a threading mechanism;

the first lead and the second lead are conveyed to a wire stripping station through a lead conveying mechanism, insulation layers of the first lead and the second lead are removed at intervals of a set interval through a wire stripping mechanism to form a first welding point and a second welding point, and the positions of the first welding point and the positions of the second welding point correspond to each other one by one to form a welding lamp area;

the first welding spot and the second welding spot are conveyed to a spot welding material station through a lead conveying mechanism, and welding materials are coated on the surfaces of the first welding spot and the second welding spot through a spot welding material mechanism;

the welding method comprises the following steps that a first welding spot and a second welding spot, the surfaces of which are coated with welding materials, are conveyed to an LED mounting station through a wire conveying mechanism, a first patch LED and a second patch LED are placed at a welding lamp area through an LED mounting mechanism, the light emitting surfaces of the first patch LED and the second patch LED are opposite, the light emitting surface of the first patch LED faces the upper side of the welding lamp area, the light emitting surface of the second patch LED faces the lower side of the welding lamp area, and the positions of the positive pole and the negative pole of the first patch LED and the second patch LED are arranged oppositely;

the first SMD LED and the second SMD LED are conveyed to a welding station through a wire conveying mechanism, and two welding feet of the first SMD LED and the second SMD LED are respectively welded on the first welding spot and the second welding spot through a welding mechanism;

conveying the welded first patch LED and the welded second patch LED to a welding detection station through a wire conveying mechanism, and detecting the welding quality of the first patch LED and the second patch LED through a welding detection mechanism; and

and the first surface mounted LED and the second surface mounted LED after detection are conveyed to a packaging station through a wire conveying mechanism, and the first surface mounted LED and the second surface mounted LED are packaged in a packaging colloid through a packaging mechanism to form a lamp bead.

In one embodiment, the step of placing the first and second chip LEDs at the soldering terminal area by the LED mounting mechanism includes:

the first feeder assembly provides a first patch LED with a light-emitting surface facing upwards;

adsorbing a first patch LED from the first feeder component through a manipulator adsorption component, and flatly pasting the first patch LED on the upper side of the welding lamp area;

the second feeder assembly provides a second patch LED with a downward light emitting surface;

adsorbing a second patch LED from the second feeder component through a manipulator adsorption component, and flatly pasting the second patch LED to a transfer position; and

and obtaining the second patch from the transfer position through a second patch LED mounting component, and flatly attaching the second patch to the lower side of the welding lamp area.

In one embodiment, the first patch LED is a different color than the second patch LED.

The utility model provides a pair of electrodeless flat-paste LED lamp cluster's production facility, include:

the wire feeding mechanism is used for feeding a first wire and a second wire on the ground side by side;

the wire stripping mechanism is used for removing the insulating layers on the surfaces of the first conducting wire and the second conducting wire at a set interval to form a first welding point and a second welding point, and the first welding point and the second welding point correspond to form a welding lamp area;

a spot welding material mechanism for coating a welding material on the surfaces of the first welding spot and the second welding spot;

the LED mounting mechanism is used for placing a first patch LED and a second patch LED at a welding lamp area, the light emitting surfaces of the first patch LED and the second patch LED are opposite, the light emitting surface of the first patch LED faces the upper side of the welding lamp area, the light emitting surface of the second patch LED faces the lower side of the welding lamp area, and the positions of the positive electrode and the negative electrode of the first patch LED and the second patch LED are opposite;

the welding mechanism is used for respectively welding two welding feet of the first surface mounted LED and the second surface mounted LED on the first welding spot and the second welding spot;

the detection mechanism is used for detecting the welding quality of the first patch LED and the second patch LED;

the packaging mechanism is used for packaging the first surface mounted LED and the second surface mounted LED in a packaging colloid to form a lamp bead; and

and the wire conveying mechanism is used for conveying the first wire and the second wire.

In one embodiment, the LED placement mechanism comprises:

a first chip LED for providing a first chip LED with a light emitting surface facing upwards;

a second chip LED for providing a second chip LED with a downward light emitting surface;

the manipulator adsorption component is used for adsorbing a first patch LED from the first feeder component, attaching the first patch LED to the upper side of the welding lamp area, adsorbing a second patch LED from the second feeder component, and placing the second patch LED at a transfer position; and

and the second patch LED mounting component is used for acquiring the second patch LED at the transfer position and mounting the second patch LED on the lower side of the welding lamp area.

In one embodiment, the manipulator adsorption assembly comprises a positioning block and a positioning block driving device, the positioning block is provided with a placing part for placing the second chip LED, the positioning block can move between a transfer position and a mounting position, and the positioning block driving device is used for driving the positioning block to move between the transfer position and the mounting position.

In one embodiment, the positioning block is further provided with a positioning groove for positioning the first lead and the second lead.

The advantageous effects of the additional features of the present invention will be explained in the detailed description of the preferred embodiments of the present description.

Drawings

Fig. 1 is a schematic structural diagram of an electrodeless flat-mounted LED lamp string according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is a schematic structural view of an electrodeless flat-mounted LED lamp string according to another embodiment of the present invention;

fig. 4 is a flowchart of a method for producing electrodeless flat-mounted LED lamp strings in an embodiment of the present invention;

fig. 5 is an isometric view of a production apparatus for electrodeless flat-paste LED lamp strings in an embodiment of the present invention;

fig. 6 is a schematic perspective view of an LED placing mechanism of a production apparatus for electrodeless flat-mounted LED lamp strings in an embodiment of the present invention;

fig. 7 is a schematic perspective view of a second surface mount LED mounting assembly according to an embodiment of the present invention;

fig. 8 is a partially enlarged schematic view at I in fig. 7.

Description of reference numerals:

10. a support frame;

20. a wire feeding mechanism;

30. a wire stripping mechanism;

40. a wire conveying mechanism;

50. a spot weld material mechanism;

60. an LED placement mechanism; 61. a first boomerang assembly; 62. a second boomerang assembly; 63. a manipulator adsorption assembly; 631. an adsorption rod; 632. a manipulator; 64. a second surface mounted LED mounting component; 641. positioning blocks; 641a, a positioning groove; 642. a translation cylinder; 643. a lifting cylinder; 644. a fixed seat; 645. a support;

70. a welding mechanism;

80. a detection mechanism;

90. a packaging mechanism; 901. a glue dispensing mechanism; 902. a curing mechanism;

110. a terminal processing mechanism; 111. a take-up pulley; 112. a take-up motor;

120. an LED light string; 121. a first conductive line; 122. a second conductive line; 123. a first patch LED; 124. a second patch LED; 125. and (5) encapsulating the colloid.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the features in the following embodiments and examples may be combined with each other without conflict.

The upper, lower, left and right in this embodiment are only for convenience of description, and are not intended to limit the scope of the present invention, and the changes or adjustments of the relative relationship should be considered as the scope of the present invention.

Fig. 1 and 2 show that, in order to implement the present invention, the electrodeless flat-paste LED lamp string 120 includes a first wire 121 and a second wire 122, a plurality of LED units and a plurality of encapsulant 125, wherein the first wire 121 and the second wire 122 are arranged side by side, and both the first wire 121 and the second wire 122 include a wire core (not shown in the figure) and an insulating layer (not shown in the figure) coated on the surface of the wire core. The first and second

conductive wires

121 and 122 in this embodiment may be a rubber-covered wire or an enameled wire. The first conductive wires 121 and the second conductive wires 122 are formed by removing the insulating layer along the axial direction thereof at intervals of a predetermined length to form a plurality of first welding points (not shown) and a plurality of second welding points (not shown), and the positions of the plurality of second welding points correspond to the positions of the plurality of first welding points one by one to form a plurality of welding lamp zones. The LED units are respectively arranged at the welding lamp areas, each LED unit comprises a first patch LED123 and a second patch LED124, the light emitting surfaces of the first patch LED123 and the second patch LED124 are opposite, the light emitting surface of the first patch LED123 faces the upper side of the welding lamp area, the light emitting surface of the second patch LED124 faces the lower side of the welding lamp area, the positions of the anode and the cathode of the first patch LED123 and the second patch LED124 are opposite, and two welding feet of the first patch LED123 and the second patch LED124 of each LED unit are respectively welded on a first welding spot and a second welding spot of the corresponding welding lamp area. The plurality of encapsulant 125 is respectively coated on the surfaces of the first patch LED123 and the second patch LED124 of the plurality of LED units to form a plurality of beads.

In one embodiment, the first and

second patch LEDs

123, 124 are different colors.

Fig. 3 is a schematic structural diagram of an electrodeless flat-mounted LED lamp string according to a second embodiment of the present invention. As shown in the figures, unlike the above embodiments, the first conductive wire 121 and the second conductive wire 122 of the electrodeless flat-mounted LED string 120 in this embodiment are twisted together.

In an embodiment of the present invention, an automatic production method of LED light string is provided, as shown in fig. 4, the production method includes the following steps:

and step S1, the first wire and the second wire are threaded, and the first wire and the second wire are threaded through the threading mechanism.

And step S2, stripping wires. The first lead and the second lead are conveyed to a wire stripping station through a lead conveying mechanism, insulation layers on the surfaces of the first lead 121 and the second lead 122 are removed at a set interval through the wire stripping mechanism to form a first welding point and a second welding point, and the positions of the first welding point and the second welding point correspond to each other one by one to form a welding lamp area.

And step S3, spot welding the materials. The first welding spot and the second welding spot are conveyed to a spot welding material station through a wire conveying mechanism, and welding materials are coated on the surfaces of the first welding spot and the second welding spot through a spot welding material mechanism.

And step S4, mounting the patch LED. First solder joint and the second solder joint that the surface coating has welding material pass through wire conveying mechanism and carry to LED pastes dress station, paste dress mechanism through LED and place first paster LED123 and second paster LED124 in welding lamp district department, the light emitting area of first paster LED123 and second paster LED124 is back on the back mutually, the light emitting area of first paster LED123 is towards the top side of welding lamp district, the light emitting area of second paster LED124 is towards the below side of welding lamp district, and the position of the positive pole and the negative pole of first paster LED123 and second paster LED124 is opposite setting. The method comprises the following specific steps: the first feeder assembly provides a first patch LED with a light-emitting surface facing upwards; the manipulator adsorption component adsorbs the first patch LED from the first feeder component and flatly pastes the first patch LED on the upper side of the welding lamp area; the second feeder assembly provides a second patch LED with a downward light emitting surface; the manipulator adsorption component adsorbs a second patch LED from the second feeder component, and the second patch LED is flatly placed at a transfer position; and the second patch LED mounting component obtains the second patch from the transfer position and flatly attaches the second patch to the lower side of the welding lamp area.

And step S5, welding. The first patch LED123 and the second patch LED are conveyed to a welding station through a wire conveying mechanism, and the anodes and the cathodes of the first patch LED123 and the second patch LED124 are respectively welded with the first welding point of the first wire 121 and the second welding point of the second wire 122 through the welding mechanism.

And step S6, welding detection. And the welded first patch LED123 and the welded second patch LED are conveyed to a welding detection station through a wire conveying mechanism, and the welding quality of the patch LEDs is detected through the welding detection mechanism.

And step S7, packaging. The first surface mounted LED123 and the second surface mounted LED124 after detection are conveyed to a packaging station through a wire conveying mechanism, and the first surface mounted LED123 and the second surface mounted LED124 are packaged in a packaging colloid 125 through a packaging mechanism to form lamp beads.

And step S8, terminal processing. And carrying out subsequent processing on the lamp string.

The utility model provides a production method of electrodeless flat-paste LED lamp cluster realizes the online full-automatic production of electrodeless flat-paste LED lamp cluster, and production efficiency and quality improve greatly, simultaneously reduce cost.

In another embodiment of the present invention, a production apparatus for electrodeless flat-paste LED lamp string is provided, as shown in fig. 5, the production apparatus for electrodeless flat-paste LED lamp string comprises a wire feeding mechanism 20, a wire stripping mechanism 30, a spot welding material mechanism 50, a LED placing mechanism 60, a welding mechanism 70, a detection mechanism 80, a packaging mechanism 90 and a wire conveying mechanism 40, the wire feeding mechanism 20, the wire stripping mechanism 30, the spot welding material mechanism 50, the LED placing mechanism 60, the welding mechanism 70, the detection mechanism 80, the packaging mechanism 90 and the wire conveying mechanism 40 are arranged in a pipelined linear manner, thereby forming a full-automatic production line for LEDs. In one embodiment, the production equipment for the electrodeless flat-pasting LED lamp string further comprises a support frame 10 for supporting the wire feeding mechanism 20, the wire stripping mechanism 30, the spot welding material mechanism 50, the LED placing mechanism 60, the welding mechanism 70, the detection mechanism 80, the packaging mechanism 90 and the lead conveying mechanism 40.

Preferably, the production equipment for the electrodeless flat-mounted LED lamp string in the embodiment includes two full-automatic LED production lines, and the two full-automatic LED production lines are arranged side by side. Therefore, two LED lamp strings can be produced simultaneously, and the production efficiency is greatly improved.

The threading mechanism 20 threads the first wire 121 and the second wire 122. The thread feeding mechanism 20 in this embodiment includes a tension controller for providing a tension force in a direction opposite to the thread feeding direction to the first and

second wires

121 and 122, and for cooperating with the wire pressing assembly to keep the wires in a tight state.

The wire stripping mechanism 30 is used for removing the insulation layer on the surface of the first conductive wire 121 and the second conductive wire 122 at a set interval to form a first welding point and a second welding point. The wire stripping mechanism 30 in this embodiment includes a wire pressing assembly and a wire stripping knife assembly, and the wire pressing assembly is used for positioning and pressing the first wire 121 and the second wire 122, so as to provide a positioning basis for wire stripping. The wire pressing assembly in this embodiment includes a front wire pressing mechanism and a rear wire pressing mechanism which are oppositely arranged at a certain interval in the moving direction of the first wire 121 and the second wire 122. In one embodiment, the front wire pressing mechanism and the rear wire pressing mechanism each comprise a cushion block, a pressing block located above the cushion block, and an air cylinder for driving the pressing block to move up and down relative to the cushion block. The wire stripping blade assembly is located between the front wire pressing mechanism and the rear wire pressing mechanism, and is used for removing an insulating layer (such as insulating paint or insulating glue) on the surface of the welding position of the first wire 121 and the second wire 122 to form a first welding point and a second welding point. The wire stripping knife assembly is prior art and is not described herein.

The spot welding material mechanism 50 is used to apply a welding material to the first and second welding points of the first and

second wires

121 and 122. The spot welding material mechanism 50 in this embodiment includes a visual positioning component, a wire positioning component, and a spot welding component, where the visual positioning component and the wire positioning component are used to accurately position the first welding point and the second welding point of the first wire 121 and the second wire 122, and the spot welding component is used to coat the welding material on the first welding point and the second welding point of the first wire 121 and the second wire 122. In one embodiment, the wicking assembly includes a wicking syringe positioned over the first and second

conductive wires

121 and 122 and a wicking gas supply for supplying gas to the wicking syringe.

The LED placing mechanism 60 is used for flatly pasting a first patch LED123 in a welding lamp area, the positive pole of the first patch LED123 is pasted on the first welding point of the first lead 121, the negative pole is pasted on the second lead 122, the light emitting surface of the second patch LED124 and the light emitting surface of the first LED are flatly pasted back to back in the welding lamp area, the positive pole of the second patch LED124 is pasted on the second welding point of the second lead 122, and the negative pole is pasted on the first welding point of the first lead 121.

Fig. 6 is a schematic perspective view of an LED placing mechanism 60 according to an embodiment of the present invention, as shown in fig. 6, the LED placing mechanism 60 includes a first feeder assembly 61, a second feeder assembly 62, a manipulator adsorption assembly 63, and a second patch LED mounting assembly 64, where the first feeder assembly 61 is used to provide a first patch LED 123; the second boomerang assembly 62 is adapted to provide a second patch LED124 with the light emitting face of the second patch LED124 facing opposite the light emitting face of the first patch LED 123. The robot suction assembly 63 is configured to suck the first chip LED123 from the first feeder assembly 61 and attach the first chip LED123 to the upper side of the solder lamp area, and is configured to suck the second chip LED124 from the second feeder assembly 62 and place the second chip LED124 at a relay position. The robot suction assembly 63 in this embodiment includes a suction rod 631 and a robot 632, the suction rod 631 is used for sucking the patch LED, the suction rod 631, and a vacuum generator. The robot 632 is used to drive the adsorption rod 631 to reciprocate between the feeder assembly and the transfer positioning assembly.

The second chip LED mounting assembly 64 is configured to obtain the second chip LED124 at the transfer position and mount the second chip LED124 on the lower side of the solder lamp area. As shown in fig. 7 and 8, the robot sucking assembly 63 includes a positioning block 641 and a positioning block 641 driving device, the positioning block 641 is provided with a placing portion for placing the second die attach LED124, the positioning block 641 is movable between a transfer position and a mounting position, and the positioning block 641 driving device is configured to drive the positioning block 641 to move between the transfer position and the mounting position. In this embodiment, the driving device of the positioning block 641 comprises a translation cylinder 642 and a lifting cylinder 643, wherein the translation cylinder 642 is installed on the support 645, and an expansion rod of the translation cylinder 642 is connected with the positioning block 641. When the telescopic link of translation cylinder 642 stretches out, drive locating piece 641 and move to the transfer position, when the telescopic link of translation cylinder 642 withdraws, drive locating piece 641 and move to the subsides dress position. The lifting cylinder 643 is installed on the fixing base 644, the fixing base 644 is installed on the support frame 10, the telescopic rod of the lifting cylinder 643 is connected with the support 645, when the positioning block 641 moves to the mounting position, the telescopic rod of the lifting cylinder 643 extends out, and the second patch LED124 is mounted on the welding lamp area.

In one embodiment, the positioning block 641 further has a positioning groove 641a for positioning the first conductive line 121 and the second conductive line 122.

The soldering mechanism 70 is used for soldering the positive electrodes and the negative electrodes of the first patch LED123 and the second patch LED124 to the first soldering point of the first wire 121 and the second soldering point of the second wire 122, respectively. The welding mechanism 70 may employ laser welding, hot air welding, or the like.

The detection mechanism 80 is used for detecting the welding quality of the patch LED. The detection mechanism 80 includes a power-on component for providing a voltage between the first wire 121 and the second wire 122 and a photosensitive detection component. The photosensitive detection assembly judges the welding lightening of the LED by photosensitive detection or visual detection and sends out signals of good products and defective products.

The packaging mechanism 90 is used for packaging the patch LED and the portion of the third wire corresponding to the patch LED in a packaging adhesive 125. The packaging mechanism 90 in this embodiment includes a dispensing mechanism 901 and a curing mechanism 902, where the dispensing mechanism 901 is used to coat packaging glue on the surface of the patch LED. The curing mechanism 902 is used for curing glue on the surface of the patch LED. The curing mechanism 902 in this embodiment utilizes the UV dry glue principle to perform rapid curing on the glue solution in the previous process. Preferentially, the curing mechanism 902 includes precuring subassembly and secondary curing subassembly in advance, the precuring subassembly with the secondary curing subassembly is arranged along sending the line direction in proper order, the precuring subassembly with the secondary curing subassembly all includes the UV lamp of arranging from top to bottom and the setting device that bloies, and the UV lamp is used for shining the liquid glue of coating on paster LED, and the setting and the precuring are bloied to liquid glue to the setting device output air current of blowing, keep lamp pearl wire welding strength, guarantee lamp pearl, wire and external insulation. The pre-curing assembly is used for primarily setting and curing the glue solution, and the secondary curing assembly is used for further curing the primarily cured and set packaging glue, so that the welding strength between the surface mounted LED and the lead is ensured.

The wire feed mechanism 40 is used to power the advancement of the wire. The wire conveying mechanism 40 in this embodiment includes a plurality of linear single-axis manipulators and a plurality of pneumatic fingers, and the plurality of linear single-axis manipulators are arranged at intervals along the wire feeding direction, and are used for providing linear wire pulling power and providing the linear wire pulling power to the pneumatic finger mounting platform. The pneumatic fingers are respectively arranged on the single-shaft manipulators and are responsible for positioning and pressing the wires.

In one embodiment, the production equipment for the electrodeless flat-mounted LED lamp string further includes a terminal processing mechanism 110, and the terminal processing mechanism 110 is used for performing subsequent processing on the processed surface-mounted LEDs. The terminal processing mechanism 110 in this embodiment includes a take-up device, the take-up device includes a take-up pulley 111 and a take-up motor 112 for driving the take-up pulley 111 to rotate, and the processed LED light string is wound on the take-up pulley 111 to form a coil material. The terminal processing mechanism 110 may be a wire twisting device, a wire shearing device, or the like, in addition to the wire take-up device. The stranded wire LED lamp string is produced through the stranded wire device, and the LED lamp string with any length is produced through the wire shearing device.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.

Claims

1. An electrodeless flat-mounted LED lamp string is characterized by comprising:

2. The electrodeless flat-patch LED lamp string as claimed in claim 1, wherein the two patch LEDs of the LED unit are different in color.

3. The electrodeless flat LED lamp string according to claim 1, wherein the first conducting wire and the second conducting wire are rubber wires or enameled wires.

4. The utility model provides a production facility of electrodeless flat-mounted LED lamp cluster which characterized in that includes:

5. The production equipment of the electrodeless flat-mounted LED lamp string as claimed in claim 4, wherein the LED placing mechanism comprises:

6. The production equipment of the electrodeless flat-pasting LED lamp string as claimed in claim 5, wherein the manipulator adsorption assembly comprises a positioning block and a positioning block driving device, the positioning block is provided with a placing part for placing the second SMD LED, the positioning block can move between a transfer position and a pasting position, and the positioning block driving device is used for driving the positioning block to move between the transfer position and the pasting position.

7. The production equipment of the electrodeless flat-mounted LED lamp string as claimed in claim 6, wherein the positioning block is further provided with a positioning groove for positioning the first lead and the second lead.