CN214254420U

CN214254420U - LED film screen

Info

Publication number: CN214254420U
Application number: CN202120484235.8U
Authority: CN
Inventors: 奚玉琳; 奚邦籽
Original assignee: Jiangxi Huachuang Touch Technology Co ltd
Current assignee: Jiangxi Huachuang Touch Technology Co ltd
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-09-21
Anticipated expiration: 2031-03-05

Abstract

An LED film screen comprises a base material, a conductive circuit, a light-emitting component and a protective layer, wherein the light-emitting component comprises a lamp bead component and a packaging body used for packaging the lamp bead component, and the packaging body is arranged between the base material and the protective layer and wraps the lamp bead component; the substrate, the conducting circuit, light emitting component with the protective layer stacks up the setting in proper order, lamp pearl subassembly with the conducting circuit electricity is connected, the protective layer sets up the packaging body is kept away from the terminal surface of substrate. The lamp pearl subassembly after the encapsulation is difficult for appearing the astigmatism and forming the fog state when using, has guaranteed good effect that presents, and lamp pearl subassembly encapsulates closely, consequently has high waterproof nature.

Description

LED film screen

Technical Field

The utility model relates to a LED display screen field especially relates to a LED pad pasting screen.

Background

In the development process of continuous innovation of the LED display screen, a plurality of subdivided products are derived, and the LED film screen is one of the subdivided products. The LED film screen is a flexible OLED, and is widely used in the fields of aerospace, commercial buildings, shopping centers, commercial refrigerators, and glass windows and commodity showcases of luxury and jewelry chain stores because of its advantages of thin thickness, light weight, and flexibility.

In current LED pad pasting screen, its lamp pearl subassembly does not directly use through the encapsulation, appears the astigmatism easily and is the fog state, leads to the picture that shows not clear enough, influences visual experience. Therefore, how to avoid the lamp bead assembly from being in a foggy state due to astigmatism is a problem to be solved in the industry.

SUMMERY OF THE UTILITY MODEL

In view of this, it is actually necessary to provide an LED film screen adopting the lamp bead assembly packaging structure.

An LED film screen comprises a base material, a conductive circuit, a light-emitting component and a protective layer, wherein the light-emitting component comprises a lamp bead component and a packaging body used for packaging the lamp bead component, and the packaging body is arranged between the base material and the protective layer and wraps the lamp bead component; the substrate, the conducting circuit, light emitting component with the protective layer stacks up the setting in proper order, lamp pearl subassembly with the conducting circuit electricity is connected, the protective layer sets up the packaging body is kept away from the terminal surface of substrate.

Preferably, the packaging body is made of AB glue or UV glue or hot melt glue.

Preferably, the conductive lines are made of metal and arranged in a grid shape.

Preferably, the conductive lines are arranged in a mesh shape of a polygon.

Preferably, the conductive circuit is a copper wire.

Preferably, the width dimension of any copper wire of the conductive circuit is 5-150 μm.

Preferably, the lamp bead subassembly is equipped with the pin, the lamp bead subassembly pass through the pin with the conducting wire electricity is connected, the pin contains one or more copper lines.

Preferably, the LED film pasting screen comprises a plurality of the lamp bead assemblies, and the lamp bead assemblies are arranged in a matrix.

The LED film pasting screen adopting the lamp bead component packaging structure is not easy to cause astigmatism and is in a fog state during working, the quality of a displayed picture is ensured, and the lamp bead component has high waterproofness after being tightly packaged.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from the structures shown in these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of an LED film screen provided by an embodiment of the utility model.

Figure 2 is the schematic diagram of lamp pearl subassembly pin that utility model embodiment provided.

Fig. 3 is a schematic view of a first embodiment of a conductive circuit provided in an embodiment of the present invention.

Fig. 4 is a schematic view of a second embodiment of the conductive circuit provided in the embodiment of the present invention.

Fig. 5 is a schematic view of a third embodiment of the conductive circuit provided in the embodiment of the present invention.

Fig. 6 is a schematic view of a fourth embodiment of the conductive circuit provided in the embodiment of the present invention.

Fig. 7 is a schematic flow chart of a processing method of the LED film pasting screen provided by the embodiment of the utility model.

DESCRIPTION OF SYMBOLS IN THE DRAWINGS

Label name

100 LED film screen 31 lamp bead component

10 base material 32 pin

20 conductive circuit 33 package

30 light emitting assembly 40 protective layer

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

For a clearer and more accurate understanding of the present invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings. Description of drawings the accompanying drawings illustrate examples of embodiments of the present invention, in which like reference numerals refer to like elements. It is to be understood that the drawings are not to scale as the actual practice of the invention, but are for illustrative purposes and are not drawn to scale.

The LED film screen 100 is formed by arranging a plurality of bead assemblies 31 in a matrix, and a single bead assembly 31 is taken as an example for description.

Please refer to fig. 1-2 in combination, which is a schematic diagram of a structure of a LED film and a schematic diagram of a lamp bead assembly pin. The LED film screen 100 comprises a substrate 10, a conductive circuit 20, a light emitting component 30 and a protective layer 40, wherein the light emitting component 30 comprises a lamp bead component 31 and a packaging body 33. Substrate 10, conducting wire 20, lamp pearl subassembly 31, packaging body 33 and protective layer 40 range upon range of setting. Conducting wire 20 lays on substrate 10, lamp pearl subassembly 31 sets up on conducting wire 20 and is connected with conducting wire 20 electricity, and the inseparable cladding lamp pearl subassembly 31 of packaging body 33, protective layer 40 set up the terminal surface that deviates from conducting wire 20 at packaging body 33.

The substrate 10 has flexibility, so that the LED film screen 100 can be mounted on glass or a wall surface with any radian. In the present embodiment, the substrate 10 is made of a flexible PET material.

The lamp bead assembly 31 is provided with a pin 32, and the pin 32 is provided with a copper wire electrically connected with the conductive circuit 20. In some possible embodiments, the pins 32 are provided with a plurality of copper wires electrically connected to the conductive circuit 20, and the plurality of copper wires are uniformly distributed around the bead assembly 31, so that the LED film-attached screen 100 looks more beautiful.

In this embodiment, the package body 33 is made of hot melt adhesive, and the package body 33 is heated to be in a molten state to tightly wrap the lamp bead assembly 31, and the lamp bead assembly 31 is cooled and solidified to be packaged. In some feasible embodiments, the package body 33 is made of AB glue, the a glue and the B glue are mixed according to a ratio of 1:1 and then filled between the substrate 10 and the protective layer 40, and the AB glue can be cured at normal temperature to complete the packaging of the lamp bead assembly 31. In some possible embodiments, the encapsulation 33 may further adopt UV glue, the UV glue is filled between the substrate 10 and the protection layer 40, and the UV glue is cured by ultraviolet irradiation to complete the encapsulation of the lamp bead assembly 31. The lamp beads of the packaged lamp bead component 31 leak out of the end face of the packaging body 33 far away from the substrate 10 and are located on the same horizontal plane.

The protective layer 40 is disposed on the end surface of the package body 33 departing from the lamp bead assembly 31. The protective layer 40 may be glass or a PET film, and is disposed parallel to the PET substrate 10, and both of them extrude the package 33 to form smooth both end surfaces.

In this embodiment, the conductive traces 20 are disposed in a grid pattern, and the copper wires are used to form a grid copper wire laid on the substrate 10, which has the advantages that the wiring is regular, so that the LED film-attached screen 100 looks more beautiful, and light can more uniformly penetrate through the LED film-attached screen 100, thereby improving the brightness of the LED film-attached screen 100. It is understood that the conductive traces 20 may be made of other metal materials, such as aluminum, silver, etc.

The width of any copper line of the conductive trace 20 is 5 μm to 150 μm, and the distance between two non-intersecting copper lines and the angle between two intersecting copper lines are not limited, so as to meet more usage requirements.

In this embodiment, after the substrate 10 and the conductive traces 20 are fabricated, the substrate 10 and the conductive traces 20 are pressed together to form a conductive substrate.

Referring to fig. 3 to 6, a first embodiment of the conductive circuit provided in an embodiment of the present invention is shown, a second embodiment of the conductive circuit provided in an embodiment of the present invention is shown, a third embodiment of the conductive circuit provided in an embodiment of the present invention is shown, and a fourth embodiment of the conductive circuit provided in an embodiment of the present invention is shown. The conductive traces 20 are arranged in a grid shape, and the grid shape is a square (as shown in fig. 3), a rhombus (as shown in fig. 4), a regular hexagon (as shown in fig. 5), or an irregular pattern (as shown in fig. 6). It is understood that the grid pattern includes, but is not limited to, the grid pattern shown in the embodiment.

The substrate 10, the conductive circuit 20, the lamp bead assembly 31, the packaging body 33 and the protective layer 40 are sequentially stacked, the packaging body 33 with viscosity is combined into a whole, and the packaging body 33 tightly packages the lamp bead assembly 31, so that the LED film pasting screen 100 has high water resistance, high durability and high stability.

Please refer to fig. 7 in combination, which is a schematic flow chart of a processing method of an LED film pasting screen according to an embodiment of the present invention. The processing method of the LED film screen 100 includes the following steps.

Step S101: and manufacturing a conductive circuit 20 and a substrate 10, wherein the conductive circuit 20 is manufactured into a grid shape, and the flexible PET substrate 10 is used as a circuit board.

Step S103: the conductive circuit 20 and the substrate 10 are pressed to form a conductive substrate.

Step S105: connect lamp pearl subassembly 31 electricity in electrically conductive substrate.

Step S107: and spreading the hot melt adhesive on the lamp bead component 31.

Step S109: the protective layer 40 is placed over the hot melt adhesive.

Step S111: the hot melt adhesive is heated to be in a molten state.

Step S113: the air between the substrate 10 and the protective layer 40 is evacuated to make the space between the substrate 10 and the protective layer 40 in a vacuum state or an oxygen-free state.

Step S115: the substrate 10 and the protective layer 40 are relatively pressed to make the hot melt adhesive flow to fill the gap.

Step S117: and after the hot melt adhesive is cooled and solidified, an encapsulation body 33 for coating the lamp bead assembly 31 is formed between the substrate 10 and the protective layer 40.

The encapsulated lamp bead assembly 31 is not easy to cause astigmatism and is in a fog state in the use process, and the experience effect of the LED film pasting screen 100 is greatly improved.

It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, to the extent that such modifications and variations fall within the scope of the invention and the equivalent techniques thereof, it is intended that the present invention also encompass such modifications and variations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the following claims.

Claims

1. An LED film-pasted screen is characterized by comprising a base material, a conductive circuit, a light-emitting component and a protective layer, wherein the light-emitting component comprises a lamp bead component and a packaging body for packaging the lamp bead component, and the packaging body is arranged between the base material and the protective layer and coats the lamp bead component; the substrate, the conducting circuit, light emitting component with the protective layer stacks up the setting in proper order, lamp pearl subassembly with the conducting circuit electricity is connected, the protective layer sets up the packaging body is kept away from the terminal surface of substrate.

2. The LED film pasting screen of claim 1, wherein said encapsulation body is made of AB glue or UV glue or hot melt glue.

3. The LED film screen of claim 1, wherein the conductive wires are made of metal and arranged in a grid.

4. The LED film screen of claim 3, wherein the conductive traces are arranged in a mesh shape that is a polygon.

5. The LED film screen of claim 3, wherein the conductive traces are copper wires.

6. The LED film attached screen according to claim 5, wherein the width dimension of any copper wire of the conductive circuit is 5 μm to 150 μm.

7. The LED film screen of claim 1, wherein the lamp bead assembly is provided with pins, the lamp bead assembly is electrically connected with the conductive circuit through the pins, and the pins comprise one or more copper wires.

8. The LED film screen of claim 1, wherein the LED film screen comprises a plurality of the bead assemblies, and the bead assemblies are arranged in a matrix.