TWI661745B - 單點控制燈串電路及其方法 - Google Patents

單點控制燈串電路及其方法 Download PDF

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Publication number
TWI661745B
TWI661745B TW107113722A TW107113722A TWI661745B TW I661745 B TWI661745 B TW I661745B TW 107113722 A TW107113722 A TW 107113722A TW 107113722 A TW107113722 A TW 107113722A TW I661745 B TWI661745 B TW I661745B
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Taiwan
Prior art keywords
light
modules
power
module
power supply
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TW107113722A
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English (en)
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TW201916739A (zh
Inventor
蔡乃成
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美商科斯莫燈飾公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
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    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
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    • H02J7/007—Regulation of charging or discharging current or voltage
    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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Abstract

本發明提供一種單點控制燈串電路及其方法。單點控制燈串電路包含多個發光模組、電源供應模組、主控制模組以及多個單點控制模組。主控制模組輸出電源供應請求至電源供應模組，以指示電源供應模組供應電源依序傳輸至多個發光模組。多個單點控制模組選擇性地配置連接多個發光模組，各單點控制模組輸出發光控制訊號，以控制對應配置的發光模組的發光狀態。因此，燈串控制電路可提供多樣化的發光效果，並可避免電源在傳輸過程中逐漸衰減，而使多個發光模組具有改善的發光亮度。

Description

單點控制燈串電路及其方法
本發明是有關於一種燈串電路和其控制方法，且特別是針對導線的多個線段個別控制的單點控制燈串電路及其方法。
目前，燈串市場的照明產業不斷發展，照明技術日臻完善，作為普及和推廣的LED燈串，顯得尤為重要。而且，人們已不在侷限單一的傳統燈具，越來越多的LED燈串廣泛用於樓道、走廊、地下車庫、衛生間等公共照明場所。驅動控制是LED燈的重要組成部分，是使LED燈串正常工作的重要因素之一。然而，以往LED燈串的驅動控制方式是由單一主控元件進行控制，使得發光變化效果受限，並且單一主控元件無法解決電源在傳輸過程中產生微量或顯著衰減，導致每個燈串的發光二極體的發光亮度變低、無法正常發光的問題。
本發明的目的在於提供一種單點控制燈串電路，其用以解決傳統燈串電路具有發光效果單一、燈串電路無法以期望亮度發光之缺失。
本發明提供一種單點控制燈串電路，包含： 多個發光模組，彼此相互連接；電源供應模組，連接多個發光模組，電源供應模組供應電源依序傳輸至多個發光模組；主控制模組，連接電源供應模組，主控制模組輸出電源供應請求至電源供應模組，以指示電源供應模組供應電源；以及多個單點控制模組，選擇性地配置連接多個發光模組，各單點控制模組輸出發光控制訊號，以控制對應配置的一或多個發光模組的發光狀態。
本發明提供一種單點控制燈串電路的方法，包含下列步驟：由主控制模組輸出電源供應請求至電源供應模組；基於電源供應請求，從電源供應模組供應的電源依序傳輸至多個發光模組；以及透過多個單點控制模組分別輸出多個發光控制訊號，以選擇性地控制多個發光模組的發光狀態。
如上所述，本發明具有下列優勢：
1.個別控制每個燈串(發光模組)或分別控制導線的多個線段上的多個燈串的發光狀態，使得多個燈串以不同的時序發光，並且這些發光模組在該些時序中呈現不同的光彩變化，滿足使用者的期望。
2.無論電路結構中的線路和元件間的複雜度、各個燈串與電源供應模組例如電源供應器、電流源或電壓源之間的配置關係等，皆可精準控制各個燈串的一或多個發光元件例如發光二極體的明暗度，在發光元件的發光亮度過低時可適當補償供應的電源，包含使所有發光元件的亮度一致，以及有效避免/解決因電源在傳輸過程中衰減過度以至於發光元件無法正常發光的現象。
1‧‧‧單點控制燈串電路
11~16‧‧‧發光模組
20‧‧‧電源供應模組
201‧‧‧電源
211~213‧‧‧衰減電源
30‧‧‧主控制模組
301‧‧‧電源供應請求
41~43‧‧‧單點控制模組
411、421、431‧‧‧發光控制訊號
412、422、432‧‧‧電源調整訊號
413、423、433‧‧‧工作電源值
414、424、434‧‧‧差值
415、425、435‧‧‧電流路徑長度
416、426、436‧‧‧比例
51~53‧‧‧升壓恆流模組
511、521、531‧‧‧單點調整電源
60、601~603‧‧‧電源衰減量測模組
61~63‧‧‧衰減電源值
S1~S3、S11~S18‧‧‧步驟
圖1是本發明單點控制燈串電路的第一實施例的方塊圖。
圖2是本發明單點控制燈串電路的第二實施例的方塊圖。
圖3是本發明單點控制燈串電路的第三實施例的方塊圖。
圖4是本發明單點控制燈串電路的第四實施例的電路配置圖。
圖5是本發明單點控制燈串電路的第五實施例的電路配置圖。
圖6是本發明單點控制燈串電路的方法的第一實施例的步驟流程圖。
圖7是本發明單點控制燈串電路的方法的第二實施例的步驟流程圖。
在下文將參看隨附圖式更充分地描述各種例示性實施例，在隨附圖式中展示一些例示性實施例。然而，本發明概念可能以許多不同形式來實現，且不應解釋為限於本文中所闡述之例示性實施例。確切而言，提供此等例示性實施例使得本發明將為詳盡且完整，且將向熟習此項技術者充分傳達本發明概念的範疇。在諸圖式中，類似數字始終指示類似元件。
應理解，雖然本文中可能使用術語第一、第二、第三等來描述各種元件或訊號等，但此等元件或訊號不應受此等術語限制。此等術語乃用以區分一元件與另一元件，或者一訊號與另一訊號。另外，如本文中所使用，術語「或」視實際情況可能包括相關聯之列出項目中之任一者或者多者之所有組合。
請參閱圖1，其是本發明單點控制燈串電路的第一實施例的方塊圖。如圖1所示，單點控制燈串電路1包含多個發光模組11~13、電源供應模組20、主控制模組30以及多個單點控制模組41~43，其中單點控制模組41電性連接發光模組11，單點控制模組42電性連接發光模組12，單點控制模組43電性連接發光模組13；電源供應模組20電性連接在主控制模組30以及發光模組11~13之間。
主控制模組30可為微處理器，用以輸出電源供應請求301至電源供應模組20，以指示電源供應模組20供應電源201至多個發光模組11~13，以使多個發光模組11~13取得發光所需的電源20而發光。
為使發光模組具有各種不同的發光效果，單點控制模組41可輸出發光控制訊號411至對應配置的發光模組11，以個別控制發光模組11的發光狀態。單點控制模組42、43可分別輸出發光控制訊號421、431，以分別控制對應配置的發光模組12、13的發光狀態，例如發光亮度、顏色、時間、頻率等特徵。單點控制模組41、42、43對發光模組11、12、13的控制時點可為同步或非同步。上述單點控制模組41~43可為與主控制模組30獨立作業的其他微處理器。
也就是說，在本發明中，主控制模組僅用於控制電源供應模組的電源供應，而非配置以直接控制發光模組的發光狀態。特別是，針對每一個發光模組個別設置一個單點控制模組，如單點控制模組41配置專責控制發光模組11、單點控制模組42配置專責控制發光模組12、單點控制模組43配置專責控制發光模組13，藉以實現單個發光模組的個別獨立控制。另外或替換地，亦可針對每兩個或更多個相鄰的發光模組配置同一單點控制模組，例如電路結構中僅設置單點控制模組41以及單點控制模組43，其中單點控制模組41配置專責控制發光模組11和12，單點控制模組43配置專責控制發光模組13。應理解，上述連接方式為舉例說明，所屬技術領域中具有通常知識者基於本發明的上述概念可適當調整電路元件間的配置關係，以及增加或減少設置的元件數量。這意味著，多個單點控制模組可選擇性地配置連接多個發光模組。藉由上述技術手段，本發明可提升發光模組的發光控制的精準度，並可藉由各個單點控制模組針對與其對應配置的發光模組設定與其他發光模組不同的發光參數，使燈串電路呈現更多樣化的 發光效果。
請參閱圖2，其是本發明單點控制燈串電路的第二實施例的方塊圖。如圖所示，單點控制燈串電路1包含多個發光模組11~13、電源供應模組20、主控制模組30、多個單點控制模組41~43、多個升壓恆流模組51~53以及電源衰減量測模組60。其中，升壓恆流模組51電性連接在單點控制模組41以及發光模組11之間，升壓恆流模組52電性連接在單點控制模組42以及發光模組12之間，升壓恆流模組53電性連接在單點控制模組43以及發光模組13之間；主控制模組30電性連接電源供應模組20；電源供應模組20電性連接發光模組11~13；電源衰減量測模組60電性連接發光模組11~13的每一個與電源供應模組20之間的導線。
首先，響應於主控制模組30產生的電源供應請求301，電源供應模組20輸出電源201。實務上，在電源201從電源供應模組20傳輸至多個發光模組11~13的過程中可能依電路設計不同或其他因素而有微量或顯著衰減的現象發生。如圖2所示，電源201衰減後形成待分別流過發光模組11~13的衰減電源211~213，而這些衰減電源211~213的數值可能因發光模組11~13的每一個與電源供應模組20之間的配置有所差異而彼此不相同。
假設電路配置中的所有發光模組11~13為具有相同的特性的發光元件。在理想狀態下，例如電源供應模組20供應相同大小的電流至彼此串聯連接的所有發光模組11~13時，所有發光模組11~13應具有相同的發光亮度。但實務上，雖然有些發光模組，例如與電源供應模組20相隔較近的發光模組13接收到的電流並未發生衰減現象，但與電源供應模組20相隔較遠即傳輸距離較遠的發光模組11~12接收到的電流在傳輸過程中可能因經過多個電子元件時發生衰減而較初始供應電流小。電流衰減現象將導致在初始供應相同大小的電流至串聯連接的所有發光模組11~13狀況下，不同的發光模組11~13具有不同的發光亮度，如此無法達成 所期望的。在供應相同大小的電流下，所有發光模組11~13具有相同的發光亮度，甚至可能因衰減後的電源201過小，例如小於工作電流或工作電壓，而無法使發光模組11~13發光。
為解決上述問題，本發明進一步透過電源衰減量測模組60的量測引腳連接從電源供應模組20延伸至發光模組11~13的每一個的導線線段，以量測電源201通過導線的多個線段時衰減後分別所形成的具有相同或不同大小的衰減電源211~213，以取得分別對應衰減電源211~213的衰減電源值61~63，其例如為電壓值或電流值。應理解，在本實施例中，所欲達成主要目的為解決電源衰減導致燈串電路的發光效果不符合期望的問題，因此為方便說明，以「衰減電源」用語進行說明，以與電源供應模組20產生的電源201做區別，即假設所有電源201通過發光模組11~13已衰減為衰減電源211~213。然而，所屬技術領域中具有通常知識者應理解，實際上，可能因發光模組配置位置離電源供應模組20較近及/或電源201未通過其他電子元件，而未發生電源衰減，使得例如發光模組13所接收到的衰減電源213的衰減電源值63與電源供應模組20所供應的電源201數值大小相同。
上述電源衰減量測模組60可為交流/直流電流感測器，例如ACS717和ACS718電流感測器IC，亦可為交流/直流電壓感測器，或可量測電壓和電流的電壓電流量測儀器，例如三用電表等。
電源衰減量測模組60所量測的衰減電源值61~63依序或同時從電源衰減量測模組60分別供應至單點控制模組41~43。詳言之，電源衰減量測模組60將所量測的待供應至發光模組11的衰減電源211對應的衰減電源值61，供應至負責個別控制發光模組11的單點控制模組41。電源衰減量測模組60將所量測的待供應至發光模組12的衰減電源212對應的衰減電源值62供應至負責個別控制發光模組12的單點控制模組42。同理，電源衰減量測模組60將所量測的待供應至發光模組13的衰減電源213對應的衰 減電源值63供應至負責個別控制發光模組13的單點控制模組43。
接著，單點控制模組41~43分別依據電源衰減量測模組60的量測結果，以決定衰減電源211~213的調整幅度。具體地，單點控制模組41~43分別預先儲存與其對應配置的發光模組11~13的工作電源值413、423、433，如單點控制模組41儲存發光模組11的工作電源值413。當單點控制模組41從電源衰減量測模組60接收到衰減電源值61~63時，單點控制模組41計算衰減電源211的衰減電源值61與電源供應模組20初始供應的電源201的差值414。單點控制模組42計算衰減電源212的衰減電源值62與電源201的差值424，單點控制模組43計算衰減電源213的衰減電源值63與電源201的差值434。
進一步，單點控制模組41~43分別判斷衰減電源值61~63分別小於發光模組11~13的工作電源值413、423、433時，單點控制模組41~43分別輸出電源調整訊號412、422、432，以分別指示升壓恆流模組51~53分別基於工作電源值413、423、433以及電源供應模組20初始供應的電源201，以分別調整衰減電源211~213而產生單點調整電源511、521、531。例如，單點控制模組41控制升壓恆流模組51產生的單點調整電源511大於發光模組11的工作電源值413，甚至與電源201大小相同，單點調整電源511、521、531可彼此相同(例如皆與電源201大小相同)或不相同，並接著將單點調整電源511、521、531分別供應至對應配置的發光模組11~13。
如此，在本發明實例中，不僅可地個別控制燈串電路的多個發光模組，使得多個發光模組以不同的時序發光，並且這些發光模組在該些時序中呈現不同的光彩變化，更能滿足使用者需求，並且無論電路結構中的線路和元件的複雜度，皆可精準控制發光模組的明暗度，且可有效避免電源衰減過度以至於無法使發光模組正常發光的現象發生。
圖3是本發明單點控制燈串電路的第三實施例的方塊圖。如圖所示，單點控制燈串電路1包含多個發光模組11~13、電源供應模組20、主控制模組30、多個單點控制模組41~43、多個升壓恆流模組51~53以及電源衰減量測模組60，其中升壓恆流模組51電性連接在單點控制模組41以及發光模組11之間，升壓恆流模組52電性連接在單點控制模組42以及發光模組12之間，升壓恆流模組53電性連接在單點控制模組43以及發光模組13之間；主控制模組30電性連接電源供應模組20；電源供應模組20電性連接發光模組11~13；電源衰減量測模組60電性連接發光模組11~13的每一個與電源供應模組20之間的導線。
為更精準、快速地調整發光模組11~13的發光亮度，單點控制模組41~43可預先儲存電路結構的設計參數，例如電源201(在傳輸過程中衰減為衰減電源211~213)從電源供應模組20到達與單點控制模組41~43分別對應配置的發光模組11~13的過程中分別通過的導線各線段的電流路徑長度415、425、435，如電源供應模組20與發光模組11之間供電流流通的導線線段長度為電流路徑長度415、電源供應模組20與發光模組12之間供電流流通的導線線段長度為電流路徑長度425，電源供應模組20與發光模組13之間供電流流通的導線線段長度為電流路徑長度435。
當單點控制模組41~43接收到電源衰減量測模組60在電源供應模組20與發光模組11~13之間的導線各線段分別量測到的衰減電源211~213分別對應的衰減電源值61~63時，單點控制模組41~43分別計算衰減電源值61~63與電源201的差值414、424、434，並進一步分析電流路徑長度415、425、435與差值414、424、434的比例416、426、436，藉以判斷在特定的導線線段長度下，電源201轉變為衰減電源211~213的衰減程度，可做為調整電路配置的參考。
進一步地，單點控制模組41~43可依據發光模組11~13與其 他元件間的特定電路配置所導致的特定衰減程度，以預估在電路配置不變狀況下，下次欲驅動發光模組11~13發光時，電源供應模組20欲供應的初始電源201值以及單點控制模組41~43控制升壓恆流模組51~53對衰減電源211~213的調整幅度。舉例來說，如圖3所示的電路配置，電源供應模組20與發光模組11之間的電流路徑長度415大於電源供應模組20與發光模組13之間的電流路徑長度435，導致待通過發光模組11的衰減電源211的衰減電源值61與電源211值的差值414，大於待通過發光模組13的衰減電源213的衰減電源值63與電源211值的差值434。若欲使將衰減電源211、213皆調整成與電源201數值大小相同，單點控制模組41對衰減電源211的調整幅度大於單點控制模組43對衰減電源213的調整幅度。
圖4是本發明單點控制燈串電路的第四實施例的電路配置圖。如圖所示，單點控制燈串電路1包含多個發光模組11~16、電源供應模組20、主控制模組30、單點控制模組41~43、升壓恆流模組51~53以及電源衰減量測模組601~603。
不同於第一至第三實施例和後續將描述的第五實施例所示，單點控制模組的數量等於發光模組的數量，以達成單個單點控制模組針對單個發光模組進行個別控制。在本實施例中，單點控制模組41~43的數量少於發光模組11~16的數量，如單點控制模組41控制兩個發光模組11~12、單點控制模組42控制兩個發光模組13~14、單點控制模組43控制兩個發光模組15~16。應理解，每個單點控制模組控制41~43的發光模組11~16數量可依電路設計需求做調整，多個單點控制模組控制的發光模組數量可彼此不同，例如配置部分單點控制模組控制單個發光模組，其他單點控制模組控制多個發光模組。
在本實施例中，多個發光模組11~16皆為發光二極體，但實際上亦可為其他具發光功能的電子元件。這些發光模組11~16透過 導線彼此同向串聯連接。電源供應模組20連接發光模組11的正引腳，以及透過主控制模組30連接發光模組16的負引腳。電源衰減量測模組601連接在發光模組11的正引腳與單點控制模組41之間；電源衰減量測模組602連接在發光模組13的正引腳與單點控制模組42之間；電源衰減量測模組603連接在發光模組15的正引腳與單點控制模組43之間。升壓恆流模組51連接發光模組11的正引腳；升壓恆流模組52連接發光模組13的正引腳；升壓恆流模組53連接發光模組15的正引腳。單點控制模組41連接在升壓恆流模組51與電源衰減量測模組601之間；單點控制模組42連接在升壓恆流模組52與電源衰減量測模組602之間；單點控制模組43連接在升壓恆流模組53與電源衰減量測模組603之間。
主控制模組30指示電源供應模組20供應電源201，而電源201例如電流將通過導線從發光模組11往發光模組16的方向流動，最後回到電源供應模組20。為了量測通過導線的各線段的電源201，針對發光模組11~12、發光模組13~14以及發光模組15~16三組的每一組分別配置電源衰減量測模組601~603。理想狀態下，流過串聯連接的發光模組11~16的電流應相同，即皆為電源201。但實際測量下，會發現在導線的各線段分別量測到的待通過發光模組11~12、發光模組13~14以及發光模組15~16的電源值為電源201衰減後的數值，為方便說明，如圖4所示，在本實施例中將所量測到的衰減後的電源201以衰減電源211~213表示，如圖4所示，電源供應模組20可為電流源向發光模組11~16供應電流，但實際上亦可為電壓源、電源供應器等電源供應元件。
當單點控制模組41~43分別從電源衰減量測模組601~603接收到衰減電源211~213時，可依據衰減電源211~213的衰減幅度來決定對衰減電源211~213升流或升壓的調整幅度。如圖4所示，發光模組16與電源供應模組20的輸出端之間的導線線段長度大於發光模組11與電源供應模組20的輸出端之間的導線線段長 度，導致待通過發光模組15~16的衰減電源213的衰減幅度較待通過發光模組11~12的衰減電源211大，因此升壓恆流模組53將衰減電源213調整為與電源201相同的調整幅度大於升壓恆流模組51將衰減電源211調整為與電源201相同的調整幅度。
圖5是本發明單點控制燈串電路的第五實施例的電路配置圖。單點控制燈串電路1包含多個發光模組11~13、電源供應模組20、主控制模組30、多個單點控制模組41~43、多個升壓恆流模組51~53以及電源衰減量測模組601~603。主控制模組30電性連接電源供應模組20。電源供應模組20連接發光模組11~13中每一個最上方發光二極體的正引腳以及最下方發光二極體的負引腳，其中發光模組11~13透過導線彼此並聯連接，而形成多個燈串，每個發光模組11~13可包含多個發光二極體，例如三個，發光二極體的數量可依需求調整。電源衰減量測模組601~603的一端分別連接發光模組11~13中最上方發光二極體的正引腳，並且升壓恆流模組51~53的一端配置亦是如此。單點控制模組41~43分別連接在升壓恆流模組51~53的另一端以及電源衰減量測模組601~603的另一端之間。
由於所有發光模組11~13為並聯連接，在理想狀態下，這些發光模組11~13應以相同的電壓發出具有相同亮度的光線，但實務上，可能會發生衰減現象，導致在電線各線段所量測到並非電源201，而是數值較小的衰減電源211~213。因此，例如在本實施例，可透過三組：(1)單點控制模組41、升壓恆流模組51以及電源衰減量測模組601；(2)單點控制模組42、升壓恆流模組52以及電源衰減量測模組602；(3)單點控制模組43、升壓恆流模組53以及電源衰減量測模組603，以個別針對發光模組11~13的每一個進行衰減電源211~213的數值量測，並根據量測結果進行個別的發光控制。
進一步地，為使燈串電路更具符合期望的發光效果，單點控 制模組41~43可分別具有一資料庫。當單點控制模組41~43分別接收到電源衰減量測模組601~603的量測結果時，可從單點控制模組41~43本身或雲端伺服器等的資料庫中查找分別與單點控制模組41~43對應配置的發光模組11~13之間的連接關係，以及發光模組11~13中的發光模組例如發光二極體之間的連接關係、各發光模組的工作電源值以及耐受功率值，並據以判斷出同時適用於分別與單點控制模組41~43對應配置的發光模組11~13的共用單點電源值。單點控制模組41~43分別基於衰減電源211~213分別對應的共用單點電源值，分別決定對待通過發光模組11~13的衰減電源211~213的調整幅度，例如可將衰減電源211~213皆調整為與電源201相同，使得發光模組11~13的發光亮度相同。
圖6是本發明單點控制燈串電路的方法的第一實施例的步驟流程圖。如圖所示，單點控制燈串電路的方法，包含下列步驟：步驟S1：由主控制模組輸出電源供應請求至電源供應模組；步驟S2：基於電源供應請求，從電源供應模組供應的電源依序傳輸至多個發光模組；以及步驟S3：透過多個單點控制模組分別輸出多個發光控制訊號，以選擇性地控制多個發光模組的發光狀態，以控制多個發光模組在相同或不同時間點發光，並可控制多個發光模組在同一時間區間具有多變的發光效果，例如分別發出紅光、綠光或藍光等多色光線。
圖7是本發明單點控制燈串電路的方法的第二實施例的步驟流程圖。如圖所示，單點控制燈串電路的方法，包含下列步驟：步驟S11：以包含多個線段的導線將多個發光模組相互連接，例如並聯連接及/或串聯連接；步驟S12：儲存同一線段上的發光模組的工作電源值在對應配置的各單點控制模組；步驟S13：由主控制模組輸出電源供應請求至電源供應模組； 步驟S14：基於電源供應請求，從電源供應模組供應的電源依序傳輸至多個發光模組；步驟S15：由電源衰減量測模組分別量測電源通過導線的多個線段時衰減後所形成的多個衰減電源；步驟S16：由各單點控制模組比對各衰減電源是否小於電源及各發光模組的工作電源，若否，執行步驟S18：允許各衰減電源供應至在對應的各線段上的發光模組，若是，執行步驟S17：由各單點控制模組輸出電源調整訊號，以指示升壓恆流模組基於工作電源以及電源調整衰減電源以形成單點調整電源，並將各單點調整電源供應至與各單點控制模組對應配置的發光模組，從而調整發光模組的發光亮度。
另外，為更精準地調整衰減電源，使燈串電路的發光效果更符合期望，單點控制燈串電路的方法可更包含下列步驟：由各單點控制模組從資料庫中查找與其對應配置的發光模組之間的連接關係以及各發光模組所包含的發光模組之間的連接關係、工作電源值及耐受功率值，並據以判斷出同時適用於發光模組的共用單點電源值；以及由各單點控制模組基於共用單點電源值，指示升壓恆流模組調整衰減電源。
為加速燈串電路的往後供應電源後對衰減電源的調整，單點控制燈串電路的方法可更包含下列步驟：由各單點控制模組儲存電源從電源供應模組到達與各單點控制模組對應配置的各發光模組的過程中所通過的各線段的電流路徑長度，計算待通過與其對應配置的各發光模組的衰減電源與電源的差值，分析各電流路徑長度與差值的比例，並據以預估下個相同或不同的電源通過與其對應配置的各發光模組的衰減電源值。
如上所述，本發明具有下列優勢：
1.個別控制每個燈串(發光模組)或分別控制導線的多個線段上的多個燈串的發光狀態，使得多個燈串以不同的時序 發光，並且這些發光模組在該些時序中呈現不同的光彩變化，滿足使用者的期望。
2.無論電路結構中的線路和元件間的複雜度、各個燈串與電源供應模組例如電源供應器、電流源或電壓源之間的配置關係等，皆可精準控制各個燈串的一或多個發光元件例如發光二極體的明暗度，在發光元件的發光亮度過低時可適當補償供應的電源，包含使所有發光元件的亮度一致，以及有效避免/解決因電源在傳輸過程中衰減過度以至於發光元件無法正常發光的現象。
以上所述僅為本發明之較佳可行實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。

Claims (9)

  1. 一種單點控制燈串電路，包含：多個發光模組，彼此相互連接；一電源供應模組，連接該多個發光模組，該電源供應模組供應一電源依序傳輸至該多個發光模組；一主控制模組，連接該電源供應模組，該主控制模組輸出一電源供應請求至該電源供應模組，以指示該電源供應模組供應該電源；多個單點控制模組，選擇性地配置連接該多個發光模組，各該單點控制模組輸出一發光控制訊號，以控制對應配置的該一或多個發光模組的發光狀態；以及至少一電源衰減量測模組，連接該多個單點控制模組，該電源衰減量測模組量測該電源分別通過一導線的多個線段時衰減後分別形成的多個衰減電源，並將各該衰減電源的值輸出至對應的各該單點控制模組，各該單點控制模組計算該電源與該衰減電源的一差值。
  2. 如請求項第1項所述的單點控制燈串電路，其中該多個單點控制模組的數量少於該多個發光模組的數量，各該單點控制模組控制與其對應配置的該一或多個發光模組具有相同的發光亮度、顏色、時間、頻率或其任意組合。
  3. 如請求項第1項所述的單點控制燈串電路，更包含多個升壓恆流模組，該多個發光模組以該導線相互連接，各該升壓恆流模組連接同一該線段上的該單點控制模組以及該一或多個發光模組，各該單點控制模組判斷該電源通過各該線段時衰減後所形成的該衰減電源的值小於所儲存的各該發光模組的一工作電源值時，輸出一電源調整訊號以指示各該升壓恆流模組基於該電源以及各該工作電源值調整該衰減電源以產生一單點調整電源，並供應該單點調整電源至對應的該一或多個發光模組。
  4. 如請求項第3項所述的單點控制燈串電路，其中各該單點控制模組儲存該電源從該電源供應模組到達與各該單點控制模組對應配置的各該發光模組的過程中所通過的該導線的各該線段的一電流路徑長度，分析該電流路徑長度與該差值的一比例，並據以預估後續相同或不同大小的該電源通過各該發光模組的該衰減電源的值。
  5. 如請求項第3項所述的單點控制燈串電路，其中各該發光模組包含一或多個發光模組，該多個發光模組彼此相互連接，各該單點控制模組從其一資料庫中查找與各該單點控制模組對應配置的該一或多個發光模組之間的連接關係，以及其中各該發光模組中的該一或多個發光模組之間的連接關係、該一或多個工作電源值及一或多個耐受功率值，並據以判斷出同時適用於與各該單點控制模組對應配置的該一或多個發光模組的一共用單點電源值，各該單點控制模組基於該共用單點電源值，決定對待通過各該發光模組的該衰減電源的調整。
  6. 一種單點控制燈串電路的方法，包含下列步驟：由一主控制模組輸出一電源供應請求至一電源供應模組；基於該電源供應請求，從該電源供應模組供應該電源依序傳輸至多個發光模組；利用一電源衰減量測模組量測該電源分別通過一導線的多個線段時衰減後分別形成的多個衰減電源，並將各該衰減電源的值輸出至對應的各該單點控制模組；以及透過多個單點控制模組計算該電源與該衰減電源的一差值並分別輸出多個發光控制訊號，以選擇性地控制該多個發光模組的發光狀態。
  7. 如請求項第6項所述的方法，更包含下列步驟：以該導線將該多個發光模組相互連接；儲存同一該線段上的該一或多個發光模組的一或多個工作電源值在對應配置的各該單點控制模組；以及由各該單點控制模組比對各該衰減電源是否小於該電源及/或各該發光模組的各該工作電源，若否，允許各該衰減電源供應至在對應的各該線段上的該一或多個發光模組，若是，由各該單點控制模組輸出一電源調整訊號，以指示一升壓恆流模組基於該電源以及該工作電源調整該衰減電源以形成一單點調整電源，並將各該單點調整電源供應至與各該單點控制模組對應配置的該一或多個發光模組。
  8. 如請求項第6項所述的方法，更包含下列步驟：由各該單點控制模組儲存該電源從該電源供應模組到達與各該單點控制模組對應配置的各該發光模組的過程中所通過的各該線段的一電流路徑長度，分析各該電流路徑長度與該差值的一比例，並據以預估後續相同或不同大小的該電源通過與其對應配置的各該發光模組的該衰減電源的值。
  9. 如請求項第6項所述的方法，更包含下列步驟：由各該單點控制模組從一資料庫中查找與各該單點控制模組對應配置的該一或多個發光模組之間的連接關係，以及各該發光模組所包含的一或多個發光模組之間的連接關係、該一或多個工作電源值及一或多個耐受功率值，並據以判斷出同時適用於與各該單點控制模組對應配置的該一或多個發光模組的一共用單點電源值；以及由各該單點控制模組基於該共用單點電源值，決定一升壓恆流模組對該衰減電源的調整。
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