TWI666972B - 具時控功能的燈具電路 - Google Patents

具時控功能的燈具電路 Download PDF

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Publication number
TWI666972B
TWI666972B TW107111314A TW107111314A TWI666972B TW I666972 B TWI666972 B TW I666972B TW 107111314 A TW107111314 A TW 107111314A TW 107111314 A TW107111314 A TW 107111314A TW I666972 B TWI666972 B TW I666972B
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TW
Taiwan
Prior art keywords
light
modules
light emitting
time
module
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TW107111314A
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English (en)
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TW201916747A (zh
Inventor
蔡乃成
Original Assignee
美商科斯莫燈飾公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
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    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
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    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
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    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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Abstract

本發明提供一種具時控功能的燈具電路，包含：電源供應控制模組，供應正電壓及負電壓中的其中之一至第一電線，以及供應正電壓及負電壓中的另一者至第二電線；複數個發光模組，其中第一發光模組的第一正引腳與第二發光模組的第二負引腳連接第一電線，且第一發光模組的第一負引腳與第二發光模組的第二正引腳連接第二電線；以及時控模組，計時和控制發光模組的發光狀態。因此，本發明可進行快速的正負極性的切換以及控制發光模組的發光時間點和頻率，以提供更多樣化的發光效果。

Description

具時控功能的燈具電路
本發明是有關於一種燈具電路，且特別是有關於一種具時控功能的燈具電路。
在現有燈串結構技術中，相互並聯連接的複數個燈串皆為同向連接，亦即這些燈串的發光模組的正引腳皆連接至同一電線而僅能固定接收正電壓，且發光模組的負引腳皆連接至另一電線而僅能固定接收負電壓。再者，習知技術並未針對每一燈串設置時控元件，以分別針對複數個燈串的複數個發光模組，進行相同或不同的發光時間點、發光時間長度、週期/頻率控制。
本發明的目的在於提供一種具時控功能的燈具電路，其用以解決習知燈串為共正或共負極的結構且未針對個別的發光模組進行發光時間控制，因而具有常亮、變化少、功能單一的缺失。
本發明提供一種具時控功能的燈具電路，包含：電源供應控制模組，連接第一電線以及第二電線，供應正電壓以及負電壓中的其中之一至第一電線，以及供應正電壓以及負電壓中的另一者至第二電線；複數個發光模組，複數個發光模組彼此並聯連接，其 中第一發光模組的第一正引腳與第二發光模組的第二負引腳連接第一電線，且第一發光模組的第一負引腳與第二發光模組的第二正引腳連接第二電線；以及至少一時控模組，設置在電源供應控制模組以及複數個發光模組之間，以計時和控制複數個發光模組的發光狀態。
本發明提供一種具時控功能的燈具電路，包含：電源供應控制模組，連接第一電線、第二電線以及第三電線，供應正電壓或負電壓至第一電線、第二電線以及第三電線；複數個發光模組，包含第一發光模組以及第二發光模組，第一發光模組的第一正引腳連接第一電線，第一發光模組的第一負引腳以及第二發光模組的第二正引腳連接第二電線，第二發光模組的第二負引腳連接第三電線；以及至少一時控模組，設置在電源供應控制模組以及複數個發光模組之間，以計時和控制複數個發光模組的發光狀態。
如上所述，相較於有固定正負極的單迴路串燈結構，本發明具時控功能的燈具電路為沒有固定正負極的多迴路串燈結構，以提供更多選擇切換不同的複數個發光二極體的明暗變化，搭配時控模組的配置，例如時控模組的配置數量取決於發光模組的數量，以分別控制複數個發光模組每一個持續發光或閃爍(間斷發光)的時間點、發光時間長度、頻率/週期等特徵，以提供更多樣化的發光效果，且由於串燈結構不需要嚴格區分正負極連接，從而簡化了串燈的裝配製程，從而提高生產效率、降低生產成本。
2‧‧‧電源供應控制模組
21‧‧‧第一電線
22‧‧‧第二電線
23‧‧‧第三電線
24‧‧‧第四電線
3‧‧‧時控模組
51‧‧‧第一發光模組
52‧‧‧第二發光模組
53‧‧‧第三發光模組
54‧‧‧第四發光模組
59‧‧‧第九發光模組
60‧‧‧第十發光模組
S、SW‧‧‧開關模組
R1、R2、R3、R4、R5、R6、R7‧‧‧電阻
Q1、Q2、Q3、Q4‧‧‧電晶體
C‧‧‧電容
X‧‧‧諧振器
U‧‧‧電源
VCC‧‧‧電壓供應源
圖1是本發明具時控功能的燈具電路的第一實施例的電路方塊圖。
圖2是本發明具時控功能的燈具電路的第二實施例的電路方塊圖。
圖3是本發明具時控功能的燈具電路的第三實施例的電路方塊圖。
圖4是本發明具時控功能的燈具電路的第四實施例的電路方塊圖。
圖5是本發明具時控功能的燈具電路的第五實施例的電路方塊圖。
圖6是本發明具時控功能的燈具電路的第六實施例的電路細部結構配置圖。
在下文將參看隨附圖式更充分地描述各種例示性實施例，在隨附圖式中展示一些例示性實施例。然而，本發明概念可能以許多不同形式來實現，且不應解釋為限於本文中所闡述之例示性實施例。確切而言，提供此等例示性實施例使得本發明將為詳盡且完整，且將向熟習此項技術者充分傳達本發明概念的範疇。在諸圖式中，類似數字始終指示類似元件。
應理解，雖然用語「第一」、「第二」等在本文中可以用來描述各種部件、元件、組件或部分，但是這些部件、元件、組件或部分不應被這些用語限制。這些用語僅用於將一個元件、部件、組件或部分與另一個元件、部件、組件或部分區分開。因此，在不背離本申請的教導的情況下，下文中討論的第一元件、第一部件、第一組件、或第一部分可被稱作第二元件、第二部件、第二組件、或第二部分等，用語「第三」、「第四」等依此類推。
請參閱圖1，其是本發明具時控功能的燈具電路的第一實施例的電路方塊圖。如圖所示，具時控功能的燈具電路，包含電源供應控制模組2、時控模組3、開關模組S，以及複數個發光模組如第一發光模組51、第二發光模組52、第三發光模組53及第四發光模組54，其中電源供應控制模組2連接第一至第四發光模組51~54的正引腳和負引腳而形成迴路；時控模組3設置於電源供應控制模組2以及第一至第四發光模組51~54之間。
電源供應控制模組2連接第一電線21以及第二電線22的一 端，第一發光模組51的正引腳、第二發光模組52的負引腳、第三發光模組53的正引腳以及第四發光模組54的負引腳連接第一電線21的另一端，第一發光模組51的負引腳、第二發光模組52的正引腳、第三發光模組53的負引腳以及第四發光模組54的正引腳連接第二電線22的另一端。
上述第一電線21以及第二電線22並行設置，第一至第四發光模組51~54彼此並聯連接在第一電線21以及第二電線22之間，第一電線21以及第二電線22可以為銅線/漆包線、鐵氟龍線、PVC線或其他適當的線材，第一電線21以及第二電線22內的導體可以為銅線，在此僅舉例說明，線材種類並非用以限制本發明。
實施上，舉例來說，在第一時間區間，電源供應控制模組2供應正電壓至第一電線21以及供應負電壓至第二電線22；接著在第一時間區間間隔一段時間後的第二時間區間內，可以轉而供應負電壓至第一電線21以及供應正電壓至第二電線22，藉此使第一至第四發光模組51~54具有輪流發光的明暗變化。也就是說，本發明每一條電線皆可選擇性供應正電壓和負電壓，並非如習知技術限制特定電線固定輸出正電壓或負電壓。
第一至第四發光模組51~54可以為發光二極體且呈規則設置，例如在本實施例中，第一發光模組51與第三發光模組53同向設置，且第二發光模組52與第四發光模組54同向設置，但第一發光模組51以及第三發光模組53與第二發光模組52以及第四發光模組54反向設置。換言之，第一發光模組51的正引腳以及第三發光模組53的正引腳與第二發光模組52的負引腳以及第四發光模組54的負引腳連接第一電線21，且第一發光模組51的負引腳以及第三發光模組53的負引腳與第二發光模組52的正引腳以及第四發光模組54的正引腳連接第二電線22。應理解，發光模組的數量、型態、發光顏色、配置等特徵可以取決於電路設計需求而調整，不以本實施例為限。
誠如上述，相較於一般的燈具，所有發光模組的正引腳皆連接同一電線以固定供應正電壓，所有複數個發光模組的皆連接另一同一電線以固定供應負電壓。在本發明實施例中，複數個發光模組的正引腳與其他複數個發光模組的負引腳連接同一電線，並且這些複數個發光模組的負引腳與其他複數個發光模組的正引腳連接另一同一電線，同一電線可選擇性或輪流地供應正電壓以及負電壓，形成沒有固定正負極的燈具結構，可以改善習知均為共正或共負極的結構的燈串具有常亮、變化少、功能單一的缺失，且由於串燈結構不需要嚴格區分正負極連接，簡化了串燈的裝配製程，從而提高生產效率、降低生產成本。
進一步地，時控模組3可以包含計時器，其可設置在電源供應控制模組2以及第一至第四發光模組51~54之間，以同步地控制第一至第四發光模組51~54的發光時間點，並計時第一至第四發光模組51~54的每一個的發光時間長度。
為了使時控模組3方便控制第一至第四發光模組51~54的發光狀態，例如，在第一電線21上可以設置開關模組S(實際上亦可將開關模組S設置在第二電線22上)，時控模組3可電性連接開關模組S以選擇性地開啟或閉合開關模組S，如圖1所示的開關模組S在開啟位置，使電源供應控制模組2與第一至第四發光模組51~54形成開迴路，如此電流無法從電源供應控制模組2通過第一電線21流至第一至第四發光模組51~54；反之，亦無法從電源供應控制模組2通過第二電線22流至第一至第四發光模組51一54後，再通過第一電線21回流至電源供應控制模組2。因此，在時控模組3控制開關模組S呈開啟狀態時，第一至第四發光模組51~54皆無法發光。
進一步地，當時控模組3判斷目前時間到達一設定時間時，時控模組3控制開關模組S從上述開啟位置轉至閉合位置，使電源供應控制模組2與第一至第四發光模組51~54形成閉迴路，此時， 電源供應控制模組2可以透過第一電線21供應大於第一發光模組51及第三發光模組53的臨界電壓(例如0.7伏特)的正電壓以及透過第二電線22供應負電壓，使得第一發光模組51以及第三發光模組53導通而發光，例如發出相同或不同顏色的光線，例如紅光、綠光或藍光，其可以持續發光或短暫的閃爍發光；而第二發光模組52以及第四發光模組54則因未導通而無法發光。
替換地或在第二發光模組52以及第四發光模組54停止發光的一段時間後，電源供應控制模組2可以透過第二電線22供應大於第二發光模組52以及第四發光模組54的臨界電壓的正電壓以及透過第一電線21供應負電壓，使得第二發光模組52以及第四發光模組54導通而發光；而第一發光模組51以及第三發光模組53則未導通而無法發光。
請參閱圖2，其是本發明具時控功能的燈具電路的第二實施例的電路方塊圖。如圖所示，具時控功能的燈具電路，包含電源供應控制模組2、時控模組3、複數個開關模組S，以及複數個發光模組如第一發光模組51、第二發光模組52、第三發光模組53及第四發光模組54，其中電源供應控制模組2連接第一至第四發光模組51~54的正引腳和負引腳而形成迴路；時控模組3設置於電源供應控制模組2以及第一至第四發光模組51~54之間。
與第一實施例相同部分不在此贅述，本實施例與第一實施例差異在於，第一實施例僅設置一個時控模組3共用於控制複數個發光模組的發光狀態，而本實施例針對每一個發光模組51~54分別設置與其串聯連接的個別時控模組3，亦即在本實施例中，時控模組3的配置數量取決於發光模組的數量例如四個，以分別控制與第一至第四發光模組51~54每一個串接的各個開關模組S的開啟或閉合，從而分別控制第一至第四發光模組51~54每一個持續發光或閃爍(間斷發光)的時間點、發光時間長度、頻率/週期等特徵。因此，本實施例相較於第一實施例的具時控功能的燈具電路 具有更多樣化的發光效果。
請參閱圖3，其是本發明具時控功能的燈具電路的第三實施例的電路方塊圖。如圖所示，具時控功能的燈具電路，包含電源供應控制模組2、時控模組3、複數個開關模組S，以及複數個發光模組如第一至第十發光模組51~60，其中電源供應控制模組2連接第一至第十發光模組51~60的正引腳和負引腳而形成迴路；複數個時控模組3分別電性連接複數個開關模組S；各個開關模組S與第一至第十發光模組51~60中對應的發光模組串聯連接。
與第二實施例相同部分不在此贅述，本實施例與第二實施例差異在於，第二實施例的第一至第四發光模組51~54的每一個僅包含單個發光元件例如發光二極體；而在本實施例中，第一至第十發光模組51~60的每一個包含彼此串聯連接的複數個發光元件，使得第一至第四發光模組51~54的每一個皆形成燈串結構。
更具體地說，第一發光模組51的複數個發光元件彼此同向串聯連接，即最上方的發光元件的負引腳連接下方第二個發光元件的正引腳，且由上方往下數的第二個發光元件的負引腳連接由上方往下數的第三個發光元件的正引腳，依此類推。第二發光模組52至第九發光模組59與第一發光模組51的複數個發光元件的配置類似。相反地，第十發光模組60的複數個發光元件彼此同向串聯連接，但與第一發光模組51的複數個發光元件反向並聯連接。
應理解，第一至第十發光模組51~60的每一個可視需求決定正引腳連接電源供應控制模組2的第一電線21以及第二電線22的任一者，負引腳則連接另一者，如在本實施例中，第一發光模組51的正引腳與第十發光模組60的負引腳連接至同一電線(第一電線21)，第一發光模組51的負引腳與第十發光模組60的正引腳連接至同一電線(第二電線22)。
如上所述，不受限於一般串燈電路，不同發光模組的複數個發光元件僅彼此同向並聯連接，即所有發光元件的正引腳連接至同 一電線，而負引腳連接至另一同一電線。在本實施例中，不同燈串的複數個發光元件可以彼此反向並聯連接，即部分發光元件的正引腳與其他發光元件的負引腳連接至同一電線，形成沒有固定正負極的燈具結構，藉此簡化了串燈的裝配製程，從而提高生產效率、降低生產成本。
請參閱圖4，其是本發明具時控功能的燈具電路的第四實施例的電路方塊圖。如圖所示，具時控功能的燈具電路，包含電源供應控制模組2、時控模組3、複數個開關模組S，以及複數個發光模組如第一至第四發光模組51~54，其中電源供應控制模組2連接第一至第四發光模組51~54的正引腳和負引腳而形成迴路；各個時控模組3設置於電源供應控制模組2以及第一至第四發光模組51~54之間。
與前述實施例相同部分不在此贅述，本實施例與前述實施例差異在於，前述實施例和第二實施例為2線2迴路的電路結構；本實施例為4線4迴路的燈串結構。
在本實施例中，電源供應控制模組2以四個電源供應輸出端分別連接第一至第四電線21~24，第一發光模組51的正引腳以及第三發光模組53的負引腳連接第一電線21；第一發光模組51的負引腳、第三發光模組53的正引腳以及第二發光模組52的正引腳連接第二電線22；第二發光模組52的負引腳以及第四發光模組54的正引腳連接第三電線23，第四發光模組54的負引腳連接第四電線24，從而形成4線4迴路的燈串結構。
在上述實施例中分別揭露2線2迴路和4線4迴路的LED燈串結構，然而應理解，實際上可調整電線及所接合的發光元件的型態、數量和配置關係，從而形成期望的電路配置，例如3線/2迴路3迴路/4迴路、4線3迴路/4迴路/5迴路/6迴路、4線3迴路或4線12迴路等，發光元件可以為依據發光色彩變化等需求選擇單點、雙點或其他複數個點的LED晶片，例如複數個發光元件可 以分別發出紅光、藍光和綠光等顏色的光線，在此僅舉例說明，不以此為限。
請參閱圖5，其是本發明具時控功能的燈具電路的第五實施例的電路方塊圖。如圖所示，具時控功能的燈具電路，包含電源供應控制模組2、時控模組3、複數個開關模組S，以及複數個發光模組如第一至第十發光模組51~60，其中電源供應控制模組2連接第一至第十發光模組51~60的正引腳和負引腳而形成迴路；各個時控模組3設置於對應的電源供應控制模組2以及第一至第十發光模組51~60中對應的發光模組之間。
與前述實施例相同部分不在此贅述，本實施例與前述實施例差異在於，前述實施例僅設置一個電源供應控制模組共用於複數個發光模組，在本實施例中，針對每一個燈串即第一至第十發光模組51~60的每一個分別配置個別的電源供應控制模組2，即電源供應控制模組2的數量取決於燈串的串數。
時控模組3可以連接在各發光模組的正引腳或負引腳以及電源供應控制模組2之間，例如其中一時控模組3連接第一發光模組51的正引腳以及電源供應控制模組2之間。時控模組3的數量分別對應於電源供應控制模組2的數量及發光模組51~60的數量，每個時控模組3分別控制對應的電源供應控制模組2與第一至第十發光模組51~60中對應的其中一發光模組形成的迴路。
應理解，時控模組3的數量亦可以多於或少於發光模組的數量，在本實施例中，為方便說明，時控模組3的數量與發光模組的數量相同，即第一至第四發光模組51~54的每一個個別串接一個時控模組3，複數個時控模組3可以分別依據複數個設定時間3，以分別同步地或非同步地依序控制第一至第四發光模組51~54的發光時間點和頻率，這些第一至第四發光模組51~54的發光狀態可以彼此相同或不同。
請參閱圖6，其是本發明具時控功能的燈具電路的第六實施例 的電路細部結構配置圖。如圖所示，具時控功能的燈具電路，包含彼此相連形成迴路的電源供應控制模組2、時控模組3、開關模組S，以及第一至第十發光模組51~60。
電源供應控制模組2包括有控制開關模組SW、單片機78P153、由多個電容C和諧振器X組成的振盪電路，振盪電路設置有為其單獨供電的電源U，電源U連接單片機78P153的第4引腳，使單片機78P153以不同頻率輸出高電壓或低電壓訊號。場效應電晶體Q4的閘極和CMOS電晶體Q3的基極分別透過電阻R4和電阻R5與單片機78P153的第14引腳連接，場效應電晶體Q4的汲極和CMOS電晶體Q3的集極透過電阻7相互連接，CMOS電晶體Q3的射極接地；場效應電晶體Q2的閘極和CMOS電晶體Q1的基極分別透過電阻R3和電阻R2與單片機78P153的第13引腳連接，場效應電晶體Q2的汲極和CMOS電晶體Q1的集極透過電阻6相互連接，CMOS電晶體Q2的射極接地。
特別是，針對每組燈串設置個別的控制開關模組S，如圖所示，第一發光模組51的最上方發光元件的負引腳以及第十發光模組60的最上方發光元件的正引腳分別串接一個控制開關模組S，第一發光模組51以及其控制開關模組S的串接電路與第十發光模組60以及其控制開關模組S的串接電路並聯連接，開關模組S的另一端連接場效應電晶體Q4的汲極和CMOS電晶體Q3的集極。第一發光模組51的最下方發光元件的正引腳以及第十發光模組60的最下方發光元件的負引腳連接場效應電晶體Q2的汲極和CMOS電晶體Q1的集極。
另外，針對每個燈串即第一至第十發光模組51~60的每一個設置個別的時控模組3，各個時控模組3可以控制開關模組S的啟閉，從而控制每個燈串的發光狀態。舉例來說，當單片機78P153的第14引腳為高電壓，單片機78P153的第13引腳為低電壓，CMOS電晶體Q3未導通，CMOS電晶體Q1導通，場效應電晶體 Q4處於高電壓，場效應電晶體Q2處於低電壓時，時控模組3可以控制與第一發光模組51串接的開關模組S閉合，例如開關模組S閉合5秒後，開啟3秒，再閉合5秒，即控制第一發光模組51每隔3秒發光一次，每次發光持續時間為5秒，使第一發光模組51閃爍發光。相反地，當單片機78P153的第14引腳為低電壓，單片機78P153的第13引腳為高電壓時，時控模組3可以控制與第十發光模組60串接的開關模組S閉合，例如控制第十發光模組60持續發光10秒，同時其他發光模組可設置相同或不同的發光狀態，且可依據需求增減發光模組的數量以及調整其發光狀態，以具有更豐富的發光變化效果。
以上所述僅為本發明之較佳可行實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。

Claims (9)

  1. 一種具時控功能的燈具電路，包含：一電源供應控制模組，連接一第一電線以及一第二電線，該電源供應控制模組供應一正電壓以及一負電壓中的其中之一至該第一電線，以及供應該正電壓以及該負電壓中的另一者至該第二電線；複數個發光模組，該複數個發光模組彼此並聯連接，其中一第一發光模組的一第一正引腳與一第二發光模組的一第二負引腳連接該第一電線，且該第一發光模組的一第一負引腳與該第二發光模組的一第二正引腳連接該第二電線；以及至少一時控模組，設置在該電源供應控制模組以及該複數個發光模組之間，以計時和控制該複數個發光模組的複數個發光狀態；其中該至少一時控模組為複數個，該複數個時控模組分別連接該複數個發光模組，各該時控模組分別依據一設定時間，以控制該複數個發光模組的發光時間點和頻率。
  2. 如請求項第1項所述的具時控功能的燈具電路，更包含複數個開關模組，分別串聯連接該複數個發光模組以及分別連接該複數個時控模組，該複數個時控模組分別依據相同或不同的複數個設定時間，以分別控制該複數個開關模組的開啟和關閉，從而分別控制該複數個發光模組的發光時間點和頻率。
  3. 如請求項第1項所述的具時控功能的燈具電路，更包含複數個該電源供應控制模組，分別連接該複數個時控模組，該複數個電源供應控制模組的數量以及該複數個時控模組的數量分別對應於該複數個發光模組的數量。
  4. 如請求項第1項所述的具時控功能的燈具電路，其中該第一發光模組包含彼此同向串聯連接的複數個第一發光元件，該第二發光模組包含彼此同向串聯連接的複數個第二發光元件，該複數個第一發光元件與該複數個第二發光元件同向或反向並聯連接。
  5. 一種具時控功能的燈具電路，包含：一電源供應控制模組，連接一第一電線、一第二電線以及一第三電線，該電源供應控制模組供應一正電壓或一負電壓至該第一電線、該第二電線以及該第三電線；複數個發光模組，包含一第一發光模組以及一第二發光模組，該第一發光模組的一第一正引腳連接該第一電線，該第一發光模組的一第一負引腳以及該第二發光模組的一第二正引腳連接該第二電線，該第二發光模組的一第二負引腳連接該第三電線；以及至少一時控模組，設置在該電源供應控制模組以及該複數個發光模組之間，以計時和控制該複數個發光模組的複數個發光狀態。
  6. 如請求項第5項所述的具時控功能的燈具電路，其中該至少一時控模組為複數個，該複數個時控模組分別連接該複數個發光模組，各該時控模組分別依據一設定時間，以控制該複數個發光模組的發光時間點和頻率。
  7. 如請求項第6項所述的具時控功能的燈具電路，更包含複數個開關模組，分別串聯連接該複數個發光模組以及分別連接該複數個時控模組，該複數個時控模組分別依據相同或不同的複數個設定時間，以分別控制該複數個開關模組的開啟和關閉，從而分別控制該複數個發光模組的發光時間點和頻率。
  8. 如請求項第6項所述的具時控功能的燈具電路，更包含複數個該電源供應控制模組，分別連接該複數個時控模組，該複數個電源供應控制模組的數量以及該複數個時控模組的數量分別對應於該複數個發光模組的數量。
  9. 如請求項第5項所述的具時控功能的燈具電路，其中該第一發光模組包含彼此同向串聯連接的複數個第一發光元件，該第二發光模組包含彼此同向串聯連接的複數個第二發光元件，該複數個第一發光元件與該複數個第二發光元件同向或反向並聯連接。
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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10845012B1 (en) * 2019-06-14 2020-11-24 Fourstar Group Inc. Decorative light string
CN110630923A (zh) 2019-09-06 2019-12-31 珠海博杰电子股份有限公司 无极平贴led灯串、其生产方法及生产设备
CN110645494A (zh) * 2019-09-06 2020-01-03 珠海博杰电子股份有限公司 无极侧贴led灯串、其生产方法及生产设备
CN110726081B (zh) 2019-09-06 2024-02-27 珠海博杰电子股份有限公司 Led灯串、其生产方法及生产设备
CN110736034B (zh) 2019-09-06 2024-05-28 珠海博杰电子股份有限公司 Led软管灯、其生产方法及生产设备
US11603983B2 (en) 2019-09-06 2023-03-14 Zhuhai Bojay Electronics Co. Ltd. LED light string ornament and method for manufacturing the same
CN110617414A (zh) 2019-09-06 2019-12-27 珠海博杰电子股份有限公司 Led网灯及其生产方法
CN110994329B (zh) * 2019-12-06 2021-02-26 广州市亿源机电有限公司 线束自动识别插孔装置及方法
CN111168377B (zh) * 2020-01-13 2021-06-11 浙江阳光照明电器集团股份有限公司 一种led球泡灯自动化装配设备
CN113365387A (zh) * 2020-03-02 2021-09-07 科斯莫灯饰公司 具多种发光模式的灯串的发光控制器及控制方法、灯串组件
TWI724917B (zh) * 2020-06-10 2021-04-11 矽誠科技股份有限公司 具有休眠模式之發光二極體模組及發光二極體燈串
US11359775B2 (en) * 2020-06-10 2022-06-14 Ledup Manufacturing Group Limited Series connected parallel array of LEDs
CN111933555B (zh) * 2020-09-16 2021-02-19 深圳平晨半导体科技有限公司 一种高效多工位同步固晶装置及方法
TWI748724B (zh) * 2020-11-03 2021-12-01 電威電機工廠股份有限公司 花園燈的控制系統及其控制方法
CN113147464B (zh) * 2021-04-30 2022-09-30 重庆工业职业技术学院 一种多功能新能源汽车充电桩
CN115405878A (zh) 2021-05-26 2022-11-29 珠海博杰电子股份有限公司 单根导线的led灯串及照明装置
JP7302627B2 (ja) * 2021-06-11 2023-07-04 株式会社プロテリアル 電線接続構造、電線接続方法、医療器具、及び医療器具の製造方法
EP4130552A1 (en) * 2021-08-04 2023-02-08 Chongyi Jingyi Lighting Products Co., Ltd. Led lamp module
US11777334B2 (en) * 2021-11-11 2023-10-03 Beta Air, Llc System for charging multiple power sources and monitoring diode currents for faults
TWI792840B (zh) * 2022-01-07 2023-02-11 瑞昱半導體股份有限公司 Usb晶片及其操作方法
CN114554645A (zh) * 2022-03-11 2022-05-27 厦门普为光电科技有限公司 具照度补偿功能的照明装置及照明装置的照度补偿方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426270A (zh) * 2001-12-14 2003-06-25 香港大学 彩色发光二极管的高效驱动器
TWM368010U (en) * 2009-06-19 2009-11-01 Semisilicon Technology Corp LED (light emitting diode) lamp string and net lamp thereof
CN201758472U (zh) * 2010-03-19 2011-03-09 技领半导体(上海)有限公司 包含有由多个短串连成长串的led灯串电路
TW201313066A (zh) * 2011-09-06 2013-03-16 Univ Nat Taipei Technology 交流驅動的發光二極體裝置
CN103460799A (zh) * 2011-03-07 2013-12-18 奥斯兰姆施尔凡尼亚公司 用于固态光源的高效率、低储能驱动电路
CN204836690U (zh) * 2015-07-29 2015-12-02 东莞市纳川盈海照明有限公司 通过两线双回路调色温的led灯具

Family Cites Families (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794522A (en) * 1972-01-24 1974-02-26 Burroughs Corp Stripping insulated wire
JP2683926B2 (ja) * 1988-01-25 1997-12-03 三菱電機株式会社 絶縁被覆電線の被覆剥離方法及びその装置
JP2928634B2 (ja) * 1990-11-30 1999-08-03 トキコーポレーション株式会社 帯状電線に対する導線露出穴加工具および加工方法
US5608290A (en) * 1995-01-26 1997-03-04 Dominion Automotive Group, Inc. LED flashing lantern
US5800500A (en) * 1995-08-18 1998-09-01 Pi Medical Corporation Cochlear implant with shape memory material and method for implanting the same
US5935465A (en) * 1996-11-05 1999-08-10 Intermedics Inc. Method of making implantable lead including laser wire stripping
US6027952A (en) * 1997-01-21 2000-02-22 Liu; Ming-Hsun Method of manufacturing a string of electrically connected light emitting diodes
DE29706201U1 (de) * 1997-03-27 1997-05-28 Osa Elektronik Gmbh Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper
US6374143B1 (en) * 1999-08-18 2002-04-16 Epic Biosonics, Inc. Modiolar hugging electrode array
CN100343573C (zh) * 2000-11-29 2007-10-17 吴政雄 可弯形灯饰装置及其制造方法
DE10106961A1 (de) * 2001-02-15 2002-08-29 Happich Fahrzeug & Ind Teile Bleuchtungseinrichtung
TW470136U (en) * 2001-03-30 2001-12-21 Tsuei-Duan Weng Strand structure of decoration lights
JP3796159B2 (ja) * 2001-10-24 2006-07-12 矢崎総業株式会社 電線の被覆材除去方法及び被覆材除去装置
CN1514497A (zh) * 2002-12-12 2004-07-21 林锡煌 发光晶粒串联封装方法
CN2612082Y (zh) * 2003-04-04 2004-04-14 京东方科技集团股份有限公司 组合充电电池
US6860007B1 (en) * 2003-08-26 2005-03-01 Li-Wen Liu Method of producing an LED rope light
JP4262565B2 (ja) * 2003-10-15 2009-05-13 株式会社松村電機製作所 照明装置
US6935762B2 (en) * 2003-11-26 2005-08-30 Vickie Jean's Creations, Inc. Light string assembly
WO2011143510A1 (en) * 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US7221110B2 (en) * 2004-12-17 2007-05-22 Bruce Industries, Inc. Lighting control system and method
US7235815B2 (en) * 2005-02-14 2007-06-26 Hsien-Ta Shen LED light set
CN2830875Y (zh) * 2005-09-29 2006-10-25 陈铭培 灌注成型的节日灯串
CN2872072Y (zh) * 2006-01-06 2007-02-21 林书弘 具防呆机制的发光二极管灯串装置
JP2007290013A (ja) * 2006-04-26 2007-11-08 Phoeton Corp シールド導体層の切断方法及びレーザ加工装置
US7670023B1 (en) * 2006-05-15 2010-03-02 Peterson Terry J Flashlight with photovoltaic power source
US7947921B2 (en) * 2006-10-30 2011-05-24 Delphi Technologies, Inc. Electric wire insulation center stripping method and device
TW200831818A (en) * 2007-01-25 2008-08-01 nai-cheng Cai Manufacturing method of an LED lamp string
JP2008188661A (ja) 2007-02-07 2008-08-21 Sumitomo Electric Ind Ltd レーザ加工方法
CN101255961A (zh) * 2007-03-01 2008-09-03 蔡乃成 Led灯串制造方法
TWM343822U (en) * 2008-03-21 2008-11-01 Mosdesign Semiconductor Corp Simultaneous LED cascade circuit of two-cord AC power
CN201274636Y (zh) * 2008-07-11 2009-07-15 上海现代科技发展有限公司 图像识别视觉全自动贴片机
EP2216866A3 (en) * 2009-02-06 2011-07-13 HID Global GmbH Method to strip a portion of an insulated wire
TWI556696B (zh) * 2009-07-14 2016-11-01 蔡乃成 表面黏著型發光元件燈組之製造方法
US8397381B2 (en) * 2009-08-06 2013-03-19 Allied Bright Technology Limited Method for manufacturing light set with surface mounted light emitting components
CN201487798U (zh) * 2009-08-18 2010-05-26 普信科技股份有限公司 一种安全节能型灯饰
CN201611025U (zh) * 2009-08-20 2010-10-20 杭州佑国光电科技有限公司 可调光led灯
US8454186B2 (en) * 2010-09-23 2013-06-04 Willis Electric Co., Ltd. Modular lighted tree with trunk electical connectors
TWI431218B (zh) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar
CN102833995A (zh) * 2011-06-17 2012-12-19 王协峰 一种全自动高速led插件贴片机
CN105828473B (zh) * 2011-07-14 2018-02-09 陈家德 两阶式发光二极管安全监控照明装置
TW201307728A (zh) * 2011-08-09 2013-02-16 Foxsemicon Integrated Tech Inc 發光二極體燈具
CN102322589B (zh) * 2011-08-31 2013-07-10 浙江恒森光电科技有限公司 Led灯条全自动加工设备
CN202201584U (zh) * 2011-08-31 2012-04-25 浙江恒森光电科技有限公司 Led灯条全自动加工设备的旋转绕线台
CN202302947U (zh) * 2011-10-14 2012-07-04 廖国荣 贴片led铜线灯串
TW201320384A (zh) * 2011-11-08 2013-05-16 Ind Tech Res Inst 吸頂燈
CN102548240B (zh) * 2012-01-12 2015-02-11 广东木几智能装备有限公司 Led贴片机双臂多头贴片系统
TWI528018B (zh) * 2012-03-07 2016-04-01 鴻海精密工業股份有限公司 貼片機檢測裝置
CN103369776A (zh) * 2012-04-10 2013-10-23 深圳中科光华科技有限公司 一种带实时检测的多个串联led回路并联的驱动装置和恒流驱动方法
FR2992784B1 (fr) 2012-06-29 2015-08-07 Laselec Dispositif de denudage de cables electriques utilisant des diodes laser violettes ou bleues
TWI556539B (zh) * 2012-09-21 2016-11-01 Battery pack series and parallel matrix connection application module
WO2014153034A1 (en) * 2013-03-14 2014-09-25 Milwaukee Electric Tool Corporation Power tool having multiple battery packs
CN104185384B (zh) * 2013-05-22 2017-07-25 松下知识产权经营株式会社 安装部件的安装方法及安装装置
CN103915870B (zh) * 2014-03-28 2017-04-12 小米科技有限责任公司 一种电源和终端
TWM493218U (zh) * 2014-05-20 2015-01-01 Maintech Semiconductor Inc 兩線式各燈可獨立明滅之發光二極體（ｌｅｄ）燈串電路
CN204026263U (zh) * 2014-08-13 2014-12-17 乐清市新明丽灯饰有限公司 可拆卸网灯
WO2016033013A1 (en) * 2014-08-25 2016-03-03 Master Lock Company Llc Circuits and methods using parallel, separate battery cells
TWI536866B (zh) * 2014-08-29 2016-06-01 矽誠科技股份有限公司 具有可燒錄功能之發光二極體燈及燈串及系統
TWI556547B (zh) * 2014-09-16 2016-11-01 盧昭正 擴散電勢二極體應用電路
CN204481496U (zh) * 2014-12-26 2015-07-15 成都建中锂电池有限公司 带有安全保护系统的一次锂电池组
TWM503521U (zh) * 2015-02-03 2015-06-21 King Yang Internat Technology Co Ltd Ｌｅｄ燈裝飾載具
WO2016196031A1 (en) * 2015-06-01 2016-12-08 Autonomix Medical, Inc. Elongated conductors and methods of making and using the same
CN105407654A (zh) * 2015-11-09 2016-03-16 东莞市浩远电子有限公司 贴片机及其贴片方法
CN105353721A (zh) * 2015-11-10 2016-02-24 中国科学院合肥物质科学研究院 一种全自动led贴片机控制系统
TWM516227U (zh) * 2015-11-12 2016-01-21 Tian-Yu Chen 表貼式ｌｅｄ模組的成型結構
CN205546029U (zh) * 2016-01-11 2016-08-31 武汉金东方智能景观股份有限公司 Led灯照明电路
CN205489597U (zh) * 2016-01-12 2016-08-17 吉安精程仪表科技有限公司 一种多电池仪表供电电路
US10239159B2 (en) * 2016-06-30 2019-03-26 The Boeing Company Laser wire processing device
CN106532150B (zh) * 2016-12-02 2019-05-03 中国船舶重工集团公司第七一九研究所 一种模块化的高压大容量锂电池组可控拓扑结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1426270A (zh) * 2001-12-14 2003-06-25 香港大学 彩色发光二极管的高效驱动器
TWM368010U (en) * 2009-06-19 2009-11-01 Semisilicon Technology Corp LED (light emitting diode) lamp string and net lamp thereof
CN201758472U (zh) * 2010-03-19 2011-03-09 技领半导体(上海)有限公司 包含有由多个短串连成长串的led灯串电路
CN103460799A (zh) * 2011-03-07 2013-12-18 奥斯兰姆施尔凡尼亚公司 用于固态光源的高效率、低储能驱动电路
TW201313066A (zh) * 2011-09-06 2013-03-16 Univ Nat Taipei Technology 交流驅動的發光二極體裝置
CN204836690U (zh) * 2015-07-29 2015-12-02 东莞市纳川盈海照明有限公司 通过两线双回路调色温的led灯具

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