TWI699254B - 燈串及其自動組裝設備和方法 - Google Patents

燈串及其自動組裝設備和方法 Download PDF

Info

Publication number
TWI699254B
TWI699254B TW107130604A TW107130604A TWI699254B TW I699254 B TWI699254 B TW I699254B TW 107130604 A TW107130604 A TW 107130604A TW 107130604 A TW107130604 A TW 107130604A TW I699254 B TWI699254 B TW I699254B
Authority
TW
Taiwan
Prior art keywords
lamp
wire
light
lamp housing
housings
Prior art date
Application number
TW107130604A
Other languages
English (en)
Other versions
TW201914727A (zh
Inventor
蔡乃成
Original Assignee
美商科斯莫燈飾公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商科斯莫燈飾公司 filed Critical 美商科斯莫燈飾公司
Publication of TW201914727A publication Critical patent/TW201914727A/zh
Application granted granted Critical
Publication of TWI699254B publication Critical patent/TWI699254B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
    • H02G1/1256—Machines the cutting element not rotating about the wire or cable making a transverse cut using wire or cable-clamping means
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/007—Regulation of charging or discharging current or voltage
    • H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
    • H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
    • H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/747—Lightning equipment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H02J2007/0067—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

本發明提供一種燈串及其自動組裝設備和方法。燈串的自動組裝方法包含以下步驟：利用裝配機台排列多個燈殼在燈殼載具內；利用裝配機台致動固持件水平移動，以將固持件上的多個發光元件分別對準多個燈殼的多個容置空間；利用裝配機台致動固持件朝燈殼載具垂直移動，使得多個發光元件分別進入多個容置空間內分別與多個燈殼接合；利用裝配機台將第一導線以及第二導線連同多個發光元件從固持件上取下；利用裝配機台將第一導線以及第二導線穿過多個燈殼的多個燈殼貫穿孔；以及利用裝配機台將燈串從燈殼載具內取出。

Description

燈串及其自動組裝設備和方法
本發明是有關於一種燈串，且特別是有關於一種燈串及其自動組裝設備和方法。
在節日的裝飾品中，各種顏色的閃爍燈泡是必不可少的。通過設置各種顏色的燈泡形成不同顏色的燈串，從而裝點節日氣氛。在現有技術中，為裝點節日氣氛，期望實現多排燈泡閃爍和不同幻彩的效果，將不同顏色的燈泡進行交叉組合成聖誕燈串。然而，聖誕燈串和其他節日的燈飾屬於傳統行業，需通過大量的手工來完成對燈串的組裝，不但生產效率極低，且人工成本較高。
為解決習知技術的缺失，本發明的目的在於提供一種燈串的自動組裝設備，適用於燈串，燈串包含第一導線、第二導線、多個發光元件以及多個燈殼，燈串的自動組裝設備包含：燈殼載具，多個燈殼沿燈殼載具的長邊方向排列在燈殼載具內，各燈殼具有容置空間以及燈殼貫穿孔，燈殼貫穿孔貫穿燈殼本體；固持件，沿固持件的長邊方向繞設第一導線以及第二導線在 固持件上，多個發光元件跨接在第一導線以及相鄰的第二導線之間；以及裝配機台，連接固持件，配置以致動固持件移動，以移動多個發光元件分別進入多個燈殼的多個容置空間內，接著將多個發光元件連同第一導線以及第二導線一起從固持件上取下，將第一導線以及第二導線穿過多個燈殼的多個燈殼貫穿孔並繞設在燈殼載具上，接著在多個燈殼的多個容置空間內分別容置多個接合件用以接合多個燈殼與分別對應的多個發光元件、部分第一導線以及部分第二導線以組成燈串，最後將燈串從燈殼載具內取出。
另外，本發明提供一種燈串，利用自動組裝設備組裝而成，自動組裝設備包含燈殼載具、固持件以及裝配機台，裝配機台連接固持件，燈串包含：多個燈殼，沿燈殼載具的長邊方向排列在燈殼載具內，各燈殼具有容置空間以及燈殼貫穿孔，燈殼貫穿孔貫穿各燈殼本體；第一導線以及第二導線，彼此相隔預定距離沿固持件的長邊方向繞設在固持件上；以及多個第一發光元件，跨接在第一導線以及第二導線之間；其中在裝配機台致動固持件移動後，多個第一發光元件分別進入多個燈殼的多個容置空間內，多個第一發光元件連同第一導線以及第二導線一起從固持件上被裝配機台卸下，第一導線以及第二導線穿過多個燈殼的多個燈殼貫穿孔並繞設在燈殼載具上，多個接合件分別容置在多個燈殼的多個容置空間內以接合多個燈殼與分別對應的多個發光元件、部分第一導線以及部分第二導線以組成燈串，接著燈串從燈殼載具內被裝配機台取出。
另外，本發明提供一種燈串的自動組裝方法，利用自動組裝設備組裝一燈串，自動組裝設備包含燈殼載具、固持件以及與固持件連接的裝配機台，燈串包含第一導線、第二導線、多個發光元件以及多個燈殼，第一導線以及第二導線沿固持件的長邊方向 繞設在固持件上，多個發光元件跨接在第一導線以及相鄰的第二導線之間，燈串的自動組裝方法包含以下步驟：利用裝配機台沿燈殼載具的長邊方向排列多個燈殼在燈殼載具內；利用裝配機台致動固持件相對於燈殼載具平行移動，以將多個發光元件分別對準多個燈殼的多個容置空間；利用裝配機台致動固持件朝燈殼載具垂直移動，以移動多個發光元件分別進入多個容置空間內；利用裝配機台將第一導線以及第二導線連同多個發光元件從固持件上取下；利用裝配機台將第一導線以及第二導線穿過多個燈殼的多個燈殼貫穿孔，並繞設在燈殼載具上；利用裝配機台在多個燈殼的多個容置空間內分別容置多個接合件，透過多個接合件接合多個燈殼與分別對應的多個發光元件、部分第一導線以及部分第二導線以組成燈串；以及利用裝配機台將燈串從燈殼載具內取出。
如上所述，本發明提供自動組裝設備和方法以及使用自動組裝設備和方法組裝的燈串，透過自動組裝設備和方法自動化地實現在同一組燈串中組裝不同發光效果的多個燈具，可提高生產效率、節省勞動力，從而有效降低生產成本，同時使燈串具有多樣化的發光效果。
10、120‧‧‧燈殼載具
101‧‧‧載具通孔
21、22‧‧‧導線
231‧‧‧發光元件
24‧‧‧燈殼
2411‧‧‧容置部
2412‧‧‧裝飾部
242‧‧‧燈殼貫穿孔
25‧‧‧塞件
30、320‧‧‧固持件
31‧‧‧槽座
32‧‧‧凸塊
40‧‧‧裝配機台
50‧‧‧模具
51‧‧‧凹槽
60‧‧‧點膠機台
61‧‧‧點膠噴嘴
S1001~S1017‧‧‧步驟
圖1是本發明第一實施例的燈串的自動組裝設備的燈殼載具以及置放在燈殼載具內的燈殼的結構配置圖。
圖2是本發明第一實施例的燈串的自動組裝設備的點膠機台在燈殼內點膠的示意圖。
圖3是本發明第一實施例的燈串的自動組裝設備的固持件、 繞設在固持件上的導線以及貼設在導線上的LED晶片的結構配置圖。
圖4是本發明第一實施例的燈串的自動組裝設備的裝配機台以及裝設在裝配機台上的固持件的結構配置圖。
圖5是本發明第一實施例的燈串的自動組裝設備的固持件以及燈殼載具的側視圖。
圖6是本發明第一實施例的燈串的自動組裝設備的固持件以及燈殼載具的正視圖。
圖7是本發明第二實施例的燈串的示意圖。
圖8是本發明第三實施例的燈串的自動組裝設備的燈殼載具、模具以及固持件的結構配置圖。
圖9是本發明第三實施例的燈串的示意圖。
圖10是本發明第四實施例的燈串的自動組裝方法的步驟流程圖。
以下是通過特定的具體實施例來說明本發明所揭露有關本發明的實施方式，本領域技術人員可由本說明書所揭露的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所揭露的內容並非用以限制本發明的保護範圍。
應理解，雖然本文中可能使用術語第一、第二、第三等來描述各種元件或者訊號，但這些元件或者訊號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一訊號與另一訊號。另外，本文中所使用的術語“或”，應視實際情況可 能包括相關聯的列出項目中的任一個或者多個的組合。
為了解釋清楚，在一些情況下，本技術可被呈現為包括包含功能塊的獨立功能塊，其包含裝置、裝置元件、軟體中實施的方法中的步驟或路由，或硬體及軟體的組合。
實施根據這些揭露方法的裝置可以包括硬體、韌體及/或軟體，且可以採取任何各種形體。這種形體的典型例子包括筆記型電腦、智慧型電話、小型個人電腦、個人數位助理等等。本文描述之功能也可以實施於週邊設備或內置卡。透過進一步舉例，這種功能也可以實施在不同元件或在單個裝置上執行的不同程序的電路板。
該指令、用於傳送這樣的指令的介質、用於執行其的計算資源或用於支持這樣的計算資源的其他結構，係為用於提供在這些揭露中所述的功能的手段。
[第一實施例]
請參閱圖1，其是本發明第一實施例的燈串的自動組裝設備的燈殼載具以及置放在燈殼載具內的燈殼的結構配置圖。
如圖1所示，燈殼載具10為長條狀槽體。燈殼載具10的底面上具有多個載具通孔101，這些載具通孔101彼此相隔一預定距離。多個燈殼24沿燈殼載具10的長邊方向依序或同時排列在燈殼載具10的槽內，相鄰的每兩個燈殼24的側面相互接觸。
燈殼24可包含容置部2411以及裝飾部2412。容置部2411以及裝飾部2412可為一體成形，或可拆卸地組合而成。舉例來說，裝飾部2412的外觀呈長方體，容置部2411為圓柱狀，但本發明不以此為限。容置部2411可組裝在裝飾部2412的一側，或從裝飾部2412的一表面凸起。
燈殼24的裝飾部2412可具有中空空間，中空空間貫穿燈殼24的頂面和底面。裝飾部2412的中空空間可連通容置部2411的 容置空間。本實施例的中空空間為雪花形體，但本發明不以此為限。裝飾部2412可具有燈殼貫穿孔242，燈殼貫穿孔242通過裝飾部2412的中空空間貫穿裝飾部2412的兩側面。實務上，可依需求改變燈殼貫穿孔242貫穿裝飾部2412的其他表面。
燈殼24的容置部2411的形狀可對應燈殼載具10的載具通孔101的形態。實施上，如圖4所示的裝配機台40將多個燈殼24置放在燈殼載具10內時，燈殼24的容置部2411從燈殼載具10的上表面通過載具通孔101至燈殼載具10的另一相對表面外，即燈殼24的容置部2411位於燈殼載具10的下表面下，裝飾部2412平放在燈殼載具10的表面上。可選擇性地，燈殼24的厚度可與燈殼載具10的槽壁高度相同，使裝飾部2412置放在燈殼載具10內時，燈殼24的裝飾部2412的上表面與燈殼載具10的上邊緣對齊。
請參閱圖2，其是本發明第一實施例的燈串的自動組裝設備的點膠機台在燈殼內點膠的示意圖。
如圖2所示，裝配機台40可包含或額外的點膠機台60可具有一或多個點膠噴嘴61。在裝配機台40將第一導線21以及第二導線22穿過燈殼載具10上的燈殼24的燈殼貫穿孔並繞設在燈殼載具10上之前或之後(本實施例)，點膠機台60可致動一或多個點膠噴嘴61水平和垂直移動，以使點膠噴嘴61的噴嘴頭對準個燈殼24的容置空間，接著透過一個點膠噴嘴61依序或同時透過多個點膠噴嘴61在多個燈殼24的容置空間內點膠/塗膠(即接合件)。
請參閱圖3，其是本發明第一實施例的燈串的自動組裝設備的固持件、繞設在固持件上的導線以及貼設在導線上的LED晶片的結構配置圖。
如圖3所示，裝配機台40可沿固持件30的長邊方向，繞設第一導線21以及第二導線22在固持件30上，接著可透過裝配機 台40包含的或額外的貼片機台將多個第一發光元件231例如發光二極體晶片跨接在固持件30上的第一導線21以及相鄰的第二導線22之間。
請一併參閱圖4至圖6，圖4是本發明第一實施例的燈串的自動組裝設備的裝配機台以及裝設在裝配機台上的固持件的結構配置圖；圖5是本發明第一實施例的燈串的自動組裝設備的固持件以及燈殼載具的側視圖；圖6是本發明第一實施例的燈串的自動組裝設備的固持件以及燈殼載具的正視圖。
如圖4所示，固持件30可裝設在裝配機台40上，並連接裝配機台40的致動器。此時，固持件30上方的多個發光元件231面向上方。裝配機台40欲組裝燈串時，裝配機台40可180度翻轉固持件30，使得多個發光元件231轉為如圖5所示的多個發光元件231面向放置固持件30下方的燈殼載具10，其中燈殼載具10內已排設有多個燈殼24。依據每一燈串的實際需求可選擇放置不同數量和形態的燈殼24，本發明不以此為限。
在本實施例中，固持件30可具有槽座31以及凸塊32。凸塊32的截面積可為H形狀。凸塊32可拆卸地裝設在槽座31內。此時，凸塊32中間的突起部分可突出至槽座31面對燈殼載具10的一表面外。如圖3和圖4所示，第一導線21以及第二導線22繞設在固持件30的槽座31以及凸塊32上，多個第一發光元件231彼此分隔的平放在固持件30的凸塊32上。
進一步地，如圖5所示，裝配機台40可調整第一導線21以及第二導線22在固持件30上的繞設狀態，使得第一導線21的多個第一線段以及第二導線22的多個第二線段從接觸固持件30件的位置下移至不接觸裝配機台40的位置處，跨接在這些第一線段以及第二線段之間的第一發光元件231不再平放在固持件30的凸塊32上。
裝配機台40可相對於燈殼載具10移動固持件30，使多個第 一發光元件231分別對準多個燈殼24的多個容置空間。裝配機台40可接著朝向燈殼載具10的方向移動固持件30，以移動多個第一發光元件231分別進入多個燈殼24的多個容置空間內。
舉例來說，除了多個第一發光元件231，燈串20可更包含多個第二發光元件。多個第二發光元件可分別與多個第一發光元件231背對背貼設在一起。在裝配機台40致動固持件30移動後，多個第二發光元件可與多個第一發光元件231一同進入多個燈殼24的多個容置空間內。
第一發光元件231以及第二發光元件可透過燈殼24的容置空間內的接合件與對應的燈殼24接合。另外，燈殼24內的第一導線21以及第二導線22亦可透過接合件與燈殼24接合。如此，燈殼24可固定在第一導線21以及第二導線22的一位置處而不會任意移動、脫落。
若接合件為黏著劑時，裝配機台40可待黏著劑黏固硬化而將燈殼24固定在第一導線21以及第二導線22上之後，始將多個第一發光元件231以及第二發光元件連同第一導線21以及第二導線22一起從固持件30上取下。此時，第一發光元件231以及第二發光元件維持在對應的燈殼24的容置空間內。
裝配機台40接著將第一導線21以及第二導線22穿過多個燈殼24的多個燈殼貫穿孔242。如此，可實現由第一導線21、第二導線22、多個第一發光元件231以及多個燈殼24組裝成燈串。最後，裝配機台40將燈串從燈殼載具10內取出。
[第二實施例]
請參閱圖7，其是本發明第二實施例的燈串的示意圖。如圖7所示，燈串可利用相同或類似於上述自動組裝設備組裝而成。燈串包含第一導線21、第二導線22、多個發光元件以及多個燈殼24。
燈殼24的容置部2411位於燈殼24的裝飾部2412的一表面 上。裝飾部2412的形狀可為實體的星形，在此僅舉例說明，本發明不以此為限。燈殼24的裝飾部2412與容置部2411可彼此不連通。容置部2411具有貫穿孔。
實施上，第一導線21以及第二導線22穿過貫穿孔。此時，發光元件跨接在位於燈殼24內的第一導線21的一第一線段以及相鄰的第二導線22的一第二線段之間。
燈殼24的容置部2411具有一開口面向遠離裝飾部2412的方向。因此，進一步地，可例如使用裝配機台取得塞件25，接著分別塞入燈殼24的容置空間內，以塞住第一發光元件231保持在容置空間內。
[第三實施例]
請參閱圖8，圖8是本發明第三實施例的燈串的自動組裝設備的燈殼載具、模具以及固持件的結構配置圖；圖9是本發明第四實施例的燈串的示意圖。
如圖8所示，燈殼載具120呈中空長條體。模具50具有多個凹槽51。多個凹槽51的形態分別對應多個燈殼24的形態。多個凹槽51可具有相同或不同的形狀。本實施例的多個凹槽51皆為心形體，但不以此為限。
實施上，裝配機台可取得模具50並安裝模具50在燈殼載具120上，接著取得多個燈殼24分別置放在模具50的多個凹槽51內。裝配機台將第一導線21以及第二導線22以及跨接在兩導線21、22之間的如圖9所示的多個發光元件231一起從固持件320上取下。
裝配機台可移動多個發光元件231分別進入多個燈殼24的多個容置空間內，多個發光元件231分別透過燈殼24內的多個接合件分別與多個燈殼24接合，第一導線21以及第二導線22穿過多個燈殼24的多個燈殼貫穿孔並繞設在燈殼載具120上，接著在燈 殼24的容置空間內容置接合件例如黏膠以接合多個燈殼24與分別對應的多個發光元件231、部分第一導線21以及部分第二導線22以組成燈串，藉以完成燈串的組裝，如圖5所示組成燈串的其中一個心形體的發光元件231。
[第四實施例]
請參閱圖10，其是本發明第五實施例的燈串的自動組裝方法的步驟流程圖。如圖10所示，本實施例的燈串的自動組裝方法包含以下步驟S1001~S1017，適用於上述自動組裝設備和燈串。
步驟S1001：利用裝配機台跨接多個發光元件在第一導線以及相鄰的第二導線之間。
步驟S1003：利用裝配機台沿固持件的長邊方向繞設第一導線以及第二導線在固持件上，第一導線以及第二導線彼此相隔預定距離。
步驟S1005：利用裝配機台沿燈殼載具的長邊方向排列多個燈殼在燈殼載具內。
步驟S1007：利用裝配機台致動固持件相對於燈殼載具平行移動，以將多個發光元件分別對準多個燈殼的多個容置空間。
步驟S1009：利用裝配機台致動固持件朝燈殼載具垂直移動，以移動多個發光元件分別進入多個容置空間內。
步驟S1011：利用裝配機台將第一導線以及第二導線連同多個發光元件從固持件上取下。
步驟S1013：利用裝配機台將第一導線以及第二導線穿過多個燈殼的多個燈殼貫穿孔，並繞設在燈殼載具上。
步驟S1015：利用裝配機台在多個燈殼的多個容置空間內分別容置多個接合件，透過多個接合件接合多個燈殼與分別對應的多個發光元件、部分第一導線以及部分第二導線以組成燈串。
步驟S1017：利用裝配機台將燈串從燈殼載具內取出。
步驟S1015可包含步驟：利用裝配機台在多個燈殼的多個容置空間內點膠；以及利用烤箱將多個容置空間內的膠體烘乾。
針對上方步驟S1005，本實施例自動組裝方法可更進一步包含以下步驟：將多個燈殼置放在燈殼載具內，相鄰的每兩個燈殼的側面相互接觸；將多個燈殼的多個容置部分別從燈殼載具的一表面通過燈殼載具的多個載具通孔至燈殼載具的另一相對表面外；以及平放多個燈殼的多個裝飾部在燈殼載具的表面上，使多個燈殼的上表面與燈殼載具的上緣齊平。
針對步驟S1005的另一實施方式，本實施例自動組裝方法可更進一步包含以下步驟：利用裝配機台取得模具安裝在燈殼載具內；以及利用裝配機台取得多個燈殼，分別置放多個燈殼在模具的多個凹槽內。
另外，在步驟S1015之後，本實施例自動組裝方法可更進一步包含以下步驟：利用裝配機台取得多個塞件分別塞入多個燈殼的多個容置空間內，以塞住發光元件以及部分的導線保持在容置空間內。
[實施例的有益效果]
本發明的有益效果在於，本發明提供自動組裝設備和方法以及使用自動組裝設備和方法組裝的燈串，透過自動組裝設備和方法自動化地實現在同一組燈串中組裝不同發光效果的多個燈具，可提高生產效率、節省勞動力，從而有效降低生產成本，同時使燈串具有多樣化的發光效果。
最後須說明地是，於前述說明中，儘管已將本發明技術的概念以多個示例性實施例具體地示出與闡述，然而在此項技術的領域中具有通常知識者將理解，在不背離由以下申請專利範圍所界定的本發明技術的概念之範圍的條件下，可對其作出形式及細節上的各種變化。
S1001~S1017‧‧‧步驟

Claims (14)

  1. 一種燈串的自動組裝設備，適用於一燈串，該燈串包含一第一導線、一第二導線、多個發光元件以及多個燈殼，該燈串的自動組裝設備包含：一燈殼載具，該多個燈殼沿該燈殼載具的長邊方向排列在該燈殼載具內，各該燈殼具有一容置空間以及一燈殼貫穿孔，該燈殼貫穿孔貫穿該燈殼本體；一固持件，沿該固持件的長邊方向繞設該第一導線以及該第二導線在該固持件上，該多個發光元件跨接在該第一導線以及相鄰的該第二導線之間；以及一裝配機台，連接該固持件，配置以致動該固持件移動，以移動該多個發光元件分別進入該多個燈殼的該多個容置空間內，接著將該多個發光元件連同該第一導線以及該第二導線一起從該固持件上取下，將該第一導線以及該第二導線穿過該多個燈殼的該多個燈殼貫穿孔並繞設在該燈殼載具上，接著在該多個燈殼的該多個容置空間內分別容置多個接合件用以接合該多個燈殼與分別對應的該多個發光元件、部分該第一導線以及部分該第二導線以組成該燈串，最後將該燈串從該燈殼載具內取出。
  2. 如請求項1所述的燈串的自動組裝設備，其中該固持件具有一槽座以及一凸塊，該凸塊裝設在該槽座內，部分該凸塊突出至該槽座面對該燈殼載具的一表面外，該第一導線以及該第二導線繞設在該槽座以及該凸塊上，該多個發光元件位於該凸塊上。
  3. 如請求項1所述的燈串的自動組裝設備，其中該燈殼載具具有多個載具通孔，各該燈殼包含相連通的一容置部以及一裝飾部，該容置部從該裝飾部的一表面凸起，該裝配機台將該多個燈殼置放在該燈殼載具內時，該容置部從該燈殼載具的一表面 通過各該載具通孔至該燈殼載具的另一相對表面外，該裝飾部平放在該燈殼載具的該表面上。
  4. 如請求項1所述的燈串的自動組裝設備，其中該裝配機台取得多個塞件，接著分別塞入該多個燈殼的該多個容置空間內，以分別塞住該多個發光元件保持在該多個容置空間內。
  5. 如請求項1所述的燈串的自動組裝設備，更包含一模具，具有多個凹槽，該多個凹槽的形態分別對應該多個燈殼的形態，該裝配機台取得該模具並安裝在該燈殼載具上，接著取得該多個燈殼分別置放在該模具的該多個凹槽內。
  6. 一種燈串，利用一自動組裝設備組裝而成，該自動組裝設備包含一燈殼載具、一固持件以及一裝配機台，該裝配機台連接該固持件，該燈串包含：多個燈殼，沿該燈殼載具的長邊方向排列在該燈殼載具內，各該燈殼具有一容置空間以及一燈殼貫穿孔，該燈殼貫穿孔貫穿各該燈殼本體；一第一導線以及一第二導線，彼此相隔一預定距離沿該固持件的長邊方向繞設在該固持件上；以及多個第一發光元件，跨接在該第一導線以及該第二導線之間；其中該多個第一發光元件分別置放在該多個燈殼的該多個容置空間內，該第一導線以及該第二導線穿過該多個燈殼的該多個燈殼貫穿孔並繞設在該燈殼載具上，多個接合件分別容置在該多個燈殼的該多個容置空間內，該多個燈殼分別透過多個接合件，以分別與對應的該多個發光元件接合。
  7. 如請求項6所述的燈串，其中該燈串更包含多個第二發光元件，該多個第二發光元件分別與該多個第一發光元件背對背貼設在一起，並分別在該多個燈殼的該多個容置空間內，分別透過該多個接合件，以分別與該多個燈殼接合。
  8. 如請求項6所述的燈串，其中各該燈殼包含一裝飾部以及一容 置部，該容置部從該裝飾部的一表面凸起，該裝飾部具有一中空空間連通該容置部的該容置空間，該燈殼貫穿孔通過該中空空間貫穿該裝飾部，該第一導線以及該第二導線通過該中空空間穿過該燈殼貫穿孔。
  9. 如請求項6所述的燈串，更包含多個塞件，分別塞入該多個燈殼的該多個容置空間內，以塞住該多個發光元件分別保持在該多個容置空間內。
  10. 一種燈串的自動組裝方法，利用一自動組裝設備組裝一燈串，該自動組裝設備包含一燈殼載具、一固持件以及與該固持件連接的一裝配機台，該燈串包含一第一導線、一第二導線、多個發光元件以及多個燈殼，該第一導線以及該第二導線沿該固持件的長邊方向繞設在該固持件上，該多個發光元件跨接在該第一導線以及該第二導線之間，該燈串的自動組裝方法包含以下步驟：利用該裝配機台沿該燈殼載具的長邊方向排列該多個燈殼在該燈殼載具內；利用該裝配機台致動該固持件相對於該燈殼載具平行移動，以將該多個發光元件分別對準該多個燈殼的多個容置空間；利用該裝配機台致動該固持件朝該燈殼載具垂直移動，以移動該多個發光元件分別進入該多個容置空間內；利用該裝配機台將該第一導線以及該第二導線連同該多個發光元件從該固持件上取下；利用該裝配機台將該第一導線以及該第二導線穿過該多個燈殼的多個燈殼貫穿孔，並繞設在該燈殼載具上；利用該裝配機台在該多個燈殼的該多個容置空間內分別容置多個接合件，透過該多個接合件接合該多個燈殼與分別對應的該多個發光元件、部分該第一導線以及部分該第二導線以組成該燈串；以及 利用該裝配機台將該燈串從該燈殼載具內取出。
  11. 如請求項10所述的燈串的自動組裝方法，更包含以下步驟：利用該裝配機台將該多個燈殼置放在該燈殼載具內，相鄰的每兩個該燈殼的側面相互接觸；利用該裝配機台將該多個燈殼的多個容置部分別從該燈殼載具的一表面通過該燈殼載具的多個載具通孔至該燈殼載具的另一相對表面外；以及利用該裝配機台平放該多個燈殼的多個裝飾部在該燈殼載具的該表面上，使該多個燈殼的上表面與該燈殼載具的上緣齊平。
  12. 如請求項10所述的燈串的自動組裝方法，更包含以下步驟：利用該裝配機台取得多個塞件分別塞入該多個燈殼的該多個容置空間內，以塞住該多個發光元件分別保持在該多個容置空間內。
  13. 如請求項10所述的燈串的自動組裝方法，更包含以下步驟：利用該裝配機台取得一模具安裝在該燈殼載具內；以及利用該裝配機台取得該多個燈殼，分別置放該多個燈殼在該模具的多個凹槽內。
  14. 如請求項10所述的燈串的自動組裝方法，其中利用該裝配機台在該多個燈殼的該多個容置空間內分別容置多個接合件，透過該多個接合件接合該多個燈殼與分別對應的該多個發光元件、部分該第一導線以及部分該第二導線以組成該燈串的步驟包含以下步驟：利用該裝配機台在該多個燈殼的該多個容置空間內點膠；以及利用一烤箱將該多個容置空間內的膠體烘乾。
TW107130604A 2017-09-29 2018-08-31 燈串及其自動組裝設備和方法 TWI699254B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762565327P 2017-09-29 2017-09-29
US62/565,327 2017-09-29
US201762584619P 2017-11-10 2017-11-10
US62/584,619 2017-11-10

Publications (2)

Publication Number Publication Date
TW201914727A TW201914727A (zh) 2019-04-16
TWI699254B true TWI699254B (zh) 2020-07-21

Family

ID=65034629

Family Applications (7)

Application Number Title Priority Date Filing Date
TW107111314A TWI666972B (zh) 2017-09-29 2018-03-30 具時控功能的燈具電路
TW107111310A TWI641780B (zh) 2017-09-29 2018-03-30 燈條製造方法及用於製造燈條的繞線架
TW107111312A TW201914717A (zh) 2017-09-29 2018-03-30 電線、剝線方法以及燈具
TW107113722A TWI661745B (zh) 2017-09-29 2018-04-23 單點控制燈串電路及其方法
TW107130119A TWI718406B (zh) 2017-09-29 2018-08-29 電源供應裝置
TW107130604A TWI699254B (zh) 2017-09-29 2018-08-31 燈串及其自動組裝設備和方法
TW107131148A TWI681697B (zh) 2017-09-29 2018-09-05 Ｌｅｄ晶片的貼片設備和方法

Family Applications Before (5)

Application Number Title Priority Date Filing Date
TW107111314A TWI666972B (zh) 2017-09-29 2018-03-30 具時控功能的燈具電路
TW107111310A TWI641780B (zh) 2017-09-29 2018-03-30 燈條製造方法及用於製造燈條的繞線架
TW107111312A TW201914717A (zh) 2017-09-29 2018-03-30 電線、剝線方法以及燈具
TW107113722A TWI661745B (zh) 2017-09-29 2018-04-23 單點控制燈串電路及其方法
TW107130119A TWI718406B (zh) 2017-09-29 2018-08-29 電源供應裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107131148A TWI681697B (zh) 2017-09-29 2018-09-05 Ｌｅｄ晶片的貼片設備和方法

Country Status (4)

Country Link
US (7) US20190101254A1 (zh)
CN (7) CN109587898B (zh)
CA (7) CA3013375A1 (zh)
TW (7) TWI666972B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10845012B1 (en) 2019-06-14 2020-11-24 Fourstar Group Inc. Decorative light string
CN110630923A (zh) 2019-09-06 2019-12-31 珠海博杰电子股份有限公司 无极平贴led灯串、其生产方法及生产设备
CN110726081B (zh) 2019-09-06 2024-02-27 珠海博杰电子股份有限公司 Led灯串、其生产方法及生产设备
CN110736034A (zh) 2019-09-06 2020-01-31 珠海博杰电子股份有限公司 Led软管灯、其生产方法及生产设备
US11603983B2 (en) 2019-09-06 2023-03-14 Zhuhai Bojay Electronics Co. Ltd. LED light string ornament and method for manufacturing the same
CN110645494A (zh) * 2019-09-06 2020-01-03 珠海博杰电子股份有限公司 无极侧贴led灯串、其生产方法及生产设备
CN110994329B (zh) * 2019-12-06 2021-02-26 广州市亿源机电有限公司 线束自动识别插孔装置及方法
CN111168377B (zh) * 2020-01-13 2021-06-11 浙江阳光照明电器集团股份有限公司 一种led球泡灯自动化装配设备
CN113365387A (zh) * 2020-03-02 2021-09-07 科斯莫灯饰公司 具多种发光模式的灯串的发光控制器及控制方法、灯串组件
TWI724917B (zh) * 2020-06-10 2021-04-11 矽誠科技股份有限公司 具有休眠模式之發光二極體模組及發光二極體燈串
US11359775B2 (en) * 2020-06-10 2022-06-14 Ledup Manufacturing Group Limited Series connected parallel array of LEDs
CN111933555B (zh) * 2020-09-16 2021-02-19 深圳平晨半导体科技有限公司 一种高效多工位同步固晶装置及方法
TWI748724B (zh) * 2020-11-03 2021-12-01 電威電機工廠股份有限公司 花園燈的控制系統及其控制方法
CN113147464B (zh) * 2021-04-30 2022-09-30 重庆工业职业技术学院 一种多功能新能源汽车充电桩
CN115405878A (zh) 2021-05-26 2022-11-29 珠海博杰电子股份有限公司 单根导线的led灯串及照明装置
JP7302627B2 (ja) * 2021-06-11 2023-07-04 株式会社プロテリアル 電線接続構造、電線接続方法、医療器具、及び医療器具の製造方法
EP4130552A1 (en) * 2021-08-04 2023-02-08 Chongyi Jingyi Lighting Products Co., Ltd. Led lamp module
US11777334B2 (en) * 2021-11-11 2023-10-03 Beta Air, Llc System for charging multiple power sources and monitoring diode currents for faults
TWI792840B (zh) * 2022-01-07 2023-02-11 瑞昱半導體股份有限公司 Usb晶片及其操作方法
CN114554645A (zh) * 2022-03-11 2022-05-27 厦门普为光电科技有限公司 具照度补偿功能的照明装置及照明装置的照度补偿方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100343573C (zh) * 2000-11-29 2007-10-17 吴政雄 可弯形灯饰装置及其制造方法
TW201307728A (zh) * 2011-08-09 2013-02-16 Foxsemicon Integrated Tech Inc 發光二極體燈具
TW201319453A (zh) * 2011-11-08 2013-05-16 Ind Tech Res Inst 照明裝置、光源結構與光源模組
TWM503521U (zh) * 2015-02-03 2015-06-21 King Yang Internat Technology Co Ltd Ｌｅｄ燈裝飾載具

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794522A (en) * 1972-01-24 1974-02-26 Burroughs Corp Stripping insulated wire
JP2683926B2 (ja) * 1988-01-25 1997-12-03 三菱電機株式会社 絶縁被覆電線の被覆剥離方法及びその装置
JP2928634B2 (ja) * 1990-11-30 1999-08-03 トキコーポレーション株式会社 帯状電線に対する導線露出穴加工具および加工方法
US5608290A (en) * 1995-01-26 1997-03-04 Dominion Automotive Group, Inc. LED flashing lantern
US5800500A (en) * 1995-08-18 1998-09-01 Pi Medical Corporation Cochlear implant with shape memory material and method for implanting the same
US5935465A (en) * 1996-11-05 1999-08-10 Intermedics Inc. Method of making implantable lead including laser wire stripping
US6027952A (en) * 1997-01-21 2000-02-22 Liu; Ming-Hsun Method of manufacturing a string of electrically connected light emitting diodes
DE29706201U1 (de) * 1997-03-27 1997-05-28 Osa Elektronik Gmbh Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper
US6374143B1 (en) * 1999-08-18 2002-04-16 Epic Biosonics, Inc. Modiolar hugging electrode array
DE10106961A1 (de) * 2001-02-15 2002-08-29 Happich Fahrzeug & Ind Teile Bleuchtungseinrichtung
TW470136U (en) * 2001-03-30 2001-12-21 Tsuei-Duan Weng Strand structure of decoration lights
JP3796159B2 (ja) * 2001-10-24 2006-07-12 矢崎総業株式会社 電線の被覆材除去方法及び被覆材除去装置
US7178971B2 (en) * 2001-12-14 2007-02-20 The University Of Hong Kong High efficiency driver for color light emitting diodes (LED)
CN1514497A (zh) * 2002-12-12 2004-07-21 林锡煌 发光晶粒串联封装方法
CN2612082Y (zh) * 2003-04-04 2004-04-14 京东方科技集团股份有限公司 组合充电电池
US6860007B1 (en) * 2003-08-26 2005-03-01 Li-Wen Liu Method of producing an LED rope light
JP4262565B2 (ja) * 2003-10-15 2009-05-13 株式会社松村電機製作所 照明装置
US6935762B2 (en) * 2003-11-26 2005-08-30 Vickie Jean's Creations, Inc. Light string assembly
WO2011143510A1 (en) * 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US7221110B2 (en) * 2004-12-17 2007-05-22 Bruce Industries, Inc. Lighting control system and method
US7235815B2 (en) * 2005-02-14 2007-06-26 Hsien-Ta Shen LED light set
CN2830875Y (zh) * 2005-09-29 2006-10-25 陈铭培 灌注成型的节日灯串
CN2872072Y (zh) * 2006-01-06 2007-02-21 林书弘 具防呆机制的发光二极管灯串装置
JP2007290013A (ja) * 2006-04-26 2007-11-08 Phoeton Corp シールド導体層の切断方法及びレーザ加工装置
US7670023B1 (en) * 2006-05-15 2010-03-02 Peterson Terry J Flashlight with photovoltaic power source
US7947921B2 (en) * 2006-10-30 2011-05-24 Delphi Technologies, Inc. Electric wire insulation center stripping method and device
TW200831818A (en) * 2007-01-25 2008-08-01 nai-cheng Cai Manufacturing method of an LED lamp string
JP2008188661A (ja) 2007-02-07 2008-08-21 Sumitomo Electric Ind Ltd レーザ加工方法
CN101255961A (zh) * 2007-03-01 2008-09-03 蔡乃成 Led灯串制造方法
TWM343822U (en) * 2008-03-21 2008-11-01 Mosdesign Semiconductor Corp Simultaneous LED cascade circuit of two-cord AC power
CN201274636Y (zh) * 2008-07-11 2009-07-15 上海现代科技发展有限公司 图像识别视觉全自动贴片机
EP2216866A3 (en) * 2009-02-06 2011-07-13 HID Global GmbH Method to strip a portion of an insulated wire
TWM368010U (en) * 2009-06-19 2009-11-01 Semisilicon Technology Corp LED (light emitting diode) lamp string and net lamp thereof
TWI556696B (zh) * 2009-07-14 2016-11-01 蔡乃成 表面黏著型發光元件燈組之製造方法
US8397381B2 (en) * 2009-08-06 2013-03-19 Allied Bright Technology Limited Method for manufacturing light set with surface mounted light emitting components
CN201487798U (zh) * 2009-08-18 2010-05-26 普信科技股份有限公司 一种安全节能型灯饰
CN201611025U (zh) * 2009-08-20 2010-10-20 杭州佑国光电科技有限公司 可调光led灯
US8299724B2 (en) * 2010-03-19 2012-10-30 Active-Semi, Inc. AC LED lamp involving an LED string having separately shortable sections
US8568015B2 (en) * 2010-09-23 2013-10-29 Willis Electric Co., Ltd. Decorative light string for artificial lighted tree
KR20140023304A (ko) * 2011-03-07 2014-02-26 오스람 실바니아 인코포레이티드 고체 상태 광원들을 위한 고효율 저에너지 스토리지 구동기 회로
TWI431218B (zh) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar
CN102833995A (zh) * 2011-06-17 2012-12-19 王协峰 一种全自动高速led插件贴片机
CN105828473B (zh) * 2011-07-14 2018-02-09 陈家德 两阶式发光二极管安全监控照明装置
CN202201584U (zh) * 2011-08-31 2012-04-25 浙江恒森光电科技有限公司 Led灯条全自动加工设备的旋转绕线台
CN102322589B (zh) * 2011-08-31 2013-07-10 浙江恒森光电科技有限公司 Led灯条全自动加工设备
TWI448200B (zh) * 2011-09-06 2014-08-01 Univ Nat Taipei Technology AC-driven light-emitting diode devices
CN202302947U (zh) * 2011-10-14 2012-07-04 廖国荣 贴片led铜线灯串
CN102548240B (zh) * 2012-01-12 2015-02-11 广东木几智能装备有限公司 Led贴片机双臂多头贴片系统
TWI528018B (zh) * 2012-03-07 2016-04-01 鴻海精密工業股份有限公司 貼片機檢測裝置
CN103369776A (zh) * 2012-04-10 2013-10-23 深圳中科光华科技有限公司 一种带实时检测的多个串联led回路并联的驱动装置和恒流驱动方法
FR2992784B1 (fr) 2012-06-29 2015-08-07 Laselec Dispositif de denudage de cables electriques utilisant des diodes laser violettes ou bleues
TWI556539B (zh) * 2012-09-21 2016-11-01 Battery pack series and parallel matrix connection application module
CN205724938U (zh) * 2013-03-14 2016-11-23 米沃奇电动工具公司 具有多个电池组的电动工具
CN104185384B (zh) * 2013-05-22 2017-07-25 松下知识产权经营株式会社 安装部件的安装方法及安装装置
CN103915870B (zh) * 2014-03-28 2017-04-12 小米科技有限责任公司 一种电源和终端
TWM493218U (zh) * 2014-05-20 2015-01-01 Maintech Semiconductor Inc 兩線式各燈可獨立明滅之發光二極體（ｌｅｄ）燈串電路
CN204026263U (zh) * 2014-08-13 2014-12-17 乐清市新明丽灯饰有限公司 可拆卸网灯
US9806551B2 (en) * 2014-08-25 2017-10-31 Master Lock Company Llc Circuits and methods for using parallel separate battery cells
TWI536866B (zh) * 2014-08-29 2016-06-01 矽誠科技股份有限公司 具有可燒錄功能之發光二極體燈及燈串及系統
TWI556547B (zh) * 2014-09-16 2016-11-01 盧昭正 擴散電勢二極體應用電路
CN204481496U (zh) * 2014-12-26 2015-07-15 成都建中锂电池有限公司 带有安全保护系统的一次锂电池组
US9730639B2 (en) * 2015-06-01 2017-08-15 Autonomix Medical, Inc. Elongated conductors and methods of making and using the same
CN204836690U (zh) * 2015-07-29 2015-12-02 东莞市纳川盈海照明有限公司 通过两线双回路调色温的led灯具
CN105407654A (zh) * 2015-11-09 2016-03-16 东莞市浩远电子有限公司 贴片机及其贴片方法
CN105353721A (zh) * 2015-11-10 2016-02-24 中国科学院合肥物质科学研究院 一种全自动led贴片机控制系统
TWM516227U (zh) * 2015-11-12 2016-01-21 Tian-Yu Chen 表貼式ｌｅｄ模組的成型結構
CN205546029U (zh) * 2016-01-11 2016-08-31 武汉金东方智能景观股份有限公司 Led灯照明电路
CN205489597U (zh) * 2016-01-12 2016-08-17 吉安精程仪表科技有限公司 一种多电池仪表供电电路
US10239159B2 (en) * 2016-06-30 2019-03-26 The Boeing Company Laser wire processing device
CN106532150B (zh) * 2016-12-02 2019-05-03 中国船舶重工集团公司第七一九研究所 一种模块化的高压大容量锂电池组可控拓扑结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100343573C (zh) * 2000-11-29 2007-10-17 吴政雄 可弯形灯饰装置及其制造方法
TW201307728A (zh) * 2011-08-09 2013-02-16 Foxsemicon Integrated Tech Inc 發光二極體燈具
TW201319453A (zh) * 2011-11-08 2013-05-16 Ind Tech Res Inst 照明裝置、光源結構與光源模組
TWM503521U (zh) * 2015-02-03 2015-06-21 King Yang Internat Technology Co Ltd Ｌｅｄ燈裝飾載具

Also Published As

Publication number Publication date
CN109611711A (zh) 2019-04-12
CN109585627A (zh) 2019-04-05
TW201916739A (zh) 2019-04-16
CA3013375A1 (en) 2019-03-29
US20190101254A1 (en) 2019-04-04
US10264631B1 (en) 2019-04-16
US20190103592A1 (en) 2019-04-04
TW201916747A (zh) 2019-04-16
TWI718406B (zh) 2021-02-11
US20190103736A1 (en) 2019-04-04
CN109587870B (zh) 2021-07-13
TW201914727A (zh) 2019-04-16
US10299329B2 (en) 2019-05-21
US10993304B2 (en) 2021-04-27
CA3019082A1 (en) 2019-03-29
CA3014183A1 (en) 2019-03-29
TWI681697B (zh) 2020-01-01
CN109586352A (zh) 2019-04-05
US20190104578A1 (en) 2019-04-04
CN109587870A (zh) 2019-04-05
CA3014179A1 (en) 2019-03-29
CA3014180A1 (en) 2019-03-29
TW201916528A (zh) 2019-04-16
CA3014180C (en) 2020-10-13
US10631388B2 (en) 2020-04-21
US20190101253A1 (en) 2019-04-04
US20190103505A1 (en) 2019-04-04
US10609800B2 (en) 2020-03-31
CA3019044A1 (en) 2019-03-29
CA3019057A1 (en) 2019-03-29
TWI641780B (zh) 2018-11-21
US20190104576A1 (en) 2019-04-04
CN109586141B (zh) 2020-12-22
TWI666972B (zh) 2019-07-21
TW201914717A (zh) 2019-04-16
CN109587898B (zh) 2020-12-22
CN109586141A (zh) 2019-04-05
TW201916791A (zh) 2019-04-16
TW201915384A (zh) 2019-04-16
CN109570997A (zh) 2019-04-05
TWI661745B (zh) 2019-06-01
CN109587898A (zh) 2019-04-05

Similar Documents

Publication Publication Date Title
TWI699254B (zh) 燈串及其自動組裝設備和方法
CN204227148U (zh) 无框型led面板灯
EP3173679B1 (en) Plastic clad aluminum led light bulb
CN204201599U (zh) 无缝拼接线灯及无缝拼接线灯组
US9090381B2 (en) Illuminated bottle stopper
CN102798052A (zh) 一种方便拼装的led灯
CN208397756U (zh) 一种防水型led灯串
CN205372130U (zh) 一种设置有连接件的灯具单元以及灯具
US20050254239A1 (en) Decoration having double light sources
CN201170494Y (zh) 发光玻璃
CN202024154U (zh) 一种led发光模块
CN205746656U (zh) 一种灯具配件及其组成的灯体
CN203893091U (zh) 一种用于led灯具的透镜组装结构
CN205535163U (zh) 一种节日装饰灯
CN215446110U (zh) 一种具有led软灯丝的灯饰灯串
TWI644054B (zh) Lamp manufacturing process
CN203907349U (zh) 一种带透镜的防水背光模组
CN214840623U (zh) 一种拼接式平面灯壳体及拼接式其平面灯
CN215951174U (zh) 一种具有led软灯丝的防水灯饰灯串
CN203615139U (zh) 一种照明灯具及其照明模组
CN204268163U (zh) 一种照明装置
CN215892077U (zh) 一种用于陶瓷小壁灯的安装结构
CN212869444U (zh) 一种led柔性灯带
CN206130561U (zh) 灯具
CN209165060U (zh) 一种led长条灯板