TW201832000A - 感光性轉印材料、電路配線的製造方法及觸控面板的製造方法 - Google Patents
感光性轉印材料、電路配線的製造方法及觸控面板的製造方法 Download PDFInfo
- Publication number
- TW201832000A TW201832000A TW107105337A TW107105337A TW201832000A TW 201832000 A TW201832000 A TW 201832000A TW 107105337 A TW107105337 A TW 107105337A TW 107105337 A TW107105337 A TW 107105337A TW 201832000 A TW201832000 A TW 201832000A
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- group
- transfer material
- pattern
- polymer
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Health & Medical Sciences (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031526 | 2017-02-22 | ||
JP2017-031526 | 2017-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201832000A true TW201832000A (zh) | 2018-09-01 |
Family
ID=63253275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107105337A TW201832000A (zh) | 2017-02-22 | 2018-02-13 | 感光性轉印材料、電路配線的製造方法及觸控面板的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6685460B2 (ja) |
CN (1) | CN110337610A (ja) |
TW (1) | TW201832000A (ja) |
WO (1) | WO2018155192A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006098709A (ja) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | 平版印刷版原版 |
JP2007163772A (ja) * | 2005-12-13 | 2007-06-28 | Kansai Paint Co Ltd | 回路基板用ポジ型レジスト組成物、回路基板用ポジ型ドライフィルム、及び、それを用いた回路基板の製造方法 |
JP2009003000A (ja) * | 2007-06-19 | 2009-01-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及び光硬化物の除去方法 |
JP5623897B2 (ja) * | 2010-01-22 | 2014-11-12 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置 |
JP5524036B2 (ja) * | 2010-01-25 | 2014-06-18 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、液晶表示装置、及び、有機el表示装置 |
JP6100500B2 (ja) * | 2012-10-26 | 2017-03-22 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
JP6267951B2 (ja) * | 2013-12-18 | 2018-01-24 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
WO2016190405A1 (ja) * | 2015-05-28 | 2016-12-01 | 富士フイルム株式会社 | 回路配線の製造方法、回路配線、入力装置および表示装置 |
-
2018
- 2018-02-07 JP JP2019501205A patent/JP6685460B2/ja active Active
- 2018-02-07 WO PCT/JP2018/004274 patent/WO2018155192A1/ja active Application Filing
- 2018-02-07 CN CN201880012881.5A patent/CN110337610A/zh active Pending
- 2018-02-13 TW TW107105337A patent/TW201832000A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN110337610A (zh) | 2019-10-15 |
JP6685460B2 (ja) | 2020-04-22 |
JPWO2018155192A1 (ja) | 2019-11-07 |
WO2018155192A1 (ja) | 2018-08-30 |
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