TW201804528A - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TW201804528A TW201804528A TW106105926A TW106105926A TW201804528A TW 201804528 A TW201804528 A TW 201804528A TW 106105926 A TW106105926 A TW 106105926A TW 106105926 A TW106105926 A TW 106105926A TW 201804528 A TW201804528 A TW 201804528A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin layer
- resin
- laser
- layer
- resin substrate
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims abstract description 105
- 229920005989 resin Polymers 0.000 title claims abstract description 105
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 239000010410 layer Substances 0.000 claims abstract description 75
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 238000010521 absorption reaction Methods 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- High Energy & Nuclear Physics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016148328A JP6814459B2 (ja) | 2016-07-28 | 2016-07-28 | レーザ加工方法 |
| JPJP2016-148328 | 2016-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201804528A true TW201804528A (zh) | 2018-02-01 |
Family
ID=61075568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106105926A TW201804528A (zh) | 2016-07-28 | 2017-02-22 | 雷射加工裝置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6814459B2 (ja) |
| KR (1) | KR102353912B1 (ja) |
| CN (1) | CN107685199A (ja) |
| TW (1) | TW201804528A (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020017471A (ja) | 2018-07-27 | 2020-01-30 | 三星ダイヤモンド工業株式会社 | 多層基板を切断する方法及び切断装置 |
| JP2020019070A (ja) | 2018-07-30 | 2020-02-06 | 三星ダイヤモンド工業株式会社 | 多層基板を切断する方法及び切断装置 |
| JP2020053208A (ja) | 2018-09-26 | 2020-04-02 | 三星ダイヤモンド工業株式会社 | 基板小片の切り出し方法及び切出装置 |
| JP2020088217A (ja) | 2018-11-28 | 2020-06-04 | 三星ダイヤモンド工業株式会社 | 基板小片の切り出し方法及び切出装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08174262A (ja) * | 1994-12-27 | 1996-07-09 | Matsushita Electric Ind Co Ltd | エキシマレーザ加工方法 |
| JP4886937B2 (ja) * | 2001-05-17 | 2012-02-29 | リンテック株式会社 | ダイシングシート及びダイシング方法 |
| JP4141809B2 (ja) * | 2002-11-15 | 2008-08-27 | セイコーエプソン株式会社 | レーザー加工方法 |
| JP4233999B2 (ja) * | 2003-12-25 | 2009-03-04 | 日東電工株式会社 | 積層型偏光板およびその製造方法 |
| JP2005306418A (ja) * | 2004-04-20 | 2005-11-04 | Shin Etsu Polymer Co Ltd | 電子部品搬送体およびその製造方法 |
| JP2006088260A (ja) * | 2004-09-22 | 2006-04-06 | Sumitomo Metal Mining Package Materials Co Ltd | 接着剤層付きフレキシブル樹脂基板の穴開け加工方法 |
| JP2006186263A (ja) * | 2004-12-28 | 2006-07-13 | Disco Abrasive Syst Ltd | 被加工物保持装置 |
| JP2007057622A (ja) * | 2005-08-22 | 2007-03-08 | Ricoh Co Ltd | 光学素子及びその製造方法、光学素子用形状転写型の製造方法及び光学素子用転写型 |
| CN101195191A (zh) * | 2006-12-06 | 2008-06-11 | 中华映管股份有限公司 | 激光切割装置及激光切割方法 |
| JP5096040B2 (ja) * | 2007-05-16 | 2012-12-12 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
| WO2011016572A1 (ja) * | 2009-08-06 | 2011-02-10 | 住友化学株式会社 | 偏光板の製造方法 |
| AU2010348477B2 (en) * | 2010-03-19 | 2015-04-09 | Toray Industries, Inc. | Method for cutting carbon fiber base |
| JP2012045567A (ja) * | 2010-08-26 | 2012-03-08 | Sumitomo Electric Ind Ltd | レーザ加工方法および装置 |
| JP5764430B2 (ja) * | 2011-08-22 | 2015-08-19 | 花王株式会社 | 積層体の製造方法 |
| JP2014008511A (ja) | 2012-06-28 | 2014-01-20 | Mitsubishi Rayon Co Ltd | 熱可塑性樹脂シートを切断する方法及び導光板 |
| JP6192300B2 (ja) * | 2013-01-17 | 2017-09-06 | 株式会社トッパンＴｄｋレーベル | ラベルシート及びその製造方法 |
| JP2014231071A (ja) * | 2013-05-29 | 2014-12-11 | 三星ダイヤモンド工業株式会社 | レーザ光による基板切断装置 |
| JP2015020173A (ja) * | 2013-07-16 | 2015-02-02 | Ntn株式会社 | レーザスクライブ装置およびレーザスクライブ加工方法 |
| JP2016013566A (ja) * | 2014-07-02 | 2016-01-28 | Ntn株式会社 | レーザ加工装置およびレーザ加工方法 |
| KR20170088844A (ko) * | 2014-11-20 | 2017-08-02 | 니폰 제온 가부시키가이샤 | 광학 필름의 제조 방법 |
-
2016
- 2016-07-28 JP JP2016148328A patent/JP6814459B2/ja active Active
-
2017
- 2017-02-22 TW TW106105926A patent/TW201804528A/zh unknown
- 2017-03-14 KR KR1020170032076A patent/KR102353912B1/ko active IP Right Grant
- 2017-06-27 CN CN201710498881.8A patent/CN107685199A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP6814459B2 (ja) | 2021-01-20 |
| JP2018015784A (ja) | 2018-02-01 |
| CN107685199A (zh) | 2018-02-13 |
| KR20180013676A (ko) | 2018-02-07 |
| KR102353912B1 (ko) | 2022-01-20 |
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