TW201543051A - 探測器 - Google Patents

探測器 Download PDF

Info

Publication number
TW201543051A
TW201543051A TW104104051A TW104104051A TW201543051A TW 201543051 A TW201543051 A TW 201543051A TW 104104051 A TW104104051 A TW 104104051A TW 104104051 A TW104104051 A TW 104104051A TW 201543051 A TW201543051 A TW 201543051A
Authority
TW
Taiwan
Prior art keywords
platform
substrate
wafer
probe card
detector
Prior art date
Application number
TW104104051A
Other languages
English (en)
Chinese (zh)
Inventor
Shuji Akiyama
Kazuya Yano
Isamu Inomata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201543051A publication Critical patent/TW201543051A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW104104051A 2014-02-13 2015-02-06 探測器 TW201543051A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014025579A JP6276053B2 (ja) 2014-02-13 2014-02-13 プローバ

Publications (1)

Publication Number Publication Date
TW201543051A true TW201543051A (zh) 2015-11-16

Family

ID=53774734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104051A TW201543051A (zh) 2014-02-13 2015-02-06 探測器

Country Status (4)

Country Link
US (1) US9684014B2 (ja)
JP (1) JP6276053B2 (ja)
KR (1) KR101838604B1 (ja)
TW (1) TW201543051A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115638757A (zh) * 2022-11-11 2023-01-24 法博思(宁波)半导体设备有限公司 一种硅片量测范围无限制的装置及方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102566162B1 (ko) 2016-08-23 2023-08-10 삼성전자주식회사 웨이퍼 검사 장치 및 이를 이용한 웨이퍼 검사 방법
KR102367037B1 (ko) * 2017-06-21 2022-02-24 도쿄엘렉트론가부시키가이샤 검사 시스템
US10527649B2 (en) * 2017-07-14 2020-01-07 International Business Machines Corporation Probe card alignment
JP6958338B2 (ja) * 2017-12-22 2021-11-02 東京エレクトロン株式会社 基板処理装置及び基板処理装置の運転方法
CN109406921B (zh) * 2018-11-07 2023-08-29 东莞市柏尔电子科技有限公司 一种圆柱形电容的圆盘输送检测装置
WO2021124862A1 (ja) * 2019-12-20 2021-06-24 日本電産リード株式会社 検査装置
JP2022043453A (ja) 2020-09-04 2022-03-16 株式会社ニューフレアテクノロジー θステージ機構及び電子ビーム検査装置
CN114088992B (zh) * 2021-11-17 2024-03-19 佛山中科灿光微电子设备有限公司 电阻基板中心定位夹持装置及包含该装置的测阻仪

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853149U (ja) * 1981-10-05 1983-04-11 株式会社　東京精密 ウエハ搬送装置
JPS5972146A (ja) 1982-10-18 1984-04-24 Nec Corp ウエハ−プロ−ビング装置
US4892455A (en) * 1987-05-21 1990-01-09 Hine Derek L Wafer alignment and transport mechanism
JP3156192B2 (ja) 1994-04-19 2001-04-16 東京エレクトロン株式会社 プローブ方法及びその装置
JPH11297772A (ja) * 1998-04-07 1999-10-29 Mitsubishi Electric Corp プローブ装置及びウエハ検査方法
JP4971416B2 (ja) 1999-01-29 2012-07-11 東京エレクトロン株式会社 被検査体の載置機構
JP4173309B2 (ja) * 2002-01-28 2008-10-29 東京エレクトロン株式会社 センタリング装置及び枚葉式検査装置
US7547181B2 (en) * 2004-11-15 2009-06-16 Dainippon Screen Mfg. Co., Ltd. Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum
WO2007057944A1 (ja) * 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
JP5581713B2 (ja) * 2009-02-12 2014-09-03 株式会社Ｓｕｍｃｏ ウェーハ表面測定装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115638757A (zh) * 2022-11-11 2023-01-24 法博思(宁波)半导体设备有限公司 一种硅片量测范围无限制的装置及方法
CN115638757B (zh) * 2022-11-11 2023-11-28 法博思(宁波)半导体设备有限公司 一种硅片量测范围无限制的装置及方法

Also Published As

Publication number Publication date
JP2015153860A (ja) 2015-08-24
JP6276053B2 (ja) 2018-02-07
US20150226767A1 (en) 2015-08-13
KR101838604B1 (ko) 2018-03-14
KR20150095584A (ko) 2015-08-21
US9684014B2 (en) 2017-06-20

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