JP6071027B2 - プローバ - Google Patents
プローバ Download PDFInfo
- Publication number
- JP6071027B2 JP6071027B2 JP2016199377A JP2016199377A JP6071027B2 JP 6071027 B2 JP6071027 B2 JP 6071027B2 JP 2016199377 A JP2016199377 A JP 2016199377A JP 2016199377 A JP2016199377 A JP 2016199377A JP 6071027 B2 JP6071027 B2 JP 6071027B2
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- Prior art keywords
- test head
- wafer
- wafer chuck
- probe card
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 claims description 159
- 239000000523 sample Substances 0.000 claims description 131
- 230000007246 mechanism Effects 0.000 claims description 55
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 description 51
- 238000007689 inspection Methods 0.000 description 26
- 238000001514 detection method Methods 0.000 description 18
- 230000006837 decompression Effects 0.000 description 17
- 230000003028 elevating effect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 238000012546 transfer Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012790 confirmation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (5)
- ウエハの電気的特性を検査するテストヘッドと、
前記ウエハを保持するウエハチャックと、
前記ウエハチャックに対向する面に複数のプローブを有するプローブカードと、
前記プローブカードと前記テストヘッドの間に介在して配置され、前記プローブカードと前記テストヘッドとを電気的に接続するポゴフレームと、
前記ウエハチャックと前記プローブカードとの間に密閉空間を形成するシール部材と、
前記密閉空間を減圧することで、前記ウエハチャックを前記プローブカードに向かって引き寄せる減圧手段と、を備え、
前記ポゴフレームを筺体によって支持し、前記ポゴフレームが支持された前記筺体によってテストヘッド保持部を介して前記テストヘッドを支持し、
前記テストヘッド保持部は前記テストヘッドを弾性支持する緩衝部を備える、
プローバ。 - 前記緩衝部は前記テストヘッドを前記ポゴフレームとは反対側に付勢する弾性部材を有する、
請求項1に記載のプローバ。 - 前記テストヘッド保持部は前記テストヘッドの互いに異なる複数の位置をそれぞれ弾性支持する複数の前記緩衝部を備える、
請求項1又は2に記載のプローバ。 - 複数の前記緩衝部は前記テストヘッドの重心から互いに等距離離れた位置に設けられる、
請求項3に記載のプローバ。 - 前記テストヘッド保持部は、
前記テストヘッドを昇降移動させる昇降機構と、
前記テストヘッドが昇降移動する際に前記テストヘッドを案内する規制面を有するガイド部と、
を備える請求項1から4のいずれか1項に記載のプローバ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015069272 | 2015-03-30 | ||
JP2015069272 | 2015-03-30 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016171662A Division JP6048614B1 (ja) | 2015-03-30 | 2016-09-02 | プローバ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017001921A Division JP6781926B2 (ja) | 2015-03-30 | 2017-01-10 | プローバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017017347A JP2017017347A (ja) | 2017-01-19 |
JP6071027B2 true JP6071027B2 (ja) | 2017-02-01 |
Family
ID=57247112
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016066460A Active JP6041175B2 (ja) | 2015-03-30 | 2016-03-29 | プローバ |
JP2016171662A Active JP6048614B1 (ja) | 2015-03-30 | 2016-09-02 | プローバ |
JP2016199377A Active JP6071027B2 (ja) | 2015-03-30 | 2016-10-07 | プローバ |
JP2017001921A Active JP6781926B2 (ja) | 2015-03-30 | 2017-01-10 | プローバ |
JP2020172961A Active JP7022291B2 (ja) | 2015-03-30 | 2020-10-14 | プローバ |
JP2022014573A Active JP7245984B2 (ja) | 2015-03-30 | 2022-02-02 | プローバ |
JP2023036115A Active JP7503735B2 (ja) | 2015-03-30 | 2023-03-09 | プローバ |
JP2024091423A Pending JP2024109990A (ja) | 2015-03-30 | 2024-06-05 | プローバ |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016066460A Active JP6041175B2 (ja) | 2015-03-30 | 2016-03-29 | プローバ |
JP2016171662A Active JP6048614B1 (ja) | 2015-03-30 | 2016-09-02 | プローバ |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017001921A Active JP6781926B2 (ja) | 2015-03-30 | 2017-01-10 | プローバ |
JP2020172961A Active JP7022291B2 (ja) | 2015-03-30 | 2020-10-14 | プローバ |
JP2022014573A Active JP7245984B2 (ja) | 2015-03-30 | 2022-02-02 | プローバ |
JP2023036115A Active JP7503735B2 (ja) | 2015-03-30 | 2023-03-09 | プローバ |
JP2024091423A Pending JP2024109990A (ja) | 2015-03-30 | 2024-06-05 | プローバ |
Country Status (2)
Country | Link |
---|---|
US (1) | US10338101B2 (ja) |
JP (8) | JP6041175B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI756377B (zh) * | 2017-03-07 | 2022-03-01 | 日商東京威力科創股份有限公司 | 檢查裝置及接觸方法 |
Families Citing this family (21)
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JP6655514B2 (ja) * | 2016-09-21 | 2020-02-26 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
KR102227072B1 (ko) * | 2016-11-23 | 2021-03-12 | 주식회사 기가레인 | 프로브 카드용 나사 체결 장치 및 이를 구비한 프로브 카드 조립장치 |
WO2018097446A1 (ko) * | 2016-11-23 | 2018-05-31 | 주식회사 기가레인 | 프로브 카드용 나사 체결 장치 및 이를 구비한 프로브 카드 조립장치 |
JP6978840B2 (ja) * | 2017-02-28 | 2021-12-08 | 株式会社Screenホールディングス | 基板処理装置および基板保持装置 |
TWI628449B (zh) * | 2017-05-05 | 2018-07-01 | 漢民科技股份有限公司 | 晶圓針測裝置主動式預熱及預冷系統及晶圓檢測方法 |
US11152238B2 (en) * | 2017-11-30 | 2021-10-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing stage profiler jig |
JP6956030B2 (ja) * | 2018-02-28 | 2021-10-27 | 東京エレクトロン株式会社 | 検査システム |
JP2020047860A (ja) | 2018-09-20 | 2020-03-26 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
JP7186355B2 (ja) * | 2019-01-15 | 2022-12-09 | 株式会社東京精密 | ウェーハ検出装置、ウェーハ検出方法、及びプローバ |
JP7257880B2 (ja) * | 2019-05-23 | 2023-04-14 | 東京エレクトロン株式会社 | 試験用ウエハおよび試験方法 |
JP7371885B2 (ja) * | 2019-07-08 | 2023-10-31 | ヤマハファインテック株式会社 | 電気検査装置及び保持ユニット |
KR102339327B1 (ko) * | 2019-10-28 | 2021-12-15 | 주식회사 나노엑스 | 전기 소자 검사 장치용 프로브 헤드의 제조 방법 |
JP7437991B2 (ja) * | 2020-03-25 | 2024-02-26 | 東京エレクトロン株式会社 | 検査装置、及び、チャックトップの位置調整方法 |
KR102425162B1 (ko) * | 2020-10-28 | 2022-07-27 | 주식회사 에머릭스 | Pcba 검사장치 |
KR102236670B1 (ko) | 2020-11-23 | 2021-04-06 | 주식회사 에머릭스 | Pcba 검사 장치 |
KR102536717B1 (ko) * | 2020-11-24 | 2023-05-26 | 주식회사 에머릭스 | Pcba 검사장치 |
KR102536716B1 (ko) * | 2020-11-24 | 2023-05-26 | 주식회사 에머릭스 | Pcba 검사장치 |
KR102566008B1 (ko) * | 2021-09-14 | 2023-08-14 | (주) 티원시스템 | 프로브카드 핀 삽입장치 |
JP2023082554A (ja) | 2021-12-02 | 2023-06-14 | 株式会社東京精密 | 筐体及びプローバ |
JP7530018B2 (ja) | 2022-03-17 | 2024-08-07 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
KR102640026B1 (ko) * | 2023-10-26 | 2024-02-23 | 타코(주) | 프로브 카드 |
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JP2013251509A (ja) * | 2012-06-04 | 2013-12-12 | Tokyo Electron Ltd | 基板検査装置 |
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JP5664938B2 (ja) | 2013-02-01 | 2015-02-04 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
JP2014179379A (ja) * | 2013-03-13 | 2014-09-25 | Tokyo Electron Ltd | ウエハ検査装置及び該装置の整備方法 |
JP6289962B2 (ja) * | 2013-07-11 | 2018-03-07 | 東京エレクトロン株式会社 | プローブ装置 |
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2016
- 2016-03-29 JP JP2016066460A patent/JP6041175B2/ja active Active
- 2016-09-02 JP JP2016171662A patent/JP6048614B1/ja active Active
- 2016-10-07 JP JP2016199377A patent/JP6071027B2/ja active Active
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2017
- 2017-01-10 JP JP2017001921A patent/JP6781926B2/ja active Active
- 2017-09-27 US US15/717,819 patent/US10338101B2/en active Active
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- 2022-02-02 JP JP2022014573A patent/JP7245984B2/ja active Active
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- 2023-03-09 JP JP2023036115A patent/JP7503735B2/ja active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI756377B (zh) * | 2017-03-07 | 2022-03-01 | 日商東京威力科創股份有限公司 | 檢查裝置及接觸方法 |
Also Published As
Publication number | Publication date |
---|---|
US20180017594A1 (en) | 2018-01-18 |
JP7245984B2 (ja) | 2023-03-27 |
JP2022058826A (ja) | 2022-04-12 |
JP6781926B2 (ja) | 2020-11-11 |
JP6041175B2 (ja) | 2016-12-07 |
JP6048614B1 (ja) | 2016-12-21 |
JP2023067997A (ja) | 2023-05-16 |
JP2021010023A (ja) | 2021-01-28 |
JP2017017347A (ja) | 2017-01-19 |
JP2024109990A (ja) | 2024-08-14 |
JP7503735B2 (ja) | 2024-06-21 |
JP2017028296A (ja) | 2017-02-02 |
JP2016192549A (ja) | 2016-11-10 |
US10338101B2 (en) | 2019-07-02 |
JP2017098572A (ja) | 2017-06-01 |
JP7022291B2 (ja) | 2022-02-18 |
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