TW201334110A - 濕式處理設備 - Google Patents

濕式處理設備 Download PDF

Info

Publication number
TW201334110A
TW201334110A TW101135984A TW101135984A TW201334110A TW 201334110 A TW201334110 A TW 201334110A TW 101135984 A TW101135984 A TW 101135984A TW 101135984 A TW101135984 A TW 101135984A TW 201334110 A TW201334110 A TW 201334110A
Authority
TW
Taiwan
Prior art keywords
support
mobile station
processing chamber
substrate
wet processing
Prior art date
Application number
TW101135984A
Other languages
English (en)
Chinese (zh)
Inventor
Seung-Il Chang
Kil-Soo An
Original Assignee
Mmtech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mmtech Co Ltd filed Critical Mmtech Co Ltd
Publication of TW201334110A publication Critical patent/TW201334110A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW101135984A 2012-02-10 2012-09-28 濕式處理設備 TW201334110A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120013810A KR20130092217A (ko) 2012-02-10 2012-02-10 습식 처리 장치

Publications (1)

Publication Number Publication Date
TW201334110A true TW201334110A (zh) 2013-08-16

Family

ID=48926973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101135984A TW201334110A (zh) 2012-02-10 2012-09-28 濕式處理設備

Country Status (4)

Country Link
JP (1) JP5444433B2 (ja)
KR (1) KR20130092217A (ja)
CN (1) CN103247553A (ja)
TW (1) TW201334110A (ja)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3455072B2 (ja) * 1997-07-31 2003-10-06 株式会社東芝 荷電ビーム描画装置及び方法
JP3661075B2 (ja) * 1998-06-23 2005-06-15 東京エレクトロン株式会社 基板保持用チャックの洗浄・乾燥装置及び基板保持用チャックの洗浄・乾燥方法
JP2000040684A (ja) * 1998-07-23 2000-02-08 Ebara Corp 洗浄装置
JP2002313899A (ja) * 2001-04-11 2002-10-25 Sumitomo Electric Ind Ltd 基板保持構造体および基板処理装置
JP4574987B2 (ja) * 2002-01-10 2010-11-04 東京エレクトロン株式会社 処理装置
US6846380B2 (en) * 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
JP4749690B2 (ja) * 2004-09-10 2011-08-17 株式会社日立ハイテクノロジーズ 真空処理装置
US20060054090A1 (en) * 2004-09-15 2006-03-16 Applied Materials, Inc. PECVD susceptor support construction
JP2007335709A (ja) * 2006-06-16 2007-12-27 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101205627A (zh) * 2006-12-21 2008-06-25 中国科学院半导体研究所 一种制备氮化物单晶衬底的氢化物气相外延装置
JP2008174361A (ja) * 2007-01-19 2008-07-31 Tokyo Electron Ltd 基板搬送装置
JP4955071B2 (ja) * 2007-11-16 2012-06-20 株式会社アルバック 貼合せ基板製造装置および貼合せ基板製造方法
JP5338114B2 (ja) * 2008-04-10 2013-11-13 株式会社ニコン 半導体基板の貼り合わせ装置及び半導体装置の製造方法
JP4645696B2 (ja) * 2008-08-01 2011-03-09 東京エレクトロン株式会社 被処理体の支持機構及びロードロック室
KR101005888B1 (ko) * 2008-12-02 2011-01-06 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5394969B2 (ja) * 2010-03-30 2014-01-22 大日本スクリーン製造株式会社 基板処理装置、基板処理システム、および基板処理方法

Also Published As

Publication number Publication date
KR20130092217A (ko) 2013-08-20
CN103247553A (zh) 2013-08-14
JP5444433B2 (ja) 2014-03-19
JP2013163592A (ja) 2013-08-22

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