TW201334110A - Wet treating apparatus - Google Patents

Wet treating apparatus Download PDF

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Publication number
TW201334110A
TW201334110A TW101135984A TW101135984A TW201334110A TW 201334110 A TW201334110 A TW 201334110A TW 101135984 A TW101135984 A TW 101135984A TW 101135984 A TW101135984 A TW 101135984A TW 201334110 A TW201334110 A TW 201334110A
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TW
Taiwan
Prior art keywords
support
mobile station
processing chamber
substrate
wet processing
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TW101135984A
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Chinese (zh)
Inventor
Seung-Il Chang
Kil-Soo An
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Mmtech Co Ltd
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Publication of TW201334110A publication Critical patent/TW201334110A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A wet treating apparatus that includes a process room that comprises a first gate through which a substrate enters and a second gate through which the substrate exits; a moving table that is equipped to be moved up and down in the process room and on which the substrate is placed; a plurality of supporters connected to the moving table; a driving unit that is equipped to move the moving table up and down by being connected to at least one of the supporters; a fixed table that is fixedly disposed to face the moving table and through which at least one of the supporters passes; and a plurality of protection members that are disposed between the fixed table and the moving table, surround each of the supporters, and are equipped to be expanded and contracted.

Description

濕式處理設備 Wet processing equipment

本發明涉及濕式處理設備,且更明確地說,涉及用於通過濕式處理方法處理基板的表面的濕式處理設備。 The present invention relates to wet processing equipment and, more particularly, to a wet processing apparatus for treating a surface of a substrate by a wet processing method.

用於包含薄膜電晶體的顯示裝置的基板以及用於半導體裝置的基板經歷表面處理工藝,以用於從基板的表面去除氧化矽薄膜或用於平坦化矽薄膜的表面。 A substrate for a display device including a thin film transistor and a substrate for a semiconductor device are subjected to a surface treatment process for removing a ruthenium oxide film from the surface of the substrate or for planarizing a surface of the ruthenium film.

表面處理工藝是通過將諸如蝕刻劑的處理液體施加於基板的表面上而執行。 The surface treatment process is performed by applying a treatment liquid such as an etchant onto the surface of the substrate.

在濕式處理設備中,執行工藝的處理室可能會受到處理液體污染。因此,安裝於處理室中的裝備可能容易腐蝕。因此,安裝於執行工藝的處理室中的裝備需由具有高的耐腐蝕性以及高的耐化學性的材料形成。此情形過度地增加了裝備成本,而且,歸因於材料的限制,諸如複雜的升高系統的某裝備可能無法安裝於處理室中。 In a wet processing apparatus, the processing chamber performing the process may be contaminated by the processing liquid. Therefore, equipment installed in the processing chamber may be susceptible to corrosion. Therefore, the equipment installed in the processing chamber performing the process needs to be formed of a material having high corrosion resistance and high chemical resistance. This situation excessively increases the cost of equipment and, due to material limitations, certain equipment such as complex elevated systems may not be installed in the processing chamber.

本發明提供一種濕式處理設備,其中具有長的耐久性的升高處理設施可用低的成本來安裝。 The present invention provides a wet processing apparatus in which an elevated processing facility having long durability can be installed at a low cost.

本發明提供一種濕式處理設備,包含:處理室,其包括基板進入所通過的第一門以及所述基板退出所通過的第二門;移動台,其經配備以在所述處理室中上下移動且其上放置有所述基板;多個支撐件,其連接到所述移動台;驅動單元,其經配備以通過連接到所述支撐件中的至少一 個而上下移動所述移動台;固定台,其固定地安置於所述處理室中且面對所述移動台,且所述支撐件中的至少一個通過固定台;以及多個保護構件,其安置於所述固定台與所述移動台之間、圍繞所述支撐件中的每一個,且經配備以延伸以及收縮。 The present invention provides a wet processing apparatus comprising: a processing chamber including a first door through which a substrate enters and a second door through which the substrate exits; a mobile station equipped to be up and down in the processing chamber Moving and having the substrate placed thereon; a plurality of supports coupled to the mobile station; a drive unit configured to be coupled to at least one of the supports Moving the mobile station up and down; a fixed table fixedly disposed in the processing chamber and facing the mobile station, and at least one of the support members passes through the fixed table; and a plurality of protective members, And disposed between the fixed table and the mobile station, surrounding each of the support members, and equipped to extend and contract.

所述固定台可位於所述移動台與所述驅動單元之間。 The fixed station may be located between the mobile station and the drive unit.

所述固定台可包含位於所述處理室的底部表面與所述移動台之間的第一固定台。 The stationary station can include a first stationary station located between a bottom surface of the processing chamber and the mobile station.

所述固定台可包含位於所述處理室的上部表面與所述移動台之間的第二固定台。 The stationary station can include a second stationary station between the upper surface of the processing chamber and the mobile station.

所述支撐件可包含連接到所述移動台的下部表面的至少一個第一支撐件。 The support member can include at least one first support member coupled to a lower surface of the mobile station.

所述支撐件可包含連接到所述移動台的上部表面的至少一個第二支撐件。 The support member can include at least one second support member coupled to an upper surface of the mobile station.

並未連接到所述驅動單元的所述支撐件是導杆。 The support that is not connected to the drive unit is a guide.

所述固定台可與所述處理室的側壁以密封方式組合。 The fixing table can be combined with the side walls of the processing chamber in a sealed manner.

所述第一門以及所述第二門可垂直於彼此而安置。 The first door and the second door may be disposed perpendicular to each other.

所述濕式處理工藝可更包含安裝於所述處理室中且將處理液體供應到所述基板上的濕式處理單元。 The wet processing process may further include a wet processing unit installed in the processing chamber and supplying processing liquid onto the substrate.

如上文所述,根據本發明,由於形成上下移動移動台的升高系統的支撐件以及驅動單元可被保護以免受處理溶液影響,因此不必通過使用具有高的耐腐蝕性以及高的耐化學性的昂貴材料來形成這些構成元件,從而降低濕式處理設備的製造成本。 As described above, according to the present invention, since the support member and the drive unit forming the raising system for moving the moving table up and down can be protected from the treatment solution, it is not necessary to have high corrosion resistance and high chemical resistance by use. Expensive materials to form these constituent elements, thereby reducing the manufacturing cost of the wet processing equipment.

又,濕式處理設備中的升高系統的耐久性可增加。 Also, the durability of the elevated system in the wet processing apparatus can be increased.

又,即使濕式處理單元安裝於處理室中,升高系統仍可安裝於處理室中。 Also, even if the wet processing unit is installed in the processing chamber, the lifting system can be installed in the processing chamber.

處理室的上部表面和/或底部表面可被保護以免受處理溶液的分散影響。 The upper and/or bottom surface of the processing chamber can be protected from the dispersion of the processing solution.

由於處理液體是由第一固定台收集,因此處理液體的排放為順利的且處理液體的處理為容易的,從而減少環境污染。 Since the treatment liquid is collected by the first fixed stage, the discharge of the treatment liquid is smooth and the treatment of the treatment liquid is easy, thereby reducing environmental pollution.

為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.

現將參看繪示本發明之示範性實施例的隨附圖式來更全面地描述本發明。 The invention will now be described more fully hereinafter with reference to the accompanying drawings.

圖1是繪示根據本發明的實施例的濕式處理設備的配置的示意圖。 1 is a schematic diagram showing the configuration of a wet processing apparatus according to an embodiment of the present invention.

如圖1中所示,根據當前實施例的濕式處理設備包含處理室20、移動台40以及第一固定台51。移動台40以及第一固定台51安置於處理室20中。 As shown in FIG. 1, the wet processing apparatus according to the current embodiment includes a processing chamber 20, a moving stage 40, and a first fixing stage 51. The mobile station 40 and the first fixed stage 51 are disposed in the processing chamber 20.

處理室20可為將基板10進行濕式處理的腔室,且包含基板10進入所通過的第一門21以及基板10退出所通過的第二門22。第一門21以及第二門22可在垂直於彼此的方向上安置。在本發明的實施例中,第一門21安置於處理室20的側壁的上側上,且第二門22安置於第一門21的正下方。然而,本發明不限於此,即,第二門22可安置於處 理室20的側壁的上側上,且第一門21可安置於第二門22的正下方。又,第一門21可形成於處理室20的側壁的上側上,且第二門22可安置於處理室20的另一側壁的下側上。又,第一門21可安置於處理室20的側壁的下側上,且第二門22可安置於處理室20的另一側壁的上側上。 The processing chamber 20 may be a chamber for wet processing the substrate 10, and includes a first door 21 through which the substrate 10 enters and a second door 22 through which the substrate 10 exits. The first door 21 and the second door 22 may be disposed in a direction perpendicular to each other. In an embodiment of the invention, the first door 21 is disposed on the upper side of the side wall of the processing chamber 20, and the second door 22 is disposed directly below the first door 21. However, the invention is not limited thereto, that is, the second door 22 can be placed at The upper side of the side wall of the chamber 20, and the first door 21 can be disposed directly below the second door 22. Also, the first door 21 may be formed on the upper side of the side wall of the process chamber 20, and the second door 22 may be disposed on the lower side of the other side wall of the process chamber 20. Also, the first door 21 may be disposed on a lower side of the side wall of the process chamber 20, and the second door 22 may be disposed on an upper side of the other side wall of the process chamber 20.

儘管未圖示,但扇形篩檢程式(fan filter)單元(未圖示)可安裝於處理室20的外部區域上。扇形篩檢程式單元將處理室20的內區域維持為清潔的,且通過執行通風而防止顆粒附著到基板10的表面。 Although not shown, a fan filter unit (not shown) may be mounted on the outer area of the processing chamber 20. The fan-shaped screening program unit maintains the inner region of the process chamber 20 clean and prevents particles from adhering to the surface of the substrate 10 by performing ventilation.

基板10放置於處理室20中的移動台40上。 The substrate 10 is placed on a moving stage 40 in the processing chamber 20.

圖2是圖1的移動台40的實例的透視圖。如圖2中所示,移動台40可包含框架41。框架41包含:第一框架411以及第二框架412,其在X方向上彼此平行而延伸,X方向是基板10的水平移動方向X1;以及第三框架413以及第四框架414,其在Y方向上彼此平行而延伸,Y方向是垂直於基板10的水平移動方向X1的方向。第一至第四框架411至414經組合以大致形成四邊形。位於水平移動方向X1的邊緣上的第三框架413定位為低於其他框架,使得基板10可容易地進入處理室20中。儘管未圖示,但當基板10在不同於進入方向的方向上退出時,第四框架414連同第三框架413也可定位為低於第一框架411以及第二框架412。 2 is a perspective view of an example of the mobile station 40 of FIG. 1. As shown in FIG. 2, the mobile station 40 can include a frame 41. The frame 41 includes: a first frame 411 and a second frame 412 extending parallel to each other in the X direction, the X direction being a horizontal moving direction X1 of the substrate 10; and a third frame 413 and a fourth frame 414 in the Y direction The upper side extends in parallel with each other, and the Y direction is a direction perpendicular to the horizontal moving direction X1 of the substrate 10. The first to fourth frames 411 to 414 are combined to form a substantially quadrangular shape. The third frame 413 located on the edge of the horizontal moving direction X1 is positioned lower than the other frames, so that the substrate 10 can easily enter the processing chamber 20. Although not illustrated, when the substrate 10 is ejected in a direction different from the entry direction, the fourth frame 414 together with the third frame 413 may also be positioned lower than the first frame 411 and the second frame 412.

支撐基板10的側表面的支撐滾筒43安裝於第一框架411以及第二框架412的上部表面上。又,支撐滾筒43可 安裝於第四框架414上,第四框架414安置于水平移動方向X1的另一邊緣上。 A support roller 43 that supports a side surface of the substrate 10 is mounted on the upper surfaces of the first frame 411 and the second frame 412. Moreover, the support roller 43 can Mounted on the fourth frame 414, the fourth frame 414 is disposed on the other edge of the horizontal movement direction X1.

如圖2中所示,多個支撐杆421是通過在第一框架411以及第二框架412上分開預定間隙而安置。分開預定間隙的多個驅動輥422耦接到支撐杆421中的每一個。支撐杆421中的每一個的兩個邊緣分別埋入於第一框架411以及第二框架412中。齒輪(未圖示)安裝於支撐杆421中的每一個的兩個邊緣上。螺旋齒輪(helical gear)安裝於第一框架411以及第二框架412中的一個上,且螺旋齒輪由額外驅動單元(未圖示)旋轉。當螺旋齒輪由驅動單元旋轉時,支撐杆421通過動力從螺旋齒輪的傳送而旋轉,且因此,支撐輥422也旋轉。如圖1中所示,基板10放置於驅動輥422上,且基板10可通過驅動輥422的旋轉在水平移動方向X1上移動。 As shown in FIG. 2, a plurality of support bars 421 are disposed by separating predetermined gaps on the first frame 411 and the second frame 412. A plurality of driving rollers 422 that are separated by a predetermined gap are coupled to each of the support bars 421. Two edges of each of the support bars 421 are embedded in the first frame 411 and the second frame 412, respectively. Gears (not shown) are mounted on both edges of each of the support bars 421. A helical gear is mounted on one of the first frame 411 and the second frame 412, and the helical gear is rotated by an additional drive unit (not shown). When the helical gear is rotated by the driving unit, the support rod 421 is rotated by the transmission of power from the helical gear, and thus, the support roller 422 also rotates. As shown in FIG. 1, the substrate 10 is placed on the driving roller 422, and the substrate 10 is movable in the horizontal moving direction X1 by the rotation of the driving roller 422.

多個支撐件44連接到移動台40,且可延伸且可收縮的保護構件45形成以圍繞支撐件44中的每一個的外側。 A plurality of supports 44 are coupled to the moving table 40, and an extendable and collapsible protective member 45 is formed to surround the outside of each of the supports 44.

移動台40可通過支撐件44的移動而上下移動,即,在圖2中,在支撐件44的Z方向上向上移動以及向下移動(或延伸以及收縮移動)。此時,當在位於Y方向的邊緣上的一對支撐件44與在Y方向的另一邊緣上的一對支撐件44之間的延伸以及收縮長度不同時,移動台40可傾斜預定角θ,且因此,如圖3中所示,放置於移動台40上的基板10也可從第一位置P1傾斜到第二位置P2。在此狀況下,由於第一框架411上的支撐滾筒43(見圖2),基 板10可能不會進一步下降。移動台40的傾斜對於處置大型基板為非常有用的,且對從基板10的表面排放處理液體也是有用的。 The moving table 40 is movable up and down by the movement of the support member 44, that is, in FIG. 2, moving upward and downward (or extending and contracting movement) in the Z direction of the support member 44. At this time, when the extension and the contraction length between the pair of support members 44 on the edge located in the Y direction and the pair of support members 44 on the other edge in the Y direction are different, the moving stage 40 can be inclined by a predetermined angle θ And, therefore, as shown in FIG. 3, the substrate 10 placed on the mobile station 40 can also be tilted from the first position P1 to the second position P2. In this case, due to the support roller 43 on the first frame 411 (see Fig. 2), the base The board 10 may not drop further. The tilt of the mobile stage 40 is very useful for handling large substrates, and is also useful for discharging treated liquid from the surface of the substrate 10.

在圖1的濕式處理設備中,用於將處理液體施加到基板10的表面上的濕式處理單元30提供於處理室20中。濕式處理單元30可供應用於清潔或蝕刻基板10的表面的至少一種處理液體,且可為經設計以在沿著基板10的表面在水準方向上往復地線性移動的同時將處理液體噴射到基板10的表面上的線性刀片(blade),或經設計以通過至少一個噴嘴噴灑基板10的表面的全部或部分的噴灑單元。 In the wet processing apparatus of FIG. 1, a wet processing unit 30 for applying a processing liquid onto a surface of the substrate 10 is provided in the processing chamber 20. The wet processing unit 30 can be applied to at least one processing liquid that cleans or etches the surface of the substrate 10, and can be designed to inject the processing liquid to the linearly reciprocating movement in the horizontal direction along the surface of the substrate 10. A linear blade on the surface of the substrate 10, or a spray unit designed to spray all or part of the surface of the substrate 10 through at least one nozzle.

驅動單元60安裝於處理室20的下側上。第一支撐件44a連接到驅動單元60。第一支撐件44a的上部末端與移動台40的下部表面組合。驅動單元60同時或部分地升高(或降低)第一支撐件44a,且因此,移動台40可在處理室20中升高(或降低)。驅動單元60以及第一支撐件44a可為圓柱體裝置或馬達與齒輪裝置。 The drive unit 60 is mounted on the underside of the process chamber 20. The first support 44a is coupled to the drive unit 60. The upper end of the first support member 44a is combined with the lower surface of the moving table 40. The drive unit 60 simultaneously or partially raises (or lowers) the first support 44a, and thus, the mobile stage 40 can be raised (or lowered) in the process chamber 20. The drive unit 60 and the first support 44a can be cylindrical devices or motor and gear devices.

面對移動台40的第一固定台51位於處理室20中。第一固定台51安置於移動台40與處理室20的底部表面24之間。 The first fixed stage 51 facing the mobile station 40 is located in the processing chamber 20. The first fixing table 51 is disposed between the moving table 40 and the bottom surface 24 of the processing chamber 20.

驅動單元60安置於第一固定台51與處理室20的底部表面24之間,且由此,連接到驅動單元60的第一支撐件44a通過第一固定台51連接到移動台40。第一支撐件44a經安裝,使得第一支撐件44a的升高移動不被第一固定台51中斷。 The drive unit 60 is disposed between the first fixed stage 51 and the bottom surface 24 of the process chamber 20, and thereby, the first support 44a connected to the drive unit 60 is connected to the mobile stage 40 through the first fixed stage 51. The first support member 44a is mounted such that the elevated movement of the first support member 44a is not interrupted by the first fixed table 51.

第一支撐件44a由第一保護構件45a圍繞。第一保護構件45a形成以上下延伸或收縮。第一保護構件45a可由具有高的耐化學性的合成樹脂材料形成,以防止第一支撐件44a受從濕式處理單元30所噴射的處理液體影響。因此,在圖1的濕式處理設備中,根據當前實施例,位於移動台40與第一固定台51之間的第一支撐件44a處於由第一保護構件45a密封以免受處理液體影響的狀態。第一保護構件45a可按風箱的形狀形成。 The first support member 44a is surrounded by the first protective member 45a. The first protective member 45a is formed to extend or contract downward. The first protective member 45a may be formed of a synthetic resin material having high chemical resistance to prevent the first support member 44a from being affected by the treatment liquid ejected from the wet processing unit 30. Therefore, in the wet processing apparatus of Fig. 1, according to the current embodiment, the first support member 44a located between the mobile station 40 and the first fixed stage 51 is in a state of being sealed by the first protective member 45a from the treatment liquid. . The first protective member 45a may be formed in the shape of a bellows.

第一固定台51可與處理室20的側壁組合且密封。因此,驅動單元60以及第一支撐件44a的位於第一固定台51下的部分可被保護以免受處理液體影響。儘管未圖示,但排水系統可與第一固定台51組合,使得朝向處理室20的底部表面24下降的處理液體收集於第一固定台51上且順利地排放到外部。 The first fixing table 51 can be combined with the side wall of the processing chamber 20 and sealed. Therefore, the driving unit 60 and the portion of the first support 44a located under the first fixing table 51 can be protected from the treatment liquid. Although not shown, the drainage system may be combined with the first fixing table 51 such that the treatment liquid descending toward the bottom surface 24 of the processing chamber 20 is collected on the first fixing table 51 and smoothly discharged to the outside.

在本發明中,由於第一支撐件44a以及驅動單元60被保護以免受處理液體影響,因此不必由昂貴的高抗腐蝕性以及高耐化學性材料形成第一支撐件44a以及驅動單元60,從而降低製造成本且增加第一支撐件44a以及驅動單元60的耐久性。又,儘管濕式處理單元30安裝於處理室20中,但用於升高移動台40的元件(諸如,第一支撐件44a以及驅動單元60)也可安裝於處理室20中。 In the present invention, since the first support member 44a and the drive unit 60 are protected from the treatment liquid, it is not necessary to form the first support member 44a and the drive unit 60 from expensive high corrosion resistance and high chemical resistance materials, thereby The manufacturing cost is reduced and the durability of the first support member 44a and the drive unit 60 is increased. Also, although the wet processing unit 30 is installed in the processing chamber 20, elements for raising the moving table 40, such as the first support 44a and the driving unit 60, may be installed in the processing chamber 20.

在圖1的濕式處理設備的狀況下,基板10通過第一門21進入處理室20中。此時,移動台40位於處理室20的上部部分上以收納基板10。之後,移動台40朝向處理室 20的下部部分降低,且關於基板10的表面的濕式處理由濕式處理單元30執行。之後,基板10通過第二門22從處理室20排出。濕式處理單元30可位於處理室20的上部部分上。在此狀況下,當移動台40位於處理室20的上部部分上時,可執行濕式處理。當濕式處理完成時,保留於基板10的表面上的處理液體可由上文所述的傾斜工藝,或通過另外安裝氣刀單元或濕式處理單元30將空氣噴灑到基板10的表面上來去除。 In the state of the wet processing apparatus of FIG. 1, the substrate 10 enters the processing chamber 20 through the first door 21. At this time, the moving stage 40 is located on the upper portion of the processing chamber 20 to house the substrate 10. After that, the mobile station 40 faces the processing room. The lower portion of 20 is lowered, and the wet processing with respect to the surface of the substrate 10 is performed by the wet processing unit 30. Thereafter, the substrate 10 is discharged from the processing chamber 20 through the second door 22. The wet processing unit 30 can be located on the upper portion of the processing chamber 20. In this case, when the mobile station 40 is placed on the upper portion of the processing chamber 20, a wet process can be performed. When the wet treatment is completed, the treatment liquid remaining on the surface of the substrate 10 may be removed by the tilting process described above, or by additionally installing an air knife unit or a wet processing unit 30 to spray air onto the surface of the substrate 10.

圖4是繪示根據本發明的另一實施例的濕式處理設備的配置的示意圖。第二固定台52安裝於移動台40與處理室20的上部表面23之間。驅動單元60位於第二固定台52與處理室20的上部表面23之間。第二支撐件44b連接於移動台40與驅動單元60之間。因此,連接到驅動單元60的第二支撐件44b通過第二固定台52連接到移動台40。第二支撐件44b經安裝,使得第二支撐件44b的升高移動(或收縮移動)不被第二固定台52中斷。 4 is a schematic diagram showing the configuration of a wet processing apparatus according to another embodiment of the present invention. The second fixing table 52 is mounted between the moving table 40 and the upper surface 23 of the processing chamber 20. The drive unit 60 is located between the second fixed stage 52 and the upper surface 23 of the processing chamber 20. The second support member 44b is coupled between the mobile station 40 and the drive unit 60. Therefore, the second support 44b connected to the drive unit 60 is connected to the mobile station 40 through the second fixed stage 52. The second support 44b is mounted such that the elevated movement (or contraction movement) of the second support 44b is not interrupted by the second fixed stage 52.

第二支撐件44b由第二保護構件45b圍繞。第二保護構件45b形成以向下延伸以及向上收縮。第二保護構件45b可由具有高的耐化學性的合成樹脂材料形成,以保護第二支撐件44b以免受處理液體影響。因此,在圖4的濕式處理設備中,位於移動台40與第二固定台52之間的第二支撐件44b由第二保護構件45b密封以免受處理液體影響。第二保護構件45b可按風箱的形狀形成。 The second support 44b is surrounded by the second protective member 45b. The second protective member 45b is formed to extend downward and contract upward. The second protective member 45b may be formed of a synthetic resin material having high chemical resistance to protect the second support member 44b from the treatment liquid. Therefore, in the wet processing apparatus of FIG. 4, the second support 44b located between the moving stage 40 and the second fixing stage 52 is sealed by the second protective member 45b from the treatment liquid. The second protective member 45b may be formed in the shape of a bellows.

第二固定台52可以密封方式附接到處理室20的側 壁。因此,驅動單元60以及第二支撐件44b位於第二固定台52上方的部分可被保護以免受處理室20中的處理液體和/或強腐蝕性氣氛影響。此濕式處理方法與參看圖1所述的濕式處理方法相同,且由此,將不重複其詳細描述。 The second fixing table 52 can be attached to the side of the processing chamber 20 in a sealed manner wall. Accordingly, the portion of the drive unit 60 and the second support 44b above the second fixed stage 52 can be protected from the processing liquid and/or the highly corrosive atmosphere in the processing chamber 20. This wet processing method is the same as the wet processing method described with reference to Fig. 1, and thus, detailed description thereof will not be repeated.

圖5是繪示根據本發明的再一實施例的濕式處理設備的配置的示意圖。第一固定台51在移動台40與處理室20的底部表面24之間進一步安裝到圖4的濕式處理設備。因此,溢出到處理室20的底部表面24上的處理液體可收集於第一固定台51上。 FIG. 5 is a schematic diagram showing the configuration of a wet processing apparatus according to still another embodiment of the present invention. The first fixed stage 51 is further mounted to the wet processing apparatus of FIG. 4 between the mobile station 40 and the bottom surface 24 of the processing chamber 20. Therefore, the treatment liquid overflowing onto the bottom surface 24 of the processing chamber 20 can be collected on the first fixing table 51.

多個第一支撐件44a安裝於移動台40的下部表面上,且第一支撐件44a的邊緣可通過第一固定台51延伸到處理室20的底部表面24。第一支撐件44a並未連接到驅動單元60,但執行為導引移動台40以具有穩定的升高移動的導杆。因此,當驅動單元60位於處理室20的上部部分上時,移動台40可穩定地上下移動。然而,本發明不限於此,即,額外驅動單元(未圖示)可安裝於第一固定台51下方且第一支撐件44a可連接到驅動單元。又,在圖5中,位於處理室20的上部部分上的驅動單元60可位於第一固定台51下方,且第二支撐件44b可用作導杆。 A plurality of first supports 44a are mounted on a lower surface of the moving table 40, and an edge of the first support 44a may extend through the first fixing table 51 to the bottom surface 24 of the processing chamber 20. The first support member 44a is not coupled to the drive unit 60, but is implemented as a guide bar that guides the mobile station 40 to have a stable elevated movement. Therefore, when the drive unit 60 is located on the upper portion of the process chamber 20, the mobile stage 40 can be stably moved up and down. However, the present invention is not limited thereto, that is, an additional driving unit (not shown) may be installed under the first fixing table 51 and the first supporting member 44a may be connected to the driving unit. Also, in FIG. 5, the driving unit 60 located on the upper portion of the processing chamber 20 may be located below the first fixing table 51, and the second supporting member 44b may serve as a guide.

第一支撐件44b如圖1中的第一支撐件44a由第一保護構件45a圍繞,且由此,將不重複其詳細描述。 The first support member 44b is surrounded by the first protective member 45a as in the first support member 44a in FIG. 1, and thus, detailed description thereof will not be repeated.

圖6是移動台40的示意性平面圖,且移動台40可在四個轉角上具有四個支撐件(第一支撐件44a以及第二支撐件44b)。 6 is a schematic plan view of the mobile station 40, and the mobile station 40 has four support members (a first support member 44a and a second support member 44b) at four corners.

即,在圖6中,第一支撐點441以及第三支撐點443可位於鄰近于水平移動方向X1(基板沿著其進入以及退出)的兩個轉角上,且第二支撐點442以及第四支撐點444可分別位於與第一支撐點441以及第三支撐點443相對的兩個轉角上。上文所述的第一支撐件44a以及第二支撐件44b安裝於第一至第四支撐點441至444上。 That is, in FIG. 6, the first support point 441 and the third support point 443 may be located on two corners adjacent to the horizontal movement direction X1 (the substrate enters and exits along the same), and the second support point 442 and the fourth The support points 444 can be located on two corners opposite the first support point 441 and the third support point 443, respectively. The first support member 44a and the second support member 44b described above are mounted on the first to fourth support points 441 to 444.

根據本發明,圖5的第一支撐件44a以及第二支撐件44b可用上文所述的結構的組合安裝於第一至第四支撐點441至444上。 According to the present invention, the first support member 44a and the second support member 44b of Fig. 5 are mounted to the first to fourth support points 441 to 444 by a combination of the structures described above.

舉例來說,第一支撐點441上的支撐件可具有與第一支撐件44a相同的結構,且第二至第四支撐點442至444上的支撐件可具有與第二支撐件44b相同的結構。此時,驅動單元可通過安置於處理室的下部部分上而連接到第一支撐件44a,或可通過安置於處理室的上部部分上而連接到第二支撐件44b。又,在此狀況下,另一第一支撐件44a可進一步安置於第二至第四支撐點442至444上。 For example, the support on the first support point 441 may have the same structure as the first support 44a, and the support on the second to fourth support points 442 to 444 may have the same structure as the second support 44b structure. At this time, the driving unit may be connected to the first support 44a by being disposed on the lower portion of the processing chamber, or may be connected to the second support 44b by being disposed on the upper portion of the processing chamber. Also, in this case, the other first support member 44a may be further disposed on the second to fourth support points 442 to 444.

或者,第一支撐點441上的支撐件可具有與第二支撐件44b相同的結構,且第二至第四支撐點442至444上的支撐件可具有與第一支撐件44a相同的結構。此時,如上文所述,驅動單元可通過安置於處理室的下部部分上而連接到第一支撐件44a,或通過安置於處理室的上部部分上而連接到第二支撐件44b。又,在此狀況下,另一第一支撐件44a可進一步安置於第一支撐點441上。 Alternatively, the support on the first support point 441 may have the same structure as the second support 44b, and the support on the second to fourth support points 442 to 444 may have the same structure as the first support 44a. At this time, as described above, the driving unit may be connected to the first support 44a by being disposed on the lower portion of the processing chamber, or connected to the second support 44b by being disposed on the upper portion of the processing chamber. Also, in this case, the other first support member 44a may be further disposed on the first support point 441.

又,第一支撐件44a可安置於第一支撐點441以及第 三支撐點443上,且第二支撐件44b可安置於第二支撐點442以及第四支撐點444上。此時,驅動單元可通過安置於處理室的下部部分上而連接到第一支撐件44a,或通過安置於處理室的上部部分上而連接到第二支撐件44b。又,在此狀況下,另一第一支撐件44a可進一步安置於第二支撐點442以及第四支撐點444上。 Also, the first support member 44a can be disposed at the first support point 441 and The three support points 443 are disposed on the second support point 442 and the fourth support point 444. At this time, the driving unit may be connected to the first support 44a by being disposed on the lower portion of the processing chamber, or connected to the second support 44b by being disposed on the upper portion of the processing chamber. Also, in this case, the other first support member 44a may be further disposed on the second support point 442 and the fourth support point 444.

第一支撐點441以及第三支撐點443上的支撐件中的至少一個(其鄰近於基板進入以及退出所沿著的水平移動方向X1)經配置為第一支撐件44a。因此,在基板在移動台40上水平地移動時基板的移動對支撐件的干擾的可能性可得以最小化。 At least one of the first support point 441 and the support on the third support point 443, which is adjacent to the horizontal movement direction X1 along which the substrate enters and exits, is configured as the first support 44a. Therefore, the possibility of interference of the movement of the substrate with the support when the substrate is horizontally moved on the moving stage 40 can be minimized.

如上文所述,在根據本發明的濕式處理設備中,濕式處理單元30在處理室20中的安裝並非必需的。舉例來說,濕式處理單元30可安裝於連接到處理室的另一處理室中。在此狀況下,處理室20暴露於腐蝕氣氛,且由此,如上文所述,基板升高系統可被保護以免受腐蝕氣氛影響。 As described above, in the wet processing apparatus according to the present invention, the installation of the wet processing unit 30 in the processing chamber 20 is not necessary. For example, the wet processing unit 30 can be mounted in another processing chamber that is connected to the processing chamber. In this case, the process chamber 20 is exposed to a corrosive atmosphere, and thus, as described above, the substrate lift system can be protected from the corrosive atmosphere.

儘管已參考本發明的示範性實施例特定地繪示且描述了本發明,但所屬領域的技術人員將理解,在不脫離如由以下權利要求所界定的本發明的精神以及範疇的情況下,可在本發明中進行形式以及細節上的各種改變。 Although the present invention has been particularly shown and described with reference to the exemplary embodiments of the present invention, those skilled in the art Various changes in form and detail can be made in the present invention.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧基板 10‧‧‧Substrate

20‧‧‧處理室 20‧‧‧Processing room

21‧‧‧第一門 21‧‧‧ first door

22‧‧‧第二門 22‧‧‧ second door

23、24‧‧‧表面 23, 24‧‧‧ surface

30‧‧‧濕式處理單元 30‧‧‧ Wet processing unit

40‧‧‧移動台 40‧‧‧Mobile Station

41‧‧‧框架 41‧‧‧Frame

411‧‧‧第一框架 411‧‧‧ first frame

412‧‧‧第二框架 412‧‧‧ second frame

413‧‧‧第三框架 413‧‧‧ third frame

414‧‧‧第四框架 414‧‧‧Fourth framework

421‧‧‧支撐杆 421‧‧‧Support rod

422‧‧‧驅動輥 422‧‧‧ drive roller

43‧‧‧支撐滾筒 43‧‧‧Support roller

44‧‧‧支撐件 44‧‧‧Support

44a‧‧‧第一支撐件 44a‧‧‧First support

44b‧‧‧第二支撐件 44b‧‧‧second support

441‧‧‧第一支撐點 441‧‧‧ first support point

442‧‧‧第二支撐點 442‧‧‧second support point

443‧‧‧第三支撐點 443‧‧‧ third support point

444‧‧‧第四支撐點 444‧‧‧fourth support point

45‧‧‧保護構件 45‧‧‧Protection components

45a‧‧‧第一保護構件 45a‧‧‧First protective member

45b‧‧‧第二保護構件 45b‧‧‧Second protective component

51‧‧‧第一固定台 51‧‧‧First fixed station

52‧‧‧第二固定台 52‧‧‧Second fixed station

60‧‧‧驅動單元 60‧‧‧ drive unit

X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction

X1‧‧‧水平移動方向 X1‧‧‧ horizontal moving direction

θ‧‧‧預定角 θ‧‧‧Predetermined angle

P1‧‧‧第一位置 P1‧‧‧ first position

P2‧‧‧第二位置 P2‧‧‧ second position

圖1是繪示根據本發明的實施例的濕式處理設備的配置的示意圖。 1 is a schematic diagram showing the configuration of a wet processing apparatus according to an embodiment of the present invention.

圖2是根據本發明的實施例的圖1的移動台的實例的透視圖。 2 is a perspective view of an example of the mobile station of FIG. 1 in accordance with an embodiment of the present invention.

圖3是繪示圖2的移動臺上的基板的傾斜狀態的示意圖。 3 is a schematic view showing a tilted state of a substrate on the mobile station of FIG. 2.

圖4是繪示根據本發明的另一實施例的濕式處理設備的配置的示意圖。 4 is a schematic diagram showing the configuration of a wet processing apparatus according to another embodiment of the present invention.

圖5是繪示根據本發明的再一實施例的濕式處理設備的配置的示意圖。 FIG. 5 is a schematic diagram showing the configuration of a wet processing apparatus according to still another embodiment of the present invention.

圖6是具有四個支撐件的移動台的示意性平面圖。 Figure 6 is a schematic plan view of a mobile station having four supports.

10‧‧‧基板 10‧‧‧Substrate

20‧‧‧處理室 20‧‧‧Processing room

21‧‧‧第一門 21‧‧‧ first door

22‧‧‧第二門 22‧‧‧ second door

23、24‧‧‧表面 23, 24‧‧‧ surface

30‧‧‧濕式處理單元 30‧‧‧ Wet processing unit

40‧‧‧移動台 40‧‧‧Mobile Station

44a‧‧‧第一支撐件 44a‧‧‧First support

45a‧‧‧第一保護構件 45a‧‧‧First protective member

51‧‧‧第一固定台 51‧‧‧First fixed station

60‧‧‧驅動單元 60‧‧‧ drive unit

Claims (10)

一種濕式處理設備,包括:處理室,其包括基板進入所通過的第一門以及所述基板退出所通過的第二門;移動台,其經配備以在所述處理室中上下移動且其上放置有所述基板;多個支撐件,其連接到所述移動台;驅動單元,其經配備以通過連接到所述支撐件中的至少一個而上下移動所述移動台;固定台,其固定地安置於所述處理室中且面對所述移動台,且所述支撐件中的至少一個通過所述固定台;以及多個保護構件,其安置於所述固定台與所述移動台之間、圍繞所述支撐件中的每一個,且經配備以延伸以及收縮。 A wet processing apparatus comprising: a processing chamber including a first door through which a substrate enters and a second door through which the substrate exits; a mobile station configured to move up and down in the processing chamber and The substrate is placed thereon; a plurality of supports coupled to the mobile station; a drive unit configured to move the mobile station up and down by being coupled to at least one of the supports; a fixed table Fixedly disposed in the processing chamber and facing the mobile station, and at least one of the support members passes through the fixed table; and a plurality of protective members disposed on the fixed station and the mobile station Between, around each of the supports, and equipped to extend and contract. 根據申請專利範圍第1項所述的濕式處理設備,其中所述固定台位於所述移動台與所述驅動單元之間。 The wet processing apparatus according to claim 1, wherein the fixed stage is located between the mobile station and the drive unit. 根據申請專利範圍第1項所述的濕式處理設備,其中所述固定台包括位於所述處理室的底部表面與所述移動台之間的第一固定台。 The wet processing apparatus of claim 1, wherein the fixing station comprises a first fixing station between a bottom surface of the processing chamber and the mobile station. 根據申請專利範圍第1項所述的濕式處理設備,其中所述固定台包括位於所述處理室的上部表面與所述移動台之間的第二固定台。 The wet processing apparatus of claim 1, wherein the fixing station comprises a second fixing station between an upper surface of the processing chamber and the moving stage. 根據申請專利範圍第1項所述的濕式處理設備,其 中所述支撐件包括連接到所述移動台的下部表面的至少一個第一支撐件。 The wet processing apparatus according to claim 1, wherein The support member includes at least one first support member coupled to a lower surface of the mobile station. 根據申請專利範圍第1項所述的濕式處理設備,其中所述支撐件包括連接到所述移動台的上部表面的至少一個第二支撐件。 The wet processing apparatus of claim 1, wherein the support comprises at least one second support coupled to an upper surface of the mobile station. 根據申請專利範圍第1項所述的濕式處理設備,其中並未連接到所述驅動單元的所述支撐件是導杆。 The wet processing apparatus according to claim 1, wherein the support member not connected to the drive unit is a guide. 根據申請專利範圍第1至7項中任一項所述的濕式處理設備,其中所述固定台與所述處理室的側壁以密封方式組合。 The wet processing apparatus according to any one of claims 1 to 7, wherein the fixing table and the side wall of the processing chamber are combined in a sealed manner. 根據申請專利範圍第1至7項中任一項所述的濕式處理設備,其中所述第一門以及所述第二門垂直於彼此而安置。 The wet processing apparatus according to any one of claims 1 to 7, wherein the first door and the second door are disposed perpendicular to each other. 根據申請專利範圍第1至7項中任一項所述的濕式處理設備,更包括安裝於所述處理室中且將處理液體供應到所述基板上的濕式處理單元。 The wet processing apparatus according to any one of claims 1 to 7, further comprising a wet processing unit installed in the processing chamber and supplying a processing liquid onto the substrate.
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