JP2008174361A - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
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- JP2008174361A JP2008174361A JP2007010189A JP2007010189A JP2008174361A JP 2008174361 A JP2008174361 A JP 2008174361A JP 2007010189 A JP2007010189 A JP 2007010189A JP 2007010189 A JP2007010189 A JP 2007010189A JP 2008174361 A JP2008174361 A JP 2008174361A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors
- B65G39/02—Adaptations of individual rollers and supports therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
【解決手段】基板搬送装置100内には、上下2段のローラ搬送コンベア120、140と、ローラ搬送コンベア120、140を昇降させる昇降機構118が設けられている。上段のローラ搬送コンベア120でガラス基板Gを搬送中に、下段のローラ搬送コンベア140にガラス基板Gを載置し、また下段のローラ搬送コンベア140でガラス基板Gを搬送中に、上段のローラ搬送コンベア120にガラス基板Gを載置する。昇降機構118でローラ搬送コンベア120、140を昇降させて行うことによって、この搬送、載置作業を繰り返し行うことができ、必要なときにガラス基板GをエキシマUV照射装置20に搬送できる。
【選択図】図3
Description
2 カセットステーション
3 処理ステーション
12 搬送アーム
13 支持部
100 基板搬送装置
110 容器
111 搬入口
112 搬出口
113 排気口
114 コンベアカバー
115 搬入口
116 搬出口
118 昇降機構
120 上段のローラ搬送コンベア
122 支持部材
124 フリーローラ
130 駆動ローラ
131 駆動軸
132 回転駆動部
133a ガイドローラ
140 下段のローラ搬送コンベア
150 大口径ローラ
151 回転軸
Claims (8)
- 基板を支持するアームから基板を受け取って、この基板を処理装置に搬送する基板搬送装置であって、
基板を水平方向に搬送可能で上下2段に配置されたローラ搬送コンベアと、
前記2段のローラ搬送コンベアを昇降させる昇降機構と、を有することを特徴とする、基板搬送装置。 - 前記2段のローラ搬送コンベアと前記昇降機構とを収容する容器を有し、
前記容器の前記アームの搬入領域に臨む側面には、基板を搬入するための搬入口が形成され、
前記容器の前記処理装置側の側面には、基板を搬出するための搬出口が形成され、
前記処理装置の内部は、前記容器の内部よりも高圧に維持され、
前記容器の側面の下部には、前記容器内の雰囲気を排気する排気口が形成されていることを特徴とする、請求項1に記載の基板搬送装置。 - 前記容器の内部には、前記2段のローラ搬送コンベアを収容するコンベアカバーが設けられ、
前記コンベアカバーの前記アームの搬入領域に臨む側面には、基板を搬入するための他の搬入口が形成され、
前記コンベアカバーの前記処理装置側の側面には、基板を搬出するための他の搬出口が形成されていることを特徴とする、請求項2に記載の基板搬送装置。 - 前記アームの先端側には、基板を支持する直線状の支持部が平行に複数設けられ、
前記ローラ搬送コンベアは、
基板を支持可能で、少なくとも基板の搬送方向に回転自在な複数の搬送ローラと、
前記複数の搬送ローラを支持し、基板の搬送方向に延びる複数の支持部材と、を有し、
前記複数の支持部材は、当該支持部材間に前記支持部が進入するように、基板の搬送方向と直角方向に並べて配置されていることを特徴とする、請求項1〜3のいずれかに記載の基板搬送装置。 - 前記搬送ローラは、無方向に回転自在なフリーローラであることを特徴とする、請求項4に記載の基板搬送装置。
- 基板の搬送方向と直角方向に、前記搬送ローラに支持された基板の位置を調整するガイドローラを有することを特徴とする、請求項4又は5に記載の基板搬送装置。
- 前記ローラ搬送コンベアは、
基板を支持することができ、基板の搬送方向に回転自在で、搬送方向と直角方向に並べて配置された複数の搬送ローラと、
前記複数の搬送ローラの中心部を貫通して当該搬送ローラを支持する回転軸と、を有し、
前記複数の搬送ローラと回転軸は、基板の搬送方向に複数並べて配置され、
前記搬送ローラの径は、前記搬送ローラの上端と前記回転軸の上端との間に前記アームが進入できる大きさに設定されていることを特徴とする、請求項1〜3のいずれかに記載の基板搬送装置。 - 基板の搬送方向と直角方向に、前記搬送ローラに支持された基板の位置を調整するガイドローラを有することを特徴とする、請求項7に記載の基板搬送装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007010189A JP2008174361A (ja) | 2007-01-19 | 2007-01-19 | 基板搬送装置 |
KR1020080005483A KR20080068581A (ko) | 2007-01-19 | 2008-01-18 | 기판 반송 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007010189A JP2008174361A (ja) | 2007-01-19 | 2007-01-19 | 基板搬送装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008174361A true JP2008174361A (ja) | 2008-07-31 |
Family
ID=39701667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007010189A Pending JP2008174361A (ja) | 2007-01-19 | 2007-01-19 | 基板搬送装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2008174361A (ja) |
KR (1) | KR20080068581A (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100965411B1 (ko) * | 2008-12-26 | 2010-06-24 | 엘아이지에이디피 주식회사 | 기판처리장치 |
KR101000494B1 (ko) * | 2008-08-26 | 2010-12-14 | 주식회사 에스에프에이 | 이송장치 |
KR101010192B1 (ko) * | 2008-08-26 | 2011-01-21 | 주식회사 에스에프에이 | 이송장치 |
JP2013163592A (ja) * | 2012-02-10 | 2013-08-22 | Mm Tech Co Ltd | 湿式処理装置 |
JP2014072366A (ja) * | 2012-09-28 | 2014-04-21 | Tdk Corp | 成膜処理装置 |
JP2016139689A (ja) * | 2015-01-27 | 2016-08-04 | 光洋サーモシステム株式会社 | 搬送装置 |
CN106966168A (zh) * | 2017-05-09 | 2017-07-21 | 成都亨通兆业精密机械有限公司 | 一种稳定运输玻璃板的传送装置 |
KR101915470B1 (ko) * | 2016-01-15 | 2018-11-07 | 주식회사 비아트론 | 로드락 챔버를 갖는 기판 열처리 시스템 |
JP2020038392A (ja) * | 2010-09-13 | 2020-03-12 | 株式会社ニコン | 移動体装置、物体処理装置、露光装置、デバイス製造方法、フラットパネル製造方法、物体交換方法、及び露光方法 |
TWI718587B (zh) * | 2019-07-16 | 2021-02-11 | 亞智科技股份有限公司 | 條棒式基板運輸裝置及其方法 |
JP2021049099A (ja) * | 2019-09-25 | 2021-04-01 | 有限会社伊藤鉄工所 | 遊技機の検査台装置における当該遊技機の搬入出装置、及び遊技機載置パレット |
CN113753580A (zh) * | 2020-06-03 | 2021-12-07 | 韩国光洋热电系统有限公司 | 热处理装置的基板搬送单元 |
CN116009367A (zh) * | 2021-10-21 | 2023-04-25 | 株式会社斯库林集团 | 基板处理装置 |
WO2024004954A1 (ja) * | 2022-06-28 | 2024-01-04 | 株式会社ブイ・テクノロジー | 搬送装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101688842B1 (ko) * | 2010-12-02 | 2017-01-03 | 주성엔지니어링(주) | 기판 처리 장치 |
KR101374291B1 (ko) * | 2011-12-29 | 2014-03-18 | 엘아이지에이디피 주식회사 | 기판 이송장치 및 이를 이용한 기판 처리장치 |
KR101435504B1 (ko) * | 2012-12-27 | 2014-09-02 | 주식회사 선익시스템 | 기판 이송 장치 및 기판 이송 방법 |
-
2007
- 2007-01-19 JP JP2007010189A patent/JP2008174361A/ja active Pending
-
2008
- 2008-01-18 KR KR1020080005483A patent/KR20080068581A/ko not_active Application Discontinuation
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101000494B1 (ko) * | 2008-08-26 | 2010-12-14 | 주식회사 에스에프에이 | 이송장치 |
KR101010192B1 (ko) * | 2008-08-26 | 2011-01-21 | 주식회사 에스에프에이 | 이송장치 |
KR100965411B1 (ko) * | 2008-12-26 | 2010-06-24 | 엘아이지에이디피 주식회사 | 기판처리장치 |
JP2020038392A (ja) * | 2010-09-13 | 2020-03-12 | 株式会社ニコン | 移動体装置、物体処理装置、露光装置、デバイス製造方法、フラットパネル製造方法、物体交換方法、及び露光方法 |
JP2013163592A (ja) * | 2012-02-10 | 2013-08-22 | Mm Tech Co Ltd | 湿式処理装置 |
JP2014072366A (ja) * | 2012-09-28 | 2014-04-21 | Tdk Corp | 成膜処理装置 |
JP2016139689A (ja) * | 2015-01-27 | 2016-08-04 | 光洋サーモシステム株式会社 | 搬送装置 |
KR101915470B1 (ko) * | 2016-01-15 | 2018-11-07 | 주식회사 비아트론 | 로드락 챔버를 갖는 기판 열처리 시스템 |
CN106966168A (zh) * | 2017-05-09 | 2017-07-21 | 成都亨通兆业精密机械有限公司 | 一种稳定运输玻璃板的传送装置 |
TWI718587B (zh) * | 2019-07-16 | 2021-02-11 | 亞智科技股份有限公司 | 條棒式基板運輸裝置及其方法 |
JP2021049099A (ja) * | 2019-09-25 | 2021-04-01 | 有限会社伊藤鉄工所 | 遊技機の検査台装置における当該遊技機の搬入出装置、及び遊技機載置パレット |
JP7142933B2 (ja) | 2019-09-25 | 2022-09-28 | 有限会社伊藤鉄工所 | 遊技機の検査台装置における当該遊技機の搬入出装置、及び遊技機載置パレット |
JP2021190673A (ja) * | 2020-06-03 | 2021-12-13 | コヨ サーモ システム コリア カンパニー リミテッド | 熱処理装置の基板搬送ユニット |
CN113753580A (zh) * | 2020-06-03 | 2021-12-07 | 韩国光洋热电系统有限公司 | 热处理装置的基板搬送单元 |
JP7155200B2 (ja) | 2020-06-03 | 2022-10-18 | コヨ サーモ システム コリア カンパニー リミテッド | 熱処理装置の基板搬送ユニット |
CN116009367A (zh) * | 2021-10-21 | 2023-04-25 | 株式会社斯库林集团 | 基板处理装置 |
JP2023062255A (ja) * | 2021-10-21 | 2023-05-08 | 株式会社Screenホールディングス | 基板処理装置 |
JP7408612B2 (ja) | 2021-10-21 | 2024-01-05 | 株式会社Screenホールディングス | 現像装置 |
WO2024004954A1 (ja) * | 2022-06-28 | 2024-01-04 | 株式会社ブイ・テクノロジー | 搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080068581A (ko) | 2008-07-23 |
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