TW201128793A - In chamber sodium doping process and system for large scale CIGS based thin film photovoltaic materials - Google Patents
In chamber sodium doping process and system for large scale CIGS based thin film photovoltaic materials Download PDFInfo
- Publication number
- TW201128793A TW201128793A TW099132118A TW99132118A TW201128793A TW 201128793 A TW201128793 A TW 201128793A TW 099132118 A TW099132118 A TW 099132118A TW 99132118 A TW99132118 A TW 99132118A TW 201128793 A TW201128793 A TW 201128793A
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- Prior art keywords
- layer
- copper
- gallium
- indium
- sodium
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 220
- 230000008569 process Effects 0.000 title claims abstract description 137
- 229910052708 sodium Inorganic materials 0.000 title claims abstract description 45
- 239000011734 sodium Substances 0.000 title claims abstract description 44
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 title claims abstract description 42
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- 239000010949 copper Substances 0.000 claims abstract description 63
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 55
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- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
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- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
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- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Description
201128793 六、發明說明: 【發明所屬之技術領域】 本發明-般涉及光伏材料和生產方法。更具體而言本發明 提供了用於製造薄膜太陽能電池的方法和結構。僅為舉例的方 式’本發法包括驗基於大雌成減絲生產黃銅礦結構 的(chalcopyrite structured)薄膜光伏電池的室内(艙内或箱内, in-chamber)鈉摻雜,但是應該認識到,本發明可以具有其他的構 造設計。 【先前技術】 從一開始,人類都在努力找到利用能量的方式。能量以諸如 石化產品、水電、核能、風能、生物質能、太陽能的形式,以及 諸如木材和煤的更基本形式$現。在過去的世紀裡,現代文明已 ,依賴於石化產品能量作為重要的能量來源。石化產品能源包括 氣和油。氣包括諸如丁燒和丙炫的較輕質形式,通常用於家用加 熱並作為用於烹隹的燃料。氣還包括汽油、柴油和喷氣燃料,常 常用=交通運輸目的。石化產品的較重_式在某些地方也能夠 用於家用加熱。不幸的是,石化產品燃料的供給是有限的並且基 於地球上可麟的量基本上是㈣的。糾,由於更多人使用石 油產品的量正在增加’所以它正迅速地變成稀缺資源,其隨著時 間將最終被耗盡。 更近地,環境清潔和可再生能源已經成為所期望的。清潔能 源的個實例疋水電能。水電能來源於通過水壩如内華達州的胡 夫水壩(H〇0verDam)產生的水流驅動的發電機。所產生的電能 用於為加利福利亞州洛杉磯市的大部分供電。清潔和可再生能源 還包括風能、波能、生物魏等,,風磨將風能轉化成更有用 4 201128793 的能量形式如電。還有其他類型的清潔能源包括太陽能。太陽能 的具體細節能夠在整個本發明背景並且更具體而言在以下描述中 能夠找到。 太陽能技術一般將太陽的電磁輻射轉化成其他有用的能量形 式。這些其他的能量形式包括熱能和電能。對於電能應用,經常 使用太陽能電池。儘管太陽能是環境清潔的並且已經在一定程度 上是成功的,但是在其被全世界範圍内廣泛使用之前還有許多局 限(或限制)有待解決。作為一個實例,一種類型的太陽能電池 利用晶體材料,其來源於半導體材料晶錠。這些晶體材料可以用 於製造光電器件’包括將電磁輻射轉化成電能的光伏和光電二極 體器件。然而,晶體材料經常成本高昂並且難以大規模製備。另 外’由這樣的晶體材料製成的器件(裝置,device)經常具有較低 的能量轉化效率。其他類型的太陽能電池利用“薄膜”技術形成光 敏材料的薄膜,用於將電磁輻射轉化成電能。在製造太陽能電池 中使用薄膜技術存在類似的限制。即,效能經常很差。另外,膜 可靠性經常也較差並且不能在傳統環境應用中使用很長時間。經 常地,薄膜很難相互機械地整合在一起。此外,形成於含鈉襯底 上的電極層和上覆吸收層(在上方的吸收層,〇verlying abs〇rber layer)的整合也存在問題,尤其對於大規模生產更是如此。這些 傳統技術的這些和其他局限性能夠在本說明書通篇中並且更具體 而言在以下内容中發現。 【發明内容】 本發明一般涉及光伏材料和生產方法。更具體而言,本發明 提供了一種用於製造薄膜太陽能電池的方法和結構。僅以舉例的 方式,本發明方法包括基於大規模成批系統的用於生產黃銅礦結 201128793 構的薄膜光伏電池的室内鈉摻雜,但是應該認識到,本發明可以 具有其他的構造設計。 在一個具體實施方式中,本發明提供了一種利用錢射工藝加 工光伏材料的方法。該方法包括提供至少一個具有上覆第一電極 層的透明襯底。另外,該方法包括在第一室内利用第一濺射工藝, 由包含銅物種(物質,species)和鎵物種的第一靶形成上覆銅和 鎵層(overlyingcopperandgalliumlayer)。該方法進一步包括在 該第一室内利用第二濺射工藝,由包含銦物種的第二把形成覆蓋 (上覆在…上,overlying)銅層和鎵層的銦層。 另外,該方法包括在該第一室内利用第三濺射工藝形成覆蓋 姻層的含納層(sodium bearing layer)。由此形成包括該銅和鎵層、 銦層以及含納層的複合膜。此外,該方法包括使該複合膜經歷至 少一個熱處理工藝以形成其中包含銅、銦、鎵和鈉的黃銅礦吸收 層(黃銅礦吸收體層,chalcopyrite absorber layer )。 在另一個具體實施方式中,本發明提供了一種利用濺射工藝 加工光伏材料的方法。該方法包括提供至少一個具有上覆第一電 極層的透明襯底 該方法包括在第—室内糊第—雜工藝,由 包含銅物種和鎵物種的第一靶形成上覆銅和鎵層。另外,該方法 已•括在該第至内利用第一滅:射工藝,由包含姻物種的第二把形 成覆蓋該銅和鎵層的銦層。該方法進一步包括將包括覆蓋銅層的 銦層的透觀底轉移到第三室,啊沒有破壞該第-室和第二室 ^間的真空以維持該銅鎵層和銦層基本上沒有濕氣(moisture,水 分^。另外,該方法包括在該第二室内利用第三濺射工藝,形成 覆盘該銦層的含崎。驗,形成包括細和麟、崎以及含 納層=複合臈。此外’該方法包括使該複合膜經歷至少—個熱處 双成其中包含銅、銦、鎵和納的黃銅礦吸收層並且包括 6 201128793 將該複合膜的透明襯底維持在基本上無濕氣的環境中。 在另一個可替換實施方式中,本發明提供了一種加工光伏吸 收材料的方法。該方法包括提供一種具有上覆鉬層的襯底。另外, 該方法包括形成覆蓋鉬層的含鈉層。另外,該方法包括形成覆蓋 含鈉層的包含銅、鎵和銦的前體層。此外,該方法包括使該前體 層經歷熱處理工藝以形成包括其中含有銅、銦、鎵和鈉的黃銅礦 結構的光伏吸收層。在一個具體實施方式中,形成含納層通過在 混有銅和鎵的含NajeO3 (其中總計8at%的鈉)的靶上濺射而實 施。在另一個具體實施方式中,前體層的熱處理在含硒的氣體 境中實施。 許多益處能夠通過應用本發明而實現。具體地,鈉摻雜工藝 用作一個對於形成銅基黃銅礦結構的高效光伏吸收層的重要步 驟。本發明提供了一種利用室内濺射工藝來實施鈉摻雜的有效方 式,從而在形成的吸收前體層中實現良好控制的鈉濃度。該方法 簡化了摻雜工藝,其中利用可選的可互換的順序實施導致形成 銅、鎵和銦基複合膜的一個或多個濺射工藝。室内鈉摻雜對於複 合膜可以在同一個濺射室内(可以是在不同的隔間)或在不同的 室内實施,它們都可以構造成大規模成批系統的部分。當然,可 以有其他的變形、修改和替代。 這些和其他的優勢可以在整個本發明說明書而尤其是以下 内容中進行描述。 【實施方式】 本發明一般涉及光伏材料和生產方法。更具體而言,本發明 提供了一種用於製造薄膜太陽能電池的方法和結構。僅以舉例的 方式,本發明方法包括基於大規模成批系統用於生產黃銅礦結構 201128793 的薄膜光伏電池的室内納摻雜,但是應該認識到,本發明可以具 有其他構造設計。 圖1是舉例說明根據本發明一個實施方式的一種製造薄膜光 伏電池的方法的簡化流程圖。該圖僅是一個實例,不應該過度地 限制本文所附權利要求的範圍。方法1000包括以下工藝: 1·工藝1〇1〇,用於提供覆蓋有第一電極層的透明襯底; 2. 工藝1020,用於在第一室内利用第一藏射工藝形成覆蓋第一電 極層的銅和鎵層; 3. 工藝1030,用於在該第一室内利用第二濺射工藝形成覆蓋銅和 鎵層的銦層; 4. 工藝1040,用於在該第一室内利用第三濺射工藝形成覆蓋銦層 的含納層,由此(1〇5〇)形成包括該銅和鎵層、銦層和含納層的 複合臈; θ 5. 工藝1060,用於使該複合膜經歷至少一個熱處理工藝以形成黃 銅礦吸收層; ' 6. 工藝1070,用於實施其他的步驟。 以上順序的工藝提供了根據本拥,實财柄一種形成 用於製造雜光伏電池的黃銅礦魏層的方法 ^式二,該方法包括在實賴歧卫藝之前,在銦層上 在雜工藝。在另—個具體實施方式中,該方法還包括 “不同隔間的相同室内實施一個或多個賤射工藝以 =錄、銦和_—個或多個層。在不背離本文所附權利要求^ ^圍的情況下’也可以提供其他替換方式,其中增加I蔽、去: 人:多個工藝,或者一個或多個工藝以不同的順序提供。例如, =層可以_鹽噴霧工藝實施。在另_個實施例中 藝可以用郷紐蓋銦含_。以 8 201128793 不同的順序實施’而其他卫藝可以插人在它們之間。例如,沉積 覆蓋第-電極層的含納層,接著沉積銅、鎵物種以及隨後沉積銦 物種。該方法的進-步細節可以在整個說明書中而更具體而言是 以下内容中找到。 在工藝1 〇 1 〇 供納約玻璃概底(s〇da iime封挪㈣伽切)。 這個工藝能夠通過圖2可視地舉例說明。圖2聽例說明根據本 發明-個實施方式的提供用於製造薄膜光伏電池的透明襯底的簡 化圖。該圖僅是-個實例,其不應該過度地限制本文所附權利要 求的範圍。本領域的普通技術人員將會意識到許多變形、替代和 修改。如所示出的,在室10内提供包括上覆第一電極層2〇〇的透 明襯底100。在-個實施方式+,第一電極層2〇〇可以包括形成在 導體層(例如’翻層)和襯底1〇〇之間的阻隔層。在一個實施例 中’透明襯底100使用納鈣玻璃’其由於明顯的經濟原因而已被 廣泛地用作窗玻璃以及用於形成薄膜光伏電池的襯底。鈉鈣玻璃 本身子(例如’ Na+),這對其上的細光伏材料的晶粒 生長提供了 JL祕響。例如,CuIn㈣% * Cu】nSe2材料的多晶 半導體膜可以形成在鈉鈣玻璃襯底上,其中粗晶粒尺寸為幾微米 或更大。鈉離子在光伏電池的吸收體(吸收劑,abs〇rber)中還充 當摻雜劑。因此,根據本發明在鈉鈣玻璃上製備的這些光伏膜能 夠具有南電池電流,其中光轉化效率為17%或更高。 在本發明的一種實施方式中,第一電極層包括鉬材料層。該 鉬層的層也可以預先塗覆在當作為透明襯底提供時的商購鈉鈣玻 璃上。可替換地,在一種實施方式中,第一電極層利用一個或多 個沉積工藝形成在未塗覆且預先清洗的鈉鈣玻璃襯底上。室1〇可 以疋構造成載入鈉鈣玻璃襯底100以實施一個或多個沉積工藝(包 括濺射形成第—電極層200)的真空室。在一個具體實施方式中, 201128793 至10可以疋用於生產薄膜太陽能電池的大規模成批系統中的多個 室或子系統中的一個。 ,以上提及的第-電極層2GG功能上用作用於之後在襯底100 上形成的4膜献電池的下電極或背電極。在—個實施例中,第 一電極層200包括雙層結構的錮材料。具體而言,在約2毫托的 相對較低的壓力下’棚雜卫藝形紐蓋鈉㉟㈣襯底的第一 鉬層:第-翻層基本上處於拉伸應力下。隨後,在約2〇毫托的相 對較局的壓力下利用錢射工藝形成覆第—銦層的第二翻層。第二 鉬層基本上處於壓縮應力下並具有約2〇〇〇人的厚度或比第一鉬層 厚約10倍。這樣的具有期望應力場的雙層鈿結構提供了利用鐘射 圖案化工藝來形成基本無關裂的某些·的優點。在一個實施 方式中It射圖案化工藝可以是在相同成批系統中實施的多個工 藝之-。因此,具有適於對應互聯結構的多侧案的第一電極層 可以在利用大規模成批系統生產薄膜S伏電池的後續卫疏之前進 行製備。 w 參照圖1,方法麵進一步包括形成覆蓋第一電極層的銅和 鎵層的第-濺射工藝(工藝咖)。該工藝能夠可視地通過圖3 舉例說明。® 3是舉例說明根據本發明—個實施方式的用於形成 光伏材料的複合膜的第一濺射工藝的簡化圖。該圖僅是一個實施 例,其不應該過度地限制本文所附權利要求的範圍。本領域的普 通技術人員將會認識到許多變形、替代和修改。如所示出的 成覆蓋在透明襯底100上的第一電極層2〇〇的銅和鎵層3〇〇。在一 個實施例中,銅和鎵層300利用第一濺射工藝形成。:一 方式中,第-滅射工藝可以在室丨。中實施,其中將二= 乾分別配置用於在同-個室10的不同隔間中分別沉積鋼和錄。在 另-種實施方式中,具有期望Cu:Ga組成的合金^i 201128793 在室ίο中實施單個濺射工藝。第一濺射工藝和第一電極層沉積也 可以在同—個室10的不同隔間中實施。 在一個具體實施方式中,可以使用DC磁控藏射工藝以在以 下條件下在第一電極層上沉積銅層。室10中的沉積壓力(使用氬 氣)控制為約6.2mTorr。氣體流速設定為約32sccm。沉積溫度可 以為剛好在室溫而無需特意地加熱襯底。沉積也可以在預熱的襯 底上實施。當然,由於在沉積期間產生等離子體可能會導致產生 較小的襯底加熱。另外,可能需要約n5W的DC電源。根據某些 實施方式’根據利用不同材料的具體情形,100W〜150W範圍的 DC電源是合適的。對於約17〇nm或更厚的銅_鎵層的完全沉積時 間為約6min或更長。 在一個可替換實施方式中,含鎵材料的薄層可以通過在提供 有氬氣的ί衣;I兄中濺射含録乾(gallium_bearing加名过)而形成。根 據一個具體實施方式,濺射工藝可以使用約12〇WDC:的電能進行 約l〇s和更少的時間。氬氣以約合適的流速提供。在一個優選的 實施方式巾,沉積碰轉在真空魏,其為約5和更低或 約1 mTorr至約42 mTorr。在一個具體實施方式中,合舰舰
目的0工 201128793 藝1〇2〇只是導致形成作為用於形成具有黃銅礦結構的光伏吸收層 的前體的複合膜的工藝。關於這種複合膜的其他描述在以下更詳 細描述中能夠找到。 在下-個工藝(卿)中,方法1000包括用於形成覆蓋銅和 鎵層的銦層的第二雜工藝。紅藝能射視地通测4舉例說 明。圖4是舉例說明根據本發明一個實施方式的用於形成光伏材 料的複合膜的第二濺射工藝的簡化圖。該圖僅是―個實施例,其 不應該過度地_本文觸翻要求的細。本賴的普通技術 人員將會認識到許多獅、替代和修改^如所示出的,形成覆蓋 較早形成的銅和鎵層300的銦層400。在-個實施例中,銦層_ 可以利用在用於實施第-贿工藝(即,工藝職)的相同室ι〇 内實施的麵卫藝形成。為了避免或至少降低相互污染並提供用 於改變局部騎環境的選擇,第二贿卫藝可以在不同隔間中實 施,其中透明襯底100從用於實施第一濺射工藝的先前隔間轉移。 在另-實施例中’銦層觀DC磁控雜工藝在驗沉積銅 層的類似條件下沉積在銅和鎵層3⑻上。用於銦層的沉積時間可 以比銅(和鎵)層的沉積時間短。例如,對於沉積約3〇〇腹厚度 (或對於較厚的吸收結構的更厚銦層)的銦層,2min*45s可能 就足夠。形成銦層3GG的工藝只是形紐合麟讀的另一部分, 尤其是目的在於在之後的光伏吸收層的最終組成中具有期望銅:銦 比率。 一再參照®卜方法1000包括用於形成覆蓋銦層的含納層的第 二濺射工藝(工藝1040)。該工藝能夠可視地通過圖5舉例說明。 圖5是舉例說明根據本發明一個實施方式的用於形成光伏材料複 合膜的第三雜工藝的簡化圖。該圖僅是一個實施例,其不應該 過度地限制本文所附權利要求的範圍。本領域的普通技術人員將 12 201128793 會認識到許多變形、替代和修改 _中較早形成_層___ 械覆盍在工藝 中,第三濺射工蓺在用於弁二笛鋼層500。在一個具體實施方式 θ在用於先別的第—和第二工藝的同一個室10中 在不同的關中實施。在—個可替換的具體實施 ‘叮7 ^楚上覆電極層200、鋼和鎵層300以及銦層400的襯底 100JT以從第-室1()轉移到第二室2G,同時沒有破壞二者之間的 真成轉銅鎵層和銦層彻基本上無濕氣。具體而言室 2〇:以彌在壓力設置為小於⑽毫⑽高真錄件下,用於實 施第二_工藝。室2G可以通於吸取水統的低溫泵進一步 支持。在另-具體實施方式中,第三贿卫藝使时佈在宿主材 料中的具有均勻組成的鈉物種的含納乾。當然,根據不同的應用, 可以有某些變形、修改和替代。 在-個實施例中,含納層形成在銦層彻的頂上。在另 -個實施财,第二濺射工藝在第―雜卫藝之前實施。換句話 說’可以先沉積銦層400。接著,利用第三濺射工藝加入覆蓋崎 400的含鈉層500。之後,利用第一難工藝,可以沉積覆蓋含納 層500的銅層或銅和鎵層。通常,包括在銦層上方的含納物種的 薄膜結構可以有助於防止或至少顯著地降低納物種接近其下方形 成的第一電極層的機會。 在一個如圖1A所示的可替換實施方式中,利用含有與銅和鎵 物種混合的化合物NajeO3的靶,含鈉物種通過第一濺射工藝 (2020)沉積。該靶中的Na含量僅為8%或更低。否則,含鈉物 種中的鈉原子(離子)將會對第一電極層例如鉬層之間的介面上 產生一些反應性破環,或者甚至導致鉬層與上覆吸收層分層。之 後,實施利用銅+鎵靶的第二濺射工藝(2030)和關於銦靶的第三 濺射工藝(2040),以形成作為用於在隨後的熱處理工藝中形成 13 201128793 光=吸收體的刖體層的複合膜。熱處理工藝包括在含砸的氣體環 境中將工藝溫度上升至5〇叱。當然,其歸射 間或之後實施。 / 在另可替換實施方式中’通過第三濺射工藝 成為複合膜599的-部分,該複合膜599包括在第—雜工藝 中形成的鋼和鎵層3〇〇和在第二濺射工藝中形成的姻層彻。另一 方面’第三着工藝提供具有用於將複合膜599轉化成光伏吸收 層所需的期望化學計量學的室内納摻雜。另外,用於將複合膜轉 化成光伏吸收層的工藝可以在以下描述中找到。 在工藝1〇4〇結束時’並且利用用於交換實施第一麟工藝、 第二濺射I藝和第三雜工藝輔相選擇,在I藝腳形成包 含銅、鎵、銦和鈉物種的複合膜599。隨後,方法麵包括使複 口膜599經歷熱處理工藝以形成具有黃銅礦結構的光伏吸收層的 工藝(工藝1060)。該工藝能夠通過圖6可視地舉例說明。圖6 是舉例說明根據本發明的一個實施方式的將複合膜599轉化 成光伏吸收層的-個熱處理工藝的簡化圖。該圖僅是一個實施 例’其不應該過度地限制本文所附權利要求的範圍。本領域的普 通技術人員將會認酬許多變形、替代和修改。在形成包括分別 在多個前沉積工藝中形成的銅和鎵層3〇〇、銦層4〇〇和含納層 500的複合膜599之後,透明襯底可以經由轉移工具從第一室 10或第二室10轉移到擴散爐(diffllsion免咖⑶)3〇 (細節未示出) 中。同樣’娜Ji具(未示丨)舰至少被設計成確健蓋概底 的複合膜599不會暴露于濕度高於·肪的濕氣。第—室⑴、 第二室20和爐30 ’包括一些轉移工具,都能夠被構造成為同一大 規模成批系統的部分。在一種實施方式中,第一室1〇和第二室2〇 是相同的。如圖6中所示,覆蓋有複合膜柳的透明襯底在 201128793 擴散爐30中經歷熱處理工藝650。事實上,多個製備的襯底(高 達40個或更多)能夠同時載入(通過垂直懸掛以防止其松垂 (sagging)等)到用於該工藝的大規模成批系統的擴散爐3〇中 在一個具體實施方式中’熱處理工藝650在能夠從室溫上升至約 500°C或更高的可變溫環境中實施。擴散爐30可以被設計成以期 望速率升溫並將溫度以約±幾度的精度控制在合適的範圍。在一個 實施例中,擴散爐30是一種定制設計的快速熱處理器。在另一個 具體實施方式中,熱處理工藝650在包含流體(fluidic,流動的) 含砸材料的環境中實施。熱處理工藝650也是一個硒化過程。在 一個實施例中,流體含砸材料是氣相元素砸(或碼蒸氣)。在另 一實施例中,使用了硒化氫(HJe)。熱處理基本上是反應性退 火和擴散過程。有時’可以加入氮氣用於增強擴散爐的熱均一性。 在對於大的成批系統的一種實施方式中,需要獲得合適的溫度分 佈。熱處理工藝通常在室溫下開始,其中利用提供到擴散爐中 與氮氣混合的碼化氫氣體的某種組成。溫度在相同的氣體混合物 組成下升高至約420±20°C,隨後保持約i/2h至ih的時間。然後, 抽出工作氣體以除去硒化物物種,從而停止反應過程。然後在溫 ,進-步升高至約5G(TC或更高之前流入邮。可選地,還加^ 氣以將玻璃襯底保持在基本上均勻的溫度下。加入氣體能夠 有助於通過鈍化介面和產生背面電場而改變光伏吸收層的譜帶和 光學分佈,從而產生更高的開路電壓。作為具_熱處理^的 結果’可以形成在黃銅礦結構中的銅銦鎵二石西化物CuIn(Ga)s: (CIGS )或 CuInSe2 (CIS )的臈 _。 2 根據本發_-個實施方式,CIGS黃_吸收層的形成 施至内鈉摻雜藝(第三濺射工#麵)之·行。在工藝麵 中加入的含鋪獅在祕理工藝躺在幫麵_巾^晶至 201128793 銅礦結構晶粒的生長方面起重要作用。具體而言’在受控摻雜濃 度下的鈉原子有助於黃銅礦晶粒以高達幾個微米的較大尺寸生 長。在沒有鈉原子的輔助或在不受控鈉含量的過量供給下’黃銅 礦晶粒將會變得顯著更細,導致在光伏電流大大降低以及太陽能 器件的效能降低。根據本發明的實施方式,納含量能夠通過室内 鈉摻雜工藝進行良好控制,該摻雜工藝簡單地是利用具有分佈於 佰主材料中的均勻組成的鈉物種的含鈉靶的濺射工藝(例如,第 二濺射工藝)。在一個實施方式中,在該CIGS黃銅礦光伏吸收層 中優選的納紐為約5xlG19原子/em3。在某些其他實施方式中,納 摻雜也可以通職儒I藝缝浸潰工藝實施。當然,對於實施 用於形成黃銅礦光伏吸收劑層的鈉摻雜,還存在許多替代、變形 和修改。 在一個可替代的實施方式中,熱處理工藝65G也可以是硫化 工藝’其中擴散爐30保持在具有流體相含硫物種的環境中。例如, 含硫物種可⑽溶液提供,其巾轉有Na2S、CS2、卿Μ、硫 代硫,鹽等。在另-實施例中,含硫物種可岐氣相中的硫化氣。 作為這些涉及硫化物的具體熱處理工藝的結果,也可以形成黃銅 礦„銦鎵二硫化物材料⑽(Ga) S2或c福2的膜_。 般而。熱處理I藝將會導細崎和沉積的包含銅、銦、録和 發生反應。在合適條件下_反應至少軸形成含有 夕個黃銅礦結構晶粒的膜6〇〇。 - 了,二r上對於cis和/或CIGS薄膜太陽能電池的具體結構進 ί明祕销描述但是在不_本文騎要求所描述的本 如 其他特定的cis和,或⑽構造也能夠使用,, 此、將二4’612’411和美國專利n〇·4,611,091中提及的那 二將匕們結合于本文中作為參考。 201128793 ,在某些其他實施方式,方法1000可以包括對於在透明襯底上 製造薄膜絲電池所需的-個或乡個工藝1(m)。例如,方法麵 可以包括形成硫化鎘層(作為覆蓋黃銅礦光伏吸收層的視窗層) 的工藝。硫化錢層特徵為寬頻隙半導體,用於之後形成的薄膜光 伏電池。在一個實施例中,硫化鎘層505可以利用濺射、真空蒸 發或化學浴沉積(CBD)技術軸並摻雜有祕導雜的n_型雜 質。根據實施方式’視窗層可以選自由硫化録(Cds)、硫化辞 (ZnS)、砸化辞(ZnSe)、氧化鋅(Zn〇)、氧化鎮辞(ZnM糾 等構成的材料組。 另外,應該加入覆蓋於黃銅礦吸收層的上電極層,或在一些 實施方式巾’直接覆蓋視g層。上雜層典魏要求是光學透明 的。-種廣泛使用的用於上電極層材料是透明的導電性氧化物。 例如,使用特徵在於電阻率為約1〇_3Qcm和更低的氧化辞膜。在 一個具體實施方式巾’加人第—氧化鋅層覆蓋視紐。在另一個 具體實施方式巾n化觸插人在視紐和第―氧化辞層之 ,。在-個具體實財式H氧化騎具有㈣阻率高二第 -氧化辞層。魏上,第二氧鱗層更多地起著_/保護層的作 用,而具有較低電阻率的第-氧化鋅層更多地起著導 作用。在某個實施方式中,氧化辞層在同一大規模 用金屬有機化學氣相沉積(MOCVD)技術形成。 另外’方法1000可以包括將包括複合膜的透明襯底維持在基 本上無濕氣的環境的卫藝。該玉藝可以在室峨摻雜工藝之後並 在熱處理卫藝之前實施。在—種實施方式中,該1藝在第一室内 形成銅和鎵層以及靖之後並在轉_第二室用^施納推雜工 f之前實施。在另-種實施方式中,該工藝也在形成鋼基黃銅確 光伏吸收層之後並在轉移到擴散爐之前實施。由於包含銅、鎵、 201128793 銦、鈉物種的特定膜組成,所以將膜暴露于水蒸汽潮濕下可能會 引起膜的晶粒結構發生嚴重破壞並最終導致其光伏效率降低。在 :個實施例中,半成品,例如,具有覆蓋組合物膜或剛形成的光 伏吸收層或吸收層加視窗層的鈉鈣玻璃襯底,可以儲存在濕度低 於10%RH的乾燥器中。在另一實施例中,半成品能夠儲存在水溶 液中。 儘管以上已經根據具體實施方式進行了舉例說明,但是可以 有其他的修改、替代和變形。應該理解,本文中描述的實施例和 實施方式僅僅是為了舉例說明的目的並且依據其的各種修改或變 化將會對本領域的技術人員給出啟示,而這些修改或變化也將包 括在本申請的精神和範圍以及所附權利要求的範圍内。 【圖式簡單說明】 圖1是舉例說明根據本發明一個實施方式的一種製造薄膜光 伏電池的方法的簡化流程圖; 圖2〜6是舉例說明根據本發明某些實施方式的包括用於製造 薄膜光伏電池而包含一系列工藝和結構的方法的示意圖。 【主要元件符號說明】 10 第一室 20 第二室 3〇 擴散爐 100透明襯底 200第一電極層 300銅和嫁層 400銦層 500含鈉層 201128793 599複合膜 600膜 650熱處理工藝
Claims (1)
- 201128793 七、申請專利範圍: 1. -種利㈣射讀力江光伏材料的方法,所述方法包括: 提供至少-個具有上覆第—電極層的透明概底; 在第至内彻第-崎卫藝,由包含鋼物種和鎵物種的第 一靶形成上覆銅和鎵層; 在所述,至内糊第二濺射1藝,由包含銦物種的第二乾 形成覆蓋所述銅和嫁層的鋼層; 在所述第-室内利用第三濺射工藝,形成覆蓋所述鋼層的含 納層由此形成包括所述銅和鎵層、所述銦層錢所述含納 層的複合膜;以及 使所述複合酿歷至少—輸處理工藝以形成其巾包含銅、 銦、鎵和鈉的黃銅礦吸收層。 2·如申請專利範圍第i項所述的方法,其中,所述透明襯底包 括鈉鈣玻璃襯底。 3·如申請專利範圍第1項所述的方法,其中,所述第一電極層 包含雙層翻材料。 如申明專利fell第1項所述的方法,其中,所述黃銅礦吸收 層包括具有納摻雜的CuInSe2 (CIS)或CuIn㈣% (aGS) 或CuIn(Ga)S2的化合物半導體。 5. 如申請專利範圍第1項所述的方法,其巾,所述黃銅礦吸收 層在熱處理工藝之後在整個所述吸收層中包含平均原子密度 為約5xl019原子/cm3的鈉。 6. 如巾st專利範圍第1項所述的方法,其巾,所述第一舰工 藝能夠在所述第二濺射工藝之後實施,以使所述銅和鎵層覆 蓋所述銦層。 7. 如申請專利範圍第1項所述的方法,其中,所述第三濺射工 20 201128793 藝能夠在所述第二濺射工藝之後實施,接著是所述第一濺射 工藝,以使所述含鈉物種形成在所述銦層與所述銅和鎵層之 間。 8.如申請專概圍第1項所述的方法,其巾,所述第三麟工 藝使用分佈在宿主材料中的具有均勻組成的所述鈉物種的含 納乾。 9·如申睛專利範圍第丨項所述的方法,其中,所述第一賤射工 藝、所述第二滅射工藝和所述第三減射工藝在同一個室内但 在不同隔間中實施。 10. 如申請專利範圍第i項所述的方法,其中’所述熱處理工藝 在從室溫升高至超過約5(xrc或更高的溫度下實施。 11. 如申請專利範圍第i項所述的方法,其中,所述熱處理工藝 在流體硒化物或流體硫化物環境中實施。 12. -種利麟射工藝加工光伏材料的方法所述方法包括: 提供至少-個具有上覆第_電極層的透明概底; 在第-至内糊第-雜工藝,由包含銅物種和鎵物種的第 一靶形成上覆銅和鎵層; 在所述第-至關用第二崎工藝,由包含銦物種的第二乾 形成覆蓋所述銅和鎵層的銦層; 將包括覆蓋所述銅層的所述銦層的所述透明概底轉移到第二 室,同時沒有破壞所述第-室和第二室之間的真空以將所述 銅鎵層和铜層維持為基本上無濕氣; 在所述第二室内利用第三濺射工藝,’形成覆蓋所述銦層的含 鈉層,由此形成包括所述銅和錄層、所述姻層以及 層的複合膜; 使所述複合膜經歷至少-個熱處理卫藝以形成其中包含銅、 21 201128793 銦、鎵和鈉的黃銅礦吸收層;以及 =括所賴合_崎翻襯底轉在基本上無濕氣的環 措Φ。 13. 如申請專利範圍第12項所述的方法 燥空氣。 ’其中’所述環境包括乾 K如申請專利範圍第12項所述的方法,其中,所述環境包括乾 燥氮氣。 15.如申請專利範圍第12項所述的方法,其中,所述透明概底包 括鈉鈣玻璃襯底。 16·如申請專利範圍第12項所述的方法,其巾,所述第一電極層 包含翻材料。 Π.如申請專利範圍第12項所述的方法,其中,所述黃銅礦吸收 層包含 CUlnSe2 (CIS)或 CuIn(G物2 (CIGS)或 Cuin(Ga)S2 的化合物半導體。 18·如申請專利範圍第12項所述的方法,其中’所述黃銅礦吸收 層在熱處理工藝之後包含約5χ1〇19原子細3的納濃度。 19.如申請專利範圍第12項所述的方法,其中,所述第^減射工 ,能夠在所述第三濺射工藝之後實施,以使所義和錄層覆 蓋所述銦層。 20·如▲申請專利範圍帛12項所述的方法,其中,所述第三麟工 藝能夠在所述第二麟卫藝之後實施,接著是所述第一滅射 工藝,以使含鈉物種形成在所述銦層與所述銅和鎵層之間。 21. 如申請專利範圍帛12項所述的方法,其中,所述第^射工 藝使用分佈在宿主材料中的具有均勻組成的所述鋼物種的含 納乾。 22. 如申請專利範圍第12項所述的方法,其中,所述第一激射工 22 201128793 藝,所述第二減射工藝和所述第 在不同隔間中實施。 三錢射工藝在同一個室内但 23. 24. 25. 26. 27. 28. 29. 月專她圍第12項所述的方法,其中所述熱處理工藝 、政爐中在w體砸化物或流體硫化物環境中實施。 2切專他圍第23顿述的方法,其巾,所述流體栖化物 ^境包含硒化歧體’而所述流體硫化物環祕含硫化氮氣 體0 如申睛專利範圍第23項所述的方法,其中,所述熱處理工藝 利用加入以增騎述擴散爐巾的溫度均勻性眺氣來實施。 一種加工光伏材料的方法,所述方法包括: k供具有上覆钥層的襯底; 形成覆蓋所述鉬層的含鈉層; 形成覆蓋所述含鈉層的包含銅、鎵和銦的前體層;以及 使所述前體層經歷熱處理;L藝以形成包括其巾包含銅、姻、 鎵和鈉的黃銅礦結構的光伏吸收層。 如申叫專利$〖圍第26項所述的方法,其中,所述襯底是光滑 板。 如申明專利範圍第26項所述的方法,其中,形成所述含納層 疋通過在包含與銅和鎵混合的Na2Se03的靶上濺射而實施 的’其中總計含8at°/〇的鈉。 如申凊專利範圍第26項所述的方法,其中,使所述前體層經 歷熱處理包括在含栖的氣體環境下將工藝溫度升高至 500。(:。 23
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-
2009
- 2009-09-23 US US12/565,749 patent/US8425739B1/en not_active Expired - Fee Related
-
2010
- 2010-09-23 EP EP10179064.0A patent/EP2306524A3/en not_active Withdrawn
- 2010-09-23 TW TW099132118A patent/TWI520366B/zh not_active IP Right Cessation
- 2010-09-25 CN CN201010293817.4A patent/CN102168252B/zh not_active Expired - Fee Related
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Publication number | Publication date |
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EP2306524A3 (en) | 2014-08-06 |
US8425739B1 (en) | 2013-04-23 |
TWI520366B (zh) | 2016-02-01 |
CN102168252A (zh) | 2011-08-31 |
CN102168252B (zh) | 2016-03-02 |
EP2306524A2 (en) | 2011-04-06 |
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