TW200845835A - Wiring substrate and method of manufacturing the same - Google Patents

Wiring substrate and method of manufacturing the same Download PDF

Info

Publication number
TW200845835A
TW200845835A TW097110025A TW97110025A TW200845835A TW 200845835 A TW200845835 A TW 200845835A TW 097110025 A TW097110025 A TW 097110025A TW 97110025 A TW97110025 A TW 97110025A TW 200845835 A TW200845835 A TW 200845835A
Authority
TW
Taiwan
Prior art keywords
layer
hole
wiring
substrate
wiring pattern
Prior art date
Application number
TW097110025A
Other languages
English (en)
Chinese (zh)
Inventor
Akio Horiuchi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200845835A publication Critical patent/TW200845835A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW097110025A 2007-05-08 2008-03-21 Wiring substrate and method of manufacturing the same TW200845835A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007123154A JP2008282842A (ja) 2007-05-08 2007-05-08 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TW200845835A true TW200845835A (en) 2008-11-16

Family

ID=39968500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110025A TW200845835A (en) 2007-05-08 2008-03-21 Wiring substrate and method of manufacturing the same

Country Status (4)

Country Link
US (2) US20080277155A1 (https=)
JP (1) JP2008282842A (https=)
KR (1) KR20080099128A (https=)
TW (1) TW200845835A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI842547B (zh) * 2023-05-24 2024-05-11 大陸商慶鼎精密電子（淮安）有限公司 電路板及其製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5313202B2 (ja) * 2010-04-30 2013-10-09 日本メクトロン株式会社 ビルドアップ型多層プリント配線板及びその製造方法
CN103299393B (zh) * 2010-10-19 2017-02-15 惠亚集团公司 制造具有带包绕镀层的通道的印刷电路板的方法
KR101165330B1 (ko) 2010-11-11 2012-07-18 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US10028394B2 (en) * 2012-12-17 2018-07-17 Intel Corporation Electrical interconnect formed through buildup process
JP6819268B2 (ja) * 2016-12-15 2021-01-27 凸版印刷株式会社 配線基板、多層配線基板、及び配線基板の製造方法
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
JP7336845B2 (ja) * 2018-11-30 2023-09-01 京セラ株式会社 印刷配線板の製造方法
JP7237572B2 (ja) * 2018-12-27 2023-03-13 京セラ株式会社 印刷配線板の製造方法及び複合印刷配線板の製造方法
DE102019108870A1 (de) * 2019-04-04 2020-10-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Träger mit verkleinerter Durchkontaktierung
TWI744896B (zh) * 2020-05-12 2021-11-01 台灣愛司帝科技股份有限公司 導電玻璃基板以及導電玻璃基板的製造系統與製作方法
KR20220059740A (ko) * 2020-11-03 2022-05-10 삼성전기주식회사 인쇄회로기판
CN112788853A (zh) * 2021-01-09 2021-05-11 勤基电路板（深圳）有限公司 一种增加过孔处焊盘面积的电路板的生产工艺及该电路板
CN113725150B (zh) * 2021-08-30 2024-06-07 中国电子科技集团公司第五十八研究所 一种通孔填充制作方法
WO2024034703A1 (ko) * 2022-08-10 2024-02-15 엘지전자 주식회사 인쇄회로기판 및 그 제조방법
CN115334764A (zh) * 2022-08-10 2022-11-11 惠州市纬德电路有限公司 一种台阶型邦定铜帽pad的pcb制作工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
JP3375732B2 (ja) * 1994-06-07 2003-02-10 株式会社日立製作所 薄膜配線の形成方法
TWI310670B (en) * 2003-08-28 2009-06-01 Ibm Printed wiring board manufacturing method and printed wiring board
JP4549807B2 (ja) * 2004-10-27 2010-09-22 シャープ株式会社 多層プリント配線板の製造方法、多層プリント配線板及び電子装置
JP2006216714A (ja) * 2005-02-02 2006-08-17 Ibiden Co Ltd 多層プリント配線板
JP2006294956A (ja) * 2005-04-13 2006-10-26 Cmk Corp 多層プリント配線板とその製造方法
JP2007129180A (ja) * 2005-10-03 2007-05-24 Cmk Corp プリント配線板、多層プリント配線板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI842547B (zh) * 2023-05-24 2024-05-11 大陸商慶鼎精密電子（淮安）有限公司 電路板及其製造方法

Also Published As

Publication number Publication date
US20110258850A1 (en) 2011-10-27
KR20080099128A (ko) 2008-11-12
US20080277155A1 (en) 2008-11-13
JP2008282842A (ja) 2008-11-20

Similar Documents

Publication Publication Date Title
TW200845835A (en) Wiring substrate and method of manufacturing the same
CN100435299C (zh) 布线基板的制备方法
JP4271590B2 (ja) 半導体装置及びその製造方法
JP4431123B2 (ja) 電子装置用基板およびその製造方法、並びに電子装置およびその製造方法
JP5221315B2 (ja) 配線基板及びその製造方法
TWI471956B (zh) 半導體封裝與製造方法
JP2002050871A (ja) ビルドアップ回路基板およびその製造方法
JP2005217225A (ja) 半導体装置及びその製造方法
TW200921816A (en) Method of making multi-layer package board of copper nuclear layer
JP2010141204A (ja) 配線基板及びその製造方法
JP2008300507A (ja) 配線基板とその製造方法
JP4489821B2 (ja) 半導体装置及びその製造方法
JP4935139B2 (ja) 多層プリント配線板
TWI389279B (zh) 電路板結構及其製法
CN102056398A (zh) 电路板结构及其制法
JP3981227B2 (ja) 多層配線基板とその製造方法
JP4759981B2 (ja) 電子部品内蔵モジュールの製造方法
TWI295912B (en) Method for manufacturing a substrate embedded with an electronic component and device from the same
JP4454814B2 (ja) 樹脂封止型半導体装置及びその製造方法
KR20070068445A (ko) 유전체의 표면에 매입된 금속 트레이스들을 갖는 상호접속소자를 제조하는 구조와 방법
JP2012248891A (ja) 配線基板及びその製造方法
US20040105955A1 (en) Lamination process and structure of high layout density substrate
JP4788654B2 (ja) 配線板の製造方法
JP2006245213A (ja) 配線基板の製造方法
JP2010067888A (ja) 配線基板及びその製造方法