TW200818380A - Substrate processing method and substrate processing apparatus - Google Patents

Substrate processing method and substrate processing apparatus Download PDF

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Publication number
TW200818380A
TW200818380A TW096123286A TW96123286A TW200818380A TW 200818380 A TW200818380 A TW 200818380A TW 096123286 A TW096123286 A TW 096123286A TW 96123286 A TW96123286 A TW 96123286A TW 200818380 A TW200818380 A TW 200818380A
Authority
TW
Taiwan
Prior art keywords
substrate
posture
processing
tilt
cleaning
Prior art date
Application number
TW096123286A
Other languages
English (en)
Chinese (zh)
Other versions
TWI343088B (https=
Inventor
Hideto Yamaoka
Takuya Zushi
Mitsuaki Yoshitani
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200818380A publication Critical patent/TW200818380A/zh
Application granted granted Critical
Publication of TWI343088B publication Critical patent/TWI343088B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
TW096123286A 2006-07-24 2007-06-27 Substrate processing method and substrate processing apparatus TW200818380A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006201040A JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
TW200818380A true TW200818380A (en) 2008-04-16
TWI343088B TWI343088B (https=) 2011-06-01

Family

ID=39022826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123286A TW200818380A (en) 2006-07-24 2007-06-27 Substrate processing method and substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP2008028247A (https=)
KR (1) KR100866001B1 (https=)
CN (1) CN101114578B (https=)
TW (1) TW200818380A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
TWI415210B (zh) * 2008-06-12 2013-11-11 細美事有限公司 Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same
TWI874634B (zh) * 2020-04-06 2025-03-01 日商日本電氣硝子股份有限公司 玻璃板的製造方法及其製造裝置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
JP6887616B2 (ja) * 2017-05-09 2021-06-16 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN107962501B (zh) * 2017-12-01 2019-09-20 福建和达玻璃技术有限公司 带倾角的异形玻璃盖板防眩表面处理设备
CN108000368B (zh) * 2017-12-01 2020-03-31 福建和达玻璃技术有限公司 曲边玻璃盖板防眩表面处理设备与处理方法
CN108380564A (zh) * 2018-02-05 2018-08-10 武汉华星光电技术有限公司 具有自动清洗功能的显影腔室及其清洗组件、清洗方法
JP7642005B2 (ja) 2023-03-10 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板姿勢変更装置および基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704064B2 (ja) 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法
JP4076755B2 (ja) 2001-11-02 2008-04-16 アルプス電気株式会社 ウエット処理装置およびウエット処理方法
JP4309782B2 (ja) 2004-02-27 2009-08-05 シャープ株式会社 液処理装置および液処理方法
KR100602410B1 (ko) * 2006-01-27 2006-07-20 주식회사 디엠에스 평판 처리 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415210B (zh) * 2008-06-12 2013-11-11 細美事有限公司 Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
TWI874634B (zh) * 2020-04-06 2025-03-01 日商日本電氣硝子股份有限公司 玻璃板的製造方法及其製造裝置

Also Published As

Publication number Publication date
KR100866001B1 (ko) 2008-10-29
CN101114578A (zh) 2008-01-30
CN101114578B (zh) 2011-08-10
JP2008028247A (ja) 2008-02-07
KR20080009661A (ko) 2008-01-29
TWI343088B (https=) 2011-06-01

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