CN101114578B - 基板处理方法及基板处理装置 - Google Patents

基板处理方法及基板处理装置 Download PDF

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Publication number
CN101114578B
CN101114578B CN2007101373080A CN200710137308A CN101114578B CN 101114578 B CN101114578 B CN 101114578B CN 2007101373080 A CN2007101373080 A CN 2007101373080A CN 200710137308 A CN200710137308 A CN 200710137308A CN 101114578 B CN101114578 B CN 101114578B
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CN
China
Prior art keywords
substrate
attitude
posture
posture changing
lateral attitude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007101373080A
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English (en)
Chinese (zh)
Other versions
CN101114578A (zh
Inventor
山冈英人
厨子卓哉
芳谷光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN101114578A publication Critical patent/CN101114578A/zh
Application granted granted Critical
Publication of CN101114578B publication Critical patent/CN101114578B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
CN2007101373080A 2006-07-24 2007-07-20 基板处理方法及基板处理装置 Expired - Fee Related CN101114578B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-201040 2006-07-24
JP2006201040A JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置
JP2006201040 2006-07-24

Publications (2)

Publication Number Publication Date
CN101114578A CN101114578A (zh) 2008-01-30
CN101114578B true CN101114578B (zh) 2011-08-10

Family

ID=39022826

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007101373080A Expired - Fee Related CN101114578B (zh) 2006-07-24 2007-07-20 基板处理方法及基板处理装置

Country Status (4)

Country Link
JP (1) JP2008028247A (https=)
KR (1) KR100866001B1 (https=)
CN (1) CN101114578B (https=)
TW (1) TW200818380A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100978852B1 (ko) * 2008-06-12 2010-08-31 세메스 주식회사 기판 반송 장치 및 그 방법 그리고 그 장치를 갖는 기판제조 설비
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN103324038A (zh) * 2013-06-25 2013-09-25 京东方科技集团股份有限公司 一种显影装置及显影方法
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
JP6887616B2 (ja) * 2017-05-09 2021-06-16 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN107962501B (zh) * 2017-12-01 2019-09-20 福建和达玻璃技术有限公司 带倾角的异形玻璃盖板防眩表面处理设备
CN108000368B (zh) * 2017-12-01 2020-03-31 福建和达玻璃技术有限公司 曲边玻璃盖板防眩表面处理设备与处理方法
CN108380564A (zh) * 2018-02-05 2018-08-10 武汉华星光电技术有限公司 具有自动清洗功能的显影腔室及其清洗组件、清洗方法
WO2021205898A1 (ja) * 2020-04-06 2021-10-14 日本電気硝子株式会社 ガラス板の製造方法及び製造装置
JP7642005B2 (ja) 2023-03-10 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板姿勢変更装置および基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704064B2 (ja) 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法
JP4076755B2 (ja) 2001-11-02 2008-04-16 アルプス電気株式会社 ウエット処理装置およびウエット処理方法
JP4309782B2 (ja) 2004-02-27 2009-08-05 シャープ株式会社 液処理装置および液処理方法
KR100602410B1 (ko) * 2006-01-27 2006-07-20 주식회사 디엠에스 평판 처리 장치

Also Published As

Publication number Publication date
KR100866001B1 (ko) 2008-10-29
CN101114578A (zh) 2008-01-30
JP2008028247A (ja) 2008-02-07
KR20080009661A (ko) 2008-01-29
TWI343088B (https=) 2011-06-01
TW200818380A (en) 2008-04-16

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Granted publication date: 20110810

Termination date: 20130720