JP2008028247A - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
JP2008028247A
JP2008028247A JP2006201040A JP2006201040A JP2008028247A JP 2008028247 A JP2008028247 A JP 2008028247A JP 2006201040 A JP2006201040 A JP 2006201040A JP 2006201040 A JP2006201040 A JP 2006201040A JP 2008028247 A JP2008028247 A JP 2008028247A
Authority
JP
Japan
Prior art keywords
substrate
posture
processing
cleaning
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2006201040A
Other languages
English (en)
Japanese (ja)
Inventor
Hideto Yamaoka
英人 山岡
Takuya Zushi
卓哉 厨子
Mitsuaki Yoshitani
光明 芳谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2006201040A priority Critical patent/JP2008028247A/ja
Priority to TW096123286A priority patent/TW200818380A/zh
Priority to CN2007101373080A priority patent/CN101114578B/zh
Priority to KR1020070073891A priority patent/KR100866001B1/ko
Publication of JP2008028247A publication Critical patent/JP2008028247A/ja
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3211—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
JP2006201040A 2006-07-24 2006-07-24 基板処理方法および基板処理装置 Abandoned JP2008028247A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006201040A JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置
TW096123286A TW200818380A (en) 2006-07-24 2007-06-27 Substrate processing method and substrate processing apparatus
CN2007101373080A CN101114578B (zh) 2006-07-24 2007-07-20 基板处理方法及基板处理装置
KR1020070073891A KR100866001B1 (ko) 2006-07-24 2007-07-24 기판 처리 방법 및 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006201040A JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
JP2008028247A true JP2008028247A (ja) 2008-02-07

Family

ID=39022826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006201040A Abandoned JP2008028247A (ja) 2006-07-24 2006-07-24 基板処理方法および基板処理装置

Country Status (4)

Country Link
JP (1) JP2008028247A (https=)
KR (1) KR100866001B1 (https=)
CN (1) CN101114578B (https=)
TW (1) TW200818380A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150234326A1 (en) * 2013-06-25 2015-08-20 Boe Technology Group Co., Ltd. Developing device and developing method
WO2018207536A1 (ja) * 2017-05-09 2018-11-15 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
JP7642005B2 (ja) 2023-03-10 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板姿勢変更装置および基板処理装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100978852B1 (ko) * 2008-06-12 2010-08-31 세메스 주식회사 기판 반송 장치 및 그 방법 그리고 그 장치를 갖는 기판제조 설비
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
CN108325900B (zh) * 2017-09-19 2021-02-02 福建晟哲自动化科技有限公司 一种液晶面板清洗设备
CN107962501B (zh) * 2017-12-01 2019-09-20 福建和达玻璃技术有限公司 带倾角的异形玻璃盖板防眩表面处理设备
CN108000368B (zh) * 2017-12-01 2020-03-31 福建和达玻璃技术有限公司 曲边玻璃盖板防眩表面处理设备与处理方法
CN108380564A (zh) * 2018-02-05 2018-08-10 武汉华星光电技术有限公司 具有自动清洗功能的显影腔室及其清洗组件、清洗方法
WO2021205898A1 (ja) * 2020-04-06 2021-10-14 日本電気硝子株式会社 ガラス板の製造方法及び製造装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704064B2 (ja) 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法
JP4076755B2 (ja) 2001-11-02 2008-04-16 アルプス電気株式会社 ウエット処理装置およびウエット処理方法
JP4309782B2 (ja) 2004-02-27 2009-08-05 シャープ株式会社 液処理装置および液処理方法
KR100602410B1 (ko) * 2006-01-27 2006-07-20 주식회사 디엠에스 평판 처리 장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150234326A1 (en) * 2013-06-25 2015-08-20 Boe Technology Group Co., Ltd. Developing device and developing method
US9581939B2 (en) * 2013-06-25 2017-02-28 Boe Technology Group Co., Ltd. Developing device and developing method
WO2018207536A1 (ja) * 2017-05-09 2018-11-15 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
JP2018188276A (ja) * 2017-05-09 2018-11-29 日本電気硝子株式会社 ガラス板の搬送装置及びガラス板の製造方法
JP7642005B2 (ja) 2023-03-10 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板姿勢変更装置および基板処理装置

Also Published As

Publication number Publication date
KR100866001B1 (ko) 2008-10-29
CN101114578A (zh) 2008-01-30
CN101114578B (zh) 2011-08-10
KR20080009661A (ko) 2008-01-29
TWI343088B (https=) 2011-06-01
TW200818380A (en) 2008-04-16

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A621 Written request for application examination

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Effective date: 20090205

A762 Written abandonment of application

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Effective date: 20100604