TW200816316A - Film forming method and film forming apparatus - Google Patents
Film forming method and film forming apparatus Download PDFInfo
- Publication number
- TW200816316A TW200816316A TW096117520A TW96117520A TW200816316A TW 200816316 A TW200816316 A TW 200816316A TW 096117520 A TW096117520 A TW 096117520A TW 96117520 A TW96117520 A TW 96117520A TW 200816316 A TW200816316 A TW 200816316A
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- film forming
- tungsten
- processing container
- film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/08—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
- C23C16/14—Deposition of only one other metal element
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006136560A JP5135710B2 (ja) | 2006-05-16 | 2006-05-16 | 成膜方法及び成膜装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200816316A true TW200816316A (en) | 2008-04-01 |
Family
ID=38693976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096117520A TW200816316A (en) | 2006-05-16 | 2007-05-16 | Film forming method and film forming apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5135710B2 (ja) |
KR (1) | KR101130897B1 (ja) |
CN (1) | CN101448971A (ja) |
TW (1) | TW200816316A (ja) |
WO (1) | WO2007132887A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010059488A (ja) * | 2008-09-03 | 2010-03-18 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
US8460466B2 (en) * | 2010-08-02 | 2013-06-11 | Veeco Instruments Inc. | Exhaust for CVD reactor |
KR101855217B1 (ko) | 2010-12-30 | 2018-05-08 | 비코 인스트루먼츠 인코포레이티드 | 캐리어 연장부를 이용한 웨이퍼 처리 |
CN102978582B (zh) * | 2012-11-26 | 2014-07-16 | 厦门嘉鹭金属工业有限公司 | 一种纯钨毛细管的生产装置 |
US9388493B2 (en) | 2013-01-08 | 2016-07-12 | Veeco Instruments Inc. | Self-cleaning shutter for CVD reactor |
CN103915304B (zh) * | 2014-03-18 | 2016-08-17 | 京东方科技集团股份有限公司 | 一种等离子体刻蚀装置及干法刻蚀设备 |
US9536745B2 (en) * | 2015-01-30 | 2017-01-03 | Tokyo Electron Limited | Tungsten film forming method |
JP6529129B2 (ja) * | 2015-11-30 | 2019-06-12 | 株式会社フィルテック | 成膜装置 |
JP6604895B2 (ja) * | 2016-04-13 | 2019-11-13 | 日立造船株式会社 | 排ガス処理装置の製造方法 |
AT519217B1 (de) | 2016-10-04 | 2018-08-15 | Carboncompetence Gmbh | Vorrichtung und Verfahren zum Aufbringen einer Kohlenstoffschicht |
CN107447201B (zh) * | 2017-08-14 | 2019-05-07 | 北京理工大学 | 一种钨制品的制备装置及方法 |
CN109750274B (zh) * | 2017-11-01 | 2021-10-22 | 长鑫存储技术有限公司 | 半导体生产设备及半导体工艺方法 |
JP7224175B2 (ja) * | 2018-12-26 | 2023-02-17 | 東京エレクトロン株式会社 | 成膜装置及び方法 |
CN110699663B (zh) * | 2019-09-09 | 2022-11-22 | 长江存储科技有限责任公司 | 金属薄膜沉积方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3522737B2 (ja) * | 1992-07-24 | 2004-04-26 | 東京エレクトロン株式会社 | 化学気相成長によるタングステン薄膜形成方法 |
JP2000260721A (ja) * | 1999-01-08 | 2000-09-22 | Sony Corp | 化学的気相成長装置、化学的気相成長方法および化学的気相成長装置のクリーニング方法 |
JP2000269163A (ja) * | 1999-03-18 | 2000-09-29 | Sony Corp | 金属膜の形成方法及び配線の形成方法 |
JP4126517B2 (ja) * | 1999-04-08 | 2008-07-30 | ソニー株式会社 | 気相加工装置 |
WO2000063956A1 (fr) * | 1999-04-20 | 2000-10-26 | Sony Corporation | Procede et dispositif pour realiser un depot de couches minces, et procede pour la production d'un dispositif a semiconducteur a couches minces |
JP4459329B2 (ja) * | 1999-08-05 | 2010-04-28 | キヤノンアネルバ株式会社 | 付着膜の除去方法及び除去装置 |
AU2002214283A1 (en) * | 2000-11-17 | 2002-05-27 | Tokyo Electron Limited | Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring |
JP4035011B2 (ja) * | 2002-07-17 | 2008-01-16 | 株式会社アルバック | 触媒cvd用触媒線 |
JP3835376B2 (ja) * | 2002-08-23 | 2006-10-18 | 東京エレクトロン株式会社 | 成膜処理装置 |
JP2004115844A (ja) * | 2002-09-25 | 2004-04-15 | Kyocera Corp | 薄膜デバイス用製造装置および薄膜デバイスの製造方法 |
JP4283168B2 (ja) * | 2004-06-16 | 2009-06-24 | 独立行政法人科学技術振興機構 | 成膜装置 |
JP4674061B2 (ja) * | 2004-07-14 | 2011-04-20 | 株式会社アルバック | 薄膜形成方法 |
-
2006
- 2006-05-16 JP JP2006136560A patent/JP5135710B2/ja active Active
-
2007
- 2007-05-16 KR KR1020087027767A patent/KR101130897B1/ko not_active IP Right Cessation
- 2007-05-16 TW TW096117520A patent/TW200816316A/zh unknown
- 2007-05-16 WO PCT/JP2007/060030 patent/WO2007132887A1/ja active Application Filing
- 2007-05-16 CN CNA2007800178182A patent/CN101448971A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP5135710B2 (ja) | 2013-02-06 |
CN101448971A (zh) | 2009-06-03 |
KR101130897B1 (ko) | 2012-03-28 |
JP2007308735A (ja) | 2007-11-29 |
WO2007132887A1 (ja) | 2007-11-22 |
KR20080110903A (ko) | 2008-12-19 |
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