TW200811236A - Flexible substrate, solder resist composition therefor, and manufacturing method thereof - Google Patents

Flexible substrate, solder resist composition therefor, and manufacturing method thereof Download PDF

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Publication number
TW200811236A
TW200811236A TW096115966A TW96115966A TW200811236A TW 200811236 A TW200811236 A TW 200811236A TW 096115966 A TW096115966 A TW 096115966A TW 96115966 A TW96115966 A TW 96115966A TW 200811236 A TW200811236 A TW 200811236A
Authority
TW
Taiwan
Prior art keywords
solder resist
epoxy resin
resist composition
flexible substrate
type epoxy
Prior art date
Application number
TW096115966A
Other languages
English (en)
Chinese (zh)
Other versions
TWI379865B (ko
Inventor
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200811236A publication Critical patent/TW200811236A/zh
Application granted granted Critical
Publication of TWI379865B publication Critical patent/TWI379865B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096115966A 2006-05-26 2007-05-04 Flexible substrate, solder resist composition therefor, and manufacturing method thereof TW200811236A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006146994A JP4864545B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板及びフレキシブル基板の製造方法
JP2006146993A JP4871646B2 (ja) 2006-05-26 2006-05-26 フレキシブル基板用熱硬化型ソルダーレジスト組成物、フレキシブル基板およびフレキシブル基板の製造方法

Publications (2)

Publication Number Publication Date
TW200811236A true TW200811236A (en) 2008-03-01
TWI379865B TWI379865B (ko) 2012-12-21

Family

ID=39091704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115966A TW200811236A (en) 2006-05-26 2007-05-04 Flexible substrate, solder resist composition therefor, and manufacturing method thereof

Country Status (4)

Country Link
JP (2) JP4864545B2 (ko)
KR (1) KR100830810B1 (ko)
CN (1) CN101077956B (ko)
TW (1) TW200811236A (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010014319A1 (de) 2010-01-29 2011-08-04 Siemens Aktiengesellschaft, 80333 Dämpfungsmasse für Ultraschallsensor, Verwendung eines Epoxidharzes
TWI546150B (zh) * 2010-03-30 2016-08-21 Arakawa Chem Ind Solder flux and solder composition
CN102933033B (zh) * 2012-10-31 2015-04-22 广州金鹏源康精密电路股份有限公司 一种pi油墨的运用方法
KR101451568B1 (ko) 2013-03-27 2014-10-22 주식회사 엘 앤 에프 방열구조를 갖는 인쇄회로기판
KR101687394B1 (ko) 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
CN105820646A (zh) * 2015-01-04 2016-08-03 赖中平 防焊油墨及其制造方法
JP7306381B2 (ja) * 2018-05-11 2023-07-11 株式会社レゾナック 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
JP7071300B2 (ja) * 2019-01-21 2022-05-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム、半導体積層体、半導体積層体の製造方法及び半導体装置の製造方法
JP7336881B2 (ja) * 2019-06-06 2023-09-01 太陽ホールディングス株式会社 熱硬化性組成物及びその硬化被膜を有する被覆基材

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415273A (ja) * 1990-05-10 1992-01-20 Tonen Corp ソルダーレジストインク
JPH0415272A (ja) * 1990-05-10 1992-01-20 Tonen Corp ソルダーレジストインク
JPH0747682B2 (ja) * 1990-05-10 1995-05-24 信越化学工業株式会社 エポキシ樹脂組成物及びその硬化物
JP2002171050A (ja) * 1997-04-11 2002-06-14 Ibiden Co Ltd プリント配線板
JP3346263B2 (ja) * 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
JP3537119B2 (ja) * 1998-01-16 2004-06-14 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物
JP3415047B2 (ja) * 1998-11-18 2003-06-09 ジャパンエポキシレジン株式会社 硬化性エポキシ樹脂組成物
JP2000171973A (ja) * 1998-12-08 2000-06-23 Ngk Spark Plug Co Ltd 感光性樹脂組成物及びソルダーレジスト用感光性樹脂組成物
JP4435342B2 (ja) * 1999-10-19 2010-03-17 ジャパンエポキシレジン株式会社 エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
DE10057111C1 (de) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Wärmeleitfähige Vergußmasse
JP4845274B2 (ja) * 2001-02-27 2011-12-28 京セラ株式会社 配線基板及びその製造方法
JP2002256063A (ja) 2001-02-28 2002-09-11 Ootex Kk 光硬化性レジスト組成物
JPWO2002077058A1 (ja) * 2001-03-23 2004-07-15 太陽インキ製造株式会社 活性エネルギー線硬化性樹脂、これを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物
JP4442131B2 (ja) * 2002-07-12 2010-03-31 住友化学株式会社 硬化性樹脂組成物
JP2005036092A (ja) * 2002-09-19 2005-02-10 Sumitomo Chemical Co Ltd 硬化性樹脂組成物及び保護膜
JP2004217861A (ja) * 2003-01-17 2004-08-05 Hitachi Chem Co Ltd 耐熱性接着剤ならびにこの接着剤を用いた積層物、接着剤付き放熱板および接着剤付金属箔
JP4576794B2 (ja) * 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
JP4554170B2 (ja) 2003-06-03 2010-09-29 株式会社タムラ製作所 紫外線硬化型アルカリ可溶性樹脂、ソルダーレジスト膜用紫外性硬化型樹脂およびプリント配線板
JP4999254B2 (ja) * 2003-07-29 2012-08-15 住友化学株式会社 硬化性樹脂組成物及び保護膜
JP4479882B2 (ja) * 2003-11-20 2010-06-09 信越化学工業株式会社 砲弾型発光半導体装置
TW200519535A (en) * 2003-11-27 2005-06-16 Taiyo Ink Mfg Co Ltd Hardenable resin composition, hardened body thereof, and printed circuit board
JP4345554B2 (ja) 2004-04-12 2009-10-14 日立化成工業株式会社 絶縁層と絶縁層の間に接着補助層を有するプリント配線板およびその製造方法
JP4709747B2 (ja) * 2004-03-31 2011-06-22 太陽ホールディングス株式会社 活性エネルギー線硬化性樹脂、それを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2006008867A (ja) * 2004-06-25 2006-01-12 Matsushita Electric Works Ltd ビニルエステル樹脂組成物及びその成形品

Also Published As

Publication number Publication date
JP2007314695A (ja) 2007-12-06
KR20070114027A (ko) 2007-11-29
CN101077956B (zh) 2010-12-08
JP4871646B2 (ja) 2012-02-08
KR100830810B1 (ko) 2008-05-19
JP2007317945A (ja) 2007-12-06
CN101077956A (zh) 2007-11-28
TWI379865B (ko) 2012-12-21
JP4864545B2 (ja) 2012-02-01

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