TW200810587A - Moisture barrier coatings for organic light emitting diode devices - Google Patents
Moisture barrier coatings for organic light emitting diode devices Download PDFInfo
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- TW200810587A TW200810587A TW096121508A TW96121508A TW200810587A TW 200810587 A TW200810587 A TW 200810587A TW 096121508 A TW096121508 A TW 096121508A TW 96121508 A TW96121508 A TW 96121508A TW 200810587 A TW200810587 A TW 200810587A
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/424,997 US20080006819A1 (en) | 2006-06-19 | 2006-06-19 | Moisture barrier coatings for organic light emitting diode devices |
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|---|---|
| TW200810587A true TW200810587A (en) | 2008-02-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096121508A TW200810587A (en) | 2006-06-19 | 2007-06-14 | Moisture barrier coatings for organic light emitting diode devices |
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| Country | Link |
|---|---|
| US (2) | US20080006819A1 (enExample) |
| EP (1) | EP2033494A4 (enExample) |
| JP (1) | JP2009541939A (enExample) |
| KR (1) | KR20090018825A (enExample) |
| TW (1) | TW200810587A (enExample) |
| WO (1) | WO2007149683A2 (enExample) |
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| CN103805943A (zh) * | 2012-11-08 | 2014-05-21 | 大永真空科技股份有限公司 | 利用混合多层真空沉积法进行沉积及固化的披覆薄膜 |
| TWI462685B (zh) * | 2010-01-19 | 2014-11-21 | Fih Hong Kong Ltd | 電子裝置殼體 |
| US8941097B2 (en) | 2011-07-29 | 2015-01-27 | Au Optronics Corp. | Organic luminance device, method for manufacturing same and lighting apparatus including same |
| TWI488740B (zh) * | 2012-01-06 | 2015-06-21 | Ｌｇ化學股份有限公司 | 包封用膜 |
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| US8846169B2 (en) | 2007-12-28 | 2014-09-30 | 3M Innovative Properties Company | Flexible encapsulating film systems |
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| US7957621B2 (en) * | 2008-12-17 | 2011-06-07 | 3M Innovative Properties Company | Light extraction film with nanoparticle coatings |
| SG174351A1 (en) | 2009-03-24 | 2011-10-28 | Saint Gobain Abrasives Inc | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
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| CN102484054A (zh) * | 2009-06-02 | 2012-05-30 | 圣戈班磨料磨具有限公司 | 耐腐蚀性cmp修整工件及其制造和使用方法 |
| EP2474025A2 (en) | 2009-09-01 | 2012-07-11 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
| JP2013511410A (ja) * | 2009-11-18 | 2013-04-04 | スリーエム イノベイティブ プロパティズ カンパニー | 可撓性組立品並びにその製造及び使用方法 |
| BR112012011654A2 (pt) | 2009-11-18 | 2020-08-25 | 3M Innovantive Properties Company | filmes opticos de multiplas camadas |
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2009
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| TWI462685B (zh) * | 2010-01-19 | 2014-11-21 | Fih Hong Kong Ltd | 電子裝置殼體 |
| US8941097B2 (en) | 2011-07-29 | 2015-01-27 | Au Optronics Corp. | Organic luminance device, method for manufacturing same and lighting apparatus including same |
| TWI488740B (zh) * | 2012-01-06 | 2015-06-21 | Ｌｇ化學股份有限公司 | 包封用膜 |
| CN103805943A (zh) * | 2012-11-08 | 2014-05-21 | 大永真空科技股份有限公司 | 利用混合多层真空沉积法进行沉积及固化的披覆薄膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007149683A3 (en) | 2008-02-21 |
| EP2033494A4 (en) | 2011-05-18 |
| WO2007149683A2 (en) | 2007-12-27 |
| US20080006819A1 (en) | 2008-01-10 |
| JP2009541939A (ja) | 2009-11-26 |
| US20090252894A1 (en) | 2009-10-08 |
| KR20090018825A (ko) | 2009-02-23 |
| EP2033494A2 (en) | 2009-03-11 |
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