TW200807751A - Method for manufacturing semiconductor device - Google Patents

Method for manufacturing semiconductor device Download PDF

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Publication number
TW200807751A
TW200807751A TW095147438A TW95147438A TW200807751A TW 200807751 A TW200807751 A TW 200807751A TW 095147438 A TW095147438 A TW 095147438A TW 95147438 A TW95147438 A TW 95147438A TW 200807751 A TW200807751 A TW 200807751A
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor device
trench
manufacturing
present
Prior art date
Application number
TW095147438A
Other languages
English (en)
Chinese (zh)
Inventor
Masahiro Sunohara
Yuichi Taguchi
Akinori Shiraishi
Naoyuki Koizumi
Kei Murayama
Sakaguchi Hideaki
Higashi Mitsutoshi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200807751A publication Critical patent/TW200807751A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dicing (AREA)
  • Led Device Packages (AREA)
TW095147438A 2006-01-06 2006-12-18 Method for manufacturing semiconductor device TW200807751A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006001802A JP2007184426A (ja) 2006-01-06 2006-01-06 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW200807751A true TW200807751A (en) 2008-02-01

Family

ID=37876964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147438A TW200807751A (en) 2006-01-06 2006-12-18 Method for manufacturing semiconductor device

Country Status (5)

Country Link
US (1) US7494898B2 (enExample)
EP (1) EP1806782B1 (enExample)
JP (1) JP2007184426A (enExample)
KR (1) KR20070074460A (enExample)
TW (1) TW200807751A (enExample)

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CN104752584A (zh) * 2013-12-25 2015-07-01 苏州矩阵光电有限公司 一种led封装结构
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CN103822143A (zh) * 2014-02-18 2014-05-28 江苏新广联绿色照明工程有限公司 硅基led路灯光源模块
CN103887238A (zh) * 2014-04-01 2014-06-25 惠州硕贝德无线科技股份有限公司 一种完成bga封装之后的晶圆的切割分粒方法
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
CN107438899B (zh) 2015-03-31 2021-04-30 科锐Led公司 具有包封的发光二极管和方法
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JP6866664B2 (ja) * 2017-02-06 2021-04-28 日亜化学工業株式会社 発光装置の製造方法
US10347806B2 (en) * 2017-04-12 2019-07-09 Luminus, Inc. Packaged UV-LED device with anodic bonded silica lens and no UV-degradable adhesive
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Also Published As

Publication number Publication date
EP1806782A2 (en) 2007-07-11
JP2007184426A (ja) 2007-07-19
EP1806782B1 (en) 2011-08-10
US20070161211A1 (en) 2007-07-12
EP1806782A3 (en) 2010-03-03
KR20070074460A (ko) 2007-07-12
US7494898B2 (en) 2009-02-24

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