TW200741722A - Nonvolatile semiconductor memory device - Google Patents

Nonvolatile semiconductor memory device

Info

Publication number
TW200741722A
TW200741722A TW096103472A TW96103472A TW200741722A TW 200741722 A TW200741722 A TW 200741722A TW 096103472 A TW096103472 A TW 096103472A TW 96103472 A TW96103472 A TW 96103472A TW 200741722 A TW200741722 A TW 200741722A
Authority
TW
Taiwan
Prior art keywords
sub
decoder
memory device
semiconductor memory
nonvolatile semiconductor
Prior art date
Application number
TW096103472A
Other languages
English (en)
Inventor
Yoshihiko Kusakabe
Kenichi Oto
Satoshi Kawasaki
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200741722A publication Critical patent/TW200741722A/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/08Address circuits; Decoders; Word-line control circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/30Power supply circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/10Decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/14Word line organisation; Word line lay-out

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Non-Volatile Memory (AREA)
TW096103472A 2006-02-03 2007-01-31 Nonvolatile semiconductor memory device TW200741722A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006027010A JP2007207380A (ja) 2006-02-03 2006-02-03 不揮発性半導体記憶装置

Publications (1)

Publication Number Publication Date
TW200741722A true TW200741722A (en) 2007-11-01

Family

ID=38333882

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103472A TW200741722A (en) 2006-02-03 2007-01-31 Nonvolatile semiconductor memory device

Country Status (5)

Country Link
US (4) US7411834B2 (zh)
JP (1) JP2007207380A (zh)
KR (1) KR20070079936A (zh)
CN (1) CN101013600B (zh)
TW (1) TW200741722A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576997B (zh) * 2008-09-26 2017-04-01 東芝股份有限公司 非揮發性半導體儲存裝置

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7706185B2 (en) * 2007-04-09 2010-04-27 Macronix International Co., Ltd. Reading circuitry in memory
CN101779298B (zh) 2007-08-09 2012-02-01 三菱电机株式会社 太阳能电池板
JP2009076188A (ja) * 2007-08-24 2009-04-09 Renesas Technology Corp 不揮発性半導体記憶装置
JP2009141278A (ja) * 2007-12-10 2009-06-25 Toshiba Corp 不揮発性半導体記憶装置
US9349738B1 (en) * 2008-02-04 2016-05-24 Broadcom Corporation Content addressable memory (CAM) device having substrate array line structure
JP2010050208A (ja) * 2008-08-20 2010-03-04 Renesas Technology Corp 半導体記憶装置
JP5193815B2 (ja) * 2008-11-12 2013-05-08 株式会社東芝 半導体記憶装置
US8102709B2 (en) * 2009-06-02 2012-01-24 Micron Technology, Inc. Transistor having peripheral channel
KR101642819B1 (ko) * 2009-08-31 2016-07-26 삼성전자주식회사 비휘발성 메모리 장치, 그것의 구동 방법, 그것을 포함하는 메모리 시스템
US10916317B2 (en) 2010-08-20 2021-02-09 Attopsemi Technology Co., Ltd Programmable resistance memory on thin film transistor technology
US10229746B2 (en) 2010-08-20 2019-03-12 Attopsemi Technology Co., Ltd OTP memory with high data security
US9711237B2 (en) * 2010-08-20 2017-07-18 Attopsemi Technology Co., Ltd. Method and structure for reliable electrical fuse programming
US10249379B2 (en) 2010-08-20 2019-04-02 Attopsemi Technology Co., Ltd One-time programmable devices having program selector for electrical fuses with extended area
US9818478B2 (en) 2012-12-07 2017-11-14 Attopsemi Technology Co., Ltd Programmable resistive device and memory using diode as selector
US10923204B2 (en) 2010-08-20 2021-02-16 Attopsemi Technology Co., Ltd Fully testible OTP memory
US10586832B2 (en) 2011-02-14 2020-03-10 Attopsemi Technology Co., Ltd One-time programmable devices using gate-all-around structures
US10192615B2 (en) 2011-02-14 2019-01-29 Attopsemi Technology Co., Ltd One-time programmable devices having a semiconductor fin structure with a divided active region
JP2013058276A (ja) * 2011-09-07 2013-03-28 Toshiba Corp 半導体記憶装置
KR102011466B1 (ko) 2012-08-29 2019-08-16 에스케이하이닉스 주식회사 반도체 메모리 장치 및 그것의 동작 방법
KR102041372B1 (ko) * 2013-05-23 2019-11-07 에스케이하이닉스 주식회사 반도체장치 및 반도체시스템
US9922715B2 (en) * 2014-10-03 2018-03-20 Silicon Storage Technology, Inc. Non-volatile split gate memory device and a method of operating same
CN106469563B (zh) * 2015-08-17 2018-12-18 旺宏电子股份有限公司 具有区域译码器的阵列架构
US9972395B2 (en) * 2015-10-05 2018-05-15 Silicon Storage Technology, Inc. Row and column decoders comprising fully depleted silicon-on-insulator transistors for use in flash memory systems
KR102381046B1 (ko) * 2015-10-26 2022-03-31 에스케이하이닉스 주식회사 비휘발성 메모리 장치
KR102222538B1 (ko) * 2017-04-07 2021-03-05 삼성전자주식회사 반도체 장치
US11062786B2 (en) 2017-04-14 2021-07-13 Attopsemi Technology Co., Ltd One-time programmable memories with low power read operation and novel sensing scheme
US11615859B2 (en) 2017-04-14 2023-03-28 Attopsemi Technology Co., Ltd One-time programmable memories with ultra-low power read operation and novel sensing scheme
US10726914B2 (en) 2017-04-14 2020-07-28 Attopsemi Technology Co. Ltd Programmable resistive memories with low power read operation and novel sensing scheme
US10535413B2 (en) 2017-04-14 2020-01-14 Attopsemi Technology Co., Ltd Low power read operation for programmable resistive memories
WO2019025864A2 (en) * 2017-07-30 2019-02-07 Sity Elad ARCHITECTURE OF DISTRIBUTED PROCESSORS BASED ON MEMORIES
US10770160B2 (en) 2017-11-30 2020-09-08 Attopsemi Technology Co., Ltd Programmable resistive memory formed by bit slices from a standard cell library
JP7065637B2 (ja) * 2018-02-22 2022-05-12 ルネサスエレクトロニクス株式会社 半導体装置
KR20220022157A (ko) * 2020-08-18 2022-02-25 에스케이하이닉스 주식회사 패스 트랜지스터들을 구비하는 메모리 장치
CN112180239B (zh) * 2020-09-27 2022-01-21 江苏东海半导体科技有限公司 一种集成电路输入端输出端口可靠性问题的检测方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2232463C3 (de) * 1972-07-01 1980-05-08 Bayer Ag, 5090 Leverkusen Polybenz-13-oxazindione-(2,4), Verfahren zu ihrer Herstellung und ihre Verwendung-
JP2835215B2 (ja) * 1991-07-25 1998-12-14 株式会社東芝 不揮発性半導体記憶装置
JP3036910B2 (ja) * 1991-08-20 2000-04-24 沖電気工業株式会社 Cmosデコード回路
KR940008132B1 (ko) 1991-11-28 1994-09-03 삼성전자 주식회사 신호선간의 잡음을 억제하는 메모리 소자
EP1168362A3 (en) 1991-12-09 2004-09-29 Fujitsu Limited Flash memory with improved erasability and its circuitry
JPH06168597A (ja) * 1992-03-19 1994-06-14 Fujitsu Ltd フラッシュメモリ及びレベル変換回路
JP3451118B2 (ja) * 1993-12-15 2003-09-29 株式会社日立製作所 半導体不揮発性記憶装置
JP3247034B2 (ja) * 1995-08-11 2002-01-15 シャープ株式会社 不揮発性半導体記憶装置
US5661683A (en) * 1996-02-05 1997-08-26 Integrated Silicon Solution Inc. On-chip positive and negative high voltage wordline x-decoding for EPROM/FLASH
US6207998B1 (en) * 1998-07-23 2001-03-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with well of different conductivity types
JP4012341B2 (ja) 1999-07-14 2007-11-21 株式会社ルネサステクノロジ 半導体集積回路装置
JP4503809B2 (ja) * 2000-10-31 2010-07-14 株式会社東芝 半導体記憶装置
JP4565767B2 (ja) 2001-04-11 2010-10-20 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US6549479B2 (en) * 2001-06-29 2003-04-15 Micron Technology, Inc. Memory device and method having reduced-power self-refresh mode
JP2003141887A (ja) * 2001-11-01 2003-05-16 Hitachi Ltd 不揮発性半導体記憶装置
DE60200715D1 (de) * 2002-02-20 2004-08-12 St Microelectronics Srl Selecteur à ligne des mots pour une memoire semiconductrice
JP3857640B2 (ja) 2002-11-29 2006-12-13 株式会社東芝 半導体記憶装置
JP2005039016A (ja) * 2003-07-18 2005-02-10 Toshiba Corp 不揮発性半導体記憶装置、電子カード及び電子装置
KR100559715B1 (ko) 2004-02-25 2006-03-10 주식회사 하이닉스반도체 낸드 플래시 메모리 소자의 소거 방법
JPWO2006025099A1 (ja) * 2004-08-31 2008-05-08 スパンション エルエルシー 不揮発性記憶装置、およびその制御方法
US7126862B2 (en) * 2005-03-08 2006-10-24 Spansion Llc Decoder for memory device
US7274618B2 (en) * 2005-06-24 2007-09-25 Monolithic System Technology, Inc. Word line driver for DRAM embedded in a logic process
US7468906B2 (en) * 2005-09-13 2008-12-23 Northern Lights Semiconductor Corp. Word driver and decode design methodology in MRAM circuit
JP4874721B2 (ja) * 2006-06-23 2012-02-15 株式会社東芝 半導体記憶装置
JP2008010082A (ja) * 2006-06-29 2008-01-17 Nec Electronics Corp 不揮発性半導体記憶装置及びワード線駆動方法
JP5224659B2 (ja) * 2006-07-13 2013-07-03 ルネサスエレクトロニクス株式会社 半導体記憶装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576997B (zh) * 2008-09-26 2017-04-01 東芝股份有限公司 非揮發性半導體儲存裝置

Also Published As

Publication number Publication date
KR20070079936A (ko) 2007-08-08
US20080273396A1 (en) 2008-11-06
US8085598B2 (en) 2011-12-27
US7411834B2 (en) 2008-08-12
US7859909B2 (en) 2010-12-28
US7596033B2 (en) 2009-09-29
CN101013600A (zh) 2007-08-08
US20110058426A1 (en) 2011-03-10
US20090310410A1 (en) 2009-12-17
JP2007207380A (ja) 2007-08-16
US20070183213A1 (en) 2007-08-09
CN101013600B (zh) 2010-12-08

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