TW200730064A - Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure - Google Patents

Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure

Info

Publication number
TW200730064A
TW200730064A TW095141489A TW95141489A TW200730064A TW 200730064 A TW200730064 A TW 200730064A TW 095141489 A TW095141489 A TW 095141489A TW 95141489 A TW95141489 A TW 95141489A TW 200730064 A TW200730064 A TW 200730064A
Authority
TW
Taiwan
Prior art keywords
manufacturing
metal foil
wiring
electronic component
wiring substrate
Prior art date
Application number
TW095141489A
Other languages
English (en)
Other versions
TWI399153B (zh
Inventor
Junichi Nakamura
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200730064A publication Critical patent/TW200730064A/zh
Application granted granted Critical
Publication of TWI399153B publication Critical patent/TWI399153B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095141489A 2005-12-07 2006-11-09 配線基板的製造方法及電子組件安裝結構的製造方法（一） TWI399153B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005353142A JP4897281B2 (ja) 2005-12-07 2005-12-07 配線基板の製造方法及び電子部品実装構造体の製造方法

Publications (2)

Publication Number Publication Date
TW200730064A true TW200730064A (en) 2007-08-01
TWI399153B TWI399153B (zh) 2013-06-11

Family

ID=38129197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141489A TWI399153B (zh) 2005-12-07 2006-11-09 配線基板的製造方法及電子組件安裝結構的製造方法（一）

Country Status (5)

Country Link
US (1) US7543374B2 (zh)
JP (1) JP4897281B2 (zh)
KR (1) KR20070059945A (zh)
CN (1) CN1980542A (zh)
TW (1) TWI399153B (zh)

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TWI396491B (zh) * 2010-07-06 2013-05-11 Unimicron Technology Corp 線路板的製造方法
TWI404482B (zh) * 2010-03-22 2013-08-01 Nan Ya Printed Circuit Board 電路板及其形成方法
TWI413475B (zh) * 2011-03-09 2013-10-21 Subtron Technology Co Ltd 電氣結構製程及電氣結構
TWI417002B (zh) * 2011-09-19 2013-11-21 Unimicron Technology Corp 線路板及其製作方法
TWI423739B (zh) * 2011-09-23 2014-01-11 Au Optronics Corp 可撓式基板結構之製造方法
TWI425900B (zh) * 2008-11-28 2014-02-01 Nan Ya Printed Circuit Board 無核心基板之製造方法及電路薄板之製造方法

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US8104171B2 (en) 2008-08-27 2012-01-31 Advanced Semiconductor Engineering, Inc. Method of fabricating multi-layered substrate
TWI393233B (zh) * 2009-08-18 2013-04-11 Unimicron Technology Corp 無核心層封裝基板及其製法
TWI388018B (zh) * 2009-10-22 2013-03-01 Unimicron Technology Corp 封裝結構之製法
TWI416636B (zh) * 2009-10-22 2013-11-21 Unimicron Technology Corp 封裝結構之製法
CN102054714B (zh) * 2009-11-06 2012-10-03 欣兴电子股份有限公司 封装结构的制法
KR101067157B1 (ko) * 2009-11-13 2011-09-22 삼성전기주식회사 인쇄회로기판의 제조방법
US8067266B2 (en) * 2009-12-23 2011-11-29 Intel Corporation Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication
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CN102339760B (zh) * 2010-07-14 2013-05-29 欣兴电子股份有限公司 封装结构的制作方法
JP5861262B2 (ja) 2011-03-26 2016-02-16 富士通株式会社 回路基板の製造方法及び電子装置の製造方法
US8945329B2 (en) * 2011-06-24 2015-02-03 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
KR101234933B1 (ko) * 2012-03-28 2013-02-19 삼성전기주식회사 Ｌεｄ 모듈용 기판의 제조 방법 및 이에 따라 제조된 ｌεｄ 모듈용 기판
WO2014050662A1 (ja) * 2012-09-28 2014-04-03 日東電工株式会社 半導体装置の製造方法、及び、接着シート
US20150366077A1 (en) * 2013-01-30 2015-12-17 Kyocera Corporation Method for producing mounted structure
CN203151864U (zh) * 2013-03-05 2013-08-21 奥特斯(中国)有限公司 印制电路板
FR3007403B1 (fr) * 2013-06-20 2016-08-05 Commissariat Energie Atomique Procede de realisation d'un dispositif microelectronique mecaniquement autonome
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US9171739B1 (en) * 2014-06-24 2015-10-27 Stats Chippac Ltd. Integrated circuit packaging system with coreless substrate and method of manufacture thereof
US9502267B1 (en) 2014-06-26 2016-11-22 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with support structure and method of manufacture thereof
US9412624B1 (en) 2014-06-26 2016-08-09 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with substrate and method of manufacture thereof
TWI533771B (zh) * 2014-07-17 2016-05-11 矽品精密工業股份有限公司 無核心層封裝基板及其製法
TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法
TWI567891B (zh) * 2015-01-30 2017-01-21 矽品精密工業股份有限公司 封裝基板之整版面結構
US9899239B2 (en) * 2015-11-06 2018-02-20 Apple Inc. Carrier ultra thin substrate
TWI582903B (zh) * 2015-12-02 2017-05-11 南茂科技股份有限公司 半導體封裝結構及其製作方法
TWI582921B (zh) * 2015-12-02 2017-05-11 南茂科技股份有限公司 半導體封裝結構及其製作方法
EP3255665B1 (en) 2016-06-08 2022-01-12 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic device with component carrier and method for producing it
EP3302006A1 (en) 2016-09-30 2018-04-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising at least one heat pipe and method for producing said component carrier
CN108022897A (zh) 2016-11-01 2018-05-11 财团法人工业技术研究院 封装结构及其制作方法
CN108022896A (zh) 2016-11-01 2018-05-11 财团法人工业技术研究院 一种芯片封装结构及其制作方法
CN109243980A (zh) * 2017-07-10 2019-01-18 华为技术有限公司 一种封装基板的制作方法及封装基板
JP7359531B2 (ja) * 2018-06-07 2023-10-11 新光電気工業株式会社 配線基板、配線基板の製造方法及び半導体パッケージの製造方法
WO2020121652A1 (ja) * 2018-12-14 2020-06-18 三菱瓦斯化学株式会社 半導体素子搭載用パッケージ基板の製造方法
JP7474608B2 (ja) 2020-03-09 2024-04-25 アオイ電子株式会社 半導体装置の製造方法、および半導体封止体

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CN101409239B (zh) * 2003-05-23 2011-10-05 富士通株式会社 布线板制造方法
JP2005063987A (ja) 2003-08-08 2005-03-10 Ngk Spark Plug Co Ltd 配線基板の製造方法、及び配線基板
JP4192772B2 (ja) * 2003-12-02 2008-12-10 日立化成工業株式会社 半導体チップ搭載基板及びその製造方法、並びに半導体パッケージの製造方法
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法

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TWI425900B (zh) * 2008-11-28 2014-02-01 Nan Ya Printed Circuit Board 無核心基板之製造方法及電路薄板之製造方法
TWI404482B (zh) * 2010-03-22 2013-08-01 Nan Ya Printed Circuit Board 電路板及其形成方法
TWI396491B (zh) * 2010-07-06 2013-05-11 Unimicron Technology Corp 線路板的製造方法
TWI413475B (zh) * 2011-03-09 2013-10-21 Subtron Technology Co Ltd 電氣結構製程及電氣結構
US9137899B2 (en) 2011-03-09 2015-09-15 Subtron Technology Co., Ltd. Process of electronic structure and electronic structure
TWI417002B (zh) * 2011-09-19 2013-11-21 Unimicron Technology Corp 線路板及其製作方法
TWI423739B (zh) * 2011-09-23 2014-01-11 Au Optronics Corp 可撓式基板結構之製造方法

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TWI399153B (zh) 2013-06-11
CN1980542A (zh) 2007-06-13
KR20070059945A (ko) 2007-06-12

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