WO2010049771A3 - Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial - Google Patents
Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial Download PDFInfo
- Publication number
- WO2010049771A3 WO2010049771A3 PCT/IB2009/007174 IB2009007174W WO2010049771A3 WO 2010049771 A3 WO2010049771 A3 WO 2010049771A3 IB 2009007174 W IB2009007174 W IB 2009007174W WO 2010049771 A3 WO2010049771 A3 WO 2010049771A3
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- WO
- WIPO (PCT)
- Prior art keywords
- composite material
- adhesive
- producing
- binding
- composite
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/028—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63452—Polyepoxides
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- C—CHEMISTRY; METALLURGY
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/444—Halide containing anions, e.g. bromide, iodate, chlorite
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/52—Constituents or additives characterised by their shapes
- C04B2235/5208—Fibers
- C04B2235/526—Fibers characterised by the length of the fibers
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/52—Constituents or additives characterised by their shapes
- C04B2235/5208—Fibers
- C04B2235/5264—Fibers characterised by the diameter of the fibers
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/52—Constituents or additives characterised by their shapes
- C04B2235/5284—Hollow fibers, e.g. nanotubes
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/963—Surface properties, e.g. surface roughness
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/407—Copper
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
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- Y10T428/12472—Microscopic interfacial wave or roughness
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- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24752—Laterally noncoextensive components
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- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
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- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117012384A KR101319755B1 (ko) | 2008-10-29 | 2009-10-20 | 복합 재료, 복합 재료를 제조하는 방법 및 접착 또는 결합 재료 |
JP2011533843A JP5656088B2 (ja) | 2008-10-29 | 2009-10-20 | 複合材料、複合材料形成方法、及び接着剤又は接合材料 |
EP09768229A EP2352709A2 (de) | 2008-10-29 | 2009-10-20 | Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial |
US13/126,559 US20110274888A1 (en) | 2008-10-29 | 2009-10-20 | Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material |
CN2009801430663A CN102292308A (zh) | 2008-10-29 | 2009-10-20 | 复合材料,制备复合材料的方法以及粘合剂和粘结材料 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008053736.5 | 2008-10-29 | ||
DE102008053736 | 2008-10-29 | ||
DE102009019221 | 2009-04-30 | ||
DE102009019221.2 | 2009-04-30 | ||
DE102009030118.6 | 2009-06-22 | ||
DE102009030118 | 2009-06-22 | ||
DE102009041574.2 | 2009-09-15 | ||
DE200910041574 DE102009041574A1 (de) | 2008-10-29 | 2009-09-15 | Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial |
Publications (2)
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WO2010049771A2 WO2010049771A2 (de) | 2010-05-06 |
WO2010049771A3 true WO2010049771A3 (de) | 2010-08-19 |
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PCT/IB2009/007174 WO2010049771A2 (de) | 2008-10-29 | 2009-10-20 | Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial |
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US (1) | US20110274888A1 (de) |
EP (1) | EP2352709A2 (de) |
JP (1) | JP5656088B2 (de) |
KR (1) | KR101319755B1 (de) |
CN (1) | CN102292308A (de) |
DE (1) | DE102009041574A1 (de) |
WO (1) | WO2010049771A2 (de) |
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DE102010038079A1 (de) * | 2010-10-08 | 2012-04-12 | Peter Bäumler | Verbundglas sowie Verfahren zu seiner Herstellung |
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DE102010054068A1 (de) * | 2010-12-10 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement |
DE102012102611B4 (de) * | 2012-02-15 | 2017-07-27 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
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DE102013001625A1 (de) | 2012-09-30 | 2014-04-03 | Cepventures International Corp. | Verpackung für kantenempfindliches Transportgut |
DE102012110322B4 (de) * | 2012-10-29 | 2014-09-11 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
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FR3005661B1 (fr) * | 2013-05-16 | 2016-06-10 | Novacel Sa | Film adhesif sensible a la pression et son utilisation pour la protection de surfaces |
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KR102361626B1 (ko) * | 2015-02-03 | 2022-02-11 | 주식회사 아모센스 | 세라믹 dbc 기판 및 그 제조 방법 |
DE102015107223B4 (de) * | 2015-05-08 | 2020-10-08 | Rogers Germany Gmbh | Verbundmaterial und Verfahren zu seiner Herstellung |
US11046051B2 (en) * | 2015-12-01 | 2021-06-29 | Materion Corporation | Metal-on-ceramic substrates |
WO2017109528A1 (en) * | 2015-12-22 | 2017-06-29 | Arcelormittal | A method of heat transfer between a metallic or non-metallic item and a heat transfer fluid |
HUE053117T2 (hu) * | 2016-02-26 | 2021-06-28 | Heraeus Deutschland Gmbh & Co Kg | Réz-kerámia kompozitok |
DE102016203112B4 (de) | 2016-02-26 | 2019-08-29 | Heraeus Deutschland GmbH & Co. KG | Kupfer-Keramik-Verbund |
US10000423B1 (en) | 2016-03-31 | 2018-06-19 | Ixys, Llc | Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier |
CN105845583B (zh) * | 2016-05-03 | 2018-11-06 | 佛山市百瑞新材料技术有限公司 | 一种陶瓷-金属复合基板制备工艺 |
KR20180080054A (ko) * | 2017-01-03 | 2018-07-11 | 삼성전자주식회사 | 냉장고 |
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WO2018156449A1 (en) * | 2017-02-26 | 2018-08-30 | Dow Global Technologies Llc | Fiber composite with reduced surface roughness and method for its manufacture |
KR101808985B1 (ko) * | 2017-03-31 | 2017-12-13 | 성균관대학교산학협력단 | 고분자 나노무기입자 복합체 및 이를 제조하는 방법 |
KR101953563B1 (ko) * | 2017-04-27 | 2019-03-04 | 베스트트레이드(주) | 플라즈마를 이용한 실리콘-섬유의 접착방법 |
TWI767129B (zh) * | 2018-07-11 | 2022-06-11 | 台虹科技股份有限公司 | 複合材料 |
CN109659356B (zh) * | 2018-12-18 | 2021-08-27 | 河南师范大学 | 基于硒化铜单层的具有负微分电阻和开关作用的纳米器件 |
WO2021015059A1 (ja) * | 2019-07-25 | 2021-01-28 | Agc株式会社 | 積層部材 |
KR20220037437A (ko) * | 2019-07-25 | 2022-03-24 | 에이지씨 가부시키가이샤 | 적층 부재 |
JP6831435B2 (ja) * | 2019-10-25 | 2021-02-17 | 日本特殊陶業株式会社 | 複合部材 |
CN114178710A (zh) * | 2020-08-24 | 2022-03-15 | 奥特斯(中国)有限公司 | 部件承载件及其制造方法 |
KR20220030601A (ko) * | 2020-09-03 | 2022-03-11 | 엘지이노텍 주식회사 | 열전소자 |
KR20220089570A (ko) * | 2020-12-21 | 2022-06-28 | 아피오테크 주식회사 | 유리기판 상의 회로 배선 형성방법 및 유리 회로기판 |
CN114956850B (zh) * | 2022-04-14 | 2023-05-02 | 天诺光电材料股份有限公司 | 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法 |
CN117227272A (zh) * | 2023-08-15 | 2023-12-15 | 苏州晶瓷超硬材料有限公司 | 一种金属陶瓷复合材料及其制备方法 |
CN117460174B (zh) * | 2023-12-25 | 2024-04-02 | 广州先艺电子科技有限公司 | 一种图案化amb陶瓷覆铜板的制备方法 |
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- 2009-09-15 DE DE200910041574 patent/DE102009041574A1/de not_active Withdrawn
- 2009-10-20 WO PCT/IB2009/007174 patent/WO2010049771A2/de active Application Filing
- 2009-10-20 KR KR1020117012384A patent/KR101319755B1/ko not_active IP Right Cessation
- 2009-10-20 CN CN2009801430663A patent/CN102292308A/zh active Pending
- 2009-10-20 US US13/126,559 patent/US20110274888A1/en not_active Abandoned
- 2009-10-20 JP JP2011533843A patent/JP5656088B2/ja not_active Expired - Fee Related
- 2009-10-20 EP EP09768229A patent/EP2352709A2/de not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
KR20110081889A (ko) | 2011-07-14 |
DE102009041574A1 (de) | 2010-05-12 |
US20110274888A1 (en) | 2011-11-10 |
EP2352709A2 (de) | 2011-08-10 |
JP2012507459A (ja) | 2012-03-29 |
JP5656088B2 (ja) | 2015-01-21 |
WO2010049771A2 (de) | 2010-05-06 |
CN102292308A (zh) | 2011-12-21 |
KR101319755B1 (ko) | 2013-10-17 |
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