TW200700736A - Conductive contacter holder and conductive contacter unit - Google Patents

Conductive contacter holder and conductive contacter unit

Info

Publication number
TW200700736A
TW200700736A TW095115194A TW95115194A TW200700736A TW 200700736 A TW200700736 A TW 200700736A TW 095115194 A TW095115194 A TW 095115194A TW 95115194 A TW95115194 A TW 95115194A TW 200700736 A TW200700736 A TW 200700736A
Authority
TW
Taiwan
Prior art keywords
conductive
contacter
holder
signals
retaining member
Prior art date
Application number
TW095115194A
Other languages
English (en)
Other versions
TWI294522B (en
Inventor
Hiroshi Nakayama
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200700736A publication Critical patent/TW200700736A/zh
Application granted granted Critical
Publication of TWI294522B publication Critical patent/TWI294522B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
TW095115194A 2005-04-28 2006-04-28 Conductive contacter holder and conductive contacter unit TWI294522B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005133165A JP4757531B2 (ja) 2005-04-28 2005-04-28 導電性接触子ホルダおよび導電性接触子ユニット
JP2006008905 2006-04-27

Publications (2)

Publication Number Publication Date
TW200700736A true TW200700736A (en) 2007-01-01
TWI294522B TWI294522B (en) 2008-03-11

Family

ID=37308018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115194A TWI294522B (en) 2005-04-28 2006-04-28 Conductive contacter holder and conductive contacter unit

Country Status (8)

Country Link
US (1) US8087956B2 (zh)
EP (1) EP1879038A4 (zh)
JP (1) JP4757531B2 (zh)
KR (1) KR100945518B1 (zh)
CN (1) CN101160532B (zh)
SG (1) SG161285A1 (zh)
TW (1) TWI294522B (zh)
WO (1) WO2006118220A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383153B (zh) * 2007-04-19 2013-01-21 Nhk Spring Co Ltd 導電性觸頭及導電性觸頭單元
TWI417552B (zh) * 2009-07-03 2013-12-01 Leeno Ind Inc 測試探針
TWI424166B (zh) * 2008-11-26 2014-01-21 Nhk Spring Co Ltd 探針單元用基座構件及探針單元

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2017629B1 (en) * 2006-04-28 2018-02-21 NHK SPRING Co., Ltd. Conductive contact holder
KR101106506B1 (ko) * 2008-08-07 2012-01-20 박상량 평판 접이식 코일스프링, 이를 이용한 포고핀 및 그 제조방법
TWI391668B (zh) * 2008-11-21 2013-04-01 King Yuan Electronics Co Ltd 具有高耐電流能力之電連接導體與提高電連接導體之耐電流能力的方法
JP5686009B2 (ja) * 2011-03-18 2015-03-18 富士通株式会社 基板ユニット、及び、基板ユニットの製造方法
MY177561A (en) * 2011-07-19 2020-09-19 Nhk Spring Co Ltd Contact structure unit
KR101679499B1 (ko) * 2012-05-22 2016-11-24 니혼 하츠쵸 가부시키가이샤 소켓 설치 구조 및 스프링 부재
JP2014016204A (ja) * 2012-07-06 2014-01-30 Micronics Japan Co Ltd 電気的接触子及び電気的接触子の接触方法
US9674943B2 (en) * 2012-12-06 2017-06-06 Intel Corporation Actuation mechanisms for electrical interconnections
TWM461790U (zh) * 2013-04-26 2013-09-11 De-Xing Xiao 具弧狀接觸稜線之測試探針
JP5781128B2 (ja) * 2013-08-19 2015-09-16 本田技研工業株式会社 電流供給装置及び半導体素子製造方法
CA3030747C (en) 2013-12-02 2020-11-10 Austin Star Detonator Company Method and apparatus for wireless blasting
TW201533449A (zh) 2014-02-24 2015-09-01 Mpi Corp 具有彈簧套筒式探針之探針裝置
JP6231690B2 (ja) * 2014-08-08 2017-11-15 日本発條株式会社 接続端子
CN107148575B (zh) * 2014-11-07 2021-03-12 株式会社村田制作所 探针
JP6475479B2 (ja) * 2014-11-27 2019-02-27 株式会社ヨコオ 検査ユニット
TWI702402B (zh) 2015-05-07 2020-08-21 義大利商探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
JP6881972B2 (ja) * 2016-12-27 2021-06-02 株式会社エンプラス 電気接触子及び電気部品用ソケット
JP7055596B2 (ja) * 2017-04-10 2022-04-18 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
WO2018218248A1 (en) 2017-05-26 2018-11-29 Smiths Interconnect Americas, Inc. Impedance controlled test socket
JP7271824B2 (ja) * 2018-07-31 2023-05-12 東京特殊電線株式会社 半導体デバイスの検査治具
JP7302117B2 (ja) * 2018-07-31 2023-07-04 株式会社Totoku 半導体デバイスの検査治具
CN111162419B (zh) * 2018-11-08 2022-07-12 上海雷迪埃电子有限公司 射频连接器及两电路板间的射频连接结构
JP6756946B1 (ja) * 2018-11-27 2020-09-16 日本発條株式会社 プローブユニット
CN113767530A (zh) * 2019-03-11 2021-12-07 申泰公司 阻抗受控的电接触件
US11150269B2 (en) * 2019-08-15 2021-10-19 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time
CN111969345B (zh) * 2020-07-06 2022-02-11 中航光电科技股份有限公司 一种新结构平行电路板间用电源信号混装连接器
JP2023003466A (ja) 2021-06-24 2023-01-17 株式会社ヨコオ ソケット

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DE1903088A1 (de) * 1969-01-22 1971-01-21 Siemens Ag Kontaktvorrichtung
JPH06216205A (ja) * 1993-01-13 1994-08-05 Tokyo Electron Yamanashi Kk プローブカードインターフェース装置
JPH07218536A (ja) * 1994-02-04 1995-08-18 Toudai Musen Kk コンタクトプローブ取付ホルダー
JPH08136578A (ja) * 1994-11-07 1996-05-31 Toudai Musen Kk コンタクトプローブの取付ホルダー
JP3090630B2 (ja) * 1997-05-30 2000-09-25 ユーエイチティー株式会社 Ｂｇａ、ｃｓｐ等におけるｉｃチップ実装基板の導通検査システム
JP4124520B2 (ja) 1998-07-30 2008-07-23 日本発条株式会社 導電性接触子のホルダ及びその製造方法
JP2001099889A (ja) 1999-09-29 2001-04-13 Yokowo Co Ltd 高周波回路の検査装置
JP2001273964A (ja) * 2000-03-28 2001-10-05 Mitsubishi Electric Corp Ｉｃソケットおよび半導体装置
JP2002124552A (ja) 2000-10-13 2002-04-26 Seiko Instruments Inc プローブカード及び半導体検査装置
US6507207B2 (en) 2001-02-20 2003-01-14 Vinh T. Nguyen Contact probe pin for wafer probing apparatus
US6447328B1 (en) * 2001-03-13 2002-09-10 3M Innovative Properties Company Method and apparatus for retaining a spring probe
JP2003014779A (ja) 2001-07-02 2003-01-15 Nhk Spring Co Ltd 導電性接触子
TWI284204B (en) * 2001-07-06 2007-07-21 Nhk Spring Co Ltd Conductive contact
JP4707322B2 (ja) * 2002-02-07 2011-06-22 株式会社ヨコオ 容量装荷型プローブおよびそれを用いた検査治具
WO2003087852A1 (en) 2002-04-16 2003-10-23 Nhk Spring Co., Ltd. Holder for conductive contact
AU2003235189A1 (en) 2002-04-16 2003-10-27 Nhk Spring Co., Ltd Holder for conductive contact
US6937045B2 (en) * 2002-07-18 2005-08-30 Aries Electronics, Inc. Shielded integrated circuit probe
JP4242199B2 (ja) 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383153B (zh) * 2007-04-19 2013-01-21 Nhk Spring Co Ltd 導電性觸頭及導電性觸頭單元
TWI424166B (zh) * 2008-11-26 2014-01-21 Nhk Spring Co Ltd 探針單元用基座構件及探針單元
US8633724B2 (en) 2008-11-26 2014-01-21 Nhk Spring Co., Ltd. Probe-unit base member and probe unit
TWI417552B (zh) * 2009-07-03 2013-12-01 Leeno Ind Inc 測試探針

Also Published As

Publication number Publication date
KR100945518B1 (ko) 2010-03-09
US8087956B2 (en) 2012-01-03
US20100041251A1 (en) 2010-02-18
EP1879038A4 (en) 2011-03-09
TWI294522B (en) 2008-03-11
EP1879038A1 (en) 2008-01-16
CN101160532B (zh) 2010-11-10
CN101160532A (zh) 2008-04-09
JP2006308486A (ja) 2006-11-09
SG161285A1 (en) 2010-05-27
WO2006118220A1 (ja) 2006-11-09
JP4757531B2 (ja) 2011-08-24
KR20070119049A (ko) 2007-12-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees