TW200629596A - Reflector for led and led device - Google Patents

Reflector for led and led device

Info

Publication number
TW200629596A
TW200629596A TW094130705A TW94130705A TW200629596A TW 200629596 A TW200629596 A TW 200629596A TW 094130705 A TW094130705 A TW 094130705A TW 94130705 A TW94130705 A TW 94130705A TW 200629596 A TW200629596 A TW 200629596A
Authority
TW
Taiwan
Prior art keywords
led
reflector
wiring board
printed wiring
mounting part
Prior art date
Application number
TW094130705A
Other languages
English (en)
Chinese (zh)
Other versions
TWI313937B (https=
Inventor
Ryouji Sugiura
Hideki Yoshida
Original Assignee
Hitachi Aic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Aic Inc filed Critical Hitachi Aic Inc
Publication of TW200629596A publication Critical patent/TW200629596A/zh
Application granted granted Critical
Publication of TWI313937B publication Critical patent/TWI313937B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
TW094130705A 2004-09-16 2005-09-07 Reflector for led and led device TW200629596A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004269513 2004-09-16

Publications (2)

Publication Number Publication Date
TW200629596A true TW200629596A (en) 2006-08-16
TWI313937B TWI313937B (https=) 2009-08-21

Family

ID=36059926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130705A TW200629596A (en) 2004-09-16 2005-09-07 Reflector for led and led device

Country Status (6)

Country Link
US (2) US7626211B2 (https=)
JP (1) JP4062358B2 (https=)
KR (1) KR100723618B1 (https=)
CN (1) CN100403565C (https=)
TW (1) TW200629596A (https=)
WO (1) WO2006030671A1 (https=)

Cited By (1)

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TWI422076B (zh) * 2009-02-12 2014-01-01 歐斯朗奧托半導體股份有限公司 半導體裝置及半導體裝置之製造方法

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JP2008523637A (ja) * 2004-12-14 2008-07-03 ソウル オプト−デバイス カンパニー リミテッド 複数の発光セルを有する発光素子及びそれを搭載したパッケージ
EP2280430B1 (en) 2005-03-11 2020-01-01 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
EP1897146A2 (en) * 2005-06-27 2008-03-12 Lamina Lighting, Inc. Light emitting diode package and method for making same
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
JP2007266546A (ja) * 2006-03-30 2007-10-11 Rohm Co Ltd 光通信モジュールおよびその製造方法
EP2023409B8 (en) * 2006-04-28 2018-06-27 Shimane Prefectural Government Semiconductor light emitting module and device and method of manufacturing the same
KR100854328B1 (ko) * 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
JP4533352B2 (ja) * 2006-08-09 2010-09-01 昭和電工株式会社 発光装置、表示装置、およびカバー取付部材
TW200822384A (en) * 2006-11-03 2008-05-16 Coretronic Corp LED package structure
JP5326204B2 (ja) * 2006-11-29 2013-10-30 富士通株式会社 発光部品及びその製造方法及び発光部品組立体及び電子装置
KR100827667B1 (ko) * 2007-01-16 2008-05-07 삼성전자주식회사 기판 내에 반도체 칩을 갖는 반도체 패키지 및 이를제조하는 방법
KR101491138B1 (ko) * 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
JP2009278012A (ja) * 2008-05-16 2009-11-26 Meio Kasei:Kk Ｌｅｄ装置用パッケージ
US8288845B2 (en) * 2008-11-14 2012-10-16 Triquint Semiconductor, Inc. Package including proximately-positioned lead frame
KR101006246B1 (ko) * 2009-05-21 2011-01-07 에스브이에스 주식회사 발광다이오드용 적층 세라믹 방열판
KR100986544B1 (ko) * 2009-06-10 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
US8602593B2 (en) * 2009-10-15 2013-12-10 Cree, Inc. Lamp assemblies and methods of making the same
KR101041438B1 (ko) * 2009-12-02 2011-06-15 한국광기술원 이중천공을 구비하는 발광 다이오드 패키지 및 그의 제조방법
WO2011077900A1 (ja) * 2009-12-22 2011-06-30 シャープ株式会社 発光ダイオード素子、光源装置、面光源照明装置、及び液晶表示装置
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR20130036737A (ko) * 2010-01-25 2013-04-12 비쉐이 스프라그, 인코포레이티드 금속계 전자 구성요소 및 그 제조 방법
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
TWD141522S1 (zh) * 2010-06-10 2011-07-11 晶元光電股份有限公司 發光二極體陣列
JP2012023281A (ja) * 2010-07-16 2012-02-02 Nitto Denko Corp 発光装置の製法
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN102095091A (zh) * 2010-09-30 2011-06-15 福建省万邦光电科技有限公司 Led光源模组封装结构
CN103340017B (zh) * 2011-01-28 2015-04-22 首尔半导体株式会社 Led驱动电路封装
JP2012222191A (ja) * 2011-04-11 2012-11-12 Okuno Chem Ind Co Ltd Ｌｅｄ照明ユニット
KR101250372B1 (ko) * 2011-12-09 2013-04-05 엘지이노텍 주식회사 광소자 패키지 및 그 제조 방법
DE102011056654A1 (de) * 2011-12-20 2013-06-20 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leuchtdiodenanordnung
US8766654B2 (en) * 2012-03-27 2014-07-01 Universal Scientific Industrial Co., Ltd. Package structure with conformal shielding and inspection method using the same
JP2013239644A (ja) * 2012-05-16 2013-11-28 Toshiba Corp 半導体発光装置
KR101974349B1 (ko) 2012-10-04 2019-05-02 삼성전자주식회사 발광모듈과 이를 이용한 조명장치
CN103115229B (zh) * 2013-02-27 2015-09-02 利亚德光电股份有限公司 Led显示单元及led显示系统
USD700151S1 (en) * 2013-04-17 2014-02-25 Revolution Display, Inc. LED display housing
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ
TWD167284S (zh) * 2014-01-14 2015-04-21 隆達電子股份有限公司 導線架料帶之部分
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
JP1613485S (https=) * 2017-11-07 2018-09-10
CN109192838A (zh) * 2018-08-15 2019-01-11 深圳优卫乐得科技有限公司 一种紫外led光源模组制造方法
WO2020045604A1 (ja) * 2018-08-31 2020-03-05 パナソニックＩｐマネジメント株式会社 半導体素子搭載用パッケージ及び半導体装置
US10810932B2 (en) * 2018-10-02 2020-10-20 Sct Ltd. Molded LED display module and method of making thererof
US11444120B2 (en) * 2020-01-14 2022-09-13 Au Optronics Corporation Display apparatus and method of fabricating the same

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JP3891400B2 (ja) * 2001-07-25 2007-03-14 シチズン電子株式会社 発光ダイオード
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422076B (zh) * 2009-02-12 2014-01-01 歐斯朗奧托半導體股份有限公司 半導體裝置及半導體裝置之製造方法
US8710609B2 (en) 2009-02-12 2014-04-29 Osram Opto Semiconductors Gmbh Semiconductor arrangement with a solder resist layer

Also Published As

Publication number Publication date
CN100403565C (zh) 2008-07-16
WO2006030671A1 (ja) 2006-03-23
TWI313937B (https=) 2009-08-21
KR20060085928A (ko) 2006-07-28
US20070063209A1 (en) 2007-03-22
CN1898809A (zh) 2007-01-17
JP4062358B2 (ja) 2008-03-19
JPWO2006030671A1 (ja) 2008-07-31
US20100032693A1 (en) 2010-02-11
US7626211B2 (en) 2009-12-01
KR100723618B1 (ko) 2007-06-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees