TW200607887A - Copper electroplating bath and plating process therewith - Google Patents

Copper electroplating bath and plating process therewith

Info

Publication number
TW200607887A
TW200607887A TW094123951A TW94123951A TW200607887A TW 200607887 A TW200607887 A TW 200607887A TW 094123951 A TW094123951 A TW 094123951A TW 94123951 A TW94123951 A TW 94123951A TW 200607887 A TW200607887 A TW 200607887A
Authority
TW
Taiwan
Prior art keywords
electrolytic copper
plating
via hole
plating process
electroplating bath
Prior art date
Application number
TW094123951A
Other languages
English (en)
Other versions
TWI365924B (en
Inventor
Toshihisa Isono
Shinji Tachibana
Tomohiro Kawase
Naoyuki Omura
Original Assignee
Uyemura C & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uyemura C & Co Ltd filed Critical Uyemura C & Co Ltd
Publication of TW200607887A publication Critical patent/TW200607887A/zh
Application granted granted Critical
Publication of TWI365924B publication Critical patent/TWI365924B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW094123951A 2004-07-23 2005-07-14 Copper electroplating bath and plating process therewith TWI365924B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004215561 2004-07-23
JP2005201080A JP4973829B2 (ja) 2004-07-23 2005-07-11 電気銅めっき浴及び電気銅めっき方法

Publications (2)

Publication Number Publication Date
TW200607887A true TW200607887A (en) 2006-03-01
TWI365924B TWI365924B (en) 2012-06-11

Family

ID=36104896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123951A TWI365924B (en) 2004-07-23 2005-07-14 Copper electroplating bath and plating process therewith

Country Status (5)

Country Link
US (1) US7220347B2 (zh)
JP (1) JP4973829B2 (zh)
KR (1) KR101165222B1 (zh)
CN (1) CN100595343C (zh)
TW (1) TWI365924B (zh)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004045451B4 (de) * 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
JP4976725B2 (ja) * 2005-03-31 2012-07-18 三井金属鉱業株式会社 銅電解液及びその銅電解液を用いた電析銅皮膜の形成方法
JP4816901B2 (ja) * 2005-11-21 2011-11-16 上村工業株式会社 電気銅めっき浴
EP2000013B1 (de) * 2006-03-30 2010-10-13 ATOTECH Deutschland GmbH Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
JP4895734B2 (ja) * 2006-09-08 2012-03-14 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
JPWO2008126522A1 (ja) * 2007-03-15 2010-07-22 日鉱金属株式会社 銅電解液及びそれを用いて得られた２層フレキシブル基板
WO2008142770A1 (ja) * 2007-05-21 2008-11-27 C. Uyemura & Co., Ltd. 電気銅めっき浴
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US20090038947A1 (en) * 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
JP4682285B2 (ja) * 2007-08-30 2011-05-11 日立電線株式会社 配線及び層間接続ビアの形成方法
KR101274544B1 (ko) * 2008-06-12 2013-06-17 이시하라 야쿠힌 가부시끼가이샤 전해 동피막, 그 제조 방법 및 동전해 피막 제조용의 동 전해액
JP5525762B2 (ja) * 2008-07-01 2014-06-18 上村工業株式会社 無電解めっき液及びそれを用いた無電解めっき方法、並びに配線基板の製造方法
EP2312020A4 (en) * 2008-07-07 2014-05-28 Furukawa Electric Co Ltd ELECTROLYTIC COPPER FOIL AND LAMINATE COATED WITH COPPER
US20100059385A1 (en) * 2008-09-06 2010-03-11 Delin Li Methods for fabricating thin film solar cells
US7888784B2 (en) * 2008-09-30 2011-02-15 Intel Corporation Substrate package with through holes for high speed I/O flex cable
KR20100038576A (ko) * 2008-10-06 2010-04-15 삼성전자주식회사 구리 도금용 조성물 및 이를 이용한 구리 배선의 형성 방법
US8388824B2 (en) * 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
JP2010255078A (ja) * 2009-04-28 2010-11-11 Adeka Corp 電解銅めっき浴および電解銅めっき方法
EP2357664A4 (en) * 2009-05-29 2014-07-30 Mitsui Chemicals Inc SEMICONDUCTOR SEALING COMPOSITION, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
TWI487815B (zh) * 2010-01-27 2015-06-11 Ebara Corp 鍍覆方法與鍍覆裝置
WO2011135673A1 (ja) * 2010-04-27 2011-11-03 荏原ユージライト株式会社 新規化合物およびその用途
CN102286760B (zh) 2010-05-19 2016-10-05 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统
EP2576696B1 (en) * 2010-06-01 2017-10-04 Basf Se Composition for metal electroplating comprising leveling agent
EP2392692A1 (en) 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
US20120024713A1 (en) 2010-07-29 2012-02-02 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
US20120097547A1 (en) * 2010-10-25 2012-04-26 Universiteit Gent Method for Copper Electrodeposition
KR20120088124A (ko) * 2011-01-31 2012-08-08 삼성전자주식회사 구리 도금용 조성물 및 이를 이용한 구리 범프 형성 방법
KR101705734B1 (ko) * 2011-02-18 2017-02-14 삼성전자주식회사 구리 도금 용액 및 이것을 이용한 구리 도금 방법
JP5762137B2 (ja) 2011-05-27 2015-08-12 上村工業株式会社 めっき方法
JP5851233B2 (ja) 2011-12-22 2016-02-03 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
JP5952093B2 (ja) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
CN103060860B (zh) * 2013-01-22 2016-01-20 中南大学 一种印制线路板酸性镀铜电镀液及其制备和应用方法
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9677190B2 (en) * 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
CN103572335B (zh) * 2013-11-20 2016-04-13 东莞市富默克化工有限公司 一种pcb通孔电镀铜溶液及其制备方法和电镀方法
WO2016073658A1 (en) 2014-11-05 2016-05-12 Corning Incorporated Bottom-up electrolytic via plating method
CN104532308B (zh) * 2014-12-31 2017-03-08 上海新阳半导体材料股份有限公司 一种用于酸性电镀铜的整平剂及其用途
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
CN104694982B (zh) * 2015-03-05 2018-04-27 中国科学院过程工程研究所 一种含有离子液体添加剂的无氰电镀黄铜镀液及其使用方法
KR101657675B1 (ko) * 2015-09-25 2016-09-22 한국생산기술연구원 2종의 평탄제를 포함하는 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해 구리 도금액
KR101733141B1 (ko) * 2016-03-18 2017-05-08 한국생산기술연구원 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액
JP6948053B2 (ja) 2017-01-12 2021-10-13 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法
KR102445636B1 (ko) 2017-11-28 2022-09-22 솔브레인 주식회사 평탄화제 및 이를 포함하는 구리 도금 조성물
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
US11871514B2 (en) 2020-04-01 2024-01-09 Sumitomo Electric Industries, Ltd. Flexible printed circuit board and method for producing the same
CN113278104A (zh) * 2021-05-10 2021-08-20 江苏理工学院 一种季铵盐表面活性剂及其制备方法
CN117684223A (zh) * 2022-09-02 2024-03-12 宁波安集微电子科技有限公司 一种金属电镀组合物及其使用方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (zh) * 1966-08-20 1970-04-20 Schering Ag
JPS57114685A (en) * 1981-01-07 1982-07-16 Kuraray Co Ltd Brightener for plating bath
CN1181530C (zh) * 1996-12-16 2004-12-22 国际商业机器公司 集成电路芯片上的电镀互连结构
CA2359473A1 (en) * 1999-01-21 2000-07-27 Atotech Deutschland Gmbh Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits
KR100366631B1 (ko) * 2000-09-27 2003-01-09 삼성전자 주식회사 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법
JP3780302B2 (ja) * 2002-02-27 2006-05-31 株式会社関東学院大学表面工学研究所 ビアホール及びスルーホールを有する基板のめっき方法
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
JP2003328179A (ja) * 2002-05-10 2003-11-19 Ebara Udylite Kk 酸性銅めっき浴用添加剤及び該添加剤を含有する酸性銅めっき浴並びに該めっき浴を用いるめっき方法
KR20040003216A (ko) 2002-07-02 2004-01-13 기아자동차주식회사 차량의 전방필러에 의한 운전사각 모니터장치
JP4031328B2 (ja) * 2002-09-19 2008-01-09 荏原ユージライト株式会社 酸性銅めっき浴用添加剤及び該添加剤を含有する酸性銅めっき浴並びに該めっき浴を用いるめっき方法
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
EP1475463B2 (en) * 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method

Also Published As

Publication number Publication date
JP4973829B2 (ja) 2012-07-11
US7220347B2 (en) 2007-05-22
US20060207886A1 (en) 2006-09-21
KR101165222B1 (ko) 2012-07-17
TWI365924B (en) 2012-06-11
JP2006057177A (ja) 2006-03-02
CN1900377A (zh) 2007-01-24
CN100595343C (zh) 2010-03-24
KR20060053951A (ko) 2006-05-22

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