TWI365924B - Copper electroplating bath and plating process therewith - Google Patents

Copper electroplating bath and plating process therewith

Info

Publication number
TWI365924B
TWI365924B TW094123951A TW94123951A TWI365924B TW I365924 B TWI365924 B TW I365924B TW 094123951 A TW094123951 A TW 094123951A TW 94123951 A TW94123951 A TW 94123951A TW I365924 B TWI365924 B TW I365924B
Authority
TW
Taiwan
Prior art keywords
plating process
electroplating bath
copper electroplating
process therewith
therewith
Prior art date
Application number
TW094123951A
Other languages
English (en)
Other versions
TW200607887A (en
Inventor
Toshihisa Isono
Shinji Tachibana
Tomohiro Kawase
Naoyuki Omura
Original Assignee
Uyemura C & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uyemura C & Co Ltd filed Critical Uyemura C & Co Ltd
Publication of TW200607887A publication Critical patent/TW200607887A/zh
Application granted granted Critical
Publication of TWI365924B publication Critical patent/TWI365924B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
TW094123951A 2004-07-23 2005-07-14 Copper electroplating bath and plating process therewith TWI365924B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004215561 2004-07-23
JP2005201080A JP4973829B2 (ja) 2004-07-23 2005-07-11 電気銅めっき浴及び電気銅めっき方法

Publications (2)

Publication Number Publication Date
TW200607887A TW200607887A (en) 2006-03-01
TWI365924B true TWI365924B (en) 2012-06-11

Family

ID=36104896

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123951A TWI365924B (en) 2004-07-23 2005-07-14 Copper electroplating bath and plating process therewith

Country Status (5)

Country Link
US (1) US7220347B2 (zh)
JP (1) JP4973829B2 (zh)
KR (1) KR101165222B1 (zh)
CN (1) CN100595343C (zh)
TW (1) TWI365924B (zh)

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KR101657675B1 (ko) * 2015-09-25 2016-09-22 한국생산기술연구원 2종의 평탄제를 포함하는 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해 구리 도금액
KR101733141B1 (ko) * 2016-03-18 2017-05-08 한국생산기술연구원 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액
JP6948053B2 (ja) 2017-01-12 2021-10-13 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法
KR102445636B1 (ko) 2017-11-28 2022-09-22 솔브레인 주식회사 평탄화제 및 이를 포함하는 구리 도금 조성물
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CN117684223A (zh) * 2022-09-02 2024-03-12 宁波安集微电子科技有限公司 一种金属电镀组合物及其使用方法

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Also Published As

Publication number Publication date
CN1900377A (zh) 2007-01-24
JP4973829B2 (ja) 2012-07-11
US20060207886A1 (en) 2006-09-21
CN100595343C (zh) 2010-03-24
TW200607887A (en) 2006-03-01
KR20060053951A (ko) 2006-05-22
JP2006057177A (ja) 2006-03-02
KR101165222B1 (ko) 2012-07-17
US7220347B2 (en) 2007-05-22

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