TW200539270A - Vertical heat treating apparatus and automatic teaching method for transfer mechanism - Google Patents
Vertical heat treating apparatus and automatic teaching method for transfer mechanism Download PDFInfo
- Publication number
- TW200539270A TW200539270A TW094109185A TW94109185A TW200539270A TW 200539270 A TW200539270 A TW 200539270A TW 094109185 A TW094109185 A TW 094109185A TW 94109185 A TW94109185 A TW 94109185A TW 200539270 A TW200539270 A TW 200539270A
- Authority
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- Taiwan
- Prior art keywords
- sensor
- substrate
- heat treatment
- target member
- abutment
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 82
- 238000012546 transfer Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 238000001514 detection method Methods 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims description 44
- 238000003860 storage Methods 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 79
- 238000006243 chemical reaction Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 8
- 238000012937 correction Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000003647 oxidation Effects 0.000 description 1
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- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
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- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 230000003068 static effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/163—Programme controls characterised by the control loop learning, adaptive, model based, rule based expert control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36039—Learning task dynamics, process
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40519—Motion, trajectory planning
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45063—Pick and place manipulator
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Numerical Control (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004089514A JP4047826B2 (ja) | 2004-03-25 | 2004-03-25 | 縦型熱処理装置及び移載機構の自動教示方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200539270A true TW200539270A (en) | 2005-12-01 |
| TWI357093B TWI357093B (cg-RX-API-DMAC7.html) | 2012-01-21 |
Family
ID=35056477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094109185A TW200539270A (en) | 2004-03-25 | 2005-03-24 | Vertical heat treating apparatus and automatic teaching method for transfer mechanism |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7547209B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1737031A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4047826B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN100454513C (cg-RX-API-DMAC7.html) |
| TW (1) | TW200539270A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2005093821A1 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495032B (zh) * | 2008-06-13 | 2015-08-01 | Tokyo Electron Ltd | 被處理體的移載機構及被處理體的處理系統 |
| TWI676583B (zh) * | 2016-08-01 | 2019-11-11 | 日商國際電氣股份有限公司 | 教示夾具、基板處理裝置及教示方法 |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI266378B (en) * | 2003-03-06 | 2006-11-11 | Toshiba Corp | Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method |
| CN101310377B (zh) * | 2005-11-17 | 2010-11-17 | Oc欧瑞康巴尔斯公司 | 用于盘形的工件的输送装置 |
| JP4663493B2 (ja) * | 2005-11-21 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | ティーチング装置、およびティーチング方法 |
| CH713413B1 (de) * | 2007-06-20 | 2018-07-31 | Tec Sem Ag | Detektionseinrichtung zur Ermittlung von Positionsinformationen. |
| JP5235376B2 (ja) * | 2007-10-05 | 2013-07-10 | 川崎重工業株式会社 | ロボットのターゲット位置検出装置 |
| CN101259921B (zh) * | 2008-04-14 | 2011-03-16 | 无锡市易控系统工程有限公司 | 晶圆全自动传输装置 |
| EP2148208B1 (en) | 2008-07-25 | 2016-04-13 | F.Hoffmann-La Roche Ag | Method and laboratory system for handling sample tube racks |
| JP5280901B2 (ja) * | 2009-03-18 | 2013-09-04 | 光洋サーモシステム株式会社 | 基板処理システムおよび基板処理方法 |
| JP5243569B2 (ja) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
| JP5779957B2 (ja) * | 2011-04-20 | 2015-09-16 | 東京エレクトロン株式会社 | ローディングユニット及び処理システム |
| JP5878813B2 (ja) * | 2011-06-21 | 2016-03-08 | 東京エレクトロン株式会社 | バッチ式処理装置 |
| JP5557942B2 (ja) * | 2013-04-04 | 2014-07-23 | 東京エレクトロン株式会社 | 基板搬送装置 |
| JP5750472B2 (ja) * | 2013-05-22 | 2015-07-22 | 株式会社安川電機 | 基板搬送ロボット、基板搬送システムおよび基板の配置状態の検出方法 |
| JP6438189B2 (ja) * | 2013-10-01 | 2018-12-12 | 川崎重工業株式会社 | ロボット及びロボットの制御方法 |
| US9666465B2 (en) * | 2013-12-12 | 2017-05-30 | Seagate Technology Llc | Positioning apparatus |
| JP6302275B2 (ja) * | 2014-02-12 | 2018-03-28 | 株式会社ダイヘン | 搬送ロボット、および、ティーチングシステム |
| JP6199199B2 (ja) * | 2014-02-20 | 2017-09-20 | 東京エレクトロン株式会社 | 基板処理装置、位置ずれ補正方法及び記憶媒体 |
| WO2016152721A1 (ja) * | 2015-03-25 | 2016-09-29 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
| WO2017150551A1 (ja) * | 2016-03-04 | 2017-09-08 | 川崎重工業株式会社 | 基板搬送装置及び基板搬送ロボットの教示方法 |
| JP6596375B2 (ja) | 2016-03-31 | 2019-10-23 | 株式会社荏原製作所 | ティーチング装置およびティーチング方法 |
| CN106783686B (zh) * | 2016-12-26 | 2019-05-03 | 武汉新芯集成电路制造有限公司 | 一种具有晶圆侦测功能的炉管设备 |
| JP6838010B2 (ja) | 2018-03-22 | 2021-03-03 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法およびプログラム |
| CN108716895A (zh) * | 2018-05-18 | 2018-10-30 | 北京锐洁机器人科技有限公司 | 桌面级翘曲度扫描方法及设备 |
| US10953539B2 (en) * | 2018-12-27 | 2021-03-23 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer robot and automatic teaching method |
| KR102710131B1 (ko) * | 2019-02-08 | 2024-09-26 | 야스카와 아메리카 인코포레이티드 | 관통 빔 자동 티칭 |
| CN109926637B (zh) * | 2019-03-08 | 2024-07-02 | 广东泛瑞新材料有限公司 | 一种切槽装置 |
| CN112011831B (zh) * | 2019-05-30 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 一种用于立式热处理炉的开关门组件及立式热处理炉 |
| CN110106318A (zh) * | 2019-06-14 | 2019-08-09 | 徐州万佳机电设备制造有限公司 | 一种用于铸钢件热处理装置 |
| US12334387B2 (en) * | 2019-06-28 | 2025-06-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus |
| CN110223948A (zh) * | 2019-07-23 | 2019-09-10 | 北京锐洁机器人科技有限公司 | 一种半导体用机械手 |
| CN112786480A (zh) * | 2019-11-08 | 2021-05-11 | 夏泰鑫半导体(青岛)有限公司 | 晶圆处理系统与防撞方法 |
| US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
| US11676845B2 (en) * | 2020-06-30 | 2023-06-13 | Brooks Automation Us, Llc | Automated teach apparatus for robotic systems and method therefor |
| US11845179B2 (en) * | 2020-12-22 | 2023-12-19 | Kawasaki Jukogyo Kabushiki Kaisha | Wafer jig, robot system, communication method, and robot teaching method |
| TW202247334A (zh) * | 2021-01-29 | 2022-12-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 用於在反應室內定位製程套組組件的固定裝置、半導體處理系統及方法 |
| CN113086467B (zh) * | 2021-03-24 | 2023-05-23 | 北京极智嘉科技股份有限公司 | 机器人以及基于机器人的料箱检测方法 |
| JP2024078532A (ja) * | 2022-11-30 | 2024-06-11 | 株式会社安川電機 | 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法 |
| JP2025180617A (ja) | 2024-05-30 | 2025-12-11 | 東京エレクトロン株式会社 | 熱処理システム、および状態監視方法 |
| CN118610131B (zh) * | 2024-08-08 | 2024-11-12 | 武汉新芯集成电路股份有限公司 | 半导体制程设备及半导体制程设备的保养方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218115A (ja) * | 1982-06-14 | 1983-12-19 | Sony Corp | 熱処理装置 |
| US4770590A (en) | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
| US5055036A (en) * | 1991-02-26 | 1991-10-08 | Tokyo Electron Sagami Limited | Method of loading and unloading wafer boat |
| US5409348A (en) * | 1992-05-15 | 1995-04-25 | Tokyo Electron Limited | Substrate transfer method |
| KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
| JP2898587B2 (ja) * | 1995-10-05 | 1999-06-02 | 国際電気株式会社 | 半導体製造装置の移載機のティーチング方法 |
| JP2001509643A (ja) * | 1997-07-11 | 2001-07-24 | ジェンマーク・オートメーション | 複数ポイント位置走査システム |
| JP3869098B2 (ja) * | 1997-11-28 | 2007-01-17 | 大日本スクリーン製造株式会社 | 搬送装置、基板搬入搬出装置及び基板処理装置 |
| JP3869103B2 (ja) | 1997-12-25 | 2007-01-17 | 大日本スクリーン製造株式会社 | 基板搬送教示用の治具、基板搬送装置、及び搬送教示システム |
| JP3642729B2 (ja) | 2000-11-27 | 2005-04-27 | 東京エレクトロン株式会社 | 処理装置 |
| JP4258964B2 (ja) | 2000-09-26 | 2009-04-30 | 神鋼電機株式会社 | ウェハ移載装置 |
| JP4342745B2 (ja) * | 2000-09-27 | 2009-10-14 | 株式会社日立国際電気 | 基板処理方法および半導体装置の製造方法 |
| US6717171B2 (en) * | 2001-06-05 | 2004-04-06 | Semitool, Inc. | Method and apparatus for accessing microelectronic workpiece containers |
| US7706919B2 (en) | 2001-09-07 | 2010-04-27 | Kabushiki Kaisha Yaskawa Denki | Wafer position teaching method and teaching jig |
| JP2003165078A (ja) | 2001-11-27 | 2003-06-10 | Kawasaki Heavy Ind Ltd | 自動教示システム |
| US20030170583A1 (en) * | 2002-03-01 | 2003-09-11 | Hitachi Kokusai Electric Inc. | Heat treatment apparatus and a method for fabricating substrates |
| JP4064361B2 (ja) | 2004-03-15 | 2008-03-19 | 川崎重工業株式会社 | 搬送装置の搬送位置の位置情報取得方法 |
-
2004
- 2004-03-25 JP JP2004089514A patent/JP4047826B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-24 TW TW094109185A patent/TW200539270A/zh not_active IP Right Cessation
- 2005-03-25 CN CNB2005800096164A patent/CN100454513C/zh not_active Expired - Fee Related
- 2005-03-25 US US10/593,901 patent/US7547209B2/en not_active Expired - Lifetime
- 2005-03-25 WO PCT/JP2005/005529 patent/WO2005093821A1/ja not_active Ceased
- 2005-03-25 EP EP05727144A patent/EP1737031A4/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495032B (zh) * | 2008-06-13 | 2015-08-01 | Tokyo Electron Ltd | 被處理體的移載機構及被處理體的處理系統 |
| TWI676583B (zh) * | 2016-08-01 | 2019-11-11 | 日商國際電氣股份有限公司 | 教示夾具、基板處理裝置及教示方法 |
| US10535543B2 (en) | 2016-08-01 | 2020-01-14 | Kokusai Electric Corporation | Teaching jig, substrate processing apparatus, and teaching method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4047826B2 (ja) | 2008-02-13 |
| EP1737031A4 (en) | 2008-11-19 |
| CN1934695A (zh) | 2007-03-21 |
| WO2005093821A1 (ja) | 2005-10-06 |
| TWI357093B (cg-RX-API-DMAC7.html) | 2012-01-21 |
| US20070273892A1 (en) | 2007-11-29 |
| CN100454513C (zh) | 2009-01-21 |
| EP1737031A1 (en) | 2006-12-27 |
| US7547209B2 (en) | 2009-06-16 |
| JP2005277175A (ja) | 2005-10-06 |
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