TW200526819A - Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board - Google Patents

Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board Download PDF

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Publication number
TW200526819A
TW200526819A TW093124933A TW93124933A TW200526819A TW 200526819 A TW200526819 A TW 200526819A TW 093124933 A TW093124933 A TW 093124933A TW 93124933 A TW93124933 A TW 93124933A TW 200526819 A TW200526819 A TW 200526819A
Authority
TW
Taiwan
Prior art keywords
copper foil
ultra
carrier
thin copper
thin
Prior art date
Application number
TW093124933A
Other languages
English (en)
Chinese (zh)
Other versions
TWI379925B (enExample
Inventor
Yuuji Suzuki
Akira Matsuda
Original Assignee
Furukawa Circuit Foil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil filed Critical Furukawa Circuit Foil
Publication of TW200526819A publication Critical patent/TW200526819A/zh
Application granted granted Critical
Publication of TWI379925B publication Critical patent/TWI379925B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW093124933A 2003-09-01 2004-08-19 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board TW200526819A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003308820A JP3977790B2 (ja) 2003-09-01 2003-09-01 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板

Publications (2)

Publication Number Publication Date
TW200526819A true TW200526819A (en) 2005-08-16
TWI379925B TWI379925B (enExample) 2012-12-21

Family

ID=34101285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124933A TW200526819A (en) 2003-09-01 2004-08-19 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board

Country Status (6)

Country Link
US (1) US7223481B2 (enExample)
EP (1) EP1511366A3 (enExample)
JP (1) JP3977790B2 (enExample)
KR (1) KR101056692B1 (enExample)
CN (2) CN101662892B (enExample)
TW (1) TW200526819A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8808873B2 (en) 2010-10-21 2014-08-19 Industrial Technology Research Institute Carrier-attached copper foil and method for manufacturing the same
US10757849B2 (en) 2013-05-29 2020-08-25 Tatsuta Electric Wire & Cable Co., Ltd. Electromagnetic wave shield film, printed wiring board using same, and rolled copper foil

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070087A1 (ja) * 2003-02-04 2004-08-19 Furukawa Circuit Foil Co., Ltd 複合銅箔、その製造方法及び該複合銅箔を用いた高周波伝送回路
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
JP2006310574A (ja) * 2005-04-28 2006-11-09 Nippon Kayaku Co Ltd 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。
JP5311823B2 (ja) 2005-07-21 2013-10-09 日本化薬株式会社 ポリアミド樹脂、エポキシ樹脂組成物およびその硬化物
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
WO2007052523A1 (ja) * 2005-10-31 2007-05-10 Nippon Kayaku Kabushiki Kaisha ゴム変性ポリアミド樹脂、エポキシ樹脂組成物、およびその硬化物
JP4927503B2 (ja) 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5138185B2 (ja) * 2006-06-30 2013-02-06 信越ポリマー株式会社 プリント配線基板
US8134084B2 (en) * 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
JP4891037B2 (ja) * 2006-11-22 2012-03-07 日本電解株式会社 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法
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JP4884298B2 (ja) * 2007-05-17 2012-02-29 日本化薬株式会社 樹脂層付き銅箔
KR101351928B1 (ko) 2007-12-28 2014-01-21 일진머티리얼즈 주식회사 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판
JP4973519B2 (ja) * 2008-01-18 2012-07-11 住友ベークライト株式会社 積層板、積層板の製造方法、多層プリント配線板および半導体装置
TWI398350B (zh) * 2008-02-05 2013-06-11 Du Pont 高黏著性聚醯亞胺銅箔積層板及其製造方法
JP2009214308A (ja) * 2008-03-07 2009-09-24 Furukawa Electric Co Ltd:The キャリア付き銅箔
JP5255349B2 (ja) * 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
KR101426038B1 (ko) * 2008-11-13 2014-08-01 주식회사 엠디에스 인쇄회로기판 및 그 제조방법
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CN102152528B (zh) * 2010-10-21 2015-03-11 江西理工大学 稀土改性剥离强度的载体超薄铜箔及其制备方法
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KR20120084441A (ko) * 2011-01-20 2012-07-30 이미연 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판
JP5373995B2 (ja) * 2011-08-31 2013-12-18 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP5902931B2 (ja) * 2011-12-06 2016-04-13 新光電気工業株式会社 配線基板の製造方法、及び、配線基板製造用の支持体
JP5903446B2 (ja) * 2012-02-06 2016-04-13 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法及び電子機器の製造方法
JP5854872B2 (ja) * 2012-02-15 2016-02-09 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体及びプリント配線板の製造方法
WO2013161334A1 (ja) * 2012-04-24 2013-10-31 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板
JP6096787B2 (ja) * 2012-09-24 2017-03-15 Ｊｘ金属株式会社 キャリア付金属箔、樹脂製の板状キャリアと金属箔とからなる積層体、ならびにそれらの用途
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JP6140481B2 (ja) * 2013-03-05 2017-05-31 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6140480B2 (ja) * 2013-03-05 2017-05-31 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6274736B2 (ja) * 2013-03-06 2018-02-07 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及びプリント配線板の製造方法
JP6425399B2 (ja) * 2013-03-28 2018-11-21 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
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JP5877282B1 (ja) * 2014-09-09 2016-03-02 古河電気工業株式会社 プリント配線板用銅箔及び銅張積層板
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EP1511366A2 (en) 2005-03-02
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US7223481B2 (en) 2007-05-29

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