TW200501808A - Display panel and process for producing the same - Google Patents
Display panel and process for producing the sameInfo
- Publication number
- TW200501808A TW200501808A TW093106312A TW93106312A TW200501808A TW 200501808 A TW200501808 A TW 200501808A TW 093106312 A TW093106312 A TW 093106312A TW 93106312 A TW93106312 A TW 93106312A TW 200501808 A TW200501808 A TW 200501808A
- Authority
- TW
- Taiwan
- Prior art keywords
- organic
- superimposed
- base plate
- display panel
- laminate
- Prior art date
Links
- 238000007789 sealing Methods 0.000 abstract 4
- 239000002585 base Substances 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 239000003513 alkali Substances 0.000 abstract 1
- 230000000994 depressogenic effect Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003063220 | 2003-03-10 | ||
JP2003317114 | 2003-09-09 | ||
JP2003328805 | 2003-09-19 | ||
JP2003422679A JP2005116497A (ja) | 2003-03-10 | 2003-12-19 | 表示パネル及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200501808A true TW200501808A (en) | 2005-01-01 |
Family
ID=32996198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093106312A TW200501808A (en) | 2003-03-10 | 2004-03-10 | Display panel and process for producing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060061271A1 (zh) |
JP (1) | JP2005116497A (zh) |
KR (1) | KR20050104423A (zh) |
GB (1) | GB2416320A (zh) |
TW (1) | TW200501808A (zh) |
WO (1) | WO2004082337A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004362914A (ja) | 2003-06-04 | 2004-12-24 | Idemitsu Kosan Co Ltd | 有機エレクトロルミネッセンス素子及びそれを用いた表示装置 |
JP2007250455A (ja) * | 2006-03-17 | 2007-09-27 | Hitachi Displays Ltd | 画像表示装置 |
JP4816357B2 (ja) * | 2006-09-19 | 2011-11-16 | コニカミノルタホールディングス株式会社 | 有機エレクトロルミネッセンスパネル、有機エレクトロルミネッセンスパネルの製造方法 |
JP2008089634A (ja) * | 2006-09-29 | 2008-04-17 | Seiko Epson Corp | 電気光学装置及び電子機器 |
DE102013110174A1 (de) * | 2013-09-16 | 2015-03-19 | Osram Oled Gmbh | Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements |
WO2016084256A1 (ja) * | 2014-11-28 | 2016-06-02 | パイオニア株式会社 | 発光装置 |
WO2018003865A1 (ja) * | 2016-06-28 | 2018-01-04 | 京セラ株式会社 | 封止体、太陽電池モジュールおよび封止体の製造方法 |
JP6833385B2 (ja) * | 2016-07-29 | 2021-02-24 | エルジー ディスプレイ カンパニー リミテッド | 表示装置の製造方法および製造装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0680881B2 (ja) * | 1984-06-29 | 1994-10-12 | 富士通株式会社 | 半田溶融式高密度コネクタ |
JPH04277716A (ja) * | 1991-03-06 | 1992-10-02 | Victor Co Of Japan Ltd | 情報記録媒体及び情報記録装置 |
JPH07227690A (ja) * | 1994-02-21 | 1995-08-29 | Asahi Glass Co Ltd | はんだ合金及びターゲット構造体 |
JPH10125463A (ja) * | 1995-12-28 | 1998-05-15 | Matsushita Electric Ind Co Ltd | 有機エレクトロルミネセンス素子、液晶照明装置、表示デバイス装置、および、有機エレクトロルミネセンス素子の製造方法 |
US6195142B1 (en) * | 1995-12-28 | 2001-02-27 | Matsushita Electrical Industrial Company, Ltd. | Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element |
DE69707233T2 (de) * | 1996-05-28 | 2002-07-11 | Koninklijke Philips Electronics N.V., Eindhoven | Organische elektrolumineszente vorrichtung |
US5874804A (en) * | 1997-03-03 | 1999-02-23 | Motorola, Inc. | Organic electroluminescent device hermetic encapsulation package and method of fabrication |
JPH11239866A (ja) * | 1997-12-19 | 1999-09-07 | Nihon Almit Co Ltd | 低温半田付け法 |
JP2001058287A (ja) * | 1999-06-11 | 2001-03-06 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
DE10005296A1 (de) * | 2000-02-07 | 2001-08-16 | Infineon Technologies Ag | Vorrichtung für die Emission elektromagnetischer Strahlung und Verfahren zu deren Herstellung |
US6706316B2 (en) * | 2001-05-08 | 2004-03-16 | Eastman Kodak Company | Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays |
JP3745702B2 (ja) * | 2002-05-10 | 2006-02-15 | 双葉電子工業株式会社 | リングレスゲッターを備えた電子デバイス、リングレスゲッターの固定方法、及びリングレスゲッターの活性化方法 |
JP2004027404A (ja) * | 2002-06-24 | 2004-01-29 | Hitachi Chem Co Ltd | 防湿封止材及びこれを用いた実装体、防湿封止材の製造方法及び防湿封止材を用いた実装体の製造方法 |
-
2003
- 2003-12-19 JP JP2003422679A patent/JP2005116497A/ja not_active Withdrawn
-
2004
- 2004-03-10 KR KR1020057016942A patent/KR20050104423A/ko not_active Application Discontinuation
- 2004-03-10 GB GB0518956A patent/GB2416320A/en not_active Withdrawn
- 2004-03-10 TW TW093106312A patent/TW200501808A/zh unknown
- 2004-03-10 WO PCT/JP2004/003093 patent/WO2004082337A1/ja active Application Filing
-
2005
- 2005-09-09 US US11/222,568 patent/US20060061271A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
GB2416320A (en) | 2006-01-25 |
US20060061271A1 (en) | 2006-03-23 |
WO2004082337A1 (ja) | 2004-09-23 |
GB0518956D0 (en) | 2005-10-26 |
JP2005116497A (ja) | 2005-04-28 |
KR20050104423A (ko) | 2005-11-02 |
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