TW200424771A - Alicyclic methacrylate having oxygen substituent group on <alpha>-methyl - Google Patents
Alicyclic methacrylate having oxygen substituent group on <alpha>-methyl Download PDFInfo
- Publication number
- TW200424771A TW200424771A TW093105964A TW93105964A TW200424771A TW 200424771 A TW200424771 A TW 200424771A TW 093105964 A TW093105964 A TW 093105964A TW 93105964 A TW93105964 A TW 93105964A TW 200424771 A TW200424771 A TW 200424771A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- alicyclic
- carbon atoms
- alkyl group
- oxygen substituent
- Prior art date
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 125000002723 alicyclic group Chemical group 0.000 title claims abstract description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 title 1
- -1 Alicyclic methacrylate compounds Chemical class 0.000 claims abstract description 67
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000005843 halogen group Chemical group 0.000 claims abstract description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 11
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims abstract description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 10
- 125000004093 cyano group Chemical group *C#N 0.000 claims abstract description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 125000000217 alkyl group Chemical group 0.000 claims description 18
- 125000000962 organic group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 150000002148 esters Chemical group 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 abstract description 23
- 239000000463 material Substances 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 7
- 238000011161 development Methods 0.000 abstract description 3
- 238000001312 dry etching Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 19
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 238000005530 etching Methods 0.000 description 11
- AAMTXHVZOHPPQR-UHFFFAOYSA-N 2-(hydroxymethyl)prop-2-enoic acid Chemical compound OCC(=C)C(O)=O AAMTXHVZOHPPQR-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 238000005481 NMR spectroscopy Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- 238000007429 general method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- FTTATHOUSOIFOQ-UHFFFAOYSA-N 1,2,3,4,6,7,8,8a-octahydropyrrolo[1,2-a]pyrazine Chemical compound C1NCCN2CCCC21 FTTATHOUSOIFOQ-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000002596 lactones Chemical group 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000010626 work up procedure Methods 0.000 description 3
- MEKOFIRRDATTAG-UHFFFAOYSA-N 2,2,5,8-tetramethyl-3,4-dihydrochromen-6-ol Chemical compound C1CC(C)(C)OC2=C1C(C)=C(O)C=C2C MEKOFIRRDATTAG-UHFFFAOYSA-N 0.000 description 2
- IZNVNFGCUTXHEH-UHFFFAOYSA-N 2-(ethoxymethyl)prop-2-enoic acid Chemical compound CCOCC(=C)C(O)=O IZNVNFGCUTXHEH-UHFFFAOYSA-N 0.000 description 2
- NOHCGJVKOIEMCT-UHFFFAOYSA-N 2-(methoxymethyl)prop-2-enoic acid Chemical compound COCC(=C)C(O)=O NOHCGJVKOIEMCT-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000007031 hydroxymethylation reaction Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000007069 methylation reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 125000006432 1-methyl cyclopropyl group Chemical group [H]C([H])([H])C1(*)C([H])([H])C1([H])[H] 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- OQLZINXFSUDMHM-UHFFFAOYSA-N Acetamidine Chemical group CC(N)=N OQLZINXFSUDMHM-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- PPKQIQMDBOMWML-UHFFFAOYSA-N C1CCCCCC1C1(O)CCCCCC1 Chemical group C1CCCCCC1C1(O)CCCCCC1 PPKQIQMDBOMWML-UHFFFAOYSA-N 0.000 description 1
- 241001164374 Calyx Species 0.000 description 1
- XJUZRXYOEPSWMB-UHFFFAOYSA-N Chloromethyl methyl ether Chemical compound COCCl XJUZRXYOEPSWMB-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N EtOH Substances CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 101150000419 GPC gene Proteins 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229940061627 chloromethyl methyl ether Drugs 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004966 cyanoalkyl group Chemical group 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000006547 cyclononyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- NLUNLVTVUDIHFE-UHFFFAOYSA-N cyclooctylcyclooctane Chemical group C1CCCCCCC1C1CCCCCCC1 NLUNLVTVUDIHFE-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000004772 dichloromethyl group Chemical group [H]C(Cl)(Cl)* 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- KPADFPAILITQBG-UHFFFAOYSA-N non-4-ene Chemical compound CCCCC=CCCC KPADFPAILITQBG-UHFFFAOYSA-N 0.000 description 1
- 238000010915 one-step procedure Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000012985 polymerization agent Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- VFWRGKJLLYDFBY-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag].[Ag] VFWRGKJLLYDFBY-UHFFFAOYSA-N 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 238000000233 ultraviolet lithography Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L37/00—Couplings of the quick-acting type
- F16L37/08—Couplings of the quick-acting type in which the connection between abutting or axially overlapping ends is maintained by locking members
- F16L37/084—Couplings of the quick-acting type in which the connection between abutting or axially overlapping ends is maintained by locking members combined with automatic locking
- F16L37/091—Couplings of the quick-acting type in which the connection between abutting or axially overlapping ends is maintained by locking members combined with automatic locking by means of a ring provided with teeth or fingers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/77—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
- C07D307/93—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems condensed with a ring other than six-membered
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
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Description
200424771 ⑴ 玖、發明說明 【發明所屬之技術領域】 本發明爲有關一種適合作爲使用於微細加工劑樹脂光 阻材料之基礎樹脂用單體,及新穎的在α位甲基上具有氧 取代基之含脂環的甲基丙烯酸酯化合物。 【先前技術】 近年來,隨著LSI之高集積化與高速度化,於尋求圖 案電路微細化之過程中,號稱下一世紀爲劑加工技術之遠 紫外線微影技術爲極有發展之技術。其中又對於以KrF等 離子雷射光、ArF等離子雷射光等作爲光源之光微影技 術,故極期待其可實現〇. 3 // m以下超微細加工所不可欠 缺之技術。 對於使用等離子雷射光,特別是波長193nm之 ArF 等離子雷射光作爲光源之光微影技術所使用之光阻材料 中,除必須確保該波長下之高透明性,對應薄膜化之高蝕 刻耐性,無須負擔高價光學材料即可擁有的感度外,同時 以必須尋求可正確地形成微細圖案之高解像性能。爲滿足 前述要求,必須開發出一種具有高透明性、高剛直性且具 有高反應性之基礎樹脂,目前已知之高分子化合物中,尙 未能出現可充分滿足前述特性之化合物’故仍極期待於光 阻材料上之改善。 高透明性樹脂,一般爲具有丙烯酸或甲基丙烯酸衍生 物之共聚物者,目前爲止,也有許多針對其作爲光阻材料 -5- (2) 200424771 之用途上作許多硏究。但丙烯酸或甲基丙烯酸衍生物之共 聚物,其主鏈結構上具有高度剛直性,而爲確保其必要之 蝕刻耐性時,需導入作爲酯取代基之金剛烷基等脂環結構 (專利文獻1 :特開平4 — 3 9 6 6 5號公報)。又,經由導 入脂環結構而增加聚合物之撥水性,進而妨礙顯像液之四 甲基銨氫氧化物水溶液進行圓滑的顯影過程,特別是會容 易引起超微細圖案之形狀不佳,或造成圖案崩壞等不良影 響。因此,於將前述高分子化合物作爲基礎樹脂以調製光 阻材料時,即使解像性充足,但仍未能具有充分蝕刻耐 性,或即使具有達容許範圍之蝕刻耐性但仍將因低解像性 而陷入性能不佳之結果。 [專利文獻1] 特開平4 — 3 9 6 6 5號公報 【發明內容】 本發明鑒於前述事情,而提出一種於3 〇 〇 n m以下波 鲁 長,特別是使用ArF等離子雷射光作爲光源之光微影技術 中,兼具有優良蝕刻耐性與解像性之光阻材料用聚合物原 料之單體的在α位上具有氧取代基之含脂環的甲基丙烯酸 酯化合物。 本發明者們,爲達前述目的而經過深入硏究結果,得 知經由後述方法,即可高產率且簡便的製得下述式 (1) 、 (2)與(3)所示之在^位上具有氧取代基之含 脂環的甲基丙烯酸酯化合物,又,使用此在α位上具有氧 -6 - (3) 200424771 取代基之含脂環的甲基丙烯酸酯化合物經聚合所得之高分 子化合物於等離子雷射之曝光波長中具有高度透明性,且 使用其作爲基礎樹脂使用之光阻材料,可得到兼具有優良 蝕刻耐性與解像性等特徵。其中之蝕刻耐性推測應爲本發 明化合物之脂環部分所得之效果。又,有關優良解像性部 分’推測應爲本發明化合物中存在有氧甲基而增加聚合物 主鏈附近之親水性,而得到更圓滑的顯像結果。 因此,本發明提供一種以下所示之在α位上具有氧取 代基之含脂環的甲基丙烯酸酯化合。 [I]、一種下述式(1 )所示之在α位上具有氧取代基 之含脂環的甲基丙烯酸酯化合物, OR1 0人 OR2 (1) (R1爲氫原子或碳數1至之院基’此院基可含有 鹵素原子、羥基、醚鍵結、羰基、羧基、或氰基,R2爲 碳數3至20之具有脂環結構之1價有機基)。 [II]、一種下述式(2 )所示之在α位上具有氧取代基 (4) 200424771 (R1爲氫原子或碳數1至10之烷基,此烷基可含有 鹵素原子、經基、醚鍵結、鑛基、竣基、或氰基,R3爲 碳數4至2 0之具有脂環結構之3級烷基)。 [III]、一種下述式(3)所不之在^位上具有氧取代 基之含脂環的甲基丙烯酸酯化合物, OR1
(3)
(R1爲氫原子或碳數1至ίο之烷基,此烷基可含有 鹵素原子、羥基、醚鍵結、羰基、羧基、或氰基,R4爲 碳數4至2 0之具有內酯結構之有機基)。 以下,將詳細說明本發明之內容。 本發明之在α位甲基上具有氧取代基之含脂環的甲基 丙烯酸酯化合物,例如下述式(1 ) 、 ( 2 )與(3 )所示
者。 OR1 OR1
(1) (2) (3) OR1 y 〇 人 OR2 (式中’ R1爲氫原子或碳數1至1〇之烷基,此烷基 可含有鹵素原子 '羥基、醚鍵結、羰基、羧基、或氰基, R2爲碳數3至20之具有脂環結構之!價有機基,R3爲碳 -8 - (5) 200424771 數4至2 0之具有脂環結構之3級烷基,R4爲碳數4至2 0 之具有內酯結構之有機基)。 R1之碳數1至20之烷基可爲直鏈狀、支鏈狀或環狀 烷基皆可,且可含有鹵素原子、羥基、醚鍵結、羰基、羧 基、或氰基;前述烷基之具體例如,甲基、乙基、丙基、 2 -丙基、丁基、2 — 丁基、異丁基、t 一丁基、戊基、己 基、環己基、癸基、氯甲基、二氯甲基、三氯甲基、三氟 甲基、2—羥基乙基、2 —羥基丙基、1 一乙氧基乙基、2 — φ 四氫吡喃基、甲醯基、乙醯基、甲氧基乙醯基、乙醯氧乙 醯基、氰基甲基、2 -氰基乙基等。 R2之碳數3至2 0之具有脂環結構之1價有機基,例 如環丙基、環丁基、環戊基、環己基、環庚基、二環庚 基、二環辛基、二環壬基、二環癸基、三環癸基、金剛烷 基、四環十二烷基、環己基甲基、二環庚基甲基、異原菠 烷基、盖基、羥基環己基、羥基二環庚基、羥基金剛烷 基,及後述R3、R4中所例示之內容。 φ R3之碳數4至20之具有脂環結構之3級烷基,例如 1—甲基環丙基、1 一甲基環戊基、1—乙基環戊基、1 一甲 基環己基、1 一乙基環己基、1 一環戊基環戊基、1 一環己 基環戊基、1 一甲基環己基、1 一乙基環己基、1—環戊基 環己基、1—環己基環己基、2 —甲基—2-原菠烷基、2-乙基—2 —原菠烷基、8 —甲基—8 —三環[5.2.1.02,6]癸 基、8 —乙基一8 —三環[5.2.1.02,6]癸基、3 —甲基一3 —四 環[4·4.0.12’5.Γ’1()]十二烷基、3 —乙基一3 — 四環 -9- (6) 200424771 [4.4·0.12,5.17,1()]十二烷基、2 —甲基一 2 —金剛烷基、2 — 乙基—2—金剛烷基、1—金剛烷基一甲基乙基、1—甲 基—3 -酮基一 1 一環己基、1—甲基一 1 一 (四氫D夫喃一 2 一基)乙基、5 —羥基一 2 -甲基一 2—金剛烷基、5—羥基 —2 -乙基一 2 —金剛烷基等。 R4之碳數4至2 0之具有內酯結構之有機基,例如丁 內酯基、戊內酯基、1,3 —環己烷碳內酯基、4 一氧雜—5 一酮基三環[5.2.1.〇2,6]癸基、2,6 —原菠烷碳內酯一 3 —基 甲基、2,6 —原疲院碳內酯—5 —基、3 —甲氧基鑛基一 2,6 一原菠烷碳內酯一 5 —基、7 —氧雜一 2,6 —原菠烷基碳內 酯—5 -基等。 可依用途之不同,而對R2、R3、R4作適當之選擇, 以將極性等分子全體之性質調整至最適當之狀態,進而調 整利用本化合物所得之光阻特性。 本發明之酯化合物之具體例如下所示化合物,但並不 僅限定於此。又,於下述式中,Me爲甲基,Ac爲乙醯 基、Et爲乙基。 •10- (7)200424771
-11 - 200424771
本發明之式(1)之在α位甲基上具有氧取代基之含 脂環的甲基丙烯酸酯化合物,例如可依下所示合成法製 得,但本發明並不受此方法所限定。以下將詳細說明其內 -12- (9) 200424771 容。 首先,式(1 )之R1 = 1時,可將依一般方法所製得 之對應丙烯酸酯化合物(4 )依以下1階段步驟合成。本 反應,如下所示般,可將丙烯酸酯化合物之α位之羥基甲 基化反應所得式(4 )所示丙烯酸酯化合物於溶媒中或無 溶媒中,於胺化合物之存在下,與1當量之甲醛等價物進 行反應,而得式(5 )所示α —(羥基甲基)丙烯酸酯化 合物。 ΟΗ
(4) (5) (式中’ R2爲碳數3至2 0之具有脂環結構之1價有 機基)。 上述經基甲基化反應所使用之胺化合物,例如三甲基 胺、三乙基胺、三丁基胺、吡啶、1,4 一二氮雜二環[2.2·2] 辛烷、1,5 -二氮雜二環[4·3〇]5 —壬烯、ι,8 一二氮雜二環 [5· 4·〇] 7 —十〜烯等。胺化合物之使用量,以對原料1莫 耳使用〇 · 〇 〇 1至丨〇莫耳,特別是〇. 至1莫耳爲佳。低 於0.0 01莫耳時,反應會有未能進行之情形,超過莫 耳時’則医I過量使用會有爲能充分發揮效果之情形。 甲醒等價物,例如氣體狀甲醛、嗎啉、對甲醛、 1,3,5 -三I]惡院等。甲醛等價物之使用量,以對原料1莫 耳使用〇. 2至! 〇莫耳甲醛爲佳,又以使用〇. 5至2莫耳 -13- (10) (10)200424771 爲更佳。低於〇. 2莫耳時,因原料之丙烯酸酯化合物大量 殘留,故產率會有大幅降低之情形,超過1 〇莫耳時,則 會產生大量副產物,而會有使產率大幅下降之情形。 進行上述羥基甲基化反應所使用之溶媒,例如可使用 甲苯、己烷、庚烷等烴類;二丁基醚、二乙二醇二乙基 醚、四氫呋喃等醚類;甲醇、乙醇等醇類;二氯甲烷等鹵 化烴類;乙酸乙酯等酯類;丙酮、2 — 丁酮等同類;乙腈 等腈類;二甲基亞硕、N,N’ 一二甲基甲醯胺、N,N’ —二甲 基乙醯胺等非質子性極性溶媒類;水等所選出之單獨或2 種以上混合所得者。 上述羥基甲基化反應之反應溫度,以—20 °C至10(TC 左右爲佳’其可配合原料及反應條件適當地選擇反應溫 度,例如將胺化合物之1,4 一二氮雜雙環[2 · 2.2 ]辛烷,於 使用甲醛等價物之甲醛於水中進行反應時,以0°C至60 °C 爲最佳。反應溫度越局時副反應越顯著,又,經由蒸發會 造成甲醛之流失,故於現實速度下進行反應時,以越低溫 下進行反應時,可達到高產率效果,而爲較佳。 上述加成反應之反應時間,爲配合產率之提昇,以使 用薄層滲透分析法、氣體滲透分析法等追蹤反應進行狀態 而決定,一般爲1至2 0 0小時。 反應結束後,可使用一般常用之水系後處理 (aqueous work — up )而製得標的物(5 )之α —(羥基 甲基)丙烯酸酯化合物。標的物(5 )可再使用再結晶、 色層分析、蒸餾等一般方法進行精製。 -14- (11) (11)200424771 其次,式(1)之R1爲碳數1至10之可含有鹵素原 子、羥基、醚鍵結、羰基、羧基、或氰基之烷基時’相對 於上述反應所得之α - (羥基甲基)丙烯酸酯化合物 (5 ),可使用—般常用方法之院基化或釀基化反應結 果,得標的之化合物(6 )。所得α —(院氧基甲基)或 α —(醯氧基甲基)丙烯酸酯化合物(6)可再使用色層 分析、蒸餾、再結晶等一般方法進行精製。 ΟΗ 1^ 烷基化或醯基化 OR1 y OR2 0 入 OR: (5) ⑹ (式中,R1爲碳數1至10之烷基,此烷基可含有鹵 素原子、羥基、醚鍵結、羰基、羧基、或氰基,R2爲碳 數3至20之具有脂環結構之1價有機基)。 本發明之化合物,極適合作爲光阻材料之基礎聚合物 的聚合物單體。 使用本發明之α位甲基上具有氧取代基之含脂環的甲 基丙烯酸酯化合物作爲單體使用,以製造聚合物時,一般 而言,爲將單體與溶媒混合後,再添加觸媒或聚合聚合 劑’依各種情形之不同,可於加熱或冷卻中方式進行聚合 反應。此聚合方法可依一般常用方法進行。上述聚合之 例’如自由基聚合、陽離子聚合、陰離子聚合等,必要時 -15· (12) (12)200424771 可再與其他1種或1種以上具有聚合性雙鍵之化合物進行 共聚。 上述聚合所得之聚合物作爲基礎聚合物之光阻材料, 一般可使用於其中加入有機溶劑與酸產生劑後進行調製之 方法。又必要時,可再添加交聯劑、鹼性化合物、溶解阻 礙劑等。前述光阻材料之調製,可依一般常用方法進行。 【實施方式】 以下’將使用實施例與參考例對本發明作更具體之說 明,但本發明並不受此實施例所限定。又,下記式中, Me爲甲基,Ac爲乙醯基。 [實施例1 ] α -(羥基甲基)丙烯酸(2,6 -原菠烷碳 內酯一 5—基)之合成
將丙烯酸(2,6—原菠烷碳內酯一5—基)118§、1,4 一二氮雜二環[2_2.2]辛烷31.8g、37%嗎啉50.6g、四氫呋 喃2 5 0g混合後攪拌20小時。反應液使用鹽酸中和後’進 行一般常用之水系後處理(aqueous work — up )。將溶媒 減壓餾除後,以矽膠柱狀滲透分析儀進行精製’得式 -16- (13) 200424771 (7 )所示α — (羥基甲基)丙烯酸(2,6 -原菠烷碳內酯 —5 —基)81.0g (產率 60% )。 (IR、NMR分析結果) I R (薄膜): v = 3 4 7 9, 2 9 8 0, 2 8 8 3, 1 7 8 2, 1 7 1 6, 1 6 3 7, 1 4 5 2 ,1396,1342, 1 3 0 8, 1 2 6 7, 1180, 1 1 6 3, 1 1 5 1,
1057,1 0 4 3, 1 0 2 8, 1 0 1 2, 998, 9 5 4 cm-1 ^-NMR (6 0 0MHz i n CDC 1 3): (5 = 1. 58 (1H, br. d, J = 1 1. 6Hz) , 1. 69 (1H, b r. d, J = 1 3. 8Hz) , 1. 9 3 (1H, br. d, J = 1 1. 6Hz) , 1 • 97 (1H, d d d, J = 1 3. 7, 1 1. 3, 4. 5Hz) , 2. 2 4(1 H, br. s) , 2. 4 6 - 2. 5 2 (2H, m) , 3. 1 4 (1H, m) , 4
• 2 3 (2H, s) , 4. 4 9 (1H, d, J =4. 8Hz) , 4. 5 8 (1H ,m) , 5. 81 (1H, d, J = l. 0Hz) , 6. 15 (1H, d, J = 1 .0Hz).
[實施例2]a —(甲氧基甲氧基甲基)丙烯酸(2,6 — 原菠烷碳內酯一 5—基)之合成
將實施例1所得之α — (經基甲基)丙條酸(2,6 - 原菠烷碳內酯一5 —基)23.8g、三乙基胺15.2g、乙腈 2 00g之混合物,於攪拌中加入氯甲基甲基醚9.7g。攪拌 2 0小時後,加入水使反應停止。隨後於進行一般常用之 水系後處理(a q u e 〇 u s w 〇 r k — u p )後,將溶媒減壓I留除’ -17- (14) 200424771 以矽膠柱狀滲透分析儀進行精製,得式(8 )所示α -(甲氧基甲氧基甲基)丙_酸(2,6-原疲院碳內酯一 5— 基)22.0g (產率 78% )。 [實施例3] α — (羥基甲基)丙烯酸(1 一乙基環戊 基)之合成
除將丙烯酸(2,6 -原菠烷碳內酯一 5 —基)以丙烯酸 (1 一乙基環戊基)9 5 · 4 g替代外,其他皆依實施例1相同 方法進行反應,並以減壓蒸餾精製(沸點:8 2 °C /30Pa),得式(9)所示α —(羥基甲基)丙烯酸(1 — 乙基環戊基)(產率68% )。 (IR、NMR分析結果) I R (薄膜): ν = 3 4 6 6, 2 9 7 0, 2 8 7 7, 1 7 0 7, 1 6 3 5, 1 4 6 2, 1 3 9 2 ,1 3 3 6, 1 2 7 3, 1 2 2 7, 1 1 6 3, 1113, 1 0 5 5, 9 4 9 cm -1 ^-NMR (6 0 0MHz in CDC 1 3):
(5 = 0. 8 6 (3H, m) , 1. 56 - 1. 7 6 (6H, m) , 2. 0 1 (2H ,m) , 2. 1 4 (2H, m) , 2. 6 1 (1H, b r) , 4. 2 8 (2H, s ),5. 7 4 (1H, m) , 6. 1 6 (1H, m). -18- (15) 200424771 [實施例4] α - (甲氧基甲基)丙烯酸(1 一乙基環戊 基)之合成
將α — (羥基甲基)丙烯酸(1 一乙基環戊基) 19.8g、碘化甲酯 40.0g、氧化銀(I) 30.0g、Ν,Ν’ 一二甲 基甲醯胺50g之混合物於50 °C下攪拌30小時。將固體成 分以過濾方式去除後,進行一般常用之水系後處理 (a q u e 〇 u s w 〇 r k — u p )。將溶媒減壓態除後,以減壓蒸態 方式精製(沸點:5 3 °C /16 P a ),得式(10 )所示α — (甲氧基甲基)丙烯酸(1_乙基環戊基)(產率 62 (IR、NMR分析結果) I R (薄膜): ν = 2 9 7 0, 1939, 2877, 2 8 3 5, 2 8 1 6,1 7 2 0, 1 7 0 9 ,1 6 3 7, 1 4 6 0, 1 3 9 6, 1 3 2 3,1 2 7 7, 1 1 6 1, 1 1 1 3, 9 4 8 c m一1 ^-NMR (6 0 0MHz in CDC 1 3): 5 = 0. 8 6 (3 H, t , J = 7. 6 H z) , 1. 58 — 1。75 (6H,m) ,2. 0 0 (2H, q, J = 7. 6Hz) , 2. 1 4 (2 H, m) , 3. 3 8 ( 3H, s) , 4. 09 (2H, d d) , 5. 76 (1H, d t) , 6. 20.(1 H5 d t). -19- (16) 200424771 [實施例 5 ] α — (羥基甲基)丙烯酸(8 -三環 [5.2.1.02’6]癸基)之合成
Ο ί 。伽 (11) 除將丙烯酸(2,6 —原菠烷碳內酯一 5 —基)以丙烯酸 (8 -三環[5.2.1.02,6]癸基)117g替代外,其他皆依實施 例1相同方法進行反應,得式(1 1 )所示α — (羥基甲 基)丙烯酸(8 —三環[5·2.1 ·02’6]癸基)(產率60% ) (IR、NMR分析結果) I R (薄膜):. ν == 3 4 6 7, 2 9 4 9, 2 8 6 2, 1 7 0 9, 1 6 3 5, 1 4 7 5, 1 4 4 8 ,1 3 9 6,1 3 0 9,1 2 6 7,1 2 2 3,1 1 5 7, 1 1 3 4, 1 0 5 5, 1 0 2 2, 9 8 4, 9 4 7 cm'1
^-NMR (6 0 0MHz in C D C 1 3): δ = 0. 8 8 - 1. 0 0 (2H, m) , 1. 22 (1 H, d t t , J = 1 2. 4 ,12.4, 6. 9Hz) , 1. 29 (1H, m) , 1. 36 (1H, m) , 1 • 45 (1H, ddd, J = 1 3. 4, 4. 5,2. 1Hz) , 1. 63 - 1. 7 2 (2H, m) , 1. 7 3 - 1. 9 0 (4H, m) , 2. 0 4 (1 H, d, J =4. 5Hz) , 2. 11 (1H, . s) , 2. 40 (1H, b r. s) , 4· 3 0 (2H, s) , 4. 6 5 (1H, J = 7. 2Hz) , 5. 78 (1H, m), 6. 19 (1H, d, J = 1. 0Hz).
[實施例6] α — (乙醯氧基甲基)丙烯酸(8 —三環 [5.2.1.02’6]癸基)之合成 -20- (17)200424771 一 O Ac TXK> (12) 於α — (羥基甲基)丙烯酸(8 —三環[5.2.1.02’6]癸 基)2 3 · 6 g、吡啶1 5 · 8 g之混合物中,加入乙酸酐1 5 · 3 g 後,攪拌2 0小時。加入水使反應停止,隨後於進行一般
常用之水系後處理(aqueous work— up)後’將溶媒減壓
餾除,並以減壓蒸餾方式進行精製(沸點:1 2 3 °C /13Pa),得式(12)所示α-(乙醯氧基甲基)丙烯酸 (8 -三環[5.2.1.02,6]癸基)23.7g (產率 90% )。 (I R、NMR分析結果) I R (薄膜): v = 2 9 5 1, 2 8 6 4, 1 7 4 9, 1 7 2 2, 1 6 4 3, 1 4 7 5, 1 4 4 8 ,1 4 0 0, 1 3 6 9, 1 3 1 1, 1 2 7 1, 1 2 2 8, 1 1 8 4, 1 1 6 7,
1 1 5 7, 1134, 1047,982,9 5 3 cm-1 ^-NMR (6 0 0MHz in CDC 1 3): 0· 8 8 —0. 9 9 (2H, m) , 1. 2 1 (1H, d t t ,J ==1 2. 4 2. 4, 6. 5Hz) , 1. 2 8 (1H, d t, J = 1 0. 3, 1 . 2Hz 1 · 3 5 (1H, b r. d, J = 1 0. 3Hz),1. 4 4 (1H, d d d ,J = 1 3. 4, 4· 5, 2. 1Hz) , 1. 62 - 1· 7 0 (2 Η, m) ? 1 .7 2~1. 8 9 (4Η, m) , 2· 03 (1 Η, d, J =4. 5Ηζ) , 2. 0 8 (3Η, s),2. 11 (1 Η, b r. s) , 4. 6 5 (1Η, b r · d, J = 6. 9Hz) , 4. 77 (2H, b r. s) , 5. 7 8 (1H, m) , 6. 3 1 (1H, d, J = l. 0Hz).
[實施例7] α -(羥基甲基)丙烯酸(1 一金剛烷基) 之合成 -21 - (18) 200424771
除將丙烯酸(2,6 -原菠烷碳內酯一 5 -基)以丙烯酸 (1 一金剛烷基)Η 7g替代外,其他皆依實施例1相同方 法進行反應,得式(1 3 )所示α — (羥基甲基)丙烯酸 鲁 (1 —金剛烷基)(產率60% )。 [參考例1] 本發明之α —(氧代甲基)丙烯酸酯化合物之聚合物 合成例
〇八 〇 (y"o
(14) 將實施例7所製得之α -(羥基甲基)丙烯酸(1 一 金剛烷基)7 · 1 g、甲基丙烯酸(2 —乙基一 2 -金剛烷基) 8.7g、甲基丙烯酸(2 -酮基四氫呋喃一 3 -基)6.0g、 N,N’-偶氮雙異丁腈6〇mg、四氫呋喃8〇ml之混合物於氮 氣環境、6 0 °C下加熱2 0小時。放冷後,將反應混合物滴 -22- (19) 200424771 入劇烈攪拌之2公升甲醇中,將析出之沉澱物過濾分離。 所得固體以甲醇洗淨後,經減壓乾燥,得式(1 4 )所示之 標的聚合物16.4g (產率 75% ) 。1H— NMR光譜之積分 比求得之共聚比約爲3 0 : 3 5 : 3 5。使用GP C分析所得重 量平均分子量以聚苯乙烯換算時爲 9,800,分散度 (Mw/Mn )爲 1 · 8 0。 [參考例2]使用聚合物之光阻圖案之形成例 φ 使用參考例1所得聚合物,依以下組成內容調製光阻 材料。 (A )基礎聚合物(參考例1所得聚合物) 8 0重 量份 (B )酸產生劑之三氟甲烷磺酸三苯基鱗 1 . 〇重量 份 (C )作爲溶劑之丙二醇單甲基醚乙酸鹽 480重量 份 · (D )鹼性化合物之三丁基胺 0 · 0 8重量份。 將此光阻材料使用孔徑0.2 // m鐵氟隆(商標)過濾 器過濾後,將其迴轉塗佈於以9(TC、40秒間噴以六甲基 二矽胺烷之矽晶圓上,並進行120t、90秒間之熱處理, 形成厚度5 00nm之光阻膜。隨後,經使用 ArF等離子雷 射進行曝光,並進行120 °C、90秒間之熱處理後,冷卻至 2 3 °C,再使用2 · 3 8 %四甲基銨氫氧化物水溶液,於2 3 °C 下進行6 0秒間之浸漬顯像結果,得知形成1 : 1之空間與 -23- (20) 200424771 電路圖案。對經顯像後之晶圓,使用上空SEM觀察結 果’確認其至〇.13//m爲止之圖案並未發現圖案崩解或產 生剝離等現象。基此,可確認本發明之光阻材料具有優異 之解像性。 [參考例3 ]聚合物透明性之評估 將參考例1所得之聚合物1 . 0 g溶解於環己酮6.0 g 中,使用孔徑〇. 2 μ m鐵氟隆(商標)過濾器過濾後,將 馨 所得溶液迴轉塗佈於石英基板上,並進行90 °C、60秒間 之熱處理,形成厚度5 00nm之薄膜。對此薄膜,使用紫 外線分光光度計測定其於1 9 3 nm之透過率結果,得知膜 厚5 0 Onm下具有76%之透過率。其結果可確認本發明之 聚合物於作爲等離子雷射用光阻基礎聚合物使用時具有優 異之透明性。 [參考例4] · 將參考例1所得之聚合物2.0 g溶解於環己酮1 〇 g 中,使用孔徑〇·2 # m鐵氟隆(商標)過濾器過濾後,將 所得溶液迴轉塗佈於矽晶圓上,並進行90 °C、60秒間之 熱處理,形成厚度7 0 0 nm之薄膜。對此薄膜,使用反應 性離子蝕刻裝置,於Power 100W '壓力5Pa、氣體流量 30ml/min之條件下,測定對CF4之蝕刻速度。其結果, 得知蝕刻速度(將酚醛淸漆光阻作爲1 ·〇〇所得規格化數 値)爲1 · 1 〇。又,爲進行比較,同時對作爲KrF光阻基 -24- (21) 200424771 之基礎樹脂之聚(p -羥基苯乙烯)進行測定結果,得知 其蝕刻速度爲1 . 2 0。其結果得知,本發明之聚合物對C F 4 之蝕刻速度較爲緩慢,而確認出本發明具有顯著乾蝕刻耐 性。 產業上之可利用性 本發明之在α位甲基上具有氧取代基之含脂環的甲基 丙烯酸酯化合物所製得之聚合物,具有優良之透明性,特 馨 別是於等離子曝光波長下具有優良透明性與乾蝕刻耐性, 又’使用本發明之在α位甲基上具有氧取代基之含脂環的 甲基丙烯酸酯化合物所製得之聚合物所調製之光阻材料, 可容易感應高能量線、具有優良解像性,且可使顯像步驟 圓滑進行’故容易形成微細之圖案,而極適合作爲製造超 L SI用之微細圖案形成材料。因此,本發明之在^位甲基 上具有氧取代基之含脂環的甲基丙烯酸酯化合物,於作爲 光阻材料用基礎聚合物用單體時,可達到兼具光阻解像性 春 與蝕刻耐性等優點。 -25-
Claims (1)
- (1) 200424771 拾、申請專利範圍 1 · 一種下述式(1)所示之在^位上具有氧取代基之 含脂環的甲基丙烯酸酯化合物, O^OR2 (式中,R1爲氫原子或碳數1至10之烷基,此烷基 可含有鹵素原子、羥基、醚鍵結、羰基、羧基、或氰基, R2爲碳數3至20之具有脂環結構之1價有機基)。 2. —種下述式(2)所示之在α位上具有氧取代基之 含脂環的甲基丙烯酸酯化合物,(式中,R1爲氫原子或碳數1至10之烷基’此烷基 可含有鹵素原子、羥基、醚鍵結、羰基、羧基、或氰基, R3爲碳數4至2 0之具有脂環結構之3級烷基)° 3. —種下述式(3)所示之在^位上具有氧取代基之 含脂環的甲基丙烯酸酯化合物, -26- (2) (2)200424771 OR1(3) (R1爲氫原子或碳數1至10之烷基,此烷基可含有 鹵素原子、羥基、醚鍵結、羰基、羧基、或氰基,R4爲 碳數4至20之具有內酯結構之有機基)。-27- 200424771 柒、(一)、本案指定代表圖為:無 (二)、本代表圖之元件代表符號簡單說明: Μ j\ w捌、本案若有化學式時,請揭示最能顯示發明特徵的化學 式: OR1-4-
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