TR199700165A2 - Baskili devre levhasi ve baskili devre levhasinin üzerine elektronik bilesenlerin tam hassaslikta baglanmasi ve lehimlenmesi için bir yöntem. - Google Patents
Baskili devre levhasi ve baskili devre levhasinin üzerine elektronik bilesenlerin tam hassaslikta baglanmasi ve lehimlenmesi için bir yöntem.Info
- Publication number
- TR199700165A2 TR199700165A2 TR97/00165A TR9700165A TR199700165A2 TR 199700165 A2 TR199700165 A2 TR 199700165A2 TR 97/00165 A TR97/00165 A TR 97/00165A TR 9700165 A TR9700165 A TR 9700165A TR 199700165 A2 TR199700165 A2 TR 199700165A2
- Authority
- TR
- Turkey
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- full precision
- components onto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Emergency Protection Circuit Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Resistance Welding (AREA)
- Thermistors And Varistors (AREA)
- Fuses (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
Bulus bir baskili devre levhasiyla (1) ve elektronik bilesenlerin bu baskili devre levhasinin (1) üzerine tam bir hassaslikla kurulabilmesi için, sözü geçen (12) elektronik bilesenlerin baskili devre levhasina (1) elektriksel ve iletken olarak bir tekrar akim lehimleme teknigiyle baglanmasiyla ilgilidir. Bu amaçla (1), elektronik bilesenleri (12) almak için yüzeyinde bölümleri (2, 3) olan bir baskili devre levhasi kullanilir. Sözü geçen bölümler en azindan kismen daha sonra yerlestirilecek parçalarin dis profillerine uydurulmustur. Çentikli kontürler (3) veya oluklar (2) seklindeki sözü geçen bölümler lehim macununun tatbikatinden sonra monte edilen elektronik bilesenlerin asil lehimleme isleminden önce istenilen konumlarinda durmalarini saglar.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19610586A DE19610586B4 (de) | 1996-03-18 | 1996-03-18 | Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte |
DE1996111631 DE19611631C1 (de) | 1996-03-25 | 1996-03-25 | Modul mit einem Gehäuse und einer Grundplatte |
DE19620340A DE19620340C1 (de) | 1996-05-21 | 1996-05-21 | Überspannungs - Schutzstecker |
Publications (1)
Publication Number | Publication Date |
---|---|
TR199700165A2 true TR199700165A2 (tr) | 1997-10-21 |
Family
ID=27216039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TR97/00165A TR199700165A2 (tr) | 1996-03-18 | 1997-03-06 | Baskili devre levhasi ve baskili devre levhasinin üzerine elektronik bilesenlerin tam hassaslikta baglanmasi ve lehimlenmesi için bir yöntem. |
Country Status (29)
Country | Link |
---|---|
US (1) | US5999412A (tr) |
EP (1) | EP0797379B1 (tr) |
JP (1) | JPH104250A (tr) |
KR (1) | KR19990008482A (tr) |
CN (1) | CN1168078A (tr) |
AR (1) | AR006169A1 (tr) |
AT (1) | ATE224634T1 (tr) |
AU (1) | AU713077B2 (tr) |
BG (1) | BG62425B1 (tr) |
BR (1) | BR9701324A (tr) |
CA (1) | CA2199898A1 (tr) |
CO (1) | CO4560406A1 (tr) |
CZ (1) | CZ292485B6 (tr) |
DE (1) | DE59708222D1 (tr) |
DK (1) | DK0797379T3 (tr) |
ES (1) | ES2183993T3 (tr) |
HU (1) | HUP9700597A3 (tr) |
ID (1) | ID16239A (tr) |
IL (1) | IL120102A (tr) |
NO (1) | NO970383L (tr) |
NZ (1) | NZ314160A (tr) |
PL (1) | PL182659B1 (tr) |
PT (1) | PT797379E (tr) |
SG (1) | SG52925A1 (tr) |
SI (1) | SI0797379T1 (tr) |
TR (1) | TR199700165A2 (tr) |
UA (1) | UA42784C2 (tr) |
UY (1) | UY24454A1 (tr) |
YU (1) | YU48977B (tr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2321135B (en) * | 1997-01-11 | 2001-06-27 | Furse W J & Co Ltd | Improvements in or relating to thermal trip arrangements |
FR2770739B1 (fr) * | 1997-11-05 | 2000-01-28 | Lacme | Appareil electrificateur de cloture |
AUPP308498A0 (en) | 1998-04-20 | 1998-05-14 | Krone Aktiengesellschaft | Electrical connector |
US20020046627A1 (en) | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
DE19836456C1 (de) * | 1998-08-12 | 2000-04-20 | Kostal Leopold Gmbh & Co Kg | Elektrische Leiterplatte und Verfahren zur Herstellung derselben |
US6239977B1 (en) * | 1999-05-17 | 2001-05-29 | 3Com Corporation | Technique for mounting electronic components on printed circuit boards |
JP2004509434A (ja) * | 2000-09-18 | 2004-03-25 | ミーダー・エレクトロニック | リード片を用いない表面実装用リードリレー |
US7155004B1 (en) * | 2002-11-22 | 2006-12-26 | Adc Incorporated | System and method of delivering DSL services |
US7409053B1 (en) | 2002-11-22 | 2008-08-05 | Adc Telecommunications, Inc. | System and method of providing DSL services on a telephone network |
DE102004046394B4 (de) * | 2004-08-24 | 2007-03-01 | Dehn + Söhne Gmbh + Co. Kg | Steckbare Überspannungsschutz-Anordnung |
DE102004061681B4 (de) | 2004-12-22 | 2006-10-26 | Adc Gmbh | Kabelsteckverbinder für Leiterplatten |
US7643631B2 (en) * | 2005-08-26 | 2010-01-05 | Adc Telecommunications, Inc. | Enclosure for broadband service delivery system |
US20070047526A1 (en) * | 2005-08-26 | 2007-03-01 | Bryan Kennedy | Systems and methods for conecting between telecommunications equipment |
US7522721B2 (en) * | 2005-08-26 | 2009-04-21 | Adc Telecommunications, Inc. | System for broadband service delivery |
US8064182B2 (en) | 2007-02-28 | 2011-11-22 | Adc Telecommunications, Inc. | Overvoltage protection plug |
CN101295570B (zh) * | 2007-04-25 | 2011-11-23 | 聚鼎科技股份有限公司 | 保护电路板和其过电流保护元件 |
DE102007050590B4 (de) * | 2007-10-23 | 2017-04-13 | Tyco Electronics Services Gmbh | Verteileranschlussmodul |
US7946863B2 (en) | 2008-04-25 | 2011-05-24 | Adc Telecommunications, Inc. | Circuit protection block |
US8411404B2 (en) * | 2008-05-27 | 2013-04-02 | Adc Telecommunications, Inc. | Overvoltage protection plug |
EP2790477B1 (en) | 2013-04-08 | 2018-06-13 | Electrolux Appliances Aktiebolag | A fixing device for a capacitor and a cooking oven including a cooling channel with the fixing device |
DE102014103419B4 (de) | 2014-03-13 | 2018-05-24 | Epcos Ag | Überspannungsableiter mit Schutz vor Erwärmung |
US9763328B1 (en) * | 2016-03-11 | 2017-09-12 | Continental Automotive Systems, Inc. | Electrolytic capacitor retention device |
CN106231790A (zh) * | 2016-07-27 | 2016-12-14 | 上海摩软通讯技术有限公司 | 一种印制电路板及制作方法及移动终端 |
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DE9012638U1 (de) * | 1990-09-04 | 1990-11-08 | Siemens AG, 8000 München | Im Spritzgußverfahren hergestellte Leiterplatte |
DE9012951U1 (de) * | 1990-09-11 | 1990-11-15 | Siemens AG, 8000 München | Schutzstecker für Leitungen in einem Verteiler einer Telekommunikationsanlage |
JPH04163987A (ja) * | 1990-10-29 | 1992-06-09 | Nec Corp | チップ部品実装方式 |
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DE4126913A1 (de) | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
EP0540497A3 (en) | 1991-10-29 | 1993-06-16 | Alcatel Austria Aktiengesellschaft | Method of making solid solder coatings |
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DE4225484C1 (de) * | 1992-07-30 | 1993-12-23 | Krone Ag | Schutzstecker für Anschluß- und Trennleisten der Telekommunikations- und Datentechnik |
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US5600175A (en) * | 1994-07-27 | 1997-02-04 | Texas Instruments Incorporated | Apparatus and method for flat circuit assembly |
DE4437122C2 (de) * | 1994-10-01 | 1996-07-18 | Krone Ag | Überspannungsschutzstecker |
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-
1997
- 1997-01-28 DK DK97101240T patent/DK0797379T3/da active
- 1997-01-28 ES ES97101240T patent/ES2183993T3/es not_active Expired - Lifetime
- 1997-01-28 DE DE59708222T patent/DE59708222D1/de not_active Expired - Lifetime
- 1997-01-28 PT PT97101240T patent/PT797379E/pt unknown
- 1997-01-28 AT AT97101240T patent/ATE224634T1/de active
- 1997-01-28 EP EP97101240A patent/EP0797379B1/de not_active Expired - Lifetime
- 1997-01-28 SI SI9730440T patent/SI0797379T1/xx unknown
- 1997-01-29 NO NO970383A patent/NO970383L/no not_active Application Discontinuation
- 1997-01-30 NZ NZ314160A patent/NZ314160A/en unknown
- 1997-01-30 IL IL12010297A patent/IL120102A/xx unknown
- 1997-02-04 AU AU12513/97A patent/AU713077B2/en not_active Ceased
- 1997-02-07 UY UY24454A patent/UY24454A1/es unknown
- 1997-02-14 CO CO97007791A patent/CO4560406A1/es unknown
- 1997-02-28 SG SG1997000604A patent/SG52925A1/en unknown
- 1997-03-06 TR TR97/00165A patent/TR199700165A2/tr unknown
- 1997-03-10 CZ CZ1997716A patent/CZ292485B6/cs not_active IP Right Cessation
- 1997-03-10 AR ARP970100940A patent/AR006169A1/es not_active Application Discontinuation
- 1997-03-11 JP JP9056228A patent/JPH104250A/ja active Pending
- 1997-03-11 PL PL97318893A patent/PL182659B1/pl unknown
- 1997-03-11 US US08/815,114 patent/US5999412A/en not_active Expired - Lifetime
- 1997-03-12 KR KR1019970008277A patent/KR19990008482A/ko not_active IP Right Cessation
- 1997-03-12 BG BG101319A patent/BG62425B1/bg unknown
- 1997-03-12 YU YU9197A patent/YU48977B/sh unknown
- 1997-03-13 CA CA002199898A patent/CA2199898A1/en not_active Abandoned
- 1997-03-14 UA UA97031160A patent/UA42784C2/uk unknown
- 1997-03-14 ID IDP970818A patent/ID16239A/id unknown
- 1997-03-17 HU HU9700597A patent/HUP9700597A3/hu unknown
- 1997-03-18 BR BR9701324A patent/BR9701324A/pt not_active IP Right Cessation
- 1997-03-18 CN CN97104504A patent/CN1168078A/zh active Pending
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