DE9012638U1 - - Google Patents

Info

Publication number
DE9012638U1
DE9012638U1 DE9012638U DE9012638U DE9012638U1 DE 9012638 U1 DE9012638 U1 DE 9012638U1 DE 9012638 U DE9012638 U DE 9012638U DE 9012638 U DE9012638 U DE 9012638U DE 9012638 U1 DE9012638 U1 DE 9012638U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9012638U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9012638U priority Critical patent/DE9012638U1/de
Publication of DE9012638U1 publication Critical patent/DE9012638U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE9012638U 1990-09-04 1990-09-04 Expired - Lifetime DE9012638U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9012638U DE9012638U1 (de) 1990-09-04 1990-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9012638U DE9012638U1 (de) 1990-09-04 1990-09-04

Publications (1)

Publication Number Publication Date
DE9012638U1 true DE9012638U1 (de) 1990-11-08

Family

ID=6857164

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9012638U Expired - Lifetime DE9012638U1 (de) 1990-09-04 1990-09-04

Country Status (1)

Country Link
DE (1) DE9012638U1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
DE19610586A1 (de) * 1996-03-18 1997-09-25 Krone Ag Leiterplatte und Verfahren zum lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE19701163A1 (de) * 1997-01-15 1998-07-16 Siemens Ag Elektrische Schaltung insbesondere für eine Chipkarte
WO1998044769A1 (en) * 1997-03-27 1998-10-08 Ford Motor Company Moulded sockets for electronic component attachment
US5999412A (en) * 1996-03-18 1999-12-07 Krone Aktiengesellschaft Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
DE19826971C2 (de) * 1998-06-18 2002-03-14 Reiner Goetzen Verfahren zum mechanischen und elektrischen Verbinden von Systembauteilen
WO2005057596A1 (en) * 2003-12-11 2005-06-23 Matsushita Electric Industrial Co., Ltd. Electronic component
EP3250013B1 (de) * 2015-03-03 2021-10-27 Omron Corporation Dreidimensionaler schaltungsstrukturkörper

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4141775A1 (de) * 1991-12-18 1993-06-24 Manfred Band Verfahren zur herstellung einer elektronischen schaltung
DE19610586A1 (de) * 1996-03-18 1997-09-25 Krone Ag Leiterplatte und Verfahren zum lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
US5999412A (en) * 1996-03-18 1999-12-07 Krone Aktiengesellschaft Printed-circuit board and method for the precise assembly and soldering of electronic components on the surface of the printed-circuit board
DE19610586B4 (de) * 1996-03-18 2006-04-27 Adc Gmbh Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE19701163A1 (de) * 1997-01-15 1998-07-16 Siemens Ag Elektrische Schaltung insbesondere für eine Chipkarte
DE19701163C2 (de) * 1997-01-15 2001-12-06 Siemens Ag Elektrische Schaltung insbesondere für eine Chipkarte
WO1998044769A1 (en) * 1997-03-27 1998-10-08 Ford Motor Company Moulded sockets for electronic component attachment
US5994648A (en) * 1997-03-27 1999-11-30 Ford Motor Company Three-dimensional molded sockets for mechanical and electrical component attachment
DE19826971C2 (de) * 1998-06-18 2002-03-14 Reiner Goetzen Verfahren zum mechanischen und elektrischen Verbinden von Systembauteilen
WO2005057596A1 (en) * 2003-12-11 2005-06-23 Matsushita Electric Industrial Co., Ltd. Electronic component
US7042700B2 (en) 2003-12-11 2006-05-09 Matsushita Electric Industrial Co., Ltd. Electronic component
EP3250013B1 (de) * 2015-03-03 2021-10-27 Omron Corporation Dreidimensionaler schaltungsstrukturkörper

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