AU554348B2 - Apparatus for mounting chip type circuits on printed circuit boards - Google Patents

Apparatus for mounting chip type circuits on printed circuit boards

Info

Publication number
AU554348B2
AU554348B2 AU87553/82A AU8755382A AU554348B2 AU 554348 B2 AU554348 B2 AU 554348B2 AU 87553/82 A AU87553/82 A AU 87553/82A AU 8755382 A AU8755382 A AU 8755382A AU 554348 B2 AU554348 B2 AU 554348B2
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
chip type
type circuits
mounting chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU87553/82A
Other versions
AU8755382A (en
Inventor
Kotaro Harigane
Hirokazu Shudo
Kenichi Takahashi
Shuichi Tando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of AU8755382A publication Critical patent/AU8755382A/en
Application granted granted Critical
Publication of AU554348B2 publication Critical patent/AU554348B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
AU87553/82A 1981-08-24 1982-08-24 Apparatus for mounting chip type circuits on printed circuit boards Ceased AU554348B2 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP56-124803 1981-08-11
JP56131548A JPS5833893A (en) 1981-08-24 1981-08-24 Chip electronic part mounting machine
JP56-131548 1981-08-24
JP56-124804 1981-08-25
JP56-127915 1981-08-31
JP56-127914 1981-08-31
JP56-135406 1981-09-11
JP56-135408 1981-09-11
JP56-135407 1981-09-11
JP56-137367 1981-09-16
JP56-141989 1981-09-26
JP56-150828 1981-10-09
JP56-150829 1981-10-09

Publications (2)

Publication Number Publication Date
AU8755382A AU8755382A (en) 1983-03-03
AU554348B2 true AU554348B2 (en) 1986-08-14

Family

ID=15060645

Family Applications (1)

Application Number Title Priority Date Filing Date
AU87553/82A Ceased AU554348B2 (en) 1981-08-24 1982-08-24 Apparatus for mounting chip type circuits on printed circuit boards

Country Status (3)

Country Link
JP (1) JPS5833893A (en)
KR (1) KR880002064B1 (en)
AU (1) AU554348B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU601618B2 (en) * 1987-08-31 1990-09-13 Sumitomo Electric Industries, Ltd. Chip mounting apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521422B2 (en) * 1984-08-25 1996-08-07 日東工業株式会社 Automatic chip mount device
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
JP2013118221A (en) * 2011-12-01 2013-06-13 Nippon Ritoru Kk Chip mounter
KR102141203B1 (en) * 2019-02-11 2020-08-04 세메스 주식회사 Bonding head and apparatus for bonding chips having the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334477A (en) * 1976-09-10 1978-03-31 Seiko Instr & Electronics Ltd Carrying and assembling unit for components
JPS54158670A (en) * 1978-11-16 1979-12-14 Tdk Electronics Co Ltd Holder for electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU601618B2 (en) * 1987-08-31 1990-09-13 Sumitomo Electric Industries, Ltd. Chip mounting apparatus

Also Published As

Publication number Publication date
JPH0122999B2 (en) 1989-04-28
JPS5833893A (en) 1983-02-28
AU8755382A (en) 1983-03-03
KR880002064B1 (en) 1988-10-14
KR840001427A (en) 1984-04-30

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