JPS5833893A - Chip electronic part mounting machine - Google Patents
Chip electronic part mounting machineInfo
- Publication number
- JPS5833893A JPS5833893A JP56131548A JP13154881A JPS5833893A JP S5833893 A JPS5833893 A JP S5833893A JP 56131548 A JP56131548 A JP 56131548A JP 13154881 A JP13154881 A JP 13154881A JP S5833893 A JPS5833893 A JP S5833893A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- shaped electronic
- pallet
- electronic component
- mounting head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明ネ、リード線番有しないチップ状電子部品を１個
毎にプリント基板に装着するためのチップ状電子部品装
着機に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped electronic component mounting machine for mounting chip-shaped electronic components without lead wire numbers onto a printed circuit board one by one.
従来、チップ状電子部品装着機としては、吸着盤で多数
のチップ状電子部品を吸着してプリント基板上に移送し
装着するものが本出願人より先に提案されている。Conventionally, the present applicant has previously proposed a chip-shaped electronic component mounting machine that uses a suction cup to suction a large number of chip-shaped electronic components and transfers and mounts them onto a printed circuit board.
しかしながら、吸着盤を用いる構造であると、プリント
基板上にリード付電子部品を挿入した後にチップ状電子
部品を取付けたい場合に不都合があった＠
本発明は、上記の点に鑑み、既に他の電子部品が装着さ
れているプリント基板に対してもチップ状電子部品の装
着を確実に実行可能にし、な壮かつチップ状電子部品を
挟持状態で移送する構造を採用することにより、装着速
度の高速化及び信頼性の向上を図ったチップ状電子部品
装着機を提供しようとするものである。However, the structure using a suction cup is inconvenient when it is desired to attach a chip-shaped electronic component after inserting a leaded electronic component onto a printed circuit board. It is possible to reliably attach chip-shaped electronic components to printed circuit boards on which electronic components are mounted, and by adopting a structure that transports chip-shaped electronic components while being held in place, the mounting speed is high. The purpose of this invention is to provide a chip-shaped electronic component mounting machine that is improved in terms of efficiency and reliability.
以下、本発明に係るチップ状電子部品装着機の実施例を
図面に従って説明する。Embodiments of a chip-shaped electronic component mounting machine according to the present invention will be described below with reference to the drawings.
第１図はチップ状電子部品装着機の全体的構成を示す。FIG. 1 shows the overall configuration of a chip-shaped electronic component mounting machine.
この図において、一対のスプロケットＩＡ、ＩＢ間にチ
ェーン２が架設されて水平面を走行するチェーンコンベ
ア機構３が構成されている。In this figure, a chain 2 is installed between a pair of sprockets IA and IB to form a chain conveyor mechanism 3 that runs on a horizontal surface.
チェーン２の外層側にはパレット４が等間隔で水平に多
数取付けられ、チェーン２の間欠走行に伴って間欠的に
移送されるようになっている。前記パレット４の直線配
列群に対向するように供給ユニッ）５Ａ、５Ｂが配置さ
れ、各供給ユニット５ム、５Ｂはパレット４の配列間隔
と同じ間隔で配列された多数のパーツフィーダ６を有し
ている。A large number of pallets 4 are horizontally attached to the outer layer of the chain 2 at regular intervals, and are intermittently transferred as the chain 2 travels intermittently. Supply units 5A and 5B are arranged to face the linearly arranged group of pallets 4, and each supply unit 5M and 5B has a large number of parts feeders 6 arranged at the same intervals as the arrangement intervals of the pallets 4. ing.
この場合、１個のパーツフィーダに対し１種類のチップ
状電子部品が入れられており、チップ状電子部品の装着
プログラムによって予め定められた順序で各パーツフィ
ーダ６よりパレット４にチップ状電子部品が供給される
。ＸＹテーブル（図示せず）Ｊ：、に置かれた基板７の
接着剤塗布位置にチップ状電子部品８を装着するための
装着ヘッド９は、インデックス円板１０上に４５度毎に
放射状に配設されており、これらによって装着機′ｌ５
１１が構成されている。インデックス円板１０Ｖｉ１回
に４５度ずつ回転するものであり、装着ヘッド９は上向
き状態でパレット４からチップ状電子部品８を受けて挾
持し、下向き状態で基板７上にチップ状電子部品８を置
く。In this case, one type of chip electronic component is placed in one parts feeder, and the chip electronic components are loaded from each parts feeder 6 onto the pallet 4 in a predetermined order by the chip electronic component mounting program. Supplied. Mounting heads 9 for mounting chip-shaped electronic components 8 at adhesive application positions of a substrate 7 placed on an XY table (not shown) J: are arranged radially at 45-degree intervals on an index disk 10. These are installed on the mounting machine'l5.
11 are configured. The index disk 10Vi rotates 45 degrees at a time, and the mounting head 9 receives and clamps the chip-shaped electronic component 8 from the pallet 4 while facing upward, and places the chip-shaped electronic component 8 on the board 7 while facing downward. .
第２図はチェーンコンベア機構３の詳細を示す。FIG. 2 shows details of the chain conveyor mechanism 3.
この図において、本体フレーム２０上にはチェーンガイ
ド２１が固定され、このチェーンガイド２１の溝内をチ
ェーン２が走行するようになっている。In this figure, a chain guide 21 is fixed on a main body frame 20, and a chain 2 runs in a groove of this chain guide 21.
このチェーンガイド２１はチェーン２がたわんだりしな
いように設けられている。チェーン２の上面にはパレッ
ト取付板２２を介してパレット４が取付けられている。This chain guide 21 is provided to prevent the chain 2 from bending. A pallet 4 is attached to the upper surface of the chain 2 via a pallet attachment plate 22.
また、本体フレーム２０上には支持プルツク２３が固定
され、この支持ブロック２３に軸２４にてゴムローラー
２５が軸支され、該ゴムローラー２５によってパレット
取付板２２の上面が抑えられている。前記ゴムローラー
２５は所定間隔で設けられてお抄、これによりパレット
４の傾きが防止される・さらに、支持ブロック２３及び
チェーンガイド２１を貫通するように、先端が楔状とな
ったヤゲン２６が摺動自在に設けられ、チェーン２の停
止時にベルクランク２７の矢印入方向の回動によりヤゲ
ン２６は突出してチェーン２間に入り込んでチェーン２
の位置を規制する。また、このとき上方より位置決めピ
ン２８が降下してパレット取付板２２の位置決め穴２９
に嵌合してパレット取付板２２の位置規制も行う。Further, a support pull 23 is fixed on the main body frame 20, and a rubber roller 25 is pivotally supported on the support block 23 by a shaft 24, and the upper surface of the pallet mounting plate 22 is held down by the rubber roller 25. The rubber rollers 25 are provided at predetermined intervals to prevent the pallet 4 from tilting.Furthermore, a bevel 26 with a wedge-shaped tip slides through the support block 23 and the chain guide 21. When the chain 2 is stopped, the bevel 26 protrudes and enters between the chains 2 when the bell crank 27 rotates in the direction of the arrow.
Regulate the position of. At this time, the positioning pin 28 descends from above and the positioning hole 28 of the pallet mounting plate 22 is moved downward.
The position of the pallet mounting plate 22 is also regulated by fitting into the pallet mounting plate 22.
このようｋする理由は、チェーン２＃−ｉ使用により伸
び易く、チェーンのみでパレット４の位置決めを行うの
では精度が不充分であるからであり、ヤゲン２６及び位
置決めビン２８を所定間隔で設けることによってチェー
ン２の位置決め精度を上げることができる。The reason for doing this is that the chain 2#-i tends to stretch when used, and positioning the pallet 4 using only the chain is not accurate enough. Therefore, it is necessary to provide the bevel 26 and the positioning bins 28 at predetermined intervals. Accordingly, the positioning accuracy of the chain 2 can be improved.
第３図はパレット４の詳細を示す。この図において、パ
レット基台３０上には一対の挟持バー３１ＡＩ３１Ｂが
平行リンク３２Ａ、３２Ｂによって夫々平行移動自在に
設けられ、それらの挟持バー３１Ａ、３１Ｂ間には伸長
ばね３３が設けられている。従って、両挾持バー３１Ａ
、３１Ｂは近接する方向に付勢されることになる。また
、両挾持バー３１Ａ、３１Ｂ間には前後に摺動自在にブ
ツシュウッド３４が設けられ、このブツシュウッド３４
Ｖｃ引込み状態に係止するために係止レバー３５がパレ
ット基台３０に枢着されている。すなわち、係止レバー
３５はコイルばね（図示せず）によって矢印Ｂ方向に付
勢され、これにより先端がブツシュリッド３４の突出部
に当接する。さらに、パレット基台３ｏの下面には作動
ブロック３６が摺動自在に支持され、この作動ブ四ツク
３６が矢印０の方向に押されると、平行リンク３２Ａ、
３２Ｂが夫々回動して挟持バー３１Ａ、３１Ｂか開くよ
うになっている。その作動ブロック３６と平行リンク３
２人、３２Ｂとの連動は、ギヤー又はリンク機構によっ
て行われる。そして、パーツフィーダ６よりのチップ状
電子部品８の供給は、前記作動ブロック３６を矢印０の
如く押圧して挟持パ−３ｊＡ、３１Ｂを開いた状態で挾
持ノ＜−３１ＡＩ３１Ｂ間にチップ状電子部品８を押込
むことによって行われる。なお、パレット４のチェーン
２への取付は、第２図の如くパレット取付板２２を介し
て行われる０
装着機構１１け第４図に示す如くインデックス円板１０
上に８個の装着ヘッド９を４５度毎に配設したものであ
り、装着ヘッド９はインデックス円板１００回転により
、０点、０点、０点、０点、０点、０点、０点、０点に
順次移動する０装着ヘッド９がパレット４よりチップ状
電子部品８を受けるのけ、装着ヘッド９が上向きすなわ
ち０点に位置するときであり、このときのパレット４か
ら装着ヘッド９へのチップ状電子部品８の移し変え動作
を第５図に基き説明する。FIG. 3 shows details of the pallet 4. In this figure, a pair of clamping bars 31AI31B are provided on a pallet base 30 so as to be movable in parallel by parallel links 32A and 32B, respectively, and an extension spring 33 is provided between the clamping bars 31A and 31B. Therefore, both clamping bars 31A
, 31B are biased in the direction of approaching. Further, a bushing wood 34 is provided between both the clamping bars 31A and 31B so as to be slidable back and forth.
A locking lever 35 is pivotally mounted to the pallet base 30 for locking in the Vc retracted state. That is, the locking lever 35 is biased in the direction of arrow B by a coil spring (not shown), so that the tip of the locking lever 35 comes into contact with the protrusion of the bush lid 34. Further, an operating block 36 is slidably supported on the lower surface of the pallet base 3o, and when the operating block 36 is pushed in the direction of arrow 0, the parallel link 32A,
32B rotates to open the holding bars 31A and 31B. Its actuating block 36 and parallel link 3
Interlocking with the two people 32B is performed by a gear or link mechanism. The chip-shaped electronic component 8 is fed from the parts feeder 6 by pressing the operating block 36 as shown by arrow 0 to open the clamping pars 3jA and 31B. This is done by pressing 8. The pallet 4 is attached to the chain 2 through a pallet attachment plate 22 as shown in FIG.
Eight mounting heads 9 are arranged on the top at every 45 degrees, and the mounting heads 9 rotate the index disk 100 times to read 0 points, 0 points, 0 points, 0 points, 0 points, 0 points, 0 points. When the mounting head 9 sequentially moves from the pallet 4 to the 0 point, the mounting head 9 receives the chip-shaped electronic component 8 from the pallet 4. The operation of transferring the chip-shaped electronic component 8 to the holder will be explained based on FIG.
第５図において、パレット４が丁度装着ヘッド９に対向
する位置にきたとき（図ではパレット４と装着ヘッド９
との間隔は説明しやすいように離しであるが、実際には
極く近接している。）、押出シレパー４０がパレット４
のブツシュロッドあの突出部に当接可能な位置関係とな
り、その押出しレバー４０の矢印り方向の回動に従って
ブツシュロッド３４は前進し、チップ状電子部品８は装
着ヘッド９の一対の挟持部材４１Ａ、４１Ｂ間に押出さ
れる。このとき、パレット上方に位置する支持板４２に
枢着されげね４３で下方に付勢されたガイドレバー４４
により、チップ状電子部品８の上面が抑えられた状態と
なっている。従って、チップ状電子部品８の浮上り等を
除去可能である。In FIG. 5, when the pallet 4 has just come to a position facing the mounting head 9 (in the figure, the pallet 4 and the mounting head 9
The distance between the two is shown to be far apart for ease of explanation, but in reality they are very close together. ), the extrusion syringeper 40 is the pallet 4
The bushing rod 34 is in a positional relationship in which it can come into contact with that protrusion, and as the push lever 40 rotates in the direction of the arrow, the bushing rod 34 moves forward, and the chip-shaped electronic component 8 is moved between the pair of clamping members 41A and 41B of the mounting head 9. is extruded. At this time, a guide lever 44 which is pivotally connected to a support plate 42 located above the pallet and is urged downward by a barb 43
As a result, the upper surface of the chip-shaped electronic component 8 is held down. Therefore, floating of the chip-shaped electronic component 8 and the like can be removed.
装着ヘッド９の挾持部材４１Ａ、４１ＢＶｉ装着ヘッド
本体に対し支点４５Ａ、４５Ｂを中心に回動可能であっ
て、各挟持部材４１Ａ、４１Ｂの速中に枢着された開閉
リンク４６Ａ、４６Ｂの支点４７が矢印Ｅ方向に上がる
と開き、下がると閉じるようになっている。また、装着
ヘッド９Ｖｉ吸着ビン４８を有しており、この吸着ピン
４８は挾持部材４１Ａ、４１Ｂの中間位置にあって、パ
レット４から押出されたチップ状電子部品８を吸着する
ものである。すなわち、パレット４よりのチップ状電子
部品８を受けるとき、挟持部材４１ Ａ、４１Ｂはチッ
プ状電子部品８０幅よりも大きく開くから、吸着ピン４
８の真空吸引力によって先にチップ状電子部品８を吸着
保持し、それからチップ状電子部品８を挾持部材４１Ａ
、４１Ｂにて挾持する。The clamping members 41A and 41B of the mounting head 9 are rotatable about fulcrums 45A and 45B with respect to the mounting head body, and the fulcrums 47 of the opening/closing links 46A and 46B are pivotally connected to the center of each clamping member 41A and 41B. It opens when it goes up in the direction of arrow E, and closes when it goes down. The mounting head 9Vi also has a suction pin 48, which is located at an intermediate position between the clamping members 41A and 41B, and is used to suction the chip-shaped electronic component 8 extruded from the pallet 4. That is, when receiving the chip-shaped electronic component 8 from the pallet 4, the holding members 41A and 41B open wider than the width of the chip-shaped electronic component 80, so that the suction pin 4
The chip-shaped electronic component 8 is first sucked and held by the vacuum suction force of 8, and then the chip-shaped electronic component 8 is held by the clamping member 41A.
, 41B.
第４図の０点では装着ヘッド９に挾持されたチップ状電
子部品８のＹ方向（挟持部材４１Ａ、４１Ｂの奥行方向
）の位置決めを行う。０点では、装着ヘッド９の±９０
度の回転（チップ状電子部品の方向変換）を必要に応じ
て行う。この回転は装着ヘッド９の外周の一部に形成さ
れたギヤー５０にインデックス円板１０の裏側より他の
ギヤーをかみ合わせて行う。装着ヘッド９が下向きであ
るとき、すなわち０点に位置するとき、押下げレバー５
−１の矢印７方向の回動により、装着ヘッド９の頭部５
２が押下げられ、これによって吸着ピン４８が下降し基
板７の接着剤塗布位置にチップ状電子部品８を装着する
。At point 0 in FIG. 4, the chip-shaped electronic component 8 held by the mounting head 9 is positioned in the Y direction (the depth direction of the holding members 41A and 41B). At point 0, ±90 of mounting head 9
rotation (orientation change of the chip-shaped electronic component) is performed as necessary. This rotation is performed by meshing a gear 50 formed on a part of the outer periphery of the mounting head 9 with another gear from the back side of the index disk 10. When the mounting head 9 is facing downward, that is, when it is located at the 0 point, the push-down lever 5
-1, the head 5 of the mounting head 9 is rotated in the direction of the arrow 7.
2 is pressed down, thereby the suction pin 48 descends and the chip-shaped electronic component 8 is mounted on the adhesive application position of the board 7.
なお、チップ状電子部品８の±９０度の方向変換はチェ
ーンコンベア機構３上の０点でも行われる。この０点で
はパレット４の挾持バー３１人。Note that the ±90 degree direction change of the chip-shaped electronic component 8 is also performed at the zero point on the chain conveyor mechanism 3. With this score of 0, there are 31 people holding the pallet 4 clamping bar.
３１Ｂを開き、吸着ピンでチップ状電子部品８を回転さ
せるか、あるいは別の挾持部材で挾持して回転させる。31B is opened, and the chip-shaped electronic component 8 is rotated using a suction pin or held and rotated using another holding member.
次に上記実施例の全体的動作を示す。まず、予め定めら
れたシーケンスに従って、チップ状電子部品８０品種を
選択し、供給ユニツ）５Ａ、５Ｂのパーツフィーダ６よ
り順次チップ状電子部品８をパレット４の挾持バー３１
Ａ、３１Ｂ間に挿入する。パレット４は挟持バー３１Ａ
、３１Ｂでチップ状電子部品８を挾持した状態でチェー
ンコンベア機構３の間欠運動に従って間欠走行する。そ
して、装着ヘッド９の前にパレット４が移送されるまで
の間に装着類にチップ状電子部品８が配列されるが、パ
レット４が０点にきたとき、±９０度の方向変換が必要
なものについて、チップ状電子部品８の方向変換を行う
０そして、パレット４が第４図■点の装着ヘッド９に実
質的に対接する位置にきたとき、パレット４より装着ヘ
ッド９ヘチップ状電子部品８を押出し、装着ヘッド９Ｖ
ｉ挾持部材４１Ａ、４１Ｂ間にチップ状電子部品８を挾
持した状態で０点、０点、０点の順に回転する。Next, the overall operation of the above embodiment will be described. First, according to a predetermined sequence, 80 types of chip-shaped electronic components are selected, and chip-shaped electronic components 8 are sequentially delivered to the clamping bar 31 of the pallet 4 from the parts feeders 6 of supply units 5A and 5B.
Insert between A and 31B. Pallet 4 has clamping bar 31A
, 31B intermittently travels in accordance with the intermittent movement of the chain conveyor mechanism 3 while holding the chip-shaped electronic component 8 between them. Chip-shaped electronic components 8 are arranged in the mounting class until the pallet 4 is transferred in front of the mounting head 9, but when the pallet 4 reaches the 0 point, a direction change of ±90 degrees is required. Then, when the pallet 4 comes to the position where it substantially opposes the mounting head 9 at point 4 in FIG. 4, the chip-shaped electronic component 8 is transferred from the pallet 4 to the mounting head 9. Extrude and attach the mounting head 9V
i The chip-shaped electronic component 8 is held between the holding members 41A and 41B and rotated in the order of 0 point, 0 point, and 0 point.
０点くおいて、さらに±９０度の方向変換が必要なもの
について、チップ状電子部品８の方向変換を行う。そし
て、０点にて基板７に対してチップ状電子部品８の装着
を行う。このような動作が順次繰返して実行される。With the 0 point set, the direction of the chip-shaped electronic component 8 is changed for those that require a further change of direction of ±90 degrees. Then, the chip-shaped electronic component 8 is mounted on the board 7 at point 0. Such operations are sequentially and repeatedly executed.
上記実施例によれば次のような効果を上けることができ
る。According to the above embodiment, the following effects can be achieved.
（１） 吸着ビン４８及び挾持部材４１Ａ、４１Ｂを
有する装着ヘッド９を用いてチップ状電子部品８０基板
７への装着を行っているので、基板７に既に電子部品が
装着されているような場合にも空きスペースにチップ状
電子部品を後から装着することができる。(1) Since the chip-shaped electronic component 80 is mounted on the board 7 using the mounting head 9 having the suction bottle 48 and the clamping members 41A and 41B, there is a case where the electronic component is already mounted on the board 7. Chip-shaped electronic components can also be installed later in the empty space.
（２）多品種のチップ状電子部品を装着類にパレット４
上に配列させることができ、この結果、多品種のチップ
状電子部品の装着が実現できる。(2) Pallet 4 for mounting various types of chip-shaped electronic components
As a result, it is possible to mount a wide variety of chip-shaped electronic components.
（３）パレット４及び装着ヘッド９はチップ状電子部品
を挾持した状態で移送するため、移送速度、ひいては装
着速度の高速化を図ることができる。(3) Since the pallet 4 and the mounting head 9 transfer chip-shaped electronic components while holding them therebetween, it is possible to increase the transfer speed and thus the mounting speed.
また、パレット上に部品を載置する場合の如く部品の飛
びや位置ずれが生じることがないから、信頼性も向上す
る。さらに、取扱うことのできるチップ状電子部品の寸
法の許容度が大きいため、チップ状電子部品の多様化に
対応できる。In addition, reliability is improved because parts do not fly or become misaligned, unlike when parts are placed on a pallet. Furthermore, since there is a large tolerance in the dimensions of chip-shaped electronic components that can be handled, it is possible to respond to the diversification of chip-shaped electronic components.
（４）チップ状電子部品の方向変換をパレット４が０点
にきたとき、及び装着ヘッド９が０点にきたときに行う
ようにしており、夫々の位置で±９０度の変換を行って
いる。−従って、０度、９０度、１８０度、２７０度の
４通りの装着位置を得ることができる。このため、トラ
ンジスタ等の３端子部品の取付の場合に便利である。(4) The direction of the chip-shaped electronic components is changed when the pallet 4 reaches the 0 point and when the mounting head 9 reaches the 0 point, and a ±90 degree change is performed at each position. . -Therefore, four mounting positions can be obtained: 0 degrees, 90 degrees, 180 degrees, and 270 degrees. Therefore, it is convenient for mounting three-terminal components such as transistors.
値上のように、本発明によれば、小さな空スペースの基
板に対してもチップ状電子部品の装着を確実に実行でき
、しかも高能率で高信頼度のチップ状電子部品装着機を
得ることができる。As mentioned above, according to the present invention, it is possible to obtain a chip-shaped electronic component mounting machine that can reliably mount chip-shaped electronic components even on a board with a small empty space, and that is highly efficient and highly reliable. I can do it.
第１図は本発明に係るチップ状電子部品装着機の実施例
であって全体的構成を示す斜視図、第２図はパレットを
取付けるチェーンコンベア機構を示す断面図、第３図は
パレット部分を示す斜視図、第４図は装着ヘッドを有す
る装着機構の正面図、第５図はパレットから装着ヘッド
にチップ状電子部品を移す動作を説明する斜視図である
。
ＩＡ、ＩＢ・・・スプロケット、２・・・チェーン、３
・・・チェーンコンベア機構、４・・・パレッ）、５Ａ
。
５Ｂ・・・供給ユニット、６・・・パーツフィーダ、７
・・・基板、８・・・チップ状電子部品、９・・・装着
ヘッド、１０・・・インデックス円板、１１・・・装着
機構、２０・・・本体フレーム、２１・・・チェーンガ
イド、３０・・・パレット基台、３１Ａ、３１Ｂ・・・
挾持バー、３２Ａ、３２Ｂ・・・平行リンク、３３・・
・伸長ばね、３４・・・ブツシュロッド、３６・・・作
動ブロック、４０・・・押出しレバー、４１Ａ、４１Ｂ
・・・挟持部材、４８・・・吸着ビン。
特許出願人 東京電気化学工業株式会社代理人 弁
理士 村 井 隆
第４図Fig. 1 is a perspective view showing the overall configuration of a chip electronic component mounting machine according to an embodiment of the present invention, Fig. 2 is a sectional view showing a chain conveyor mechanism for attaching a pallet, and Fig. 3 shows a pallet part. FIG. 4 is a front view of a mounting mechanism having a mounting head, and FIG. 5 is a perspective view illustrating the operation of transferring a chip-shaped electronic component from a pallet to a mounting head. IA, IB...Sprocket, 2...Chain, 3
...Chain conveyor mechanism, 4...Pallet), 5A
. 5B... Supply unit, 6... Parts feeder, 7
... Board, 8... Chip-shaped electronic component, 9... Mounting head, 10... Index disk, 11... Mounting mechanism, 20... Body frame, 21... Chain guide, 30...Pallet base, 31A, 31B...
Clamping bar, 32A, 32B...Parallel link, 33...
・Extension spring, 34... Bush rod, 36... Operating block, 40... Push lever, 41A, 41B
... Holding member, 48... Suction bottle. Patent Applicant Tokyo Denki Kagaku Kogyo Co., Ltd. Agent Patent Attorney Takashi Murai Figure 4
Claims (3)
るパレットと、チップ状電子部品を該パレットに供給す
る供給ユニットと、前記パレットよりチップ状電子部品
の供給を受けてプリント基板上にチップ状電子部品を装
着する装着ヘッドを有する◆着機構とを備え、前記パレ
ット及び装着ヘッドはチップ状電子部品を挟持状態で移
送することを特徴とするチップ状電子部品装着機０(1) A pallet that is attached to an endless belt mechanism and is intermittently transferred; a supply unit that supplies chip-shaped electronic components to the pallet; and a supply unit that supplies chip-shaped electronic components from the pallet and places the chips on a printed circuit board. A chip-shaped electronic component mounting machine 0, characterized in that the pallet and the mounting head transfer the chip-shaped electronic components in a sandwiched state.
ベアであり、該チェーンコンベアの外周側に前記パレッ
トが等間隔で水平に配列されている特許請求の範囲第１
項記載のチップ状電子部品装着機。(2) The endless band mechanism is a chain conveyor that runs on a horizontal surface, and the pallets are arranged horizontally at equal intervals on the outer circumferential side of the chain conveyor.
The chip-shaped electronic component mounting machine described in Section 1.
れたチップ状電子部品の±９０度の方向変換を行うとと
もに前記装着ヘッドの特定位置においても当該装着ヘッ
ドで挾持されたチップ状電子部品の±９０度の方向変換
を行う特許請求の範囲第１項記載のチップ状電子部品装
着機。(3) Changing the direction of the chip-shaped electronic component clamped by the pallet at a specific position of the endless belt by ±90 degrees, and also changing the direction of the chip-shaped electronic component clamped by the mounting head at a specific position of the mounting head. A chip-shaped electronic component mounting machine according to claim 1, which performs a direction change of ±90 degrees.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56131548A JPS5833893A (en) | 1981-08-24 | 1981-08-24 | Chip electronic part mounting machine |
| GB08222570A GB2108015B (en) | 1981-08-24 | 1982-08-05 | Apparatus for mounting chip type circuit elements on printed circuit boards |
| US06/409,184 US4520557A (en) | 1981-08-24 | 1982-08-18 | Apparatus for mounting chip type circuit elements on printed circuit boards |
| DE19823231174 DE3231174A1 (en) | 1981-08-24 | 1982-08-21 | DEVICE FOR ATTACHING DABLET CIRCUIT ELEMENTS TO PRINTED CIRCUIT BOARDS |
| KR8203766A KR880002064B1 (en) | 1981-08-24 | 1982-08-23 | Chip electronic part mount machine |
| CA000409940A CA1201881A (en) | 1981-08-24 | 1982-08-23 | Apparatus for mounting chip type circuit elements on printed circuit boards |
| NL8203293A NL8203293A (en) | 1981-08-24 | 1982-08-23 | DEVICE FOR MOUNTING CHIP TYPE CHAIN ELEMENTS ON PRINTED CHAIN PANELS. |
| CH5023/82A CH659734A5 (en) | 1981-08-24 | 1982-08-24 | DEVICE FOR MOUNTING CHIP-SHAPED ELECTRICAL OR. ELECTRONIC COMPONENTS ON BOARDS FOR PRINTED CIRCUITS. |
| IT22948/82A IT1152044B (en) | 1981-08-24 | 1982-08-24 | APPAREIL POUR LE MONTAGE D'ELEMENTS DE CIRCUIT DU TYPE "PUCE" SUR DES PLAQUETTES DE CIRCUIT IMPRIME |
| BE0/208867A BE894184A (en) | 1981-08-24 | 1982-08-24 | APPARATUS FOR MOUNTING "CHIP" TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT BOARDS |
| FR8214520A FR2511831B1 (en) | 1981-08-24 | 1982-08-24 | MACHINE FOR MOUNTING PELLET-TYPE CIRCUIT ELEMENTS ON PRINTED CIRCUIT PANELS |
| AU87553/82A AU554348B2 (en) | 1981-08-24 | 1982-08-24 | Apparatus for mounting chip type circuits on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56131548A JPS5833893A (en) | 1981-08-24 | 1981-08-24 | Chip electronic part mounting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5833893A true JPS5833893A (en) | 1983-02-28 |
| JPH0122999B2 JPH0122999B2 (en) | 1989-04-28 |
Family
ID=15060645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56131548A Granted JPS5833893A (en) | 1981-08-24 | 1981-08-24 | Chip electronic part mounting machine |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5833893A (en) |
| KR (1) | KR880002064B1 (en) |
| AU (1) | AU554348B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61172400A (en) * | 1984-08-25 | 1986-08-04 | 日東工業株式会社 | Automatic chip mounting apparatus |
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH088292B2 (en) * | 1987-08-31 | 1996-01-29 | 住友電気工業株式会社 | Chip mounting device |
| AU2003211289A1 (en) * | 2002-02-06 | 2003-09-02 | Mirim Intellectual Robot Technology Co., Ltd. | Blank mounting apparatus for fabrication of quartz oscillator |
| KR102141203B1 (en) * | 2019-02-11 | 2020-08-04 | 세메스 주식회사 | Bonding head and apparatus for bonding chips having the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334477A (en) * | 1976-09-10 | 1978-03-31 | Seiko Instr & Electronics Ltd | Carrying and assembling unit for components |
| JPS54158670A (en) * | 1978-11-16 | 1979-12-14 | Tdk Electronics Co Ltd | Holder for electronic component |
-
1981
- 1981-08-24 JP JP56131548A patent/JPS5833893A/en active Granted
-
1982
- 1982-08-23 KR KR8203766A patent/KR880002064B1/en active
- 1982-08-24 AU AU87553/82A patent/AU554348B2/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5334477A (en) * | 1976-09-10 | 1978-03-31 | Seiko Instr & Electronics Ltd | Carrying and assembling unit for components |
| JPS54158670A (en) * | 1978-11-16 | 1979-12-14 | Tdk Electronics Co Ltd | Holder for electronic component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61172400A (en) * | 1984-08-25 | 1986-08-04 | 日東工業株式会社 | Automatic chip mounting apparatus |
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| AU8755382A (en) | 1983-03-03 |
| KR880002064B1 (en) | 1988-10-14 |
| KR840001427A (en) | 1984-04-30 |
| AU554348B2 (en) | 1986-08-14 |
| JPH0122999B2 (en) | 1989-04-28 |
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