JPS6198000A - Ic inserter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a C display device, which automatically inserts an IC package into a board or a socket attached to a board, and which particularly shortens the operating tact. The present invention relates to an IC insertion device suitable for

[Background of the invention]

Without further ado, the prior art will be explained with reference to FIGS. 7 and 8.

Here, FIG. 7 is an operation chart of an IC clamping operation by a conventional ICC insertion device, and FIG. 8(a).

(b) Conventional IC insertion! FIG. 3 is an explanatory diagram of a problem when clamping an IC in position A.

As a device for inserting an IC into a board or a socket attached to a board, for example, there is a device described in Japanese Patent Application Laid-Open No. 176800/1983.According to this device,
Both end faces and the bottom face of both ends of package C are clamped by a pair of clamp claws with receiving claws, and the lowering, raising, and forward movement of the clamp mechanism and the opening/closing operation of the clamp claws are performed as shown in Figure 7. It is operated according to a drawing chart, and the IC is inserted into a board or a socket attached to the board.It can be said to be highly reliable in that it is clamped by a pair of clamp claws with Icl receiving claws.

However, in this IT, the positioning i of the IC is performed at the end face of the IC pancage, but in the actual IC, as shown in Figure 8 (a), Currently, the dimensional accuracy with respect to pin 2 of the IC is not known, and the center position of the IC package 1,
In other words, the center position X of the clamp mechanism and the position I to be inserted.
The pin part center position Y of pin 2 of C will not match,
There is a drawback that insertion errors often occur and the IC is often damaged.

Furthermore, since the insertion operation is performed using a big mantle place operation as shown in Figure 7, there is the problem that takt time cannot be shortened, and the height of the IC clamp position and the height of the IC insertion position must be at the same level. There was a problem in that there was a design constraint that the

[Purpose of the invention]

The present invention has been made in view of the problems of the prior art described above, and provides an IC insertion device that can perform the IC insertion work in a short takt time and can improve the reliability of the IC insertion work. is its purpose.

[Summary of the invention]

The structure of the IC insertion device according to the present invention is as follows: an IC transporting member that holds and transports a large number of ICs, the pins of the ICs, and the bottom surface of the IC package as one part; and the IC transporting member that transports the ICs. An IC positioning device that positions the IC on the IC transport member; and an IC positioning device that positions the IC on the IC transport member; a plurality of IC clamp mechanism sections arranged at intervals; a plurality of base members holding the plurality of IC clamp mechanism sections; A rotation mechanism that is held at equal intervals on the same radius of rotation; and as the rotation mechanism rotates, the plurality of IC clamp mechanisms are index-rotated or oscillated through the plurality of base members. a rotational actuating mechanism for clamping the positioned IC; and a rotating mechanism for clamping the positioned IC;
A bushing mechanism for lowering the C clamp mechanism to the IC clamping position; and a bushing mechanism for lowering the IC clamp mechanism to the IC clamping position;
C. An insertion mechanism section that lowers the insertion mechanism to the insertion position is provided.

As an additional note, the IC insertion device according to the present invention attaches a plurality of IC clamps to the rotating member at equal intervals on the same radius of rotation of the rotating member. By index-rotating or swinging the structure, a plurality of IC clamp mechanism parts arranged at equal intervals on the circumference perform the IC insertion work in sequence, and each IC clamp mechanism part as a whole can be inserted. However, by adding a mechanism that moves up and down while rotating along the groove of a cylindrical cam installed concentrically with the rotating part, the level difference between the IC clamp position and the IC insertion position can be reduced. The basic concept is to absorb it during rotational operation and perform the work of inserting and inserting the machine C at high speed.

Furthermore, a pin stop attached to the tip of an IC transport member that transports the IC using the IC pins and the bottom surface of the IC package as guides and an IC positioning device position the IC based on the IC pins. Make sure that the center of the pin part and the center of the IC clamp mechanism part always match.
By clamping C, damage caused by incorrect IC insertion is prevented.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 6.

Here, FIG. 1 shows an IC insertion device according to an embodiment of the present invention, (a) is an overall configuration diagram, (b) is an external view of a barbed cylindrical cam, and FIG. 2 is an IC insertion device according to an embodiment of the present invention. 3 is an explanatory diagram showing a positioning method using the positioning device of FIG. 2; FIG. 4 is a configuration diagram of the IC clamping mechanism; (a) is a front view; (b) is a side view, fifth
The figure is a cross-sectional view of the IC clamping mechanism and the rotating mechanism, and FIG. 6 is an operation chart of the operation performed by the IC insertion device of FIG. 1.

The IC to be fabricated has all pins 2 in an IC package 1 shown in FIG. 3.4, and is hereinafter referred to as IC3.

In Figure 1.2, 10 digits of ICa are represented by their I
The pin 2 of C and the bottom 11 of the IC package 1 [i are all IC transport blocks related to the ICy & transport member that is held and transported as a guide section.

11, a Cheno 1 for moving the IC transport block 10;
4-piece, sprocket for moving Cheno 11, 15-piece,
This is a guide member that guides the moving direction of the transport block 10.

A plurality of ICi feed block blocks 10 are attached to two consecutive chains 11 at equal intervals P using support metal fittings, and each chain 11 meshes with a sprocket 14 rotated by a transmission shaft 13.

The distance traveled by the chain 11 due to the rotation of the sprocket 1401 is exactly the same as the interval P when the IC transport block 10 is installed, and the distance traveled by the chain 11 when the sprocket 1401 rotates corresponds exactly to the interval P. They are transported one after another at the same distance i@P. In other words, engineering C
3V'i IC transport block 1 one by one in parts not shown
0 and will be transported one by one while moving intermittently by equal distances P.

In the operation chart to be explained later, this P & structure is
This will be referred to as the yM sending block pitch sending section.

Since the transported workpiece C3 rides on the IC transport block 10 using the pins 2 of the IC and the bottom of the IC package 1 as guides, the degree of loading in the width direction of the IC 30 can be accurately determined by the IC transport block 10. ing.

In this way, the IC3td transported in [7] is positioned in the longitudinal direction at the clamp position 2.

The IC positioning device is shown in detail in Figure 2.
An IC pressing member related to the IC pressing member is identified by a block 17, and is held by being pressed by a compression spring 21 on a plate 20 so as to be slidable along a shaft 19 via a fly holder 18. ing.

The shaft 19 has one end fixed to a plate 20, and is held in a holder 23 through a bearing 22 so as to be movable back and forth.

The other end of the shaft 19 is fixed to a block 25 having a cam follower 24.

The plate 20 is returned to the retreating side by the tension spring 26, but when the block 25 is pushed by a mechanism (not shown) via the cam follower 24, it moves forward behind the block 17 and the IC pushing plate 16, and returns to the clamping position [ I in Z
Position the IC 3 on the C transport block 10 in the longitudinal direction.

FIG. 3 shows details of the longitudinal positioning of the IC3.

27, the pins 2 of the IC are brought into contact with the pins provided at the ends of the plurality of ICi sending blocks 10. In the figure, 28 indicated by a dashed line is an IC clamp head which will be explained later, and 29 is an IC3: suction band to be clamped.

Block 17 and IC push plate 1 together with plate 20
6 moves forward, the tip of the IC pushing plate 16 pushes the IC 3, and the IC 3 slides on the IC transport block 10 and moves forward, but the pin 2 of the IC 3 is stopped by the small pin flanges 27 attached to the IC transport block 10. IC3 cannot move forward.

The plate 20 moves further forward, but the IC pushing plate 16 that is directly pushing the IC 3t stops against the compression spring 21. That is, the workpiece 03 is sandwiched between the pin stopper 27 and the IC pushing plate 16 which receives the cushioning force of the compression spring 21, and is positioned in the longitudinal direction with reference to the pin 2, and the IC
The center of the clamp head 28 and the center of the pin part of IC3 are W
When they match, they are clamped by suction pad 29. At this time, the strength of the compression spring 21 is determined by the pin 2 of the IC 3.
sufficient consideration must be given to avoid bending the

In this way, the three ICs are accurately transported to the clamp position Z while being positioned in the width direction on the IC transport block 10, and the IC positioning device positions the IC at the position 6w in the pitcher direction with reference to the pin 2 of the IC. It is clamped by suction.

Next, the IC clamping mechanism will be explained with reference to FIGS. 4 and 5.

The IC clamp mechanism section is arranged at equal intervals on the rotational circumference in order to clamp the ICa positioned by the IC positioning device and insert the IC3 into a board or a socket attached to the board. In this embodiment, two sets of IC clamp mechanisms are arranged symmetrically at 180° intervals.

In FIG. 4, 28 is an IC clamp head, 29 is
A suction pad 30 that is installed in the IC clamp head 28 and clamps the IC 3 by suction is a plate that fixes the clamp head 28. The plate 30 is provided to facilitate setup change when the type of IC changes. be.

When inserting the suction pad 29 into the circuit board or the socket attached to the board, a compression spring is hidden inside the lower surface of the IC clamp head 28 that presses the top surface of the IC 3 so as not to receive the insertion force directly. It is held at 31,
Further, it is connected to a vacuum generator (not shown) through a pipe 32.

33 is a shaft for pushing down the IC clamp head 28. One end of the shaft is fixed to the plate 30, and it is held in a holder 35 via a bearing 34 so as to be able to move up and down, and the other end is fixed to the plate 30. It is fixed to a block 37 with 36.

58 surrounds the shaft 38 and connects the block 37 and the holder 3.
This is a compression spring set between 5 and 5.

As shown in FIG. 5, in the above-mentioned IC clamp mechanism, two sets are arranged symmetrically at equal intervals of 180° on the circumference.
I will explain its structure to the arrow.

In FIG. 1.4.5, there are 38 pace members that hold a plurality (two sets in this embodiment) of IC clamp mechanism units, and are fixed to the holder 35. 39 is a cross roller bearing, 40 is a pair of pace members 3
8 via a cross roller bearing 40 so as to be vertically movable.

In FIGS. 1 and 5, 41 indicates the guide block 40.
This rotating arm 41 is a rotating arm that holds two heads in exactly 180° opposite directions, and finally holds the clamping mechanism part in a two-head type at equal intervals of 180° on the rotation circumference. It is fitted onto the shaft 45.

This oscillation rate s45 is 894 as shown in FIG.
A housing 44 is rotatably held through the housing 3', and the rotary arm 41 is fixed to the oscillator 845 with a clamp bushing 42.

In this way, a rotating mechanism is constructed which uses the oscillator 45, the rotating arm 41, and the guide block 40 to hold a plurality of IC clamping mechanisms at equal intervals on the same radius of rotation via a plurality of pace members 38. It consists of

Next, referring to FIG. 1 and FIG. 4, the configuration of a rotation operating mechanism section that allows the plurality of IC clamp mechanism sections to be rotated by finger via the plurality of pace members 38 as the rotation mechanism section rotates. In FIG. 1, which will be explained below, reference numeral 47 denotes a cylindrical cam arranged concentrically with the center of rotation of the rotating part, that is, the center of the oscillating shaft 4, and the cylindrical surface of this cylindrical cam 47. One continuous spiral groove 46 is formed in the groove. An external view of the cylindrical cam 47 is shown in FIG. 1(b).

48 is a cam follower that engages with the spiral groove 46 of the cylindrical cam 47; 49 is provided with the cam follower 48 at one end;
The other end is an arm member connected to the pace member 38, and the same number of arm members 49 as the plurality (two in this embodiment) of the pace members 38 are connected to the spiral groove 46 of the cylindrical cam 47, as shown in FIG. It is attached.

The oscillating shaft 45 receives power from a mechanism (not shown) through the timing pulley 50tl, rotates forward 180°,
When the oscillating motion is performed every half rotation of 180° in reverse, the clamp bushing 42 rotates the oscillating shaft 45.
The rotating arm 41, which is fixed, also makes a swinging motion every half rotation. As a result, it is clear that the clamp mechanism section also makes a swinging motion, but the cross roller bearing 39
The tip of the arm member 49 fixed to the pace member 38 which can move vertically is slidably engaged with the helical groove 46 of the cylindrical cam 47 via the cam 7 lower 48, so the pace member 38 is rotated. At the same time, it also rises or falls along the locus of the spiral groove 46.

When the entire locus of the spiral groove 46 is expressed in terms of projection, it is shown in FIG. 3 (a
) in the dashed-dotted line C. In other words, the above-mentioned rotational operating mechanism simultaneously absorbs the difference in height between the IC clamping position and the IC insertion position while the IC clamping mechanism rotates. a bushing mechanism for lowering the IC clamping mechanism to the IC clamping position in order to clamp the IC3 positioned in the state; and a bushing mechanism for lowering the IC clamping mechanism to the IC clamping position; The insertion mechanism section and f for lowering the clamp mechanism section to the IC insertion position will be described with reference to FIGS. 1 and 4.

In FIG. 1(a), the pusher 5 mechanism described below is disposed at the upper VC of the IC clamp mechanism at the IC clamp position shown on the right side of the rotation mechanism.

51, a bushing plate for pushing downward the stopper 36 of the IC clamping mechanism that has come to the IC clamping position; 52, a holder fixed to the bracket 56H; 53a, one end fixed to the bushing plate 51; , 415 is a shaft that is held in the holder 52 via a bearing so as to be able to move up and down.
A block 55 is fixed to the other end of 3a.
5 is equipped with a roller 7 roller 54. This roller follower 54 receives downward power from a mechanism not shown.

Reference numeral 57 denotes a tension spring attached to the bushing plate 51 and the bracket 563, and the bushing plate 51, the holder 52, the shaft 53a1, the block 55 , is used to push the roller follower 54 upward.

In this way, each of these parts constitutes a bushing mechanism.

In addition, in Fig. 1(a), the upper part of the IC clamp mechanism at the IC insertion position shown on the left side of the rotating mechanism is
An insertion mechanism section described below is provided. This insertion mechanism is basically the same as the bushing mechanism described above.

That is, there is a bushing spray 151 for pushing downward the stopper 35 of the IC clamp mechanism that has come to the insertion position, a holder 52 fixed to the bracket 56b, one end of which is fixed to the bushing plate 51, and An insertion mechanism is constituted by a block 55t which is held in a holder 52 in a vertically movable manner and has a roller follower 54 at the other end, a fixed shaft 53b, and a tension spring 57 attached to a bushing plate 51 and a platen 56b. has been done.

When the roller follower 54 is pushed downward by a mechanism not shown, the bushing plate 51 descends against the tension spring 57 and pushes the stopper 36 downward. When the button 36 is pushed downward by the bushing plate 51, I
The C clamp head 28 descends against the compression spring 58, and if it is at the IC clamp position, the positioned ICa is placed on the suction pad 29 from above the IC transport block 10, and the bolt that suctions it is the IC insertion position. If the IC3t-IC clamp head 28 is in this position, the lower surface of the IC3t-IC clamp head 28, which is held by the suction pad 29, is used to insert it into a board or socket (not shown).

When the downward force applied to the roller follower 54 is released, the bushing plate 51 is raised by the force of the tension spring 57, and at the same time the stopper 36 is also released, and the IC clamp head 28 is raised by the force of the compression spring 58. do.

Is the configuration detailed above? I of this embodiment that has been explained
A series of operations of the C insertion device will be explained with reference to FIG.

FIG. 8 shows that the operation of the IC insertion device of this embodiment is realized by a -axis timing cam mechanism, that is, a cam mechanism (not shown) in which each mechanism is interlocked with the rotation of the main shaft of one motor. It is an operation chart figure in case.

At the same time as the start, the rotation part and the IC transport block pitch feed part begin to move.

Specifically, the rotary arm 41 rotates half a turn, and the IC clamp head 28, which had been in the IC clamp position, moves to the IC insertion position.
to the IC7 lamp position, is there a level difference between each? It rotates and moves while absorbing it while rotating. At the same time, one of the plurality of ICi feed blocks 10 with the workpiece C3 moved to the clamp position 2
will be sent to.

The IC positioning device moves forward at a timing a little after the one-pitch feed of the IC transport block is completed.

Specifically, the IC pushing plate 16 is inserted between the IC3i stopper 27 and the IC3 is positioned with reference to the pin 2 of the IC.

Shortly after the rotation arm 41 completes its half-rotation, the bushing mechanism and insertion mechanism at the IC clamp position and IC insertion position simultaneously begin to descend.

Specifically, at the IC clamp position, the bushing plate 5
1, the IC clamp head 28 is lowered, and a little before that, the IC3t that has been positioned is suctioned by the suction pad 29, and at the C insertion position, the IC clamp head 28 is sucked by the suction pad 29. Insert into the board or socket attached to the board with the bottom surface of the board.

Thereafter, the bushing mechanism section, the insertion mechanism section, and the IC positioning device move back at the same time, and at the timing when the three components finish moving back, the rotation mechanism section and the IC transport block pitch sending section start operating again.

In this operation, one IC clamp head 28
While C3 is being inserted, the other IC clamp head 28 is clamping the next IC3 at the same time, and the next insertion operation can be carried out by just rotating the rotating part half a turn, making the insertion process easier. All can be done very quickly and efficiently.

In this way, according to the IC insertion device of this embodiment, (1) I
C3 insertion work can be performed quickly and efficiently.

(2) Since the IC 3 is positioned based on the pin 2 of the IC, it is possible to reduce insertion errors of the IC 3 and improve reliability.

It should be noted that what has been described in detail above is one embodiment of the present invention, and the present invention is not limited to the structure of this embodiment.

In other words, the shape of the IC transport member, the IC transport block pitch feed mechanism, the IC positioning device, the IC clamp mechanism, the rotation mechanism, the rotation operation mechanism, the bushing mechanism, the insertion mechanism, etc. The shape of the member does not preclude the adoption of other shapes and mechanisms as long as equivalent effects can be expected.

In addition, each operation of the IC insertion device explained in FIG. 6 is realized by a single-axis timing mechanism as described above, but the operation of each mechanical part is also performed by, for example, a pneumatic cylinder or a motor. The same effect can be obtained even if

Furthermore, in the above-mentioned embodiment, the IC clamp mechanism section is provided with two sets of IC clamp heads symmetrically spaced at equal intervals of 180 degrees on the circumference, and the operation of the rotational operation mechanism section is based on the IC clamp mechanism. Although I explained what causes the rocking rotation,
As the insertion device, it is also possible to employ a device having two or more sets of IC clamping mechanisms, in which the operation of the rotation operating mechanism causes the IC clamping mechanisms to index-rotate.

Next, index rotation is an operation in which a predetermined constant angle is sequentially rotated by an indexing operation, and is adopted when there are three or more sets of IC clamp mechanisms. It is unsuitable for operations in which the level difference between the mounting position and the mounting position is absorbed during the rotation operation to shorten the takt time, and horizontal rotation is performed at the same level.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to perform the IC insertion work in a short takt time, and moreover, it is possible to provide the IC insertion apparatus it' which can completely improve the reliability of the IC insertion work. .

[Brief explanation of the drawing]

Fig. 1 shows an IC insertion device according to an embodiment of the present invention, (a) l'' is an overall configuration diagram, (b) is an external view of a cylindrical cam, and Fig. 2 is an IC transporting member thereof. FIG. 3 is a plan view of the IC positioning device; FIG. 3 is an explanatory diagram showing a positioning method using the positioning device shown in FIG. 2; FIG. 4 is a configuration diagram of the IC clamping mechanism; (a) is a front view; is a side view, Figure 5.
6th cross-sectional view of the IC clamp mechanism and rotating mechanism.
The figure shows an operation chart of the operation performed by the IC insertion device shown in FIG. 1, FIG.
FIG. 3 is an explanatory diagram of an extra problem when clamping an IC in a conventional IC insertion device. 1...IC package 2...IC pin 3...
・IC10...IC transport block 16...IC
Pusher 21... Compression spring 23... Holder 24... Cam follower 26... Tension spring 2
7... Pin stopper 28... IC clamp head 29... Suction pad 30... Plate 3
1...Compression spring 33...Shaft 36...Weight 38...Pace m material 39...Cross roller bearing 40...Guide block 41...Rotating arm 45...Oscillator) shaft 46...Spiral groove 47...Cylindrical cam 48...Cam follower
49... Arm member 51... Bush plate 52... Holder 53a, 53b...
Shaft 54...Roller follower 55...Block 56a. 56b... Placket 57... Tension spring 5
8... Compression spring.

Claims (1)

[Scope of Claims] 1. An IC transport member that holds and transports a large number of ICs using the pins of the ICs and the bottom surface of the IC package as guide parts; An IC positioning device that positions the IC with the IC positioning device; A plurality of IC clamp mechanisms, a plurality of base members that hold the plurality of IC clamp mechanisms, and a plurality of IC clamp mechanisms that are arranged on the same radius of rotation via the plurality of base members. a rotational mechanism section that holds the plurality of IC clamping mechanisms at an interval; a rotational operation mechanism section that causes the plurality of IC clamping mechanism sections to perform index rotation or rocking rotation via the plurality of base members as the rotational mechanism section rotates; Said I to clamp the positioned IC
a push mechanism for lowering the C clamp mechanism to the IC clamp position; and a push mechanism for lowering the IC clamp mechanism to the IC clamping position;
1. An IC insertion device comprising: an insertion mechanism portion that is lowered to a C insertion position. 2. In the item described in claim 1, a plurality of base members are held in a rotating mechanism part so as to be able to move up and down, and a spiral shape is formed concentrically with the rotation center of the rotating mechanism part and continuous with the cylindrical surface of the base member. The rotation mechanism includes a cylindrical cam having a groove, and a plurality of arm members each having one end connected to the plurality of base members and the other end slidably engaged with the spiral groove of the cylindrical cam. What is claimed is: 1. An IC insertion device comprising: a rotation operating mechanism section that swings the plurality of base members via the plurality of arm members as the section rotates, thereby swinging and rotating the plurality of IC clamp mechanisms. 3. In either of claims 1 or 2, a pin stopper is provided at the tip of the IC conveying member to abut the pin of the IC, and the pin stopper and
An IC insertion device configured to position the IC by aligning the center of a pin portion of the IC with the center of an IC clamping mechanism portion using an IC pushing member of an IC positioning device that is brought into contact with a side surface of an IC package.