JPS62169424A - Assembly machine - Google Patents

Abstract

PURPOSE:To provide an assembly machine which can be easily accommodated to various types of components, by providing a cam mechanism interlocked with a handle for changing a width of a lack guide, a component pressing pin whose momentum of shift can be changed by utilizing the cam faces of the cam mechanism as stoppers, and component stopping pin whose stop position can be changed by engaging it with the cam faces. CONSTITUTION:The position of a partition plate 24 is adjusted according to a lengthwise size of a lead frame 2. For achieving this purpose, a guide pin 25 engaged in an engaging groove 26a is shifted into another engaging groove for adjusting the lengthwise receiving size of a rack guide 21. Further, two cams 23 and 33 are rotated synchronously while a handle 22 of the rack guide 21 is rotated, whereby the width of the rack guide 21 is changed. Shafts 35 and 36 are also rotated simultaneously therewith whereby the cam faces of the cams 37 and 38 are shifted. Accordingly, the momentum of shift of an ejector pin 39 and the position of a stopper pin 40 are changed so that a proper momentum of the ejector pin 39 and a proper position to which a lead frame is initially fed are assured according to the configurations and dimensions of the lead frame 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology that is effective when applied to assembly equipment, particularly for supplying parts to wire bonding equipment, pellet bonding equipment, etc. for assembling semiconductor devices.

[Prior art] An example of a detailed description of the technology of a wire bonding device, which is one of the assembly devices, is given in Kogyo Kenkyukai Co., Ltd., November 20, 1984, “Electronic Materials November 1984 Special Issue, Super LSI manufacturing/testing equipment guidebook J
, P114 to P120.

2. Description of the Related Art Semiconductor device assembly apparatuses such as wire bonding mW or pellet bonding apparatuses are known to have a member supply mechanism that transfers lead frames housed in a rack having a housing structure onto a bonding stage one by one.

[Problems to be Solved by the Invention] The component supply mechanism is prepared depending on the type of lead frame. Therefore, when assembling a wide variety of products in small quantities, it is necessary to adjust the component supply mechanism to meet the dimensional standards of the lead frame each time. I had to replace it with a mechanical one.

Regarding this point, it is possible to handle a wide variety of products by attaching a partition plate that can be moved in parallel in the length direction to the rack guide and making it possible to change the width of the rack guide. Depending on the length of the lead frame, the amount of feed of the lead frame from the rack must be adjusted and the stopping position on the chute must be changed.
The inventor of the present invention has revealed that the adjustment of the device every time the product type is changed becomes complicated, and as a result, it becomes difficult to achieve improvement in assembly efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide an assembly apparatus having a component supply mechanism that can easily accommodate changes in product types.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] A brief overview of typical inventions disclosed in this application is as follows.

That is, a cam mechanism linked to a handle that changes the rack guide width, a member pressing pin that can change the amount of displacement operation by using the cam surface of the cam mechanism as a stopper, and a member pressing pin that engages with the cam surface to adjust the stopping position of the member. assembly device with changeable member stop pins;

[Operation] According to the above means, it is possible to determine the feed amount and stop position corresponding to the size of the component simply by operating the handle to change the rack guide width, so it is possible to easily change the type of component. This can significantly improve assembly efficiency.

C Embodiment] FIG. 1 is an explanatory diagram showing a lead frame supply section of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a rack guide, and FIG. 3 is an illustration showing the entire wire bonding apparatus. FIG.

The assembly apparatus of this embodiment is a wire bonding apparatus 1, which is used to connect electrodes of pellets 3, etc. on a lead frame 2.

As shown in FIG. 3, the wire bonding apparatus 1 has a component supply mechanism 5 and a component storage mechanism 6 on both ends of a feeder 4, which is a conveying section, and a bonding mechanism section on one side of the feeder 4. 7 is located. The bonding mechanism section 7 includes a bonding head 9 mounted on an XY table 8. An arm 10 extends from the bonding head 9 onto the feeder 4, and a capillary 11 as a bonding tool is attached to the tip of the arm 10 almost perpendicularly to the arm so as to face the feeder 4. There is.

The component supply mechanism 5 includes a rack guide 21 as shown in FIG.
have. This rack guide 21 includes a pair of guide plates 21a and 21 extending in the height direction in FIG.
b, and each guide plate 21a, 21b has a structure in which the width between both guide plates 21a, 2Ib can be adjusted by a cam 23 connected to a handle 22 attached to the side of the rack guide 21. ing.

On the other hand, a partition plate 24 is attached to the inside of the guide plates 21a and 21b. A guide pin 25 is formed protruding from the side end of the partition plate 24, and the guide pin 25 is locked in a guide groove 26 formed on the side surface of the guide plate 21b. The guide a26 has a plurality of locking grooves 26 in a comb-like shape.
a, and has a structure in which the partition position can be changed by moving the guide pin 25 and changing the locking groove 26a.

Note that a rack supply section 2 is provided at the bottom of the rack guide 21.
7, and a rack (not shown) containing a plurality of lead frames 2 is sent from the rack supply section 27 to the rack guide 21.

As shown in FIG. 1, a belt 31 is suspended from the handle 22 on the side of the rack guide 21 together with a cam 23, and one side of the belt 31 is connected to a shaft 32 attached to the side of the rack guide 21. It is suspended. A cam 33 having the same structure as the cam 23 is attached in a direction opposite to the cam 23, and this cam 33 is rotated by a belt 34 suspended between the shaft 32 and the cam 33. Therefore, by manually rotating the handle 22, the shaft 32 is rotated via the belt 31, and the cam 33 is further rotated by the belt 34, so that both cams 23 and 33 are rotated synchronously. Move the temporary guide 21a.

It has a structure in which the width between 21b is changed.

A belt 35 is suspended at an axially intermediate position of the shaft 32, and one side of the belt 35 is suspended from a shaft 36 extending perpendicularly to the shaft 32. This shaft 3G has two cams 37 and 3.
An L is attached to the cam surface of one cam 37.
The ends of the letter-shaped ejector pins 39 are brought into contact with each other.

The ejecting pin 39 is configured to reciprocate a protruding portion 39a extending in the direction of the rack guide 21 by means of a driving means 40 such as an air cylinder.
The structure is such that the lead frames 2 are moved one by one in the direction of the feeder 4 by multiple ejection operations. Here, in this embodiment, the cam surface of the cam 37 is displaced by the rotation of the shaft 36, and the amount of ejection operation is changed. 40 ends are abutted. This stopper pin 40 is for stopping the lead frame 2 pushed out onto the end of the feeder 4 by the operation of the ejector pin 39 at the initial frame feeding position on the feeder 4. Here, due to the displacement of the cam surface of the cam 38,
The position of is also displaced, and the initial frame feed position is changed.

Next, the operation of this embodiment will be explained.

The rack housing the lead frame 2 is a rack guide 21.
When the lead frame 2 is held in the position, the ejecting pin 39 performs an ejecting operation due to the operation of the driving means 4o, and the lead frame 2 is pushed out in the direction of the feeder 4.

At this time, the movement of the lead frame 2 is controlled by the stopper pin 40.
The end of the feeder 4 is stopped at a predetermined position. When the lead frame 2 is transferred on the feeder 4, the stop position is the initial position, and the lead frame 2 is moved by a predetermined distance by a transfer mechanism such as a chuck (not shown), and wire bonding is performed by the bonder 8II7.

After the wire bonding is completed, the lead frame 2 is again transferred on the feeder 4 and stored in a rack (not shown) on the member storage mechanism 6 side.

In this apparatus 1 that performs the above steps, the following operations are performed when lead frames of different standards are used as members.

First, the position of the partition plate 24 is adjusted according to the lengthwise dimension of the lead frame 2. At this time, in this embodiment, the housing dimension of the rack guide 21 in the length direction is adjusted by moving the guide pin of the locking groove 26a to another locking groove.

In addition, when changing the housing dimension of the rack guide 21 in the width direction, it is done by rotating the handle 22 by a predetermined amount. At this time, the two cams 23 and 33 are rotated in synchronization with the rotation of the handle 22. As a result, the width of the rack guide 21 is changed. At the same time, the shafts 32 and 36 are also rotated, and the cam surfaces of the two cams 37 and 38 are displaced accordingly. Therefore, the amount of displacement of the ejection pin 39 and the position of the stopper pin 40 are changed, and the amount of ejection and initial frame feed position corresponding to the shape and dimensions of the lead frame 2 are ensured.

As described above, according to this embodiment, the width of the rack guide 21 can be adjusted with just a simple handle operation, and at the same time, the protrusion amount and frame feed initial position can be adjusted in accordance with the shape and dimensions of the lead frame 2 used. can be secured. Therefore, when the lead frame 2 is transferred on the feeder 4 by the chuck mechanism, etc., the optimal frame feeding initial position corresponding to the center position of the lead frame 2 is set, so that the frame is placed on the bonding stage at an accurate position. It can be done with As a result, wire bonding with high positional accuracy can be achieved.

In the above description, the invention made by the present inventor was mainly applied to its field of application, which is an assembly apparatus used in the manufacture of semiconductor devices, particularly a wire bonding apparatus, but the present invention is not limited to this. It is an effective technique that can be applied to any assembly apparatus that requires a feeding mechanism for plate-shaped members, such as a bullet bonding apparatus.

As described above, according to this embodiment, the following effects can be obtained.

(1) A cam mechanism linked to a handle that changes the rack guide width, a member pressing pin that can change the amount of displacement using the cam surface of the cam mechanism as a stopper, and a member pressing pin that engages with the cam surface to stop the member. By having a component stop pin whose position can be changed, it is possible to determine the feed amount and stop position corresponding to the size of the component simply by operating the handle to change the rack guide width, making it easy to change the type of component. This can improve assembly efficiency.

(2) According to (1) above, a single supply mechanism can handle a wide variety of products, thereby reducing the assembly cost of a wide variety of products.

(3) With +11 mentioned above, it is possible to secure the initial position of the member feed corresponding to the size of the member, so the reliability φ■
This allows for highly efficient assembly processes.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

[Effects of the Invention] A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

A cam mechanism linked to a handle that changes the rack guide width, a member pressing pin that can change the amount of displacement using the cam surface of the cam mechanism as a stopper, and a member pressing pin that engages with the cam surface to change the stopping position of the member. By having a member stop pin that allows you to change the rack guide width simply by operating the handle,
Since the feed amount and stop position can be determined in accordance with the size of the component, the type of component can be easily changed, and assembly efficiency can be improved.

Furthermore, since a single supply mechanism can handle a wide variety of products, assembly costs for a wide variety of products can be reduced.

Furthermore, since the above-mentioned (1) can ensure the desired position for feeding the member corresponding to the size of the member, a highly reliable assembly process can be performed.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing a lead frame supply section of a wire bonding apparatus which is an embodiment of the present invention, Fig. 2 is a perspective view showing a rack guide used in the embodiment, and Fig. 3 is an explanatory diagram showing the wire bonding device of the embodiment. It is an explanatory view showing the whole bonding device. 1... Wire bonding equipment (& [i-standing equipment), 2
...Lead frame, 3. Pellet, 4. Feeder, 5. Component supply mechanism, 6. Component storage mechanism, 7. Bonding mechanism section, 8. XY table, 9. ...bonding head, lO... arm, 1
1... Capillary, 21... Rack guide, 21
a, 21b...Guide plate, 22...Handle, 23
... cam, 24 ... partition plate, 25 ... guide pin, 26 ... guide groove, 26a ... locking groove, 27 ...
- Rank supply section, 31...Belt, 32...Shaft, 33...Cam, 34...Belt, 35...Belt, 36...Shaft, 37...Cam, 38...
-Cam, 39...Eject pin, 39a...Protrusion part, 40...Stoff pad pin. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. A cam mechanism interlocked with a handle that changes the rack guide width, a member pressing pin that can change the amount of displacement operation using the cam surface of the cam mechanism as a stopper, and a member pressing pin that engages with the cam surface. An assembly device equipped with a member supply means having a member stop pin that can change the stop position of the member by changing the stop position of the member. 2. The assembly apparatus according to claim 1, wherein the member is a lead frame for manufacturing a semiconductor device. 3. The assembly device according to claim 1, wherein the handle and the cam mechanism are interlocked by a pulley and a belt.