JPS62140966A - Carrying system for substrate film - Google Patents

Abstract

PURPOSE:To exactly position a substrate film to feed it at a fixed pitch by separately inserting two different pins, namely a positioning and a feeding pin, in the guide hole of the substrate film, and carrying the substrate film as at least either of the above pins has been inserted in the guide hole. CONSTITUTION:A positioning pin 11 as well as a feeding pin 12 are used in carrying a substrate film 1, and the substrate film is carried with either of the above pins kept in its guide hole. The positional discrepancy of the substrate film 1 can be therefore prevented during its carrying process, and thereby the feeding pin 12 to carry the substrate film 1 an be certainly inserted in the guide hole to carry the substrate film 1 smoothly at a fixed pitch.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention is directed to manufacturing a flexible substrate in which a wiring pattern is formed on a synthetic resin film by means such as printing. The present invention relates to a substrate film transport method for automatically pitch-feeding a substrate film made up of a number of bodies arranged in series.

[Prior Art] A flexible board is made by forming a wiring pattern on a synthetic resin, which is a flexible and lightweight member.This board is, for example, a board formed body in which a wiring pattern is formed on a single long resin film. A substrate film is formed in which the flexible substrates are arranged in two rows, and these substrate-forming bodies are finally cut and separated from the substrate film, and during manufacturing, the flexible substrate is transported to each processing step in the form of a substrate film. I have to.

Here, in order to perform the above-mentioned specific processing ψ processing on the substrate film, it is necessary to transport the substrate film at a predetermined pitch. A feeding pin is provided to transfer the substrate film at a pitch, the feeding pin is attached to and removed from a guide hole drilled in the substrate film, and the feeding pin is inserted into the guide hole and moved forward in the feeding direction of the substrate film. , the substrate film is sent forward, and then the feeding pin is removed from the guide hole and returned to the rear in the feeding direction of the substrate film, and by sequentially repeating this operation, pitch feeding of the substrate film is performed. That's what I was doing.

[Problems to be Solved by the Invention] By the way, this substrate film is a flexible member and is lightweight, so when it is placed on a conveyance path and conveyed by a feed pin, it may be exposed to vibrations etc. during the conveyance. If even the slightest positional shift occurs.

There were drawbacks such as the fact that the feed pin could not be inserted into the guide hole, and therefore the substrate film could not be transferred by the feed pin.

The present invention has been made in view of the above-mentioned problem, and it is an object of the present invention to provide a substrate film transport method that can pitch-feed a substrate film made of a flexible synthetic resin while accurately positioning it. It is something.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the substrate film transport method according to the present invention includes a substrate film that is inserted into a guide hole formed in the substrate film in the transport path of the substrate film. A positioning pin is removably installed with respect to the substrate film, and a feed pin that is inserted into the guide hole and conveys the substrate film is removable with respect to the substrate film and can be moved back and forth in the conveyance direction. With the positioning pin inserted into the guide hole, the feed pin is inserted into the guide hole, and after the positioning pin is removed from the substrate film, the feed pin is moved forward in the conveying direction. By feeding the substrate film by a predetermined pitch, the positioning pin is reinserted into the guide hole in the first stage, and then the feeding pin is detached from the guide hole and returned to the rear in the conveying direction. This is its characteristic.

[Function] Therefore, when transferring the substrate film as described above,
In addition to the feed pins, positioning pins are used, and the substrate film is transferred by keeping at least one of these pins inserted into the guide hole of the substrate film at all times. It is possible to prevent the occurrence of positional deviation during the transfer of the substrate film, to ensure the attachment and detachment of a feed pin for transporting the substrate film to and from the guide hole, and to smoothly perform pitch feeding of the substrate film. I can do it.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

Here, the substrate film l has a flexible film la made of synthetic resin, as shown in FIGS. 6 and 7, and a substrate formed body formed by forming a predetermined wiring pattern on this film la. 2,2. . . . are arranged in two rows on the left and right, and the parts other than the parts where the substrate forming body 2 will be formed have already been cut out. A protective film 3 is partially attached to the surface of the film Ia on which the wiring pattern is exposed, and a reinforcing plate 4 made of a thick resin plate is attached to the center of the other side. Furthermore, adhesive tapes 5 are attached to both sides of the substrate film 1 to prevent the substrate forming body 2 from falling off the substrate film 1 after the pressing operation. Further, the substrate film 1 has guide holes 6, 8 on its left and right and front and rear peripheral edges for positioning it in each treatment and processing step.・
... has been drilled. Then, the substrate forming body 2 is punched out from the substrate film 1 in a pressing process, so that a flexible substrate 7 as shown in FIG. 8 is formed.

In order to pitch the substrate film 1 constructed as described above, a transfer device as shown in FIGS. 1 to 4 is provided. This transfer device is installed below a conveyance table 10 that forms a conveyance path for the substrate film 1, and is connected to a pair of guide holes 6 that are inserted into each of the left and right sides of the substrate film 1. Locating pin 11.11
and a feed pin 12.12, the positioning pin 11 is provided so as to be able to protrude and retract from the conveyor table 10, and the feed pin 12 can be protruded from and retracted from the conveyor table 10, and also extends in the front and back direction of the conveyor table lO. It is also possible to move back and forth.

Next, as shown in FIG. 2 and FIG. 1
A cam lever 16 is connected to 5. The cam lever 18 is connected to a cam mechanism 17, and the positioning pin 11 attached to the shaft 13 can be moved up and down by the operation of the cam mechanism 17.

Further, the feed pin 12 is attached to the tip of a vertical shaft 18, the vertical shaft 18 is connected to a parr 19, and this parr 18 is attached to a horizontal shaft 20. An intermediate portion of the horizontal shaft 20 is fitted into a vertical movement block 21, and the other end portion of the horizontal shaft 20 is fitted into a longitudinal movement block 22.

The vertical movement block 21 connects to the cam mechanism 17 via the connecting rod 23.
This cam mechanism 17 is connected to the cam lever 24 of
By driving the horizontal shaft 20, the horizontal shaft 20 can be moved downward by L, and the feed pin 12 can be moved out of and out of the conveyor table 10. and.

The vertically movable block 21 supporting the horizontal shaft 20 has guide rods 25.2 at the front and rear of the position where the connecting rod 23 is attached.
5 is attached to each gyroscope 25 at the base 14.
It is supported so as to be movable up and down by being slidably inserted into a guide tube portion 2e fixedly provided in the guide tube portion 2e. Also, the fourth
As shown in the figure, the back-and-forth motion block 22 has a slider 2.
The slider 27 is arranged so as to be movable in the front and back direction within a slit groove 28 bored in the base 14, and a pair of front and rear rollers 29, 2B are attached. In order to displace the slider 27 in the front-back direction, a cam lever 30 is engaged with the cam mechanism 17, and an engaging portion 30a is formed at the tip of the cam lever 30. By inserting it between the rollers 29, 29, the rotational movement of the cam lever 30 can be converted into linear movement and transmitted, and the slider 27 and the horizontal shaft 20 fitted therein can be reciprocated back and forth. It is configured so that it can be done.

In FIG. 1, 31 is a spring that urges the cam lever 30 in the direction of engagement with the cam mechanism 17, and 33 is a spacer that is attached to the longitudinal movement block 22 and that limits the reciprocating stroke of the horizontal shaft 20. , 34.34.

...is axis 13. Horizontal axis 20. This is a thrust bearing for the guide rod 25.

The transfer device used in this embodiment has the above-mentioned configuration. First, a method for pitch-feeding the substrate film l using this transfer device will be described.

First, as shown in FIG.
0, the positioning pin 11 is made to protrude onto the transport table 1O, and the positioning pin 11 is inserted into the guide hole 6 of the substrate film 1.

Next, as shown in FIG. 5(a), the feed pin 12 is raised and inserted into the guide hole 6 in front of the fitting portion of the positioning pin 11 of the substrate film l, and as shown in FIG. As shown in b), the positioning pin 11 is removed from the guide hole 6. Then, as shown in FIG. 5(C), by horizontally moving the feed pin 12 forward, the feed pin 1
2 allows the substrate film l to be fed by a pitch corresponding to the stroke of the feeding pin 12.

Thereafter, as shown in FIG. 5(d), the positioning pin 11 is inserted into the guide hole 6 of the substrate film L while maintaining the above-mentioned feed pin 12 inserted into the guide hole S. After the positioning pin 11 is inserted into the guide hole 6 in this way, as shown in FIG. 5(e), the positioning pin 12 is removed from the guide hole 6 and retreated to the position shown in FIG. let

By repeating the above-mentioned operation, it becomes possible to pitch the substrate film 1 by a predetermined pitch, and during this pitch feeding, a predetermined operation such as a pressing operation can be performed on the substrate film 1. .

Therefore, as mentioned above, the positioning pin 11 and the feed pin 1
2 and 2 types of pins are used, and the substrate film l is conveyed with at least one of these two types of pins inserted into the guide hole 6 of the substrate film l. The substrate film 1 is not displaced due to vibration or the like during transportation, and the pitch can be conveyed extremely smoothly and reliably. Moreover, the above-mentioned positioning pin 11 and feed pin 12 are both connected to the cam mechanism 1.
Therefore, these pins 11 and 12 can be operated in conjunction with each other, and their operation is stable.

In addition, in order to change the stroke according to the type of substrate film when transferring the substrate film using the above-mentioned feed pin 12, the number and size of the spacers 33 attached to the forward and backward movement block 22 may be changed as appropriate. .

[Effects of the Invention] As detailed above, the substrate film transfer method according to the present invention utilizes a guide hole drilled in the substrate film, and uses two types of pins, a positioning pin and a feed pin, in this guide hole, Since the substrate film is transferred with at least one of these pins inserted into the guide hole, the substrate film can be pitch-fed while being accurately positioned without causing positional deviation. This makes it possible to smoothly and reliably transport a substrate film made of a flexible and lightweight material.

[Brief explanation of drawings]

1 to 4 show an example of a transfer device for implementing the substrate film transfer method according to the present invention, FIG. 1 is an overall configuration diagram thereof, and FIG. 3 is a plan view showing the section, FIG. 3 is a view taken along the X-x arrow in FIG.
Fig. 4 is a plan view showing the state of connection between the longitudinal motion block and the cam lever, and Figs. 5 (a), (b), (c), (d) and (e) show the positioning pin and feed pin of the transfer device, respectively. 6 is a partial plan view of the substrate film, FIG. 7 is a YY sectional view of FIG. 6, and FIG. 8 is a plan view of the flexible substrate. , a substrate film, 2: substrate forming body, 6: guide hole, 7:
Flexible substrate, lO: transport platform, 11: positioning pin, 12: feeding pin.

Claims (1)

[Claims] In a device that transports a substrate film made of a synthetic resin film material and in which a large number of substrate forming bodies constituting a flexible substrate are arranged in series, the substrate film transport path is provided with holes in the substrate film. A positioning pin, which is inserted into the guide hole, is removably installed on the substrate film, and a feed pin, which is inserted into the guide hole and conveys the substrate film, is removable from the substrate film. It is installed so as to be able to reciprocate back and forth in the conveyance direction, and with the positioning pin inserted into the guide hole, the feed pin is inserted into the guide hole, and after the positioning pin is detached from the substrate film, the feed The substrate film is fed by a predetermined pitch by moving the pin forward in the conveying direction, and then the positioning pin is reinserted into the guide hole, and then the feeding pin is removed from the guide hole and returned to the rear in the conveying direction. A substrate film transport method characterized by: