DE69629061D1 - Harztragender metallfolie für mehrschichtige leiterplatte, verfahren zu deren herstellung, mehrschichtige leiterplatte, und elektronische vorrichtung - Google Patents
Harztragender metallfolie für mehrschichtige leiterplatte, verfahren zu deren herstellung, mehrschichtige leiterplatte, und elektronische vorrichtungInfo
- Publication number
- DE69629061D1 DE69629061D1 DE69629061T DE69629061T DE69629061D1 DE 69629061 D1 DE69629061 D1 DE 69629061D1 DE 69629061 T DE69629061 T DE 69629061T DE 69629061 T DE69629061 T DE 69629061T DE 69629061 D1 DE69629061 D1 DE 69629061D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- layer circuit
- resin
- electronic device
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
- Y10T428/249999—Differentially filled foam, filled plural layers, or filled layer with coat of filling material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14534896 | 1996-06-07 | ||
JP14534896 | 1996-06-07 | ||
JP17957996 | 1996-07-09 | ||
JP17957996 | 1996-07-09 | ||
PCT/JP1996/003712 WO1997047165A1 (fr) | 1996-06-07 | 1996-12-19 | Feuille de metal porteuse de resine pour tableau de cablage multicouche, procede de fabrication de cette feuille, tableau de cablage multicouche, et dispositif electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69629061D1 true DE69629061D1 (de) | 2003-08-14 |
DE69629061T2 DE69629061T2 (de) | 2004-05-13 |
Family
ID=26476502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996629061 Expired - Lifetime DE69629061T2 (de) | 1996-06-07 | 1996-12-19 | Harztragender metallfolie für mehrschichtige leiterplatte, verfahren zu deren herstellung, mehrschichtige leiterplatte, und elektronische vorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6254971B1 (de) |
EP (1) | EP0957664B1 (de) |
JP (1) | JP3676379B2 (de) |
KR (1) | KR100280911B1 (de) |
DE (1) | DE69629061T2 (de) |
WO (1) | WO1997047165A1 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6898180B2 (en) | 1999-06-08 | 2005-05-24 | Nokia Corporation | Connection admission in a communications network |
CN1378769A (zh) | 1999-08-12 | 2002-11-06 | Ibiden股份有限公司 | 多层印刷电路板、阻焊配方、多层印刷电路板的制造方法和半导体器件 |
US6871396B2 (en) * | 2000-02-09 | 2005-03-29 | Matsushita Electric Industrial Co., Ltd. | Transfer material for wiring substrate |
JP2002033581A (ja) * | 2000-07-13 | 2002-01-31 | Mitsui Mining & Smelting Co Ltd | 銅張積層板の製造方法 |
US6596968B2 (en) * | 2000-08-28 | 2003-07-22 | Ube Industries, Ltd. | Method of producing through-hole in aromatic polyimide film |
JP2002093853A (ja) * | 2000-09-07 | 2002-03-29 | Internatl Business Mach Corp <Ibm> | プリント配線板およびフリップチップ実装方法 |
JP4529262B2 (ja) * | 2000-09-14 | 2010-08-25 | ソニー株式会社 | 高周波モジュール装置及びその製造方法 |
JP2002111222A (ja) * | 2000-10-02 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 多層基板 |
KR100618511B1 (ko) | 2002-03-05 | 2006-08-31 | 히다치 가세고교 가부시끼가이샤 | 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트배선판 및 그의 제조 방법 |
US6734259B1 (en) * | 2002-10-24 | 2004-05-11 | International Business Machines Corporation | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom |
US7023084B2 (en) * | 2003-03-18 | 2006-04-04 | Sumitomo Metal (Smi) Electronics Devices Inc. | Plastic packaging with high heat dissipation and method for the same |
US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
US8440916B2 (en) * | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
WO2009037332A1 (en) * | 2007-09-20 | 2009-03-26 | Agfa-Gevaert N.V. | Security laminates with interlaminated transparent embossed polymer hologram |
EP2042576A1 (de) * | 2007-09-20 | 2009-04-01 | Agfa-Gevaert | Sicherheitslaminat mit eingeprägtem transparentem Zwischenschicht-Polymerhologramm |
TWI478810B (zh) * | 2008-03-25 | 2015-04-01 | Ajinomoto Kk | An insulating resin sheet, and a multilayer printed circuit board using the same |
WO2009121793A2 (en) * | 2008-04-01 | 2009-10-08 | Agfa Gevaert | Lamination process for producung security laminates |
CN102123873A (zh) * | 2008-04-01 | 2011-07-13 | 爱克发-格法特公司 | 具有安全特征的安全层压材料 |
CN105150656A (zh) * | 2008-04-01 | 2015-12-16 | 爱克发-格法特公司 | 具有可通过触摸察觉的安全性特征的安全性层压板 |
JP2009283739A (ja) * | 2008-05-23 | 2009-12-03 | Shinko Electric Ind Co Ltd | 配線基板および配線基板の製造方法 |
EP2181858A1 (de) * | 2008-11-04 | 2010-05-05 | Agfa-Gevaert N.V. | Sicherheitsdokument und Herstellungsverfahren |
EP2199100A1 (de) * | 2008-12-22 | 2010-06-23 | Agfa-Gevaert N.V. | Sicherheitslaminate für Sicherheitsdokumente |
JP5444944B2 (ja) * | 2009-08-25 | 2014-03-19 | Tdk株式会社 | 活物質及び活物質の製造方法 |
US20110052473A1 (en) * | 2009-08-25 | 2011-03-03 | Tdk Corporation | Method of manufacturing active material |
JP5482062B2 (ja) * | 2009-09-29 | 2014-04-23 | Tdk株式会社 | 薄膜コンデンサ及び薄膜コンデンサの製造方法 |
EP2332738B1 (de) | 2009-12-10 | 2012-07-04 | Agfa-Gevaert | Sicherheitsdokument mit Sicherheitsmerkmal auf Rand |
EP2335937B1 (de) | 2009-12-18 | 2013-02-20 | Agfa-Gevaert | Lasermarkierbarer Sicherheitsfilm |
PL2335938T3 (pl) | 2009-12-18 | 2013-07-31 | Agfa Gevaert | Znakowalna laserowo folia zabezpieczająca |
KR101328235B1 (ko) | 2010-05-07 | 2013-11-14 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로용 동박 |
CN102371649A (zh) * | 2010-08-19 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 金属与树脂的复合体的制造方法 |
US20120090883A1 (en) * | 2010-10-13 | 2012-04-19 | Qualcomm Incorporated | Method and Apparatus for Improving Substrate Warpage |
JP5870627B2 (ja) * | 2011-11-01 | 2016-03-01 | 富士通株式会社 | 半導体装置の製造方法 |
US9076600B2 (en) | 2012-03-27 | 2015-07-07 | Tdk Corporation | Thin film capacitor |
US9030800B2 (en) | 2012-03-29 | 2015-05-12 | Tdk Corporation | Thin film capacitor |
CN104663007B (zh) | 2012-09-20 | 2017-10-24 | 株式会社可乐丽 | 电路基板及其制造方法 |
JP5874697B2 (ja) * | 2013-08-28 | 2016-03-02 | 株式会社デンソー | 多層プリント基板およびその製造方法 |
US11437304B2 (en) * | 2014-11-06 | 2022-09-06 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
JP6520085B2 (ja) | 2014-12-05 | 2019-05-29 | Tdk株式会社 | 薄膜キャパシタ |
WO2016201076A1 (en) | 2015-06-09 | 2016-12-15 | Rogers Corporation | Circuit materials and articles formed therefrom |
KR102411998B1 (ko) * | 2015-06-25 | 2022-06-22 | 삼성전기주식회사 | 회로 기판 및 그 제조방법 |
CN109641985B (zh) * | 2016-08-22 | 2022-04-22 | 株式会社大阪曹达 | 光固化性树脂组合物、油墨及涂料 |
US10993333B2 (en) * | 2017-07-15 | 2021-04-27 | Sanmina Corporation | Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates |
JP2020083931A (ja) * | 2018-11-16 | 2020-06-04 | 利昌工業株式会社 | 樹脂組成物、プリプレグ、および、積層板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6025296A (ja) * | 1983-07-22 | 1985-02-08 | 三菱瓦斯化学株式会社 | 多層板の製法 |
JPS6142872U (ja) * | 1984-08-22 | 1986-03-19 | カシオ計算機株式会社 | フレキシブル回路基板 |
JPH0686534B2 (ja) * | 1985-10-31 | 1994-11-02 | 三井東圧化学株式会社 | フレキシブルプリント回路基板の製造法 |
JPH0653261B2 (ja) * | 1988-12-13 | 1994-07-20 | 日本ジーイープラスチックス株式会社 | 耐低温衝撃性を有する塗装された樹脂成形品及びそのような樹脂成形品の塗装方法 |
JPH0716089B2 (ja) * | 1989-08-25 | 1995-02-22 | 松下電工株式会社 | 電気用積層板 |
JPH03166935A (ja) * | 1989-11-25 | 1991-07-18 | Matsushita Electric Works Ltd | 積層板 |
JPH03165596A (ja) * | 1989-11-25 | 1991-07-17 | Matsushita Electric Works Ltd | 多層積層板 |
JPH0491940A (ja) * | 1990-08-07 | 1992-03-25 | Dainippon Printing Co Ltd | 金属箔積層フィルム |
CN1036402C (zh) * | 1991-01-11 | 1997-11-12 | 旭化成工业株式会社 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
JP3166935B2 (ja) | 1992-03-26 | 2001-05-14 | 株式会社リコー | 復号処理方法および装置 |
JPH06232553A (ja) * | 1993-01-29 | 1994-08-19 | Hitachi Chem Co Ltd | 積層用片面フレキシブル銅張板 |
JP3516473B2 (ja) * | 1993-12-28 | 2004-04-05 | 新日鐵化学株式会社 | プリント基板用耐熱性接着剤フィルム |
JP3165596B2 (ja) | 1994-08-31 | 2001-05-14 | シャープ株式会社 | 空気調和機の人体検知方法 |
WO1996037915A1 (en) * | 1995-05-26 | 1996-11-28 | Sheldahl, Inc. | Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink |
US5928767A (en) * | 1995-06-07 | 1999-07-27 | Dexter Corporation | Conductive film composite |
-
1996
- 1996-12-19 KR KR1019980710013A patent/KR100280911B1/ko not_active IP Right Cessation
- 1996-12-19 JP JP50039798A patent/JP3676379B2/ja not_active Expired - Lifetime
- 1996-12-19 US US09/202,078 patent/US6254971B1/en not_active Expired - Lifetime
- 1996-12-19 EP EP96942583A patent/EP0957664B1/de not_active Expired - Lifetime
- 1996-12-19 DE DE1996629061 patent/DE69629061T2/de not_active Expired - Lifetime
- 1996-12-19 WO PCT/JP1996/003712 patent/WO1997047165A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0957664A4 (de) | 1999-11-17 |
KR20000016429A (ko) | 2000-03-25 |
JP3676379B2 (ja) | 2005-07-27 |
EP0957664B1 (de) | 2003-07-09 |
KR100280911B1 (ko) | 2001-02-01 |
WO1997047165A1 (fr) | 1997-12-11 |
US6254971B1 (en) | 2001-07-03 |
EP0957664A1 (de) | 1999-11-17 |
DE69629061T2 (de) | 2004-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69629061D1 (de) | Harztragender metallfolie für mehrschichtige leiterplatte, verfahren zu deren herstellung, mehrschichtige leiterplatte, und elektronische vorrichtung | |
DE69530990D1 (de) | Leiterplatte, verfahren zu deren herstellung und elektronische vorrichtungen | |
DE69636010D1 (de) | Gedruckte schaltungsplatte und verfahren zu deren herstellung | |
DE69931212D1 (de) | Leiterplatte und Verfahren zu deren Herstellung | |
DE69408189D1 (de) | Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung | |
DE69301941D1 (de) | Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung | |
DE69943397D1 (de) | Mehrlagenleiterplatte und Verfahren zu ihrer Herstellung | |
DE69839882D1 (de) | Mehrschichtige gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69934050D1 (de) | Gedruckte Leiterplatte und Verfahren zu deren Herstellung | |
DE69627971D1 (de) | Kupferfolie für Leiterplatte, Verfahren und Gegenstand zur Herstellung | |
DE69431723T2 (de) | Leiterplatte und verfahren zu deren herstellung | |
DE69120869T2 (de) | Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung | |
DE69732127D1 (de) | Verfahren und vorrichtung für die elektronische filmentwicklung | |
DE69931272D1 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69937153D1 (de) | Gedruckte leiterplatte und verfahren zu deren herstellung | |
DE69117381D1 (de) | Mehrschichtleiterplatte und Verfahren zu ihrer Herstellung | |
DE69121501T2 (de) | Mehrschichtige Leiterplatte und Verfahren zu ihrer Herstellung | |
DE69120198D1 (de) | Mehrschichtige, gedruckte Leiterplatte und Verfahren zu ihrer Herstellung | |
DE69611020D1 (de) | Prepreg für Leiterplatten | |
DE60032067D1 (de) | Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung | |
DE69015522D1 (de) | Vorrichtung für elektronische Bauteile und Verfahren für die Bestückung der elektronischen Bauteile. | |
DE59410240D1 (de) | Folienleiterplatten und verfahren zu deren herstellung | |
DE69202625T2 (de) | Elektronische Vorrichtung und Verfahren zu ihrer Herstellung. | |
DE69908445D1 (de) | Verbindungswerkstoff für elektronische Bauteile, elektronische Bauteile und Verfahren zu deren Herstellung | |
DE69113537D1 (de) | Verfahren und Vorrichtung zur Musterprüfung gedrukter Schaltungsplatten. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |