JPS5575248A - Method of repairing integrated circuit device and repairing insulating substrate - Google Patents

Method of repairing integrated circuit device and repairing insulating substrate

Info

Publication number
JPS5575248A
JPS5575248A JP14788178A JP14788178A JPS5575248A JP S5575248 A JPS5575248 A JP S5575248A JP 14788178 A JP14788178 A JP 14788178A JP 14788178 A JP14788178 A JP 14788178A JP S5575248 A JPS5575248 A JP S5575248A
Authority
JP
Japan
Prior art keywords
repairing
pattern
substrate
integrated circuit
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14788178A
Other languages
Japanese (ja)
Inventor
Tatsumi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14788178A priority Critical patent/JPS5575248A/en
Publication of JPS5575248A publication Critical patent/JPS5575248A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To repair and add a function to an integrated circuit devic by adhering a repairing insulating substrate having a terminal mounting pattern onto the integrated circuit (IC) device to be repaired and utilizing the pattern.
CONSTITUTION: There are provided a terminal mounting conductive pattern 6 and a grounding pad 11 at the input/output terminals of a repairing LSI on the front surface of a substrate 3 to be repaired and a grounding conductive pattern 9 through through-holes 12 from the pad 11 on the back surface thereof with adhesive coated on the outside thereof. The substrate 3 is adhered onto the LSI to be repaired, the pattern 6 is superimposed on the terminal 7 of small LSI3, and soldered thereto. Then, the pattern 6 of the substrate 3 is connected at desired positions 4 to the pattern 5 of the substrate 30. Thus, desired circuit can be simply assembled to thereby repair or add a function to the substrate without replacing the LSI.
COPYRIGHT: (C)1980,JPO&Japio
JP14788178A 1978-12-01 1978-12-01 Method of repairing integrated circuit device and repairing insulating substrate Pending JPS5575248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14788178A JPS5575248A (en) 1978-12-01 1978-12-01 Method of repairing integrated circuit device and repairing insulating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14788178A JPS5575248A (en) 1978-12-01 1978-12-01 Method of repairing integrated circuit device and repairing insulating substrate

Publications (1)

Publication Number Publication Date
JPS5575248A true JPS5575248A (en) 1980-06-06

Family

ID=15440319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14788178A Pending JPS5575248A (en) 1978-12-01 1978-12-01 Method of repairing integrated circuit device and repairing insulating substrate

Country Status (1)

Country Link
JP (1) JPS5575248A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250836A (en) * 1995-03-08 1996-09-27 Fujitsu Ltd Additional component mounting structure for printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250836A (en) * 1995-03-08 1996-09-27 Fujitsu Ltd Additional component mounting structure for printed wiring board

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