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JPS5277684A - Exeternal wiring of integrated circuit - Google Patents

Exeternal wiring of integrated circuit

Info

Publication number
JPS5277684A
JPS5277684A JP15424275A JP15424275A JPS5277684A JP S5277684 A JPS5277684 A JP S5277684A JP 15424275 A JP15424275 A JP 15424275A JP 15424275 A JP15424275 A JP 15424275A JP S5277684 A JPS5277684 A JP S5277684A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
circuit
ic
substrate
exchange
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15424275A
Inventor
Hiroo Nomura
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: Elastomer having conductivity is adhered on the circuit substrate, on which are laid electrodes of IC to connect electrically the substrate and IC circuit. Setting and exchange of IC can be made easily at will by this way.
COPYRIGHT: (C)1977,JPO&Japio
JP15424275A 1975-12-24 1975-12-24 Exeternal wiring of integrated circuit Pending JPS5277684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15424275A JPS5277684A (en) 1975-12-24 1975-12-24 Exeternal wiring of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15424275A JPS5277684A (en) 1975-12-24 1975-12-24 Exeternal wiring of integrated circuit

Publications (1)

Publication Number Publication Date
JPS5277684A true true JPS5277684A (en) 1977-06-30

Family

ID=15579933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15424275A Pending JPS5277684A (en) 1975-12-24 1975-12-24 Exeternal wiring of integrated circuit

Country Status (1)

Country Link
JP (1) JPS5277684A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688074A (en) * 1982-04-06 1987-08-18 Citizen Watch Co., Ltd. Connecting structure for a display device
US4710798A (en) * 1985-09-10 1987-12-01 Northern Telecom Limited Integrated circuit chip package
US4970780A (en) * 1986-12-15 1990-11-20 Shin-Etsu Polymer Co., Ltd. Method for the assemblage of a semiconductor device
US5866953A (en) * 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
US5925934A (en) * 1995-10-28 1999-07-20 Institute Of Microelectronics Low cost and highly reliable chip-sized package
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688074A (en) * 1982-04-06 1987-08-18 Citizen Watch Co., Ltd. Connecting structure for a display device
US4710798A (en) * 1985-09-10 1987-12-01 Northern Telecom Limited Integrated circuit chip package
US4970780A (en) * 1986-12-15 1990-11-20 Shin-Etsu Polymer Co., Ltd. Method for the assemblage of a semiconductor device
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
US5925934A (en) * 1995-10-28 1999-07-20 Institute Of Microelectronics Low cost and highly reliable chip-sized package
US5866953A (en) * 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
US6617684B2 (en) 1996-05-24 2003-09-09 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
US6853069B2 (en) 1996-05-24 2005-02-08 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant and methods
US6534858B2 (en) 1996-05-24 2003-03-18 Micron Technology, Inc. Assembly and methods for packaged die on pcb with heat sink encapsulant
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6760224B2 (en) 1998-06-30 2004-07-06 Micron Technology, Inc. Heat sink with alignment and retaining features
US6650007B2 (en) 1998-06-30 2003-11-18 Micron Technology, Inc. Stackable ceramic fbga for high thermal applications
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6858926B2 (en) 1998-06-30 2005-02-22 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6525943B2 (en) 1998-06-30 2003-02-25 Micron Technology, Inc. Heat sink with alignment and retaining features
US7285442B2 (en) 1998-06-30 2007-10-23 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6920688B2 (en) 1998-09-01 2005-07-26 Micron Technology, Inc. Method for a semiconductor assembly having a semiconductor die with dual heat spreaders
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6765291B2 (en) 1998-09-01 2004-07-20 Micron Technology, Inc. IC package with dual heat spreaders
US6518098B2 (en) 1998-09-01 2003-02-11 Micron Technology, Inc. IC package with dual heat spreaders
US6596565B1 (en) 1998-09-03 2003-07-22 Micron Technology, Inc. Chip on board and heat sink attachment methods
US6451709B1 (en) 1998-09-03 2002-09-17 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package
US6806567B2 (en) 1998-09-03 2004-10-19 Micron Technology, Inc. Chip on board with heat sink attachment and assembly
US6229204B1 (en) 1998-09-03 2001-05-08 Micron Technology, Inc. Chip on board with heat sink attachment
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6432840B1 (en) 1998-09-03 2002-08-13 Micron Technology, Inc. Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package

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